
SCOPE: QUAD SPST CMOS ANALOG SWIT CHES
Device Type Generic Number
01 DG201AA(x)/883B
02 DG202A(x)/883B
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter Mil-Std-1835 Case Outline Package Code
L CDFP4-F16 16 LEAD FLATPACK F16
K GDIP1-T16 or CDIP2-T16 16 LEAD CERDIP J16
Z CQCC1-N20 20-Pin Ceramic LCC L20
A bsolute Maximum Ratings
Voltage Referenced to V-
V+ ...................................................................................................................................... 44V
GND ................................................................................................................................... 25V
Digital Inputs, VS, VD (Note 1) ......................................................... -2V to (V+ +2V)or 20mA,
whichever occurs first
Current, Any terminal except S or D ............................................................................... 30mA
Continuous Current, S or D ............................................................................................. 20mA
(Pulsed at 1ms, 10% duty cycle max) ...................................................................... 70mA
Lead Temperature (soldering, 10 seconds) ........................................................................ +300°C
Storage Temperature ........................................................................................... -65°C to +150°C
Continuous Power Dissipation ............................................................................ TA=+70°C
16 lead Flatpack (derate 6.1mW/°C above +70°C) ................................................. 485mW
16 lead CERDIP(derate 10mW/°C above +70°C) ................................................... 800mW
20-Pin LCC (derate 9.1mW/°C above +70°C) ........................................................ 727mW
Junct ion Temperature TJ .................................................................................….. +150°C
Thermal Resista nce, J unction to Case, ΘJC:
Case Outline 16 lead Flatpack ...........................................................…... 65°C/W
Case Outline 16 lead CERDIP.............................................................….. 50°C/W
Case Outline 20-Pin LCC ....................................................................…. 20°C/W
Thermal Resistance, Junction to Ambient, ΘJA:
Case Outline 16 lead Flatpack ...........................................................…. 165°C/W
Case Outline 16 lead CERDIP..........................................................…... 100°C/W
Case Outline 20-Pin LCC .................................................................….. 110°C/W
Recommended Operating Conditions.
Ambient Operating Range (TA) .............................................................. -55°C to +125°C
NOTE 1: Signals on SX, DX, or INX exceeding V+ or V- are clamped by internal diodes, and are
also internally current limited to 25mA.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational section s of the sp ecifica tions is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
---------------------------- Electrical Characteristics of DG201A/DG202/883B 19-0041 Rev. C
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