MCP3909T-I/SSRA1 - Microchip Technology

MCP3909

Features

• Supports IEC 62053 International Energy

Metering Specification and legacy IEC 1036/

61036/687 Specifications

• Digital waveform data access through SPI

interface

- 16-bit Dual ADC output data words

- 20-bit Multiplier output data word

• Dual functionality pins support serial interface

access and simultaneous Active Power Pulse

Output

• Two 16-bit second order delta-sigma Analog-to-

Digital Converters (ADCs) with multi-bit DAC

- 81 dB SINAD (typ.) both channels

• 0.1% typical active energy measurement error

over 1000:1 dynamic range

• PGA for small signal inputs supports low value

shunt current sensor

• Ultra-low drift on-chip reference: 15 ppm/°C (typ.)

• Direct drive for electromagnetic mechanical

counter and two-phase stepper motors

• Low IDD of 4 mA (max.)

• Tamper output pin for negative power indication

• Industrial Temperature Range: -40°C to +85°C

Description

The MCP3909 device is an energy-metering IC

designed to support the IEC 62053 international

metering standard specification. It supplies a frequency

output proportional to the average active real power,

with simultaneous serial access to ADC channels and

multiplier output data. This output waveform data is

available at up to 14 kHz with 16-bit ADC output and

20-bit multiplier output words. The 16-bit, delta-sigma

ADCs allow for a wide range of IB and IMAX currents

and/or small shunt (<200 µOhms) meter designs. A no-

load threshold block prevents any current creep

measurements for the active power pulse outputs. The

integrated on-chip voltage reference has an ultra-low

temperature drift of 15 ppm per degree C.This accurate

energy metering IC with high field reliability is available

in the industry standard 24-lead SSOP pinout.

Package Type

Functional Block Diagram

FOUT0

DGND

NEG / SDO

FOUT1

CLKOUT

CLKIN

DVDD

HPF

AVDD

CH0+

CHO-

CH1-

CH1+

HFOUT

9G0

MCLR

F0 / CS

REFIN / OUT

AGND

12 F1 / SDI

F2 / SCK

24-Lead

SSOP

16-bit

ΔΣ ADC

–

CH0+

CH0-

Reference

2.4V

–

CH1+

CH1-

HPF1

LPF1 DTF

conversion

REFIN/

FOUT1

HFOUT

G0 G1

F2/SCK F1/SDI

FOUT0

OSC1 OSC2

OUT

NEG/SDO

HPF

F0/CS

Multi-level

16-bit

ΔΣ ADC

Multi-level

PGA

Serial Control

Buffers

And Output

Stepper

Motor

Output Drive

Active Power

SPI

Interface

Dual Functionality Pin

Control

MCLR

Sub-system

Clock

for

Active Power

HPF1

4kΩ

Energy Metering IC with SPI Interface and Active Power Pulse Output

MCP3909
DS22025A-page 2 © 2006 Microchip Technology Inc.
1.0 ELECTRICAL 
CHARACTERISTICS
Absolute Maximum Ratings †
VDD ...................................................................................7.0V
Digital inputs and outputs w.r.t. AGND........ -0.6V to VDD +0.6V
Analog input w.r.t. AGND ..................................... ....-6V to +6V
VREF input w.r.t. AGND ............................... -0.6V to VDD +0.6V
Storage temperature .....................................-65°C to +150°C
Ambient temp. with power applied ................-65°C to +125°C
Soldering temperature of leads (10 seconds) .............+300°C
ESD on the analog inputs (HBM,MM) .................4.0 kV, 400V
ESD on all other pins (HBM,MM) ........................4.0 kV, 400V
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD = DVDD = 4.5V to 5.5V,
Internal VREF
, HPF turned on (AC mode), AGND, DGND = 0V, MCLK = 3.58 MHz; TA = -40°C to +85°C.
Parameter Sym Min Typ. Max Units Comment
Active Power Measurement Accuracy
Active Energy Measurement 
Error
E—0.1—% F
OUT Channel 0 swings 1000:1 range, 
FOUT0, FOUT1 Frequency outputs 
only, does not apply to serial inter-
face data. (Note 1, Note 4)
No-Load Threshold/ 
Minimum Load
NLT — 0.0015 — % FOUT
Max
Frequency outputs only, does not 
apply to serial interface data. 
Disabled when F2, F1, F0 = 0, 1, 1
(Note 5, Note 6)
System Gain Error — 1 5 % FOUT (Note 2, Note 5)
AC Power Supply Rejection
(output frequency variation)
AC PSRR — 0.01 — % FOUT F2, F1, F0 = 0, 1, 1 (Note 3)
DC Power Supply Rejection
(output frequency 
variation)
DC PSRR — 0.01 — % FOUT HPF = 1, Gain = 1 (Note 3)
Waveform Sampling
A/D Converter Signal-to-
Noise and Distortion Ratio
SINAD — 81 — dB Applies to both channels,
VIN = 0 dBFS at 50 Hz
(VIN = Full Scale)
Bandwidth
(Notch Frequency)
— 14 — kHz Applies to both channels,
MCLK/256
Phase Delay Between 
Channels
— — 1/MCLK s HPF = 0 and 1, < 1 MCLK period
(Note 4, Note 6, Note 7)
Note 1: Measurement error = (Energy Measured By Device - True Energy)/True Energy * 100%. Accuracy is 
measured with signal (±660 mV) on Channel 1. FOUT0, FOUT1 pulse outputs. Valid from 45 Hz to 75 Hz. 
See typical performance curves for higher frequencies and increased dynamic range.
2: Does not include internal VREF. Gain = 1, CH0 = 470 mVDC, CH1 = 660 mVDC, difference between 
measured output frequency and expected transfer function.
3: Percent of HFOUT output frequency variation; Includes external VREF = 2.5V, CH1 = 100 mVRMS @ 50 Hz, 
CH2 = 100 mVRMS @ 50 Hz, AVDD = 5V + 1Vpp @ 100 Hz. DC PSRR: 5V ±500 mV
4: Error applies down to 60 degree lead (PF = 0.5 capacitive) and 60 degree lag (PF = 0.5 inductive).
5: Refer to Section 4.0 “Device Overview” for complete description.
6: Specified by characterization, not production tested.
7: 1 MCLK period at 3.58 MHz is equivalent to less than <0.005 degrees at 50 or 60 Hz.

MCP3909

ADC/PGA Specifications

Offset Error VOS — 2 5 mV Referred to Input, applies to both

channels

Gain Error Match — 0.5 — % FOUT (Note 5)

Internal Voltage Reference

Voltage — 2.4 — V

Tolerance — ±2 — %

Tempco — 15 — ppm/°C

Reference Input

Input Range 2.2 — 2.6 V

Input Impedance 3.2 — — kΩ

Input Capacitance — — 10 pF

Analog Inputs

Maximum Signal Level — — ±1 V CH0+,CH0-,CH1+,CH1- to AGND

Differential Input Voltage

Range Channel 0

— — ±470/G mV G = PGA Gain on Channel 0

Differential Input Voltage

Range Channel 1

——±660mV

Input Impedance 390 — — kΩProportional to 1/MCLK

Oscillator Input

Frequency Range MCLK 1 — 4 MHz

Power Specifications

Operating Voltage 4.5 — 5.5 V AVDD, DVDD

IDD,A IDD,A —2.3 2.8 mAAV

DD pin only

IDD,D IDD,D —0.8 1.2 mADV

DD pin only

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD = DVDD = 4.5V to 5.5V,

Internal VREF

, HPF turned on (AC mode), AGND, DGND = 0V, MCLK = 3.58 MHz; TA = -40°C to +85°C.

Parameter Sym Min Typ. Max Units Comment

Note 1: Measurement error = (Energy Measured By Device - True Energy)/True Energy * 100%. Accuracy is

measured with signal (±660 mV) on Channel 1. FOUT0, FOUT1 pulse outputs. Valid from 45 Hz to 75 Hz.

See typical performance curves for higher frequencies and increased dynamic range.

2: Does not include internal VREF. Gain = 1, CH0 = 470 mVDC, CH1 = 660 mVDC, difference between

measured output frequency and expected transfer function.

3: Percent of HFOUT output frequency variation; Includes external VREF = 2.5V, CH1 = 100 mVRMS @ 50 Hz,

CH2 = 100 mVRMS @ 50 Hz, AVDD = 5V + 1Vpp @ 100 Hz. DC PSRR: 5V ±500 mV

4: Error applies down to 60 degree lead (PF = 0.5 capacitive) and 60 degree lag (PF = 0.5 inductive).

5: Refer to Section 4.0 “Device Overview” for complete description.

6: Specified by characterization, not production tested.

7: 1 MCLK period at 3.58 MHz is equivalent to less than <0.005 degrees at 50 or 60 Hz.

MCP3909

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, VDD = 4.5V to 5.5V, AGND, DGND = 0V.

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range TA-40 — +85 °C

Operating Temperature Range TA-40 — +125 °C Note

Storage Temperature Range TA-65 — +150 °C

Note: The MCP3909 operates over this extended temperature range, but with reduced performance. In any case,

the Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.

MCP3909

TIMING CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD = DVDD = 4.5V to 5.5V,

AGND, DGND = 0V, MCLK = 3.58 MHz; TA = -40°C to +85°C.

Parameter Sym Min Typ Max Units Comment

Frequency Outputs

FOUT0 and FOUT1 Pulse Width

(Logic Low)

tFW —275 —ms 984376 MCLK periods

(Note 1)

HFOUT Pulse Width tHW —90 — ms 322160 MCLK periods

(Note 2)

FOUT0 and FOUT1 Pulse Period tFP Refer to Equation 4-1 s

HFOUT Pulse Period tHP Refer to Equation 4-2 s

FOUT0 to FOUT1 Falling-Edge

Time

tFS2 —0.5 tFP —

FOUT0 to FOUT1 Minimum Sepa-

ration

tFS —4/MCLK —

Digital I/O

FOUT0 and FOUT1 Output High

Voltage

VOH 4.5 ——

OH = 12 mA, DVDD = 5.0V

FOUT0 and FOUT1 Output Low

Voltage

VOL ——

0.5 V IOL = 12 mA, DVDD = 5.0V

HFOUT and NEG Output High

Voltage

VOH 4.5 ——

OH = 12 mA, DVDD = 5.0V

HFOUT and NEG Output Low

Voltage

VOL ——

0.5 V IOL = 12 mA, DVDD = 5.0V

High-Level Input Voltage

(All Digital Input Pins)

VIH 2.4 ——

VDV

DD = 5.0V

Low Level Input Voltage

(All Digital Input Pins)

VIL ——

0.85 V DVDD = 5.0V

Input Leakage Current —0.1

±1 µA VIN = 0, VIN = DVDD

Pin Capacitance ——

10 pF (Note 3)

Serial Interface Timings (Note 4)

Output Data Rate fADC —MCLK/256—

Serial Clock Frequency fCLK —20MHzV

DD = 5V

Window for serial mode entry

codes

tWINDOW — — 8/MCLK — Last bit must be clocked in

before this time.

Window start time for serial

mode entry codes

tWINSET 1/MCLK — — — First bit must be clocked in

after this time.

Serial Clock High Time tHI 10 — 40 ns

Serial Clock Low Time tLO 30 — 20 ns

CS Fall to First Rising CLK Edge tSUCS 15 — — ns

Data Input Setup Time tSU 10 — — ns

Data Input Hold Time tHD — — 10 ns

CS Rise to Output Disable tDIS ——150ns

CLK Fall to Output Data Valid tDO — — 30 ns

Note 1: If output pulse period (tFP) falls below 984376*2 MCLK periods, then tFW = 1/2 tFP

2: If output pulse period (tHP) falls below 322160*2 MCLK periods, then tHW = 1/2 tHP

. When F2, F1, F0

equals 0,1,1, the HFOUT pulse time is fixed at 64 x MCLK periods or 18 µs for MCLK = 3.58 MHz

3: Specified by characterization, not production tested.

4: Serial timings specified and production tested with 180 pF load.

MCP3909

FIGURE 1-1: Output Timings for Active Power Pulse Outputs and Negative Power Pin.

FIGURE 1-2: Serial Interface Timings showing Output, Rise, Hold, and CS Times.

SDO Rise Time tR—2—ns

SDO Fall Time tF—2—ns

TIMING CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD = DVDD = 4.5V to 5.5V,

AGND, DGND = 0V, MCLK = 3.58 MHz; TA = -40°C to +85°C.

Parameter Sym Min Typ Max Units Comment

Note 1: If output pulse period (tFP) falls below 984376*2 MCLK periods, then tFW = 1/2 tFP

2: If output pulse period (tHP) falls below 322160*2 MCLK periods, then tHW = 1/2 tHP

. When F2, F1, F0

equals 0,1,1, the HFOUT pulse time is fixed at 64 x MCLK periods or 18 µs for MCLK = 3.58 MHz

3: Specified by characterization, not production tested.

4: Serial timings specified and production tested with 180 pF load.

FOUT0

tFP

FOUT1

HFOUT

tFW

tHP

tHW

tFS

tFS2

NEG

CLK

SDI

tSU tHD

tSUCS

tHI tLO

SDO

tDO tRtF

tDIS

tCLK

Hi-z

MCP3909

FIGURE 1-3: SPI Output Pin Loading Circuit During SPI Testing.

SPI Data

Output

VDD

180 pF

RVDD VOL

–()

IOL

-------------------------------=

RVOH

()

IOH

---------------=

MCP3909

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode),

MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz.

FIGURE 2-1: Active Power Measurement

Error (Gain = 8 PF = 1).

FIGURE 2-2: Active Power Measurement

Error (Gain = 16, PF = 1).

FIGURE 2-3: Active Power Measurement

Error (Gain = 2, PF = 1).

FIGURE 2-4: Active Power Measurement

Error (Gain = 8, PF = 0.5).

FIGURE 2-5: Active Power Measurement

Error (Gain = 16, PF = 0.5).

FIGURE 2-6: Active Power Measurement

Error (Gain =2, PF = 0.5).

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0000 0.0001 0.0010 0.0100 0.1000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

-40°C `

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0000 0.0001 0.0010 0.0100 0.1000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

- 40°C

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0001 0.0010 0.0100 0.1000 1.0000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

- 40°C

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.00000.00010.00100.01000.1000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

-40°C

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0000 0.0001 0.0010 0.0100 0.1000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

-40°C

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0001 0.0010 0.0100 0.1000 1.0000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

-40°C

MCP3909

Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode),

MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz.

FIGURE 2-7: Active Power Measurement

Error (Gain = 1, PF = 1).

FIGURE 2-8: Active Power Measurement

Error (Gain = 1, PF = 0.5).

FIGURE 2-9: Channel 0 Offset Error

(DC Mode, HPF off, G = 1, PF = 1).

FIGURE 2-10: Channel 0 Offset Error

(DC Mode, HPF off, G = 2, PF = 1).

FIGURE 2-11: Channel 0 Offset Error

(DC Mode, HPF off, G = 8, PF = 1).

FIGURE 2-12: Channel 0 Offset Error

(DC Mode, HPF Off, G = 16, PF = 1).

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0001 0.0010 0.0100 0.1000 1.0000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

- 40°C

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0001 0.0010 0.0100 0.1000 1.0000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

-40°C

500

1000

1500

2000

2500

3000

-1.77 -1.68 -1.59 -1.50

Bin (mV)

Occurance

16,384 Samples

Mean = -1.62 mV

Std. Dev = 54.6 µV

500

1000

1500

2000

2500

3000

-1.30

-1.27

-1.25

-1.22

-1.20

-1.18

-1.16

-1.13

-1.11

Bin (mV)

Occurance

16384 Samples

Mean = -1.20 mV

Std. Dev. = 25.1 µV

200

400

600

800

1000

1200

-1.72

-1.70

-1.69

-1.68

-1.67

-1.66

-1.65

-1.64

-1.62

-1.61

-1.60

-1.59

Bin (mV)

Occurance

16384 Samples

Mean = -1.65 mV

Std. Dev = 16.99 µV

100

200

300

400

500

600

-1.30 -1.25 -1.23 -1.20 -1.17

Bin (mV)

Occurance

16384 Samples

Mean = - 17.91 mV

Std. Dev = - 1.22 µV

MCP3909

Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode),

MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz.

FIGURE 2-13: Active Power Measurement

Error over VDD, Internal VREF (G = 16, PF = 1).

FIGURE 2-14: Active Power Measurement

Error over VDD, External VREF (G = 1, PF = 1).

FIGURE 2-15: Active Power Measurement

Error vs. Input Frequency (G = 16).

FIGURE 2-16: Active Power Measurement

Error with External VREF (G = 1, PF = 1).

FIGURE 2-17: Active Power Measurement

Error with External VREF (G = 1, PF = 0.5).

FIGURE 2-18: Active Power Measurement

Error with External VREF (G = 2, PF = 1).

-0.15

-0.1

-0.05

0.05

0.1

0.15

0.2

0.25

0.3

0.0001 0.0010 0.0100 0.1000 1.0000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

VDD=4.75V

VDD=5.0V

VDD=4.5V

VDD=5.25V

VDD=5.5V

-0.1

-0.05

0.05

0.1

0.15

0.2

0.0001 0.0010 0.0100 0.1000 1.0000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

VDD=4.5V

VDD=4.75V

VDD=5.0V

VDD=5.25V

VDD=5.5V

-0.5

-0.4

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.4

0.5

45 50 55 60 65 70 75

Frequency (Hz)

% Error

PF = 0.5

PF = 1

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.0001 0.0010 0.0100 0.1000 1.0000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

- 40°C

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0001 0.0010 0.0100 0.1000 1.0000

CH1 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

-40°C

-0.5

-0.4

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.4

0.5

0.0001 0.0010 0.0100 0.1000 1.0000

CH0 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

- 40°C

MCP3909

Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode),

MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz.

FIGURE 2-19: Active Power Measurement

Error with External VREF (G = 2, PF = 0.5).

FIGURE 2-20: Active Power Measurement

Error with External VREF (G = 8, PF = 1).

FIGURE 2-21: Active Power Measurement

Error with External VREF (G = 8, PF = 0.5).

FIGURE 2-22: Active Power Measurement

Error with External VREF (G = 16, PF = 1).

FIGURE 2-23: Active Power Measurement

Error with External VREF (G =16, PF = 0.5).

FIGURE 2-24: Signal-to-Noise and

Distortion Ratio vs. Input Signal Amplitude

(G = 1).

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0001 0.0010 0.0100 0.1000 1.0000

CH1 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C -40°C

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0000 0.0001 0.0010 0.0100 0.1000

CH1 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

-40°C

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0000 0.0001 0.0010 0.0100 0.1000

CH1 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

-40°C

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0000 0.0001 0.0010 0.0100 0.1000

CH1 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C

- 40°C

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

0.6

0.8

0.0000 0.0001 0.0010 0.0100 0.1000

CH1 Vp-p Amplitude (V)

Measurement Error (%)

+85°C

+25°C -40°C

100

0.0001 0.0010 0.0100 0.1000 1.0000

CH0 Vp-p Amplitude (V)

SINAD (dBFS)

100

SINAD (dB)

SINAD (dBFS)

SINAD(dB)

MCP3909

Note: Unless otherwise specified, DVDD, AVDD = 5V; AGND, DGND = 0V; VREF = Internal, HPF = 1 (AC mode),

MCLK = 3.58 MHz, CH1 input = 660 mVP-P at 50 Hz, CH0 amplitude sweeps at 50 Hz.

FIGURE 2-25: Signal-to-Noise and

Distortion Ratio vs. Input Signal Amplitude

(G = 2).

FIGURE 2-26: Signal-to-Noise and

Distortion Ratio vs. Input Signal Amplitude

(G = 8).

FIGURE 2-27: Signal-to-Noise and

Distortion Ratio vs. Input Signal Amplitude

(G = 16).

FIGURE 2-28: Frequency Spectrum, 50 Hz

Input Signal.

100

0.000100 0.001000 0.010000 0.100000 1.000000

CH0 Vp-p Amplitude (V)

SINAD (dBFS)

100

SINAD (dB)

SINAD (dBFS)

SINAD (dB)

100

0.00001 0.0001 0.001 0.01 0.1

CH0 Vp-p Amplitude (V)

SINAD (dBFS)

100

SINAD (dB)

SINAD (dBFS)

100

0.000010 0.000100 0.001000 0.010000 0.100000

CH0 Vp-p Amplitude (V)

SINAD (dBFS)

100

SINAD (dB)

SINAD (dBFS)

SINAD (dB)

-160

-140

-120

-100

-80

-60

-40

-20

0 2000 4000 6000

Frequency (Hz)

Amplitude (dB)

MCP3909

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

3.1 Digital VDD (DVDD)

DVDD is the power supply pin for the digital circuitry

within the MCP3909.

This pin requires appropriate bypass capacitors and

should be maintained to 5V ±10% for specified

operation. Refer to Section 6.0 “Applications

Information”.

3.2 High-Pass Filter Input Logic Pin

(HPF)

HPF controls the state of the high-pass filter in both

input channels. A logic ‘1’ enables both filters,

removing any DC offset coming from the system or the

device. A logic ‘0’ disables both filters allowing DC

voltages to be measured.

3.3 Analog VDD (AVDD)

AVDD is the power supply pin for the analog circuitry

within the MCP3909.

This pin requires appropriate bypass capacitors and

should be maintained to 5V ±10% for specified

operation. Refer to Section 6.0 “Applications

Information”.

3.4 Current Channel (CH0-, CH0+)

CH0- and CH0+ are the fully differential analog voltage

input channels for the current measurement,

containing a PGA for small-signal input, such as shunt

current sensing. The linear and specified region of this

channel is dependant on the PGA gain. This

corresponds to a maximum differential voltage of

±470 mV/G and maximum absolute voltage, with

respect to AGND, of ±1V. Up to ±6V can be applied to

these pins without the risk of permanent damage.

Refer to Section 1.0 “Electrical Characteristics”.

Pin No. Symbol Function

1DV

DD Digital Power Supply Pin

2 HPF High-Pass Filters Control Logic Pin

3AV

DD Analog Power Supply Pin

4 NC No Connect

5 CH0+ Non-Inverting Analog Input Pin for Channel 0 (Current Channel)

6 CH0- Inverting Analog Input Pin for Channel 0 (Current Channel)

7 CH1- Inverting Analog Input Pin for Channel 1 (Voltage Channel)

8 CH1+ Non-Inverting Analog Input Pin for Channel 1 (Voltage Channel)

9MCLR

Master Clear Logic Input Pin

10 REFIN/OUT Voltage Reference Input/Output Pin

11 AGND Analog Ground Pin, Return Path for internal analog circuitry

12 SCK / F2 Serial Clock or Frequency Control for HFOUT Logic Input Pin

13 SDI / F1 Serial Data Input or Frequency Control for FOUT0/1 Logic Input Pin

14 CS / F0 Chip Select or Frequency Control for FOUT0/1 Logic Input Pin

15 G1 Gain Control Logic Input Pin

16 G0 Gain Control Logic Input Pin

17 OSC1 Oscillator Crystal Connection Pin or Clock Input Pin

18 OSC2 Oscillator Crystal Connection Pin or Clock Output Pin

19 NC No Connect

20 SDO / NEG Serial Data Out or Negative Power Logic Output Pin

21 DGND Digital Ground Pin, Return Path for Internal Digital Circuitry

22 HFOUT High-Frequency Logic Output Pin (Intended for Calibration)

23 FOUT1 Differential Mechanical Counter Logic Output Pin

24 FOUT0 Differential Mechanical Counter Logic Output Pin

MCP3909

3.5 Voltage Channel (CH1-,CH1+)

CH1- and CH1+ are the fully differential analog voltage

input channels for the voltage measurement. The linear

and specified region of these channels have a

maximum differential voltage of ±660 mV and a

maximum absolute voltage of ±1V, with respect to

AGND. Up to ±6V can be applied to these pins without

the risk of permanent damage.

Refer to Section 1.0 “Electrical Characteristics”.

3.6 Master Clear (MCLR)

MCLR controls the reset for both delta-sigma ADCs, all

digital registers, the SINC filters for each channel and

all accumulators post multiplier. The MCLR pin is also

used to change pin functionality and enter the serial

interface mode. A logic ‘0’ resets all registers and holds

both ADCs in a Reset condition. The charge stored in

both ADCs is flushed and their output is maintained to

0x0000h. The only block consuming power on the

digital power supply during Reset is the oscillator

circuit.

3.7 Reference (REFIN/OUT)

REFIN/OUT is the output for the internal 2.4V

reference. This reference has a typical temperature

coefficient of 15 ppm/°C and a tolerance of ±2%. In

addition, an external reference can also be used by

applying voltage to this pin within the specified range.

This pin requires appropriate bypass capacitors to

AGND, even when using the internal reference only.

Refer to Section 6.0 “Applications Information”.

3.8 Analog Ground (AGND)

AGND is the ground connection to internal analog

circuitry (ADCs, PGA, band gap reference, POR). To

ensure accuracy and noise cancellation, this pin must

be connected to the same ground as DGND, preferably

with a star connection. If an analog ground plane is

available, it is recommended that this device be tied to

this plane of the PCB. This plane should also reference

all other analog circuitry in the system.

3.9 Serial Clock Input or F2 Frequency

Control Pin

This dual function pin can act as either the serial clock

input for SPI communication or the F2 selection for the

high-frequency output and low-frequency output pin

ranges, changing the value of the constants FC and

HFC used in the device transfer function. FC and HFC

are the frequency constants that define the period of

the output pulses for the device.

3.10 Serial Data Input or F1 Frequency

Control Pin

This dual function pin can act as either the serial data

input for SPI communication or the F1 selection for the

high-frequency output and low-frequency output pin

ranges, changing the value of the constants FC and

HFC used in the device transfer function. FC and HFC

are the frequency constants that define the period of

the output pulses for the device.

3.11 Chip Select (CS) or F0 Frequency

Control Pin

This dual function pin can act as either the chip select

for SPI communication or the F0 selection for the high-

frequency output and low-frequency output pin ranges

by changing the value of the constants FC and HFC

used in the device transfer function. FC and HFC are

the frequency constants that define the period of the

output pulses for the device.

3.12 Gain Control Logic Pins (G1, G0)

G1 and G0 select the PGA gain (G) on Channel 0 from

four different values: 1, 2, 8 and 16.

3.13 Oscillator (OSC1, OSC2)

OSC1 and OSC2 provide the master clock for the

device. A resonant crystal or clock source with a similar

sinusoidal waveform must be placed across these pins

to ensure proper operation. The typical clock frequency

specified is 3.579545 MHz. However, the clock

frequency can be within the range of 1 MHz to 4 MHz

without disturbing measurement error. Appropriate

load capacitance should be connected to these pins for

proper operation.

A full-swing, single-ended clock source may be

connected to OSC1 with proper resistors in series to

ensure no ringing of the clock source due to fast

transient edges.

3.14 Serial Data Output or Negative

Power Output Logic Pin (NEG)

This dual function pin can act as either the serial data

output for SPI communication or NEG. NEG detects

the phase difference between the two channels and will

go to a logic ‘1’ state when the phase difference is

greater than 90° (i.e., when the measured real power is

negative). The output state is synchronous with the

rising-edge of HFOUT and maintains the logic ‘1’ until

the real power becomes positive again and HFOUT

shows a pulse.

MCP3909

3.15 Ground Connection (DGND)

DGND is the ground connection to internal digital

circuitry (SINC filters, multiplier, HPF, LPF, digital-to-

frequency converter and oscillator). To ensure

accuracy and noise cancellation, DGND must be

connected to the same ground as AGND, preferably

with a star connection. If a digital ground plane is

available, it is recommended that this device be tied to

this plane of the Printed Circuit Board (PCB). This

plane should also reference all other digital circuitry in

the system.

3.16 High-Frequency Output (HFOUT)

HFOUT is the high-frequency output of the device and

supplies the instantaneous real-power information. The

output is a periodic pulse output, with its period propor-

tional to the measured real power, and to the HFC

constant defined by F0, F1 and F2 pin logic states. This

output is the preferred output for calibration due to

faster output frequencies, giving smaller calibration

times. Since this output gives instantaneous real

power, the 2ω ripple on the output should be noted.

However, the average period will show minimal drift.

3.17 Frequency Output (FOUT0, FOUT1)

FOUT0 and FOUT1 are the frequency outputs of the

device that supply the average real-power information.

The outputs are periodic pulse outputs, with its period

proportional to the measured real power, and to the FC

constant, defined by F0 and F1 pin logic states. These

pins include high-output drive capability for direct use

of electromechanical counters and 2-phase stepper

motors. Since this output supplies average real power,

any 2ω ripple on the output pulse period is minimal.

MCP3909

4.0 DEVICE OVERVIEW

The MCP3909 is an energy metering IC that serves two

distinct functions that can operate simultaneously:

- Active Power Pulse Output

- Waveform Output via SPI Interface

For the active power output, the device supplies a

frequency output proportional to active (real) power,

and higher frequency output proportional to the

instantaneous power for meter calibration.

For the waveform output, it can be used serially to

gather 16-bit voltage channel and current channel A/D

data, or 20-bit wide multiplier output data. Both

channels use 16-bit, second-order, delta-sigma ADCs

that oversample the input at a frequency equal to

MCLK/4, allowing for wide dynamic range input signals.

A Programmable Gain Amplifier (PGA) increases the

usable range on the current input channel (Channel 0).

Figure 4-1 represents the simplified block diagram of

the MCP3909, detailing its main signal processing

blocks.

Two digital high-pass filters cancel the system offset on

both channels such that the real-power calculation

does not include any circuit or system offset. After

being high-pass filtered, the voltage and current signals

are multiplied to give the instantaneous power signal.

This signal does not contain the DC offset components,

such that the averaging technique can be efficiently

used to give the desired active-power output.

4.1 Active Power

The instantaneous power signal contains the active-

power information; it is the DC component of the

instantaneous power. The averaging technique can be

used with both sinusoidal and non-sinusoidal wave-

forms, as well as for all power factors. The

instantaneous power is thus low-pass filtered in order

to produce the instantaneous real-power signal.

A digital-to-frequency converter accumulates the

instantaneous active real power information to produce

output pulses with a frequency proportional to the

average real power. The low-frequency pulses present

at the FOUT0 and FOUT1 outputs are designed to drive

electromechanical counters and two-phase stepper

motors displaying the real-power energy consumed.

Each pulse corresponds to a fixed quantity of real

energy, selected by the F2, F1 and F0 logic settings. The

HFOUT output has a higher frequency setting and less

integration period such that it can represent the instanta-

neous real-power signal. Due to the shorter accumula-

tion time, it enables the user to proceed to faster

calibration under steady load conditions (see

Section 4.8 “Active Power FOUT0/1 and HFOUT Out-

put Frequencies”).

FIGURE 4-1: Active Power Signal Flow with Frequency Contents.

HPF

...1010..

DTF

ADC

PGA

LPF

HPF

CH0+

CH0-

CH1+

CH1-

ADC

OUT0

OUT1

OUT

INSTANTANEOUS

POWER

INSTANTANEOUS

REAL POWER

0 0

MCP3909

DC Offset

removed by HPF

ADC Output code

contains System

and ADC offset

Input Signal with

System offset and

line frequency

0 00

Frequency

Content

ANALOG DIGITAL

MCP3909

4.2 Analog Inputs

The MCP3909 analog inputs can be connected directly

to the current and voltage transducers (such as shunts

or current transformers). Each input pin is protected by

specialized ESD structures that are certified to pass

4 kV HBM and 400V MM contact charge. These

structures also allow up to ±6V continuous voltage to

be present at their inputs without the risk of permanent

damage.

Both channels have fully differential voltage inputs for

better noise performance. The absolute voltage at each

pin relative to AGND should be maintained in the ±1V

range during operation in order to ensure the measure-

ment error performance. The common-mode signals

should be adapted to respect both the previous

conditions and the differential input voltage range. For

best performance, the common-mode signals should

be referenced to AGND.

The current channel comprises a PGA on the front-end

to allow for smaller signals to be measured without

additional signal conditioning. The maximum

differential voltage specified on Channel 0 is equal to

±470 mV/Gain (see Table 4-1). The maximum peak

voltage specified on Channel 1 is equal to ±660 mV.

4.3 16-Bit Delta-Sigma A/D Converters

The ADCs used in the MCP3909 for both current and

voltage channel measurements are delta-sigma ADCs.

They comprise a second-order, delta-sigma modulator

using a multi-bit DAC and a third-order SINC filter. The

delta-sigma architecture is very appropriate for the

applications targeted by the MCP3909 because it is a

waveform-oriented converter architecture that can offer

both high linearity and low distortion performance

throughout a wide input dynamic range. It also creates

minimal requirements for the anti-aliasing filter design.

The multi-bit architecture used in the ADC minimizes

quantization noise at the output of the converters

without disturbing the linearity.

Both ADCs have a 16-bit resolution, allowing wide input

dynamic range sensing. The oversampling ratio of both

converters is 64. Both converters are continuously

converting during normal operation. When the MCLR

pin is low, both converters will be in Reset and output

code 0x0000h. If the voltage at the inputs of the ADC is

larger than the specified range, the linearity is no longer

specified. However, the converters will continue to

produce output codes until their saturation point is

reached. The DC saturation point is around 700 mV for

Channel 0 and 1V for Channel 1, using internal voltage

reference. The output code will be locked past the

saturation point to the maximum output code.

The clocking signals for the ADCs are equally

distributed between the two channels in order to

minimize phase delays to less than 1 MCLK period

(see Section 3.2 “High-Pass Filter Input Logic Pin

(HPF)”). The SINC filters main notch is positioned at

MCLK/256 (14 kHz with MCLK = 3.58 MHz), allowing

the user to be able to measure wide harmonic content

on either channel. The data ready signals used for

synchronization of the part with a MCU will come at a

rate of MCLK/256 and a pipeline delay of 3 data readys

is required to settle the SINC 3rd order digital filter. The

magnitude response of the SINC filter is shown in

Figure 4-2.

FIGURE 4-2: SINC Filter Magnitude

Response (MCLK = 3.58 MHz).

4.4 Ultra-Low Drift VREF

The MCP3909 contains an internal voltage reference

source specially designed to minimize drift over

temperature. This internal VREF supplies reference

voltage to both current and voltage channels ADCs.

The typical value of this voltage reference is 2.4V

±100 mV. The internal reference has a very low typical

temperature coefficient of ±15 ppm/°C, allowing the

output frequencies to have minimal variation with

respect to temperature since they are proportional to

(1/VREF)².

The output pin for the voltage reference is REFIN/OUT.

Appropriate bypass capacitors must be connected to

the REFIN/OUT pin for proper operation (see

Section 6.0 “Applications Information”). The

voltage reference source impedance is typically 4 kΩ,

which enables this voltage reference to be overdriven

by an external voltage reference source.

If an external voltage reference source is connected to

the REFIN/OUT pin, the external voltage will be used

as the reference for both current and voltage channel

ADCs. The voltage across the source resistor will then

TABLE 4-1: GAIN SELECTIONS

G1 G0 CH0 Gain Maximum

CH0 Voltage

00 1±470mV

01 2±235mV

10 8±60mV

11 16 ±30 mV

-120

-100

-80

-60

-40

-20

0 5 10 15 20 25 30

Frequency (kHz)

Normal Mode Rejection (dB)

MCP3909

be the difference between the internal and external

voltage. The allowed input range for the external

voltage source goes from 2.2V to 2.6V for accurate

measurement error. A VREF value outside of this range

will cause additional heating and power consumption

due to the source resistor, which might affect measure-

ment error.

4.5 Power-On Reset (POR)

The MCP3909 contains an internal POR circuit that

monitors analog supply voltage AVDD during operation.

This circuit ensures correct device startup at system

power-up and system power-down events. The POR

circuit has built-in hysteresis and a timer to give a high

degree of immunity to potential ripple and noise on the

power supplies, allowing proper settling of the power

supply during power-up. A 0.1 µF decoupling capacitor

should be mounted as close as possible to the AVDD

pin, providing additional transient immunity (see

Section 6.0 “Applications Information”).

The threshold voltage is typically set at 4V, with a

tolerance of about ±5%. If the supply voltage falls

below this threshold, the MCP3909 will be held in a

Reset condition (equivalent to applying logic ‘0’ on the

MCLR pin). The typical hysteresis value is approxi-

mately 200 mV in order to prevent glitches on the

power supply.

Once a power-up event has occurred, an internal timer

prevents the part from outputting any pulse for

approximately 1s (with MCLK = 3.58 MHz), thereby

preventing potential metastability due to intermittent

resets caused by an unsettled regulated power supply.

Figure 4-3 illustrates the different conditions for a

power-up and a power-down event in the typical

conditions.

FIGURE 4-3: Power-on Reset Operation.

4.6 High-Pass Filters and Multiplier

The active real-power value is extracted from the DC

instantaneous power. Therefore, any DC offset

component present on Channel 0 and Channel 1

affects the DC component of the instantaneous power

and will cause the real-power calculation to be

erroneous. In order to remove DC offset components

from the instantaneous power signal, a high-pass filter

has been introduced on each channel. Since the high-

pass filtering introduces phase delay, identical high-

pass filters are implemented on both channels. The

filters are clocked by the same digital signal, ensuring

a phase difference between the two channels of less

than one MCLK period. Under typical conditions

(MCLK = 3.58 MHz), this phase difference is less than

0.005°, with a line frequency of 50 Hz. The cut-off

frequency of the filter (4.45 Hz) has been chosen to

induce minimal gain error at typical line frequencies,

allowing sufficient settling time for the desired

applications. The two high-pass filters can be disabled

by applying logic ‘0’ to the HPF pin.

FIGURE 4-4: HPF Magnitude Response

(MCLK = 3.58 MHz).

The multiplier output gives the product of the two high-

pass filtered channels, corresponding to instantaneous

real power. Multiplying two sine wave signals by the

same ω frequency gives a DC component and a 2ω

component. The instantaneous power signal contains

the real power of its DC component, while also

containing 2ω components coming from the line

frequency multiplication. These 2ω components come

for the line frequency (and its harmonics) and must be

removed in order to extract the real-power information.

This is accomplished using the low-pass filter and DTF

converter.

4.7 Active Power Low-Pass Filter and

DTF Converter

For the active power signal calculation, the MCP3909

uses a digital low-pass filter. This low-pass filter is a

first-order IIR filter, which is used to extract the active

real-power information (DC component) from the

instantaneous power signal. The magnitude response

of this filter is detailed in Figure 4-5. Due to the fact that

the instantaneous power signal has harmonic content

(coming from the 2ω components of the inputs), and

AVDD

4.2V

DEVICE

MODE

RESET PROPER

OPERATION RESET

PULSE

OUT

Time

-40

-35

-30

-25

-20

-15

-10

-5

0.1 1 10 100 1000

Frequency (Hz)

Normal Mode Rejection (dB)

MCP3909

since the filter is not ideal, there will be some ripple at

the output of the low-pass filter at the harmonics of the

line frequency.

The cut-off frequency of the filter (8.9 Hz) has been

chosen to have sufficient rejection for commonly-used

line frequencies (50 Hz and 60 Hz). With a standard

input clock (MCLK = 3.58 MHz) and a 50 Hz line

frequency, the rejection of the 2ω component (100 Hz)

will be more than 20 dB. This equates to a 2ω

component containing 10 times less power than the

main DC component (i.e., the average active real

power).

FIGURE 4-5: LPF1 Magnitude Response

(MCLK = 3.58 MHz).

The output of the low-pass filter is accumulated in the

digital-to-frequency converter. This accumulation is

compared to a different digital threshold for FOUT0/1

and HFOUT

, representing a quantity of real energy

measured by the part. Every time the digital threshold

on FOUT0/1 or HFOUT is crossed, the part will output a

pulse (See Section 4.8 “Active Power FOUT0/1 and

HFOUT Output Frequencies”).

The equivalent quantity of real energy required to

output a pulse is much larger for the FOUT0/1 outputs

than the HFOUT

. This is such that the integration period

for the FOUT0/1 outputs is much larger. This larger

integration period acts as another low-pass filter so that

the output ripple due to the 2ω components is minimal.

However, these components are not totally removed,

since realized low-pass filters are never ideal. This will

create a small jitter in the output frequency. Averaging

the output pulses with a counter or a MCU in the

application will then remove the small sinusoidal

content of the output frequency and filter out the

remaining 2ω ripple.

HFOUT is intended to be used for calibration purposes

due to its instantaneous power content. The shorter

integration period of HFOUT demands that the 2ω

component be given more attention. Since a sinusoidal

signal average is zero, averaging the HFOUT signal in

steady-state conditions will give the proper real energy

value.

4.8 Active Power FOUT0/1 and HFOUT

Output Frequencies

The thresholds for the accumulated energy are

different for FOUT0/1 and HFOUT (i.e., they have

different transfer functions). The FOUT0/1 allowed

output frequencies are quite low in order to allow

superior integration time (see Section 4.7 “Active

Power Low-Pass Filter and DTF Converter”). The

FOUT0/1 output frequency can be calculated with the

following equation:

EQUATION 4-1: FOUT FREQUENCY

OUTPUT EQUATION

For a given DC input V, the DC and RMS values are

equivalent. For a given AC input signal with amplitude

of V, the equivalent RMS value is V/ sqrt(2), assuming

purely sinusoidal signals. Note that since the real

power is the product of two RMS inputs, the output fre-

quencies of AC signals are half of the DC inputs ones,

again assuming purely sinusoidal AC signals. The

constant FC depends on the FOUT0 and FOUT1 digital

settings. Table 4-2 shows FOUT0/1 output frequencies

for the different logic settings.

-40

-35

-30

-25

-20

-15

-10

-5

0.1 1 10 100 1000

Frequency (Hz)

Normal Mode Rejection (dB)

FOUT Hz() 8.06 V0

××

VREF

()

-----------------------------------------------------------=

Where:

V0=the RMS differential voltage on Channel 0

V1=the RMS differential voltage on Channel 1

G=the PGA gain on Channel 0 (current

channel)

FC=the frequency constant selected

VREF =the voltage reference

TABLE 4-2: ACTIVE POWER OUTPUT FREQUENCY CONSTANT FC FOR FOUT0/1 (VREF =2.4V)

F1 F0 FC (Hz) FC (Hz)

(MCLK = 3.58 MHz)

FOUT Frequency (Hz)

with Full-Scale

DC Inputs

FOUT Frequency (Hz)

with Full-Scale

AC Inputs

00MCLK/221 1.71 0.74 0.37

01MCLK/220 3.41 1.48 0.74

10MCLK/219 6.83 2.96 1.48

11MCLK/218 13.66 5.93 2.96

MCP3909

The high-frequency output HFOUT has lower

integration times and, thus, higher frequencies. The

output frequency value can be calculated with the

following equation:

EQUATION 4-2: ACTIVE POWER HFOUT

FREQUENCY OUTPUT

EQUATION

The constant HFC depends on the FOUT0 and FOUT1

digital settings with the Ta b le 4-3.

The detailed timings of the output pulses are described

in the Timing Characteristics table (see Section 1.0

“Electrical Characteristics” and Figure 1-1).

4.8.1 MINIMAL OUTPUT FREQUENCY

FOR NO-LOAD THRESHOLD

The MCP3909 also includes, on each output

frequency, a no-load threshold circuit that will eliminate

any creep effects in the meter. The outputs will not

show any pulse if the output frequency falls below the

no-load threshold. This threshold only applies to the

pulse outputs and does not gate any serial data coming

from either the A/D output or the multiplier output. The

minimum output frequency on FOUT0/1 and HFOUT is

equal to 0.0015% of the maximum output frequency

(respectively FC and HFC) for each of the F2, F1 and F0

selections (see Ta b l e 4 - 2 and Ta b l e 4 - 3 ); except when

F2, F1, F0 = 011. In this last configuration, the no-load

threshold feature is disabled. The selection of FC will

determine the start-up current load. In order to respect

the IEC standards requirements, the meter will have to

be designed to allow start-up currents compatible with

the standards by choosing the FC value matching

these requirements. For additional applications

information on no-load threshold, startup current and

other meter design points, refer to AN994, "IEC Com-

pliant Active Energy Meter Design Using The

MCP3905/6”, (DS00994).

TABLE 4-3: OUTPUT FREQUENCY CONSTANT HFC FOR HFOUT (VREF =2.4V)

HFOUT Hz() 8.06 V0

×V1G×× HFC

VREF

()

----------------------------------------------------------------=

Where:

V0=the RMS differential voltage on Channel 0

V1=the RMS differential voltage on Channel 1

G=the PGA gain on Channel 0 (current

channel)

HFC=the frequency constant selected

VREF =the voltage reference

F2 F1 F0 HFCHFC (Hz) HFC (Hz)

(MCLK = 3.58 MHz)

HFOUT Frequency (Hz) with

full-scale AC Inputs

000 64 x FCMCLK/215 109.25 27.21

001 32 x FCMCLK/215 109.25 27.21

010 16 x FCMCLK/215 109.25 27.21

0112048 x FCMCLK/2727968.75 6070.12

100128 x FCMCLK/216 219.51 47.42

101 64 x FCMCLK/216 219.51 47.42

110 32 x FCMCLK/216 219.51 47.42

111 16 x FCMCLK/216 219.51 47.42

MCP3909

5.0 SERIAL INTERFACE

DESCRIPTION

5.1 Dual Functionality Pin And Serial

Interface Overview

The MCP3909 device contains three serial modes that

are accessible by changing the pin functionality of the

NEG, F2, F1, and F0 pins to SDO, SCK, SDI and CS,

respectively.

These modes are entered by giving the MCP3909

device a serial command on these pins during a time

window after device reset or POR. During this window

of time, F2 acts as SCK, F1 acts as SDI and F0 acts

as CS. Once a serial mode has been entered, the

device must be reset to disable mode functionality, or

change to another serial mode. This is done by using

MCLR pin or power on reset event.

During serial mode entry and the three serial modes,

data is clocked into the device on the rising edge of

SCK and out of the device on the falling edge of SCK.

The SPI data can be access at up to 20 MHz. This

speed enables quick data retrieval in between

conversion times. For 3-phase metering applications

with multiple ADCs, this fast communication is essen-

tial to allow for power calculation windows between

conversions, as shown in Figure 5-3.

After a serial mode has been entered, all blocks of the

MCP3909 device are still operational. The PGA, A/D

converters, HPF, multiplier, LPF, and other digital

sections are still functional, allowing the device to have

true dual functionality in energy metering systems.

FIGURE 5-1: Dual Functionality Pins for

the MCP3909.

FIGURE 5-2: Data Access between Data Ready Pulses using SPI Interface for a 3-phase System.

FOUT0

DGND

NEG / SDO

FOUT1

CLKOUT

CLKIN

DVDD

HPF

AVDD

CH0+

CHO-

CH1-

CH1+

HFOUT

9G0

MCLR

F0 / CS

REFIN / OUT

AGND

12 F1 / SDI

F2 / SCK

tSAMPLE

tLINE_CYC

SDO DR

Phase A,B,C I & V Data

16 bits DR

tSAMPLE

IRQ

x 6 ADCs

MCP3909

FIGURE 5-3: Dual Functionality Pin Serial Mode Entry Protocol.

D3 D2 D1 D0

D5 D4D7 D6

12345678

MCLR

tWINSET

tWINDOW

F1 / SDI

F2 / SCK

F0 / CS

MCP3909

5.2 Serial Mode Entry Codes

The MCP3909 devices contains three different serial

modes with data presented in 2's complement coding.

• Multiplier Output

• Dual Channel Output

•Filter Input

After entering any of these modes the active power

calculation block is still functional and presents output

pulses on FOUT0, FOUT1, and HFOUT

. For this reason,

the F2, F1, F0 output frequency selection constant can

be changed with multiple command bytes for serial

mode entry.

The command bytes to enter these modes are

described in Ta b l e 5 - 1 .

TABLE 5-1: ENTRY CODES

Command

D7......D0 Serial Mode

Internal State of F2, F1, F0 Constants Frequency

Selection During Serial Mode (1)

F2 F1 F0

1 0 1 0 0 0 0 1 Multiplier Output 0 F1 pin 1

1 0 1 0 1 0 0 1 Multiplier Output 1 F1 pin 1

1 0 1 0 0 1 0 0 Dual Channel Output Pre HPF1 0 F1 pin 1

1 0 1 0 1 1 0 0 Dual Channel Output Post HPF1 1 F1 pin 1

1 0 1 0 1 0 1 0 Filter Input 1 0 F0 pin

1 0 1 0 1 1 1 0 Filter Input 1 1 F0 pin

1 0 1 0 0 0 1 0 Filter Input 0 0 F0 pin

1 0 1 0 0 1 1 0 Filter Input 0 1 F0 pin

Note 1: The active power frequency outputs FOUT0, FOUT1, and HFOUT remain active after serial mode entry.

Leaving the SDI (F1) and CS (F0) pins at a known state after serial communication will control the

frequency selection. The HPF pin controls the state of the HPF for the multiplier mode output and the out-

put pulses from the active power D to F block.

MCP3909

5.3 Multiplier Output Mode

Multiplier mode allows the user to retrieve the output

of the multiplier on the MCP3909 device. Data is

presented in a 20 bit (19 bit + sign) protocol, MSB first.

A data ready flag (DR) is output for every MCLK/256

clock cycles and a new multiplier output value is

ready. If the multiplier value is not clocked out of the

device it will be over-written. Data is clocked out on the

rising edge of SCK.

FIGURE 5-4: Multiplier Output Mode.

TABLE 5-2: MULTIPLIER OUTPUT MODE CODING

Binary Decimal

0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 +524287

0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 +524286

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0

1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 -1

1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 -524287

1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -524288

Multiplier Code CH0+CH0–

–()CH1+CH1–

–()

VREF 2

--------------------------------------------------------------------------------- 524288 8.06 G

•••

F1 / SDI

D3 D2 D1 D0

Hi-z

D16D17

123 17 18 19 20

Hi-z

X 20

DR 0

D18D19

F2 / SCK

NEG / SDO

F0 / CS

SIGN MSB LSB

MCP3909

5.4 Dual Channel Output Mode

This mode allows the user to retrieve the individual

channel information from the ADC outputs. The ADC

outputs of both channels are synchronized together

and their data ready is represented by the data ready

pulse on SDO. If the ADC output values are not clocked

out of the device, they will be over-written. A 32-bit data

word is given, each channel is 16 bits (15 bits + sign),

presented in 2's complement coding. Channel 1 comes

first then channel 0.

A data ready flag (DR) is output for every MCLK / 256

clock cycles and a new filter output value is ready. If the

dual channel output values are not clocked, and is not

clocked out of the device, they will be over-written.

The following formulas relate the channel input

voltages to their respective output code. The code

locks to +32767 on the positive side, and to -32768 on

the negative side.

5.5 High-Pass Filter Control

There are two options for the channel output data. The

first options collects the channel data pre-high pass fil-

ter, or the output of the SINC filter of the delta sigma

modulator. The second option collects the channel data

post high pass filter. It is important to note that the HPF

pin controls the state of the high pass filter for this sec-

ond option. If the HPF pin is low, the post high pass fil-

ter mode will output all zero's. This HPF pin must be

high to access the post HPF data in the channel output

mode.

FIGURE 5-5: Dual Channel Output Mode.

Channel 1 Code

VIN+ VIN-

–()

VREF

------------------------------------ 32768 8.06 0.47

0.66

-----------

⎝⎠

⎛⎞

××

Channel 0 Code

VIN+ VIN-

–()

VREF

------------------------------------

⎝⎠

⎜⎟

⎛⎞

32768 8.06 0.66

0.47

-----------

⎝⎠

⎛⎞

PGA

×××

TABLE 5-3: CHANNEL OUTPUT MODE

CODING

Binary Decimal

0 111 1111 1111 1111 + 32,767

0 111 1111 1111 1110 + 32,766

0 000 0000 0000 0000 0

1 111 1111 1111 1111 -1

1 000 0000 0000 0001 - 32,767

1 000 0000 0000 0000 - 32,768

D15 D14 D1 D0

Hi-z

D16D17

1215 17 18 31 32

Hi-z

X 32

DR D30D31

F1 / SDI

F2 / SCK

NEG / SDO

F0 / CS

X 16 X 16

Channel 1 Channel 0

MCP3909

5.6 Filter Input Mode

The filter input mode allows the user to feed the

MCP3909 device an input to the LPF1. Data is

received MSB first. The MCP3909 will treat this data

as if it were the output of the multiplier and will LPF

and D-F the result as normal, giving the resulting

output frequency on HFOUT

, FOUT0 and FOUT1. See

Tables 4-2 and 4-3 for transfer functions of the output

frequencies.

When using filter input mode, the user must wait for

the data ready flag (DR) to appear on SDO before

attempting to clock in data to the device. The user can

not access either the multiplier output or the dual

channel output while in this mode.

FIGURE 5-6: Filter Input Mode.

D3 D2 D1 D0 Hi-z

D16D18 D17

123 17 18 19 20

X 20

D19

Hi-z DR

F1 / SDI

F2 / SCK

NEG / SDO

F0 / CS

MCP3909

5.7 Using the MCP3909 with

Microcontroller (MCU) SPI Ports

With microcontroller SPI ports, it is required to send

groups of eight bits. It is also required that the micro-

controller SPI port be configured to clock out data on

the falling edge of clock and latch data in on the rising

edge, or vice versa depending on the mode.

5.7.1 SPI MODE DEFINITIONS

The following table represents the standard SPI mode

terminology, the respective PIC bit settings, and a

description of compatibility for the MCP3909 device.

The MCP3909 works in SPI mode 0,1 mode, that is the

data is clocked out of the part on the rising edge and

clocked in on the falling edge of SCK.

TABLE 5-4: SPI MODE COMPATIBILITY

Standard SPI

Mode

Terminology

PIC Control Bits

State MCP3909

Compatibility Description

CKP CKE

0,0 0 1 — Idle state for clock is low level, transmit (from PIC)

occurs from active to idle clock state

0,1 0 0 √Idle state for clock is low level, transmit (from PIC)

occurs from idle to active clock state

1,0 1 1 — Idle state for clock is high level, transmit (from PIC)

occurs from active to idle clock state

1,1 1 0 — Idle state for clock is high level, transmit (from PIC)

occurs from idle to active clock state

MCP3909

FIGURE 5-7: Multiplier Output Mode 1 SPI Communication using 8-bit segments (Mode 0,1: SCK

idles low).

1234 5678 910111213141516

D19 D15 D14 D13 D12 D11 D10 D9 D8

MCU latches data from

Data is clocked out

on rising edges of SCK

Device on falling edges of SCK

Don’t Care

XXX XXX

D15 D14 D13 D12 D11 D10 D9 D8

D19 D18 D17 D16

MCU Transmit Buffer

MCU Receive Buffer

Data stored into MCU receive register

after transmission of first 8 bits

Data stored into MCU receive register

after transmission of second 8 bits

D18 D17 D16

17 18 19 20 21 22 23 24

D2 D1 D0

D3 D2 D1 D0

MCU Transmit Buffer

MCU Receive Buffer

Data stored into MCU receive register

after transmission of third 8 bits

D7 D6 D5 D4

Don’t Care

X = Don’t Care Bits

N = Null Bits

0000

D7 D6 D5 D4

F1 / SDI

F2 / SCK

NEG / SDO

F0 / CS

F2 / SCK

F1 / SDI

NEG / SDO

MCP3909

FIGURE 5-8: Dual Channel Output Mode SPI Communication using 8-bit segments (Mode 0,1:

SCK idles low).

1 2 3 4 5 6 7 8 9 1011 1213 1415 16

D14 D13 D12 D11 D7 D6 D5 D4 D3 D2 D1 D0

MCU latches data from

Data is clocked out

on rising edges

Device on falling edges of SCK

Don’t Care

XXX XXX

D7 D6 D5 D4 D3 D2 D1 D0

D11 D10 D9 D8

MCU Transmit Buffer

MCU Receive Buffer

CH0 Data stored into MCU receive regis-

ter after transmission of first 8 bits

CH0 Data stored into MCU receive register

after transmission of second 8 bits

D15 D10 D9 D8

D15 D14 D13 D12

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

MCU latches data from

Data is clocked out

on rising edges

Device on falling edges of SCK

Don’t Care

XXX XXX

D7 D6 D5 D4 D3 D2 D1 D0

D11 D10 D9 D8

MCU Transmit Buffer

MCU Receive Buffer

CH1 Data stored into MCU receive regis-

ter after transmission of third 8 bits

CH1 Data stored into MCU receive register

after transmission of fourth 8 bits

D15 D14 D13 D12

CHANNEL 0

CHANNEL 1

D14 D13 D12 D11 D7 D6 D5 D4 D3 D2 D1 D0D15 D10 D9 D8

F1 / SDI

F2 / SCK

NEG / SDO

F0 / CS

F1 / SDI

F2 / SCK

NEG / SDO

F0 / CS

MCP3909

6.0 APPLICATIONS INFORMATION

The following application figures represent meter

designs using the MCP3909 device. Some of these

applications ideas are available as fully function meter

reference designs and demo boards. For complete

schematic and for fully function meter designs, visit

Microchip’s web page for demo board and reference

design availability.

6.1 Performing RMS, Apparent Power,

and Active Power using MCP3909

Waveform data

Figure 6-1 represents power calculations from wave-

form data based on a PIC MCU and MCP3909 device.

The PIC MCU accomplishes the following energy

meter calculation outputs per phase, per line cycle:

- RMS Current

-RMS Voltage

- Active Power

- Apparent Power

Output registers for the power quantities and calibra-

tion registers for phase, offset, gain, and LSB adjust-

ment are available through a serial interface to the PIC

microcontroller. See Microchip’s web page for firmware

solution and demo board.

The example signal flow here shows 4 output power

quantities and 6 calibration registers. For a 60 Hz

design that is using 128 samples per line cycle for the

power calculation the MCP3909 would have a new

data ready pulse every 130 µs. The SPI communica-

tion to gather 16-bits x 2 channels at 10 MHz is

approximately 3.2 µs, leaving ~125 µs for the power

calculations before the next sample is ready.

FIGURE 6-1: Power Calculations from Waveform sampling using PIC MCU. Register names shown

are used on MCP3909 Energy Meter Reference Design.

PHA_W_OFF:32

PHA_W_GAIN:16

PHA_DELAY:8

PHA_V_RMS_OFF:16

PHA_VA_GAIN:16

ADC

CURRENT

VOLTAGE

Active Power

RMS Current

RMS Voltage

Apparent Power

MCP3909

PHA_I_RMS_OFF:16

PIC Microcontroller

MCP3909

6.2 Achieving Line Cycle Sampling

with Zero Blind Cycles

In most energy meter applications, it will be necessary

to have 2N samples for each 50 or 60 Hz line cycle,

where N is typically 64, 128 or 256. Controlling the

MCLK of the MCP3909 allows you to control the

sample rate and ultimately the data ready (DR) pulses

for coherent waveform sampling. The following

scheme shows how the TIMER and COMPARATOR

modules of the PIC MCU can be used to generate the

clock for the MCP3909 from either a PLL internal

MCLK. For class 0.2 or class 0.1 meter designs that

require harmonic analysis using a PLL is recom-

mended to shift sample rate with line cycle drift, e.g.

line cycle changes from 60 Hz to 59.1 Hz. This is

shown as option 1 in Figure 6-2.

A simpler lower cost option would be to choose a

frequency that would give an integer number of line

cycles for exactly 50 Hz (or 60 Hz). This is possible

using a 39.3216 MHz crystal for the PIC18F device.

Figure 6-2 shows example clock frequencies to

achieve 128 samples for each line cycle, 1.63 MHz for

a 50 Hz line, or 1.96 MHz for a 60 Hz line. The

MCP3909 clock can operate from 1 MHz to 4 MHz.

Using this approach, the PIC MCU can gather the

waveform data immediately after the data ready pulse,

at up to 10 MHz. The remainder of the time can be used

to calculate the power measurements to achieve true

line cycle sampling with zero blind cycles.

For more information and firmware, see the Microchip’s

web page for demo board information.

FIGURE 6-2: Using the PIC device to control the MCP3909 MCLK to achieve 2N samples per line

cycle, 3-phase sampling shown with 6 ADCs

50 (or 60 Hz)

PLL Circuit

x 32768

Phase A || B || C

MCP3909 MCP3909 MCP3909

39.3216 MHz

PIC MCU

CCP2 / 32768

(50 or 60 Hz)

tSAMPLE

tLINE_CYC

SDO DR

Phase A,B,C I & V Data

16 bits DR

tSAMPLE

IRQ

Option 1 Option 2

1.63 MHz (50)

3.579 MHz

MCLK input

DR Pulse

To PIC MCU

SDO

IRQ

1.96 MHz (60)

x 6 ADCs

128 samples/line cycle

MCP3909

FIGURE 6-3: Simplified MCU Based Energy Meter.

6.3 Meter Calibration

To achieve meter calibration the MCP3909 waveform

samples are adjusted during the power calculations on

the PIC MCU. In Figure 6-3, this interface is shown via

RS-232 on the PIC microcontroller. This process is

streamlined using calibration software available from

Microchip’s web site.

6.4 Analog Meter Design Tips

For analog design tips and PCB layout recommenda-

tions, refer to AN994, "IEC Compliant Active Energy

Meter Design Using The MCP390X” (DS00994). This

application note includes all required energy meter

design information, including the following:

• Meter rating and current sense choices

• Shunt design

• PGA selection

• F2, F1, F0 selection

• Meter calibration

• Anti-aliasing filter design

• Compensation for parasitic shunt inductance

•EMC design

• Power supply design

• No-Load threshold

• Start-up current

• Accuracy Testing Results from MCP390X-based

meter

• EMC Testing Results from MCP390X-based

meter

SCK

SDI

SDO

CLKIN

CH0+

CH0-

CH1+

CH1-

AVDD,DVDD

AGND,DGND

MCP3909 RC3/SCK

RC5/SDO

RC4/SDI

RA0/ANO

GND

PIC MCU

40 MHZ

RC1/CCP2

RX/RC6

TX/RC7

RB0

RB7

...

LCD

kWhr

kVAhr

PHA_W:16

ENERGY_W:64

ENERGY_VA_GLSB:16

PHA_I_RMS:16

PHA_V_RMS:16

RS-232

To PC or

Calibration

Equipment

OSC1

OSC2

Resistor Divider

Power Supply

Circuitry

MCP3909

7.0 PACKAGING INFORMATION

7.1 Package Marking Information

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

XXXXXXXXXXX

YYWWNNN

24-Lead SSOP Examples:

XXXXXXXXXXX

MCP3909

0648256

I/SS^^

MCP3909

24-Lead Plastic Shrink Small Outline (SS) (SSOP)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

NOM

INCHES

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed.010" (0.254mm) per side.

Overall Length

Overall Width

Overall Height

Number of Pins

Lead Width

Foot Angle

Lead Thickness

Foot Length

Molded Package Width

Molded Package Thickness

JEDEC Equivalent: MO-150

Drawing No. C04-132

Controlling Parameter

Notes:

Standoff

Pitch

.010

.004

.025

Units

Dimension Limits MIN

.068

.318

.205

.301

.002

.066

MILLIMETERS

–

.006

.030

.015

.037

–

0.25

0.09

0.63

0°

0.15

0.75

4°

–

.073

.068

.323

.209

.307

.005

.026 BSC.

.078

.070

.008

.328

.212

.311

MAX

1.73

8.07

5.20

7.65

0.05

1.68

MIN

1.86

0.13

8.20

5.30

7.80

1.73

0.65 BSC.

NOM

8°

0.38

–

0.95

1.78

1.99

0.21

8.33

5.38

7.90

MAX

Revised 9-14-05

See ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

MCP3909

APPENDIX A: REVISION HISTORY

Revision A (December 2006)

• Original Release of this Document.

MCP3909

NOTES:

MCP3909

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Device: MCP3909: Energy Metering IC

MCP3909T: Energy Metering IC

(Tape and Reel)

Temperature Range: I = -40°C to +85°C

Package: SS = Plastic Shrink Small Outline (209 mil Body),

24-lead

PART NO. –X /XX

PackageTemperature

Range

Device

Examples:

a) MCP3909-I/SS: Energy Metering IC

Industrial Temperature,

24LD SSOP.

b) MCP3909T-I/SS: Tape and Reel,

Energy Metering IC

Industrial Temperature,

24LD SSOP.

MCP3909

NOTES:

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,

PICSTART, PRO MATE, PowerSmart, rfPIC, and

SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

SEEVAL, SmartSensor and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active

Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona, Gresham, Oregon and Mountain View, California. The

Company’s quality system processes and procedures are for its PIC®

8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs,

microperipherals, nonvolatile memory and analog products. In

addition, Microchip’s quality system for the design and manufacture of

development systems is ISO 9001:2000 certified.

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Habour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7250

Fax: 86-29-8833-7256

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Korea - Gumi

Tel: 82-54-473-4301

Fax: 82-54-473-4302

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

WORLDWIDE SALES AND SERVICE

12/08/06