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SI/O

VDD

GND

0.1 µF

SimpleLink

MSP432P4 LM95071

+3.3V

UCxCLK

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM95071

SNIS137G –AUGUST 2004–REVISED AUGUST 2019

LM95071 SPI/MICROWIRE 13-Bit Plus Sign Temperature Sensor

1 Features

1• Small SOT-23 package saves space

• Shutdown mode conserves power between

temperature readings

• Operates over a full −40°C to +150°C range

• SPI and MICROWIRE bus interface

• Key specifications:

– Supply voltage: 2.4 V to 5.5 V

– Supply current:

– Operating: 280 µA (typical)

– Shutdown: 6 µA (typical)

– Temperature accuracy:

– 0°C to 70°C ±1°C (maximum)

–−40°C to 150°C ±2°C (maximum)

– Temperature resolution: 0.03125°C

2 Applications

• System thermal management

• Portable electronic devices

• Personal computers

• Disk drives

• Office electronics

• Electronic test equipment

3 Description

The LM95071 is a low-power, high-resolution digital

temperature sensor with an SPI and MICROWIRE

compatible interface, available in the 5-pin SOT-23.

The host can query the LM95071 at any time to read

temperature. Its low operating current is useful in

systems where low power consumption is critical.

The LM95071 has 13-bit plus sign temperature

resolution (0.03125°C per LSB) while operating over

a temperature range of −40°C to +150°C.

The 2.4-V to 5.5-V supply voltage range, fast

conversion rate, low supply current, and simple SPI

interface of the LM95071 make it ideal for a wide

range of applications.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LM95071 SOT-23 (5) 2.90 mm × 1.60 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Temperature Monitor Application

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 3

6.1 Absolute Maximum Ratings ..................................... 3

6.2 ESD Ratings.............................................................. 3

6.3 Recommended Operating Ratings............................ 4

6.4 Thermal Information.................................................. 4

6.5 Temperature-to-Digital Converter Characteristics..... 4

6.6 Logic Electrical Characteristics - Digital DC

Characteristics ........................................................... 4

6.7 Logic Electrical Characteristics - Serial Bus Digital

Switching Characteristics........................................... 5

6.8 Timing Diagrams....................................................... 5

6.9 Typical Characteristics.............................................. 7

7 Parameter Measurement Information .................. 8

8 Detailed Description.............................................. 9

8.1 Overview................................................................... 9

8.2 Functional Block Diagram......................................... 9

8.3 Feature Description................................................... 9

8.4 Device Functional Modes........................................ 10

8.5 Programming .......................................................... 10

8.6 Register Maps......................................................... 12

9 Device and Documentation Support.................. 14

9.1 Receiving Notification of Documentation Updates.. 14

9.2 Community Resource.............................................. 14

9.3 Trademarks............................................................. 14

9.4 Electrostatic Discharge Caution.............................. 14

9.5 Glossary.................................................................. 14

10 Mechanical, Packaging, and Orderable

Information........................................................... 14

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (May 2019) to Revision G Page

• Changed Temperature Monitor Application graphic............................................................................................................... 1

Changes from Revision E (December 2018) to Revision F Page

• Added the TYPE column to the Pin Functions table ............................................................................................................. 3

• Changed V(ESD) for CDM from ±200 V to ±250 V .................................................................................................................. 3

Changes from Revision D (September 2013) to Revision E Page

• Updated data sheet layout to the latest SDS format ............................................................................................................. 1

• Moved the automotive device to a standalone data sheet (SNIS207) .................................................................................. 1

• Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes,Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .............................. 1

• Changed key graphics on the first page ................................................................................................................................ 1

• Replaced the Thermal Characteristics table with the Thermal Information table and added new thermal resistance

values .................................................................................................................................................................................... 4

• Changed Temperature-to-Digital Converter Characteristics tablenote to clarify conversion interval..................................... 4

GND

SI/O SC

VDD

LM95071/

LM95071-Q1

LM95071

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5 Pin Configuration and Functions

DBV Package

5-Pin SOT-23

Top View

Pin Function

PIN TYPE DESCRIPTION

NO. NAME

1 CS Input Chip Select input. This pin receives an active-low signal from the controller to select the device.

2 GND Ground Ground. This is the power and signal ground return.

3 SI/O Input/Output Serial Input/Output. This serial, bidirectional, data bus pin transmits and receives signals to and

from the controller. Schmitt trigger input in the input mode.

4 SC Input Serial bus clock. This serial clock signal comes from the controller. Schmitt trigger input.

5 VDD Supply Positive Supply Voltage. Supply a DC voltage from 2.4V to 5.5V to this pin and bypass with a

0.1-µF ceramic capacitor to ground.

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its rated operating conditions.

(2) Soldering process must comply with Reflow Temperature Profile specifications.

Refer to http://www.ti.com/packaging.

(3) Reflow temperature profiles are different for lead-free and non-lead-free packages.

(4) When the input voltage (VI) at any pin exceeds the power supplies (VI< GND or VI> VDD) the current at that pin should be limited to

5 mA.

6 Specifications

6.1 Absolute Maximum Ratings (1)(2)(3)

MIN MAX UNIT

Supply voltage −0.3 6 V

Voltage at any pin −0.3 VDD + 0.3 V

Input current at any pin (4) 5 mA

Storage temperature, Tstg −65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) Human body model, 100 pF discharged through a 1.5 kΩresistor. Machine model, 200 pF discharged directly into each pin.

(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic

discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V

Charged-device model (CDM), per JEDEC specification JESD22-C101(3) ±250

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(1) The life expectancy of the of the LM95071 will be reduced when operating at elevated temperatures. of the LM95071 θJA (thermal

resistance, junction-to-ambient) when attached to a printed-circuit board with 2-oz. foil is summarized in the table below.

6.3 Recommended Operating Ratings MIN MAX UNIT

Specified temperature(1), TMIN to TMAX −40 150 °C

Supply voltage (VDD) 2.4 5.5 V

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1) LM95071

UNITDBV (SOT-23)

5 PINS

RθJA Junction-to-ambient thermal resistance 167.2 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 118.8 °C/W

RθJB Junction-to-board thermal resistance 30.7 °C/W

ψJT Junction-to-top characterization parameter 14.4 °C/W

ψJB Junction-to-board characterization parameter 30.1 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W

(1) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).

(2) Typicals are at TA= 25°C and represent most likely parametric norm.

(3) The of the LM95071 will operate properly over the VDD supply voltage range of 2.4V to 5.5V.

(4) Following a power on reset, the user must allow at least 228 ms before making the first read transaction to ensure a first valid

temperature read. After the first read, in order to ensure an accurate temperature result, the time interval between any two consecutive

temperature reads must be greater than the maximum conversion time of 228 ms.

6.5 Temperature-to-Digital Converter Characteristics

Unless otherwise noted, these specifications apply for VDD = 3.3 V. All limits TA= TJ= +25°C, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

Temperature error(3) VDD = 3.0V to 3.6V; TA= 0°C to +70°C, TA= TJ= TMIN to TMAX ±1.0 °C

VDD = 3.0V to 3.6V; TA=−40°C to +150°C, TA= TJ= TMIN to TMAX ±2.0 °C

Line regulation VDD = 3.6V to 5.5V; TA= 0°C to +70°C +0.3 °C/V

VDD = 3.0V to 2.4V; TA= 0°C to +70°C -0.6

Resolution 14

0.03125 Bits

°C

Temperature

conversion time See (4) TA= TJ= +25°C 130 ms

TA= TJ= TMIN to TMAX 228

Quiescent current Operating, serial bus inactive TA= TJ= +25°C 280 µA

TA= TJ= TMIN to TMAX 520

Shutdown TA= TJ= +25°C 6 µA

TA= TJ= TMIN to TMAX 28

(1) The of the LM95071 will operate properly over the VDD supply voltage range of 2.4V to 5.5V.

(2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).

(3) Typicals are at TA= 25°C and represent most likely parametric norm.

6.6 Logic Electrical Characteristics - Digital DC Characteristics

Unless otherwise noted, these specifications apply for VDD = 2.4 V to 5.5 V(1).

PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT

VIN(1) Logical “1” Input

Voltage TA= TJ= TMIN to TMAX 0.7 × VDD VDD + 0.3 V

VIN(0) Logical “0” Input

Voltage TA= TJ= TMIN to TMAX −0.3 0.3 × VDD V

t2t4

t1t4trtf

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Logic Electrical Characteristics - Digital DC Characteristics (continued)

Unless otherwise noted, these specifications apply for VDD = 2.4 V to 5.5 V(1).

PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT

Input Hysteresis

Voltage VDD = 3 V to 3.6 V TA= TJ= +25°C 0.4 V

TA= TJ= TMIN to TMAX 0.33

IIN(1) Logical “1” Input

Current VIN = VDD TA= TJ= +25°C 0.005 µA

TA= TJ= TMIN to TMAX 3

IIN(0) Logical “0” Input

Current VIN = 0 V TA= TJ= +25°C −0.005 µA

TA= TJ= TMIN to TMAX −3

CIN All Digital Inputs TA= TJ= +25°C 20 pF

VOH High Level

Output Voltage IOH =−400 µA, TA= TJ= TMIN to TMAX 2.25 V

VOL Low Level

Output Voltage IOL = +1.6 mA, TA= TJ= TMIN to TMAX 0.4 V

IO_TRI-

STATE

TRI-STATE

®Output

Leakage Current VO= GND

VO= VDD, TA= TJ= TMIN to TMAX −1 +1 µA

(1) The of the LM95071 will operate properly over the VDD supply voltage range of 2.4V to 5.5V.

(2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).

(3) Typicals are at TA= 25°C and represent most likely parametric norm.

6.7 Logic Electrical Characteristics - Serial Bus Digital Switching Characteristics

Unless otherwise noted, these specifications apply for VDD = 2.4 V to 5.5 V(1); CL(load capacitance) on output lines = 100 pF

unless otherwise specified. MIN(2) TYP(3) MAX(2) UNIT

t1SC (Clock) Period TA= TJ= TMIN to TMAX 0.16 µs

TA= TJ= +25°C DC

t2CS Low to SC (Clock) High Set-Up Time TA= TJ= TMIN to TMAX 100 ns

t3CS Low to Data Out (SO) Delay TA= TJ= TMIN to TMAX 70 ns

t4SC (Clock) Low to Data Out (SO) Delay TA= TJ= TMIN to TMAX 70 ns

t5CS High to Data Out (SO) TRI-STATE TA= TJ= TMIN to TMAX 200 ns

t6SC (Clock) High to Data In (SI) Hold Time TA= TJ= TMIN to TMAX 50 ns

t7Data In (SI) Set-Up Time to SC (Clock)

High TA= TJ= TMIN to TMAX 30 ns

t8SC (Clock) High to CS High Hold Time TA= TJ= TMIN to TMAX 50 ns

6.8 Timing Diagrams

Figure 1. Data Output Timing Diagram

t7t8

t5t5

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Timing Diagrams (continued)

Figure 2. TRI-STATE Data Output Timing Diagram

Figure 3. Data Input Timing Diagram

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6.9 Typical Characteristics

Figure 4. Static Supply Current vs. Temperature Figure 5. Maximum Temperature Error

Figure 6. Conversion Time vs Temperature Figure 7. Typical Output Noise at 30°C

1.4V

IOH = -1.6 mA

IOL = 1.6 mA

To LM95071/

LM95071-Q1

SI/O Pin

80 pF

+3.3V

-40°C

-25°C

-0.03125°C

0°C

00,0011,0010,0000 +0.03125°C

+25°C

Temperature

+150°C

Output Code

11,1111,1111,1111

11,1100,1110,0000

11,1011,0000,0000

00,0000,0000,0000

00,0000,0000,0001

01,0010,1100,0000

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7 Parameter Measurement Information

Figure 8. Temperature-to-Digital Transfer Function (Non-Linear Scale for Clarity)

Figure 9. TRI-STATE Test Circuit

Temperature

Sensor

Circuitry

Control

Logic

Temperature

Manufacturer's

ID Register

Three-Wire

Serial Interface

14-Bit

Delta-Sigma

A/D Converter

SI/O

VDD

LM95071/

LM95071-Q1

LM95071

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8 Detailed Description

8.1 Overview

The LM95071 temperature sensor incorporates a temperature sensor and 13-bit-plus-sign ΔΣ ADC (Delta-Sigma

Analog-to-Digital Converter). Compatibility of the LM95071's three-wire serial interface with SPI and

MICROWIRE allows simple communications with common microcontrollers and processors. Shutdown mode can

be used to optimize current drain for different applications. A Manufacturer/Device ID register identifies the

LM95071 as a Texas Instruments product.

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Power Up and Power Down

The LM95071 always powers up in a known state and in the continuous conversion mode. Immediately after

power up, the LM95071 will output an erroneous code until the first temperature conversion has completed.

When the supply voltage is less than about 1.6V (typical), the LM95071 is considered powered down. As the

supply voltage rises above the nominal 1.6-V power up threshold, the internal registers are reset to the power up

default state described above.

8.3.2 Temperature Data Format

Temperature data is represented by a 14-bit, two's complement word with an LSB (Least Significant Bit) equal to

0.03125°C:

Table 1. Digital Output for Temperature Data

Temperature Digital Output

Binary Hex

+150°C 0100 1011 0000 0011 4B03

+125°C 0011 1110 1000 0011 3E83

+25°C 0000 1100 1000 0011 0C83

+0.03125°C 0000 0000 0000 0111 0007

0°C 0000 0000 0000 0011 0003

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Table 1. Digital Output for Temperature

Data (continued)

Temperature Digital Output

Binary Hex

−0.03125°C 1111 1111 1111 1111 FFFF

−25°C 1111 0011 1000 0011 F383

−40°C 1110 1100 0000 0011 EC03

The first data byte is the most significant byte with most significant bit first, permitting only as much data as

necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature

data indicate an overtemperature condition, the host processor could immediately take action to remedy the

excessive temperatures.

8.3.3 Tight Accuracy, Fine Resolution and Low Noise

The LM95071 is well suited for applications that require tight temperature measurement accuracy. In many

applications, from process control to HVAC, the low temperature error can mean better system performance and,

by eliminating a system calibration step, lower production cost.

With fine digital resolution, the LM95071 senses and reports very small changes in its temperature, making it

ideal for applications where temperature sensitivity is important. For example, the LM95071 enables the system

to quickly identify the direction of temperature change, allowing the processor to take compensating action before

the system reaches a critical temperature.

The LM95071 has very low output noise (see Figure 7 in the Typical Characteristics section), which makes it

ideal for applications where stable thermal compensation is a priority. For example, in a temperature-

compensated oscillator application, the very small deviation in successive temperature readings translates to a

stable frequency output from the oscillator.

8.4 Device Functional Modes

8.4.1 Shutdown Mode/Manufacturer ID

The master controller may enable the shutdown mode for the purpose of reducing power consumption or for

reading the Manufacturer/Device ID information. The shutdown mode is enabled by writing XX FF hex to the

LM95071 as shown in Figure 13c. The serial bus is still active when the LM95071 is in shutdown. When in

shutdown mode the LM95071 always will output 1000 0000 0000 1111. This is the Manufacturer/Device ID

information. The first 5-bits of the field (1000 0XXX) are reserved for the manufacturer ID.

8.5 Programming

8.5.1 Serial Bus Interface

The LM95071 operates as a slave and is compatible with SPI or MICROWIRE bus specifications. Data is clocked

out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC. A complete

communication is framed by falling and rising chip select (CS) signal. The CS signal should be held high for at

least one clock cycle (160 ns minimum) between communications. The transmit-only communication (register

read) consists of 16 clock cycles. A complete transmit/receive communication will consist of 32 serial clocks (see

Serial Bus Timing Diagrams). The first 16 clocks comprise the transmit phase of communication, while the

second 16 clocks are the receive phase.

When CS is high SI/O will be in TRI-STATE. Communication should be initiated by taking chip select (CS) low.

This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O)

will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of

the data will be clocked out by the falling edge of SC. CS can be taken high at any time during the transmit

phase. If CS is brought low in the middle of a conversion the LM95071 will complete the conversion and the

output shift register will be updated after CS is brought back high.

1 8

SO D14D15

1 8

D2D7 TRI-STATE

1 8

SO D8D14D15

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Programming (continued)

The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The

LM95071/LM95071-Q1 will read the data available on the SI/O line on the rising edge of the serial clock. Input

data is to an 8-bit shift register. The part will detect the last eight bits shifted into the register. The receive phase

can last up to 16 SC periods. All ones must be shifted in order to place the part into shutdown. All zeros must be

shifted in order to place the LM95071 into continuous conversion mode. Only the following codes should be

transmitted to the LM95071:

• 00 hex for continuous conversion

• FF hex for shutdown

Another code may place the part into a test mode. Test modes are used by Texas Instruments to thoroughly test

the function of the LM95071 during production testing. Only eight bits have been defined above since only the

last eight transmitted are detected by the LM95071, before CS is taken HIGH.

The following communication can be used to determine the Manufacturer's/Device ID and then immediately place

the part into continuous conversion mode. With CS continuously low:

• Read 16 bits of temperature data

• Write 16 bits of data commanding shutdown

• Read 16 bits of Manufacture's/Device ID data

• Write 8 to 16 bits of data commanding Conversion Mode

• Take CS HIGH.

Note that 228 ms (max) will have to pass for a conversion to complete before the LM95071 actually transmits

temperature data.

8.5.2 Serial Bus Timing Diagrams

Figure 10. Reading Continuous Conversion - Single Eight-Bit Frame

Figure 11. Reading Continuous Conversion - Two Eight-Bit Frames

SI/O

1 8

D14D15

1 8

D14D15

1 8

TRI-

STATE

D8 D7 D6 D0

Data from the LM95071/

LM95071-Q1 Data from the Controller

SI/O

1 8

D14D15

1 8

D14D15

1 8

TRI-

STATE

D8 D7 D6 D0

Data from the LM95071/

LM95071-Q1 Data from the Controller

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Programming (continued)

Figure 12. Writing Shutdown Mode

Figure 13. Writing Conversion Mode

8.6 Register Maps

8.6.1 Internal Register Structure

The LM95071 has three registers: the temperature register, the configuration register and the

Manufacturer/Device identification register. The temperature and Manufacturer/Device identification registers are

read only. The configuration register is write only.

8.6.1.1 Configuration Register

(Selects shutdown or continuous conversion modes):

Table 2. (Write Only):

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

X X X X X X X X Shutdown

D0–D15 set to XX FF hex enables shutdown mode.

D0–D15 set to XX 00 hex sets continuous-conversion mode.

Note: setting D0-D15 to any other values may place the LM95071 into a manufacturer's test mode, upon which

the LM95071 will stop responding as described. These test modes are to be used for Texas Instruments

production testing only. See Serial Bus Interface for a complete discussion.

8.6.1.2 Temperature Register

Table 3. (Read Only):

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

MSB Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit1 LSB 1 1

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D0–D1: Logic 1 will be output on SI/0.

D2–D15: Temperature Data. One LSB = 0.03125°C. Two's complement format.

8.6.1.3 Manufacturer/Device ID Register

Table 4. (Read Only):

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

1000000000001111

D0–D1: Logic 1 will be output on SI/0.

D2–D15: Manufacturer/Device ID Data. This register is accessed whenever the LM95071 is in shutdown mode.

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9 Device and Documentation Support

9.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

9.2 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

9.3 Trademarks

E2E is a trademark of Texas Instruments.

TRI-STATE is a registered trademark of National Semiconductor Corporation.

All other trademarks are the property of their respective owners.

9.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

9.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM95071CIMF NRND SOT-23 DBV 5 1000 Non-RoHS &

Non-Green Call TI Call TI -40 to 150 T18C

LM95071CIMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 150 T18C

LM95071CIMFX NRND SOT-23 DBV 5 3000 Non-RoHS &

Non-Green Call TI Call TI -40 to 150 T18C

LM95071CIMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 150 T18C

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 2

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM95071 :

•Automotive: LM95071-Q1

NOTE: Qualified Version Definitions:

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM95071CIMF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM95071CIMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM95071CIMFX SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM95071CIMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM95071CIMF SOT-23 DBV 5 1000 210.0 185.0 35.0

LM95071CIMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM95071CIMFX SOT-23 DBV 5 3000 210.0 185.0 35.0

LM95071CIMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

0.22

0.08 TYP

0.25

3.0

2.6

2X 0.95

1.9

1.45

0.90

0.15

0.00 TYP

5X 0.5

0.3

0.6

0.3 TYP

0 TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/E 09/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/E 09/2019

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/E 09/2019

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

8. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

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