Samsung Semiconductor, Inc.
Product Selection Guide
System LSI
August 2007
SYSTEM LSI
ASIC / FOUNDRY
ASIC ORDERING INFORMATION
CMOS IMAGE SENSORS
LCD DRIVER ICs
LCD DRIVER IC ORDERING INFORMATION
MOBILE APPLICATION PROCESSORS
HDTV/STB PRODUCTS
MICROCONTROLLERS
MICROCONTROLLER ORDERING INFORMATION
SERIAL EEPROMS
PAGE
3
4
5
5-6
7
8
9
10-14
15
16
AUGUST 2007 BR-07-ALL-002 3
SYSTEM LSIASIC/Foundry Solutions
SAMSUNG SEMICONDUCTOR, INC.
ASIC LIBRARY
Specialty I/O Peripherals
SSTL2, SSTL18 ARM PrimeCell Peripheral
LVDS Samsung Peripheral
USB 1.1
MDDR
ASIC PROCESS TECHNOLOGY
Design Rule 45nm 65nm 90nm
Process Technology L(D/R)4LP (=11LP) L6G (=10FS) L(D/R)6LP (=10LP) L(D)9G (=9SF) L(R)9LP (=9LP)
Description 45nm Low Power Process 65nm Generic Process 65nm Low Power Process 90nm Generic Process 90nm Low Power Process
(with eDRAM/RFCMOS option) (with eDRAM/RFCMOS option) (with eDRAM option) (with RFCMOS option)
Vth Option LVT/RVT/HVT LVT/RVT/HVT LVT/RVT/HVT RVT/AVT/LVT/eMPU sHVT/HVT/RVT/LVT
Core Voltage 1.1V 1.0V 1.2V 1.0~1.2V 1.2V
I/O Voltage 1.8~2.5V 1.8~3.3V 1.8~3.3V 1.8~3.3V 1.8~3.3V
SRAM Bit-cell 0.29~0.359µm2 0.625µm2 0.54~0.676µm2 0.79~1.25µm2 0.79~1.25µm2
eDRAM Bit-Cell 0.11µm2 0.189µm2 0.275µm2
Standard Cell Library SS45LP (HVT/RVT/LVT) SS65G (HVT/RVT/LVT) SS65LP (HVT/RVT/LVT) SS90G (RVT/LVT) SS90LP (HVT/RVT/LVT)
Raw Gate Density 1800kgate/mm2 750kgate/mm2 860kgate/mm2 417kgate/mm2 445kgate/mm2
(9 track) (9 track) (8 track) (9 track) (8 track)
Compiled Memory RA1D-0.299 RA1-0.62 RA1-0.54 VROM_HD SPSRAM_HD
RA1S-0.374 RA2 (Dual-port SRAM) RF1 RA1-0.676 DPSRAM_HD
RA2 (Dual-port SRAM) RF1 (1P REGFILE) RA2 1P-REGFILE_HD
(1P REGFILE) RF2 (2P REGFILE) RF1 (1P REGFILE) 2P-REGFILE_HD
RF2 (2P REGFILE) VROM RF2 (2P REGFILE) VROM_HD
VROM SPSRAM (High-speed) VROM SPSRAM_LP
SPSRAM (High-speed) DPSRAM_LP
UHD SPSRAM 1P-REGFILE_LP
2P-REGFILE_LP
GP I/O 1.8/2.5/3.3V 1.8/2.5/3.3V (5V tol) 1.8/2.5/3.3V (5V tol) 1.8/2.5/3.3V (5V tol) 1.8/2.5/3.3V (5V tol)
40µm In-line CUP 50µm In-line CUP 50µm In-line CUP 50µm In-line CUP 50µm In-line CUP
25/50 Staggered CUP 30/60 Staggered CUP 30/60 Staggered CUP 30/60 Staggered CUP 30/60 Staggered CUP
ASIC IP
High Speed Embedded Memory
Mixed Signal IP DSP IP Processor IP Interface IP IP
ADC 10bit ~ 12bit, 0.5Msps ~ 140Msps Teak-Lite ARM7TDMI-S PCI Express Embedded DRAM
DAC 10 ~ 12bit, 1M ~ 100Msps Teak ARM9 Series USB 2.0 OTG Psudo SRAM
PLL ~600MHz FSPLL, ~2GHz FSPLL, SSCG PLL, Pixel PLL, DLL ARM11 Series HDMI TX
Audio CODEC 8~96kHz Sigma-Delta audio CODEC ARM11 MPCore MIPI
DTV AFE 12bit 150MHz ADC + A-Mux + Clamp + A-Buffer + Sync Slicer + PCG Cortex SMIA
PMU SATA PHY
Voltage Regulator DDR/2/3 PHY
LVDS TX/RX
ASIC PROCESS DESCRIPTIONS
Process Geometry Description
L13HS 0.13µm 1.2V High Speed Process
L(D/F)13G 0.13µm 1.2~1.5V Generic Process (with eDRAM/Flash option)
L13LP 0.13µm 1.5V Low Power Process
L(F)18 0.18µm 1.8V Process (with Flash option)
L25 0.25µm 2.5V Process
L35(H) 0.35µm 2.5V Process (with 5V dual gate oxide option)
ASIC ORDERING INFORMATION http://www.samsung.com/Products/Semiconductor/Support/Label_CodeInfo/ASIC.pdf
For more information on Samsung’s dedicated 300mm logic foundry, go to
www.samsung.com/global/business/semiconductor/products/strategicfoundry
SYSTEM LSI
4
ASIC Ordering Information
SAMSUNG SEMICONDUCTOR, INC.
ASIC ORDERING INFORMATION
S 6 X X X X X X X X - X X X X
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
1. System LSI (S)
2. Large Classification: ASIC (6)
3. Small Classification
A : STN (Character) B : STN (Graphic)
C : TFT (Large) D : TFT (Mobile)
F : TFT (Midsmall) E : OELD
P : PDI (DUAL) T : TCON
V : Process Vehicle
4~7.
Serial No
8. Version
A~Z
*1st Version X
9~10. Mask Option
- STN (Character)
00~99 : Font
- STN (Graphic)
Mask Option
- TFT Device
Mask Option
11. " - "
12~14. Package Type
- In Case of PKG
(12) Package Type
A : SDIP B : BUMP BIZ
C : CHIP BIZ E : LQFP
J : ELP K : TR
N : COB Q : QFP
S : SOP T : TQFP
W : WAFER X : ETQFP
(13) Reserved
- PKG Option
0 : none
1 : Special Handling 1 2 : Special Handling 2
3 : Special Handling 3 A : Test Condition 1
B : Customer Option 1 C : Customer Option 2
D : Customer Option 3 E : Customer Option 4
G : Customer Option 6 H : Customer Option 7
J : Customer Option 8 K : Customer Option 9
L : Customer Option 10 M : Customer Option 11
N : Customer Option 12 P : Customer Option 13
- WAFER
0 : BUMP 1 : NO BUMP
(14) Packing
- In Case of TAB / COF
(12)(13) Film Type
00~49 TAB
50~99 COF
(14) Revision
1st Version X
15. Custom
0 : No Grinding 1 : 250°æ10um
5 : 200±10um
8 : 300±10um (CHIP BIZ) 9 : 280°æ10um
A : 300±10um
C : 300±10um (Wafer)
G : 375±10um (CHIP BIZ) J : 425±10um
K : 400±10um L : 450±10um
M : 470±10um (Wafer) N : 470±10um
R : 350±10um (Wafer) U : 610±10um
V : 500±10um (CHIP BIZ)
W : 425±10um (Wafer)
X : 425±10um (CHIP BIZ)
Y : 470±10um (CHIP BIZ)
Z : No Grinding (CHIP / Wafer)
AUGUST 2007BR-07-ALL-002BR-07-ALL-002
5
Image Sensors / LCD Driver ICs
SAMSUNG SEMICONDUCTOR, INC.
AUGUST 2007 BR-07-ALL-002BR-07-ALL-002
CMOS IMAGE SENSORS
Part Pixels Pixels
Number Type Resol. O/F Horizontal Vertical Package Production Status
S5KA3D SOC VGA 1/10" 640 480 wafer or die MP
S5K5AA SOC SXGA 1/5" 1280 1024 wafer or die MP
S5K4AA SOC SXGA 1/4" 1280 1024 wafer or die MP
S5K4BAF SOC UXGA 1/4" 1600 1200 wafer or die MP
S5K4B1F CIS UXGA 1/4" 1600 1200 wafer or die MP
S5K4CA SOC QXGA 1/4" 2048 1536 wafer or die Sampling
S5K4C1 CIS QXGA 1/4" 2048 1536 wafer or die Sampling
NOTE: * O/F: Optical Format
BW STN CHARACTER DISPLAY DRIVER IC FOR MOBILE DISPLAYS
Part CGROM CGRAM Interface Vlcd DC/DC Convert
Number Segment Common (Ch.) (Ch.) (Bits) VDD (V) (Max V.) (Times) Package
S6A0031 80 8 10160 (254) 80 (2) 4 / 8 2.4~5.5 6 2~3 Au bump chip
S6A0032 80 16 10160 (254) 80 (2) 4 / 8 2.4~5.5 6 Au bump chip
S6A0065 40 2.7~5.5 13 Bare die/64QFP
S6A0069 40 16 10080 (236) 512 (8) 4 / 8 2.7~5.5 13 Bare die/80QFP
S6A0070 80 16 8320 (224) 512 (8) 4 / 8 2.7~5.5 10 Bare die/Au bump chip
S6A0071 60 32 8400 (240) 512 (8) 4 / 8 2.4~5.5 13 2 Au bump chip/TCP
S6A0072 40 16 9600 (240) 160 (4) 1 / 4 / 8 2.7~5.5 11 Au bump chip
S6A0073 60 34 9600 (240) 512 (8) 1 / 4 / 8 2.7~5.5 13 2~3 Bare die
S6A0074 80 34 9600 (240) 512 (8) 1 / 4 / 8 2.7~5.5 13 2~3 Bare die
S6A0075 100 34 9600 (240) 512 (8) 1 / 4 / 8 2.7~5.5 13 2~3 Bare die
S6A0078 120 34 9600 (240) 512 (8) 1 / 4 / 8 2.7~5.5 13 2~3 Bare die/TCP
S6A0079 120 34 9600 (240) 512 (8) 1 / 4 / 8 2.7~5.5 13 2~3 Bare die
S6A0090 64 26 10240 (256) 160 (4) 1 / 4 / 8 2.4~5.5 11 2~3 Au bump chip/TCP
S6A0093 80 26 10240 (256) 320 (8) 1 / 4 / 8 2.4~5.5 6 4 Au bump chip/TCP
S6A0094* 80 34 21760 (544) 80 (6) 1 / 4 / 8 2.2~3.6 7 4 Au bump chip
S6A0067 80 2.7~5.5 10 Bare die/100QFP
S6A2068 60 16 8320 (224) 512 (8) 4 / 8 2.7~5.5 10 Bare die
NOTES: Devices marked with an asterisk (*) are under development. Bare die is equivalent term with bare chip, pellet or die.
TCP (Tape Carrier Package) COF (Chip On Film) is available in case of TCP.
SYSTEM LSI
6
LCD Driver ICs
SAMSUNG SEMICONDUCTOR, INC. AUGUST 2007BR-07-ALL-002
BW STN GRAPHIC DISPLAY DRIVER IC FOR MOBILE DISPLAYS
Part Interface DDRAM Vlcd DC/DC Convert
Number Segment Common (Bits) (Bits) VDD (V) (Max V.) (Times) Package
S6B0107 64 1 / 1 4.5~5.5 17
S6B0086 80 1 / 4 2.7~5.5 28
S6B0715 100 33 1 / 8 8580 2.4~5.5 15 2~4 Au bump chip/TCP
S6B0717 100 55 1 / 8 6500 2.4~5.5 15 2~5 Au bump chip/TCP
S6B0718 104 81 1 / 8 9256 2.4~3.6 15 3~6 Au bump chip/TCP
S6B0719 160 105 1 / 8 16800 2.4~3.6 15 3~6 Au bump chip/TCP
S6B0723 132 65 1 / 8 8580 2.4~5.5 15 2~5 TCP
S6B0724 132 65 1 / 8 8580 2.4~5.5 15 2~5 Au bump chip
S6B0725 104 65 1 / 8 6860 2.4~3.6 15 2~5 Au bump chip
S6B0728 132 128 1 / 8 16896 2.4~3.6 15 3~7 Au bump chip/TCP
S6B0741 128 129 1 / 8 33024 1.8~3.3 15 3~6 TCP
S6B0755 128 65 1 / 8 8320 1.8~3.3 15 3~5 Au bump chip/TCP
S6B0756 96 65 1 / 8 6240 1.8~3.3 12 2~4 Au bump chip
S6B0759 128 81 1 / 8 10368 1.8~3.3 15 3~6 Au bump chip/TCP
S6B2400 96 65 1 / 8 12480 1.8~3.3 12 3~5 Au bump chip
S6B0794 160 160 4 / 8 2.4~5.5 32 Au bump chip/TCP
S6B0796 240 240 4 / 8 2.4~5.5 32 Au bump chip/TCP
S6B1713 132 65 1 / 8 8580 2.4~5.5 15 2~5 Au bump chip/TCP
NOTES: Bare die is equivalent term with bare chip, pellet or die. TCP (Tape Carrier Package) COF (Chip On Film) is available in case of TCP.
COLOR STN GRAPHIC DISPLAY DRIVER IC FOR MOBILE DISPLAYS
Device Color DDRAM Vlcd DC/DC Convert
Name Segment Common Depth (Bits) VDD (V) (Max V.) (Times) Package
S6B33A1 132 160 256/4k 266,112 1.8~3.6 20 2, 3; -1; 2 Au bump chip
S6B33A2 128 129 256/4k 196,608 1.8~3.3 20 1, 1.5; -3; 2 Au bump chip
S6B33B0 144 177 256/4k/65k 405,504 1.8~3.3 20 1, 1.5; -3; 2 Au bump chip
S6B3300* 104 80 256/4k 99,840 1.8~3.3 15 1, 1.5; -3; 2 Au bump chip
NOTES: Devices marked with an asterisk (*) are under development. TCP (Tape Carrier Package) Bare die is equivalent term with bare chip, pellet or die.
COF (Chip On Film) is available in case of TCP.
COLOR STN GRAPHIC DISPLAY DRIVER IC FOR MOBILE DISPLAYS
Part Color Bit Map Area Vlcd
Number RGB Gate Depth (RAM) VCI (V) (Max V.) Package
S6D0110 132 176 260K 132*18*176 2.5~3.3 25V Max Au bumped chip
S6D0114 132 176 260K 132*18*176 2.5~3.3 25V Max Au bumped chip
S6D0117 132 132 260K 132*132*18 2.5~3.3 25V Max Au bumped chip
S6D0118 176 240 260K 176*18*240 2.5~3.3 25V Max Au bumped chip
S6D0123 132 176 260K 132*18*176 2.5~3.3 25V Max Au bumped chip
S6D0129 240 320 260K 240*18*320 2.5~3.3 30V Max Au bumped chip
NOTES: TCP (Tape Carrier Package) COF (Chip On Film) is available in case of TCP
SYSTEM LSI
7
LCD Driver IC Ordering Information
SAMSUNG SEMICONDUCTOR, INC.
AUGUST 2007 BR-07-ALL-002
LCD DRIVER IC ORDERING INFORMATION
S 6 X X X X X X X X - X X X X
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
1. System LSI (S)
2. Large Classification: LDI (6)
3. Small Classification
A : STN (Character) B : STN (Graphic)
C : TFT (Large) D : TFT (Mobile)
F : TFT (Midsmall) E : OELD
P : PDI (DUAL) T : TCON
V : Process Vehicle
4~7.
Serial No.
8. Version
A~Z
*1st Version X
9~10. Mask Option
- STN (Character)
00~99: Font
- STN (Graphic)
Mask Option
- TFT Device
Mask Option
11. " - "
12~14. Package Type
- In Case of PKG
A : SDIP B : BUMP BIZ
C : CHIP BIZ E : LQFP
J : ELP K : TR
N : COB Q : QFP
S : SOP T : TQFP
W : WAFER X : ETQFP
(13) Reserved
- PKG Option
0 : none
1 : Special Handling 1 2 : Special Handling 2
3 : Special Handling 3 A : Test Condition 1
B : Customer Option 1 C : Customer Option 2
D : Customer Option 3 E : Customer Option 4
G : Customer Option 6 H : Customer Option 7
J : Customer Option 8 K : Customer Option 9
L : Customer Option 10 M : Customer Option 11
N : Customer Option 12 P : Customer Option 13
- WAFER
0 : BUMP 1 : NO BUMP
(14) Packing
- In Case of TAB / COF
(12)(13) Film Type
00~49 TAB
50~99 COF
(14) Revision
1st Version X
15. Back Lap
0 : No Grinding 1 : 250±10um
5 : 200±10um
8 : 300±10um (CHIP BIZ) 9 : 280±10um
A : 300±10um
C : 300±10um (Wafer)
G : 375±10um (CHIP BIZ) J : 425±10um
K : 400±10um L : 450±10um
M : 470±10um (Wafer) N : 470±10um
R : 350±10um (Wafer) U : 610±10um
V : 500±10um (CHIP BIZ)
W : 425±10um (Wafer)
X : 425±10um (CHIP BIZ)
Y : 470±10um (CHIP BIZ)
Z : No Grinding (CHIP / Wafer)
SYSTEM LSI
8
Application Processors
SAMSUNG SEMICONDUCTOR, INC. AUGUST 2007BR-07-ALL-002
MOBILE APPLICATION PROCESSORS
Part Max Memory Boot Multimedia Connectivity Timer/PWM Serial
Number Core (Cache) Freq Inteface Option Features Counter Interface DMA Package
S3C3410 ARM7TDMI 40MHz ROM/SRAM NOR/ROM LCD I/F WDT, RTC UART/IIC 2-ch 128QFP
(4KB) SRDAM 10-bit ADC x 8 8/16-bit TCx5 SIOx2
S3C44B0 ARM7TDMI 66MHz ROM/SRAM NOR/ROM Mono/Color/Gray STN LCD I/F, WDT, RTC UARTx2 4-ch 160LQFP
(8KB) SDRAM IIS, 10-bit ADC x 8 16-bit TCx5 IIC/IIS 160FBGA
S3C2412 ARM926EJ-S 200MHz ROM/SRAM NOR /ROM TFT/STN(65K) LCD I/F, USB host 1.1 WDT, RTC UARTx3(IrDA) 4-ch 272FBGA
(8KB I/D) 266MHz SDRAM/mSDRAM NAND Touch Screen(ADC), IIS USB device 1.1 16-bit TC x4 SPIx2
NAND SD(SDIO)/MMC IIC
CF/ATA
S3C2413 ARM926EJ-S 266MHz ROM/SRAM NOR/ROM TFT/STN(65K) LCD I/F, USB host 1.1 WDT, RTC UARTx3(IrDA) 4-ch 289FBGA
(8KB I/D) SDRAM/mSDRAM NAND Camera I/F 2MP, USB device 1.1 16-bit TC x4 SPIx2
DDR/mDDR x16 OneNAND Touch Screen(ADC), IIS SD(SDIO)/MMC, IIC
NAND/oneNAND CF/ATA
S3C2410 ARM920T 200MHz ROM/SRAM NOR/ROM TFT/STN LCD I/F, USB host 1.1 WDT, RTC UARTx3(IrDA) 4-ch 272FBGA
(16KB-I,16KB-D) 266MHz SDRAM/mSDRAM NAND Touch Screen(ADC), IIS USB device 1.1 16-bit TC x4 SPIx2
NAND SD(SDIO)/MMC IIC
S3C2440 ARM920T 300MHz ROM/SRAM NOR/ROM TFT/STN LCD I/F, USB host 1.1 WDT, RTC UARTx3(IrDA) 4-ch 289FBGA
(16KB-I,16KB-D) 400MHz SDRAM/mSDRAM NAND Touch Screen(ADC), USB device 1.1 16-bit TC x4 SPIx2
NAND IIS, AC97, SD(SDIO)/MMC IIC
Camera I/F 16MP
SC32442 ARM920T 300MHz Stacked with NOR/ROM TFT/STN LCD I/F, USB host 1.1 WDT, RTC UARTx3(IrDA) 4-ch 332FBGA
(16KB-I,16KB-D) 400MHz 32/64MB mSDRAM, NAND Touch Screen(ADC), USB device 1.1 16-bit TC x4 SPIx2
64/128MB NAND IIS, AC97, SD(SDIO)/MMC IIC
Camera I/F 16MP
S3C24A0 ARM926EJ-S 266MHz ROM/SRAM NOR/ROM TFT/STN LCD I/F, USB host 1.1 WDT, RTC UARTx2(IrDA) 4-ch 337FBGA
(16KB-I,16KB-D) SDRAM/mSDRAM NAND Touch Screen(ADC), USB device 1.1 16-bit TC x4 SPIx2
NAND IIS, AC97, SD(SDIO)/MMC IIC
Camera I/F 16MP Memory Stick IrDA(v1.1)
Video CODEC(H.263/MPEG4)
Modem I/F
S3C2443 ARM920T 400MHz ROM/SRAM NOR/ROM TFT(2-PIP)/STN LCD I/F, USB host 1.1 WDT, RTC UARTx4(IrDA) 6-ch 400FBGA
(16KB-I,16KB-D) 533MHz SDRAM/mSDRAM NAND Camera I/F 8MP, IIS, AC97, USB device 1.1 16-bit TC x4 SPIx2
DDR/mDDR x16 OneNAND Touch Screen(ADC) SD(SDIO)/MMC x2 IIC
NAND/oneNAND HS-MMC(CE-ATA) IrDA(v1.1)
CF/ATA
S3C6400 ARM1176JZF 400MHz ROM/SRAM NOR/ROM TFT(5-PIP) LCD I/F, USB host 1.1, WDT, RTC UARTx4(IrDA) 32-ch 424FBGA
(16KB-I,16KB-D) 533MHz DDR/mDDR x32 NAND Camera I/F 16MP, USB OTG 2.0 32-bit TC x5 SPIx2
(16KB I/D TCM) 667MHz NAND/OneNAND OneNAND Touch Screen(ADC), SD(SDIO)/MMC x3 IIC
MoviNAND 2D Graphic, IIS, AC97, PCM HS-MMC(CE-ATA) IrDA(v1.1)
Others Video CODEC(H264,MPEG4,VC1) CF/ATA
JPEG, TV-OUT Keypad, MIPI
Modem Interface
SYSTEM LSI
9
HDTV/STB Products
SAMSUNG SEMICONDUCTOR, INC.
AUGUST 2007 BR-07-ALL-002
HDTV/STB PRODUCTS 20.1" UXGA 21.3" UXGA 21.3" QXGA 20.1" WSXGA+
Part Number S3C2800 S5H2000 S5H2010
Product Description Co-Processor for DTV MPEG Decoder DTV MPEG Decoder DTV MPEG Decoder
Typical Applications Set top box, HDTV, General Purpose Low-Mid-Range HDTV/STB Low-Mid-Range HDTV/STB
Package 208 LQFP 352 TBGA 492 BGA
CPU Core ARM920T Uses External S3C2800 CPU Uses External S3C2800 CPU
Max Frequency 200MHz 135MHz 135MHz
Data Bus (bits) 32 32 32
Serial Interface PCI (32 bits, 33MHz) PCI (32 bits, 33MHz) PCI (32 bits, 33MHz, UART,
Smart Card
I/O Pins 244 276
I/O Ports 44 General Purpose
Interupts (Ext) 34
Timer 3-Ch, 16-Bit Watchdog
Cache 16KB-I, 16KB-D
DMA/UART 4-Ch / 2-Ch
Other Features On-Chip PLL Clock Generator Display Processor (IPC, Scaler) Display Processor (IPC, Scaler)
Digital HD (24bits)/SD (8bits) Input Digital HD (24bits)/SD (8bits) input
CCIR 656-like input CCIR 656-like input
Digital/Analog HD output Digital/Analog HD output
Analog SD output Analog SD output
2 Sets of Triple 10 bit DAC 2 Sets of Triple 10 bit DAC with
enhanced CAS
2D Graphics, TS Demux 2D Graphics, TS Demux Enhanced
SYSTEM LSI
10
Microcontrollers
SAMSUNG SEMICONDUCTOR, INC. AUGUST 2007BR-07-ALL-002
4-BIT MICROCONTROLLER FAMILY
Part Name Package ROM RAM Interrupt Timer/ LCD ADC PWM(1) Max. OSC. OTP
Type Kbytes Nibble I/O Pins (Int/Ext) Counters SIO (Seg/Com) (Bit x Ch) (BitxCh) DTMF Freq. Vdd (V) Equivalent
SS3C7xxx (KS57) Series
S3C70F4XZ0-AV94 30SDIP 4 512 24 3/2 BT/WT/8TC Yes Comx4 6MHz 1.8~5.5 S3P70F4X
S3C70F4XZ0-SO94 32SOP
S3C7235DZ0-QW85 80QFP 16 512 40 3/3 BT/WT/WDT/8T Yes 32/4 6MHz 1.8~5.5 S3P7235X
S3C72H8XZ0-QT88 64QFP 8 512 21 3/3 BT/WT/WDT/8T/16T 26/4 Comx2 6MHz 1.8~5.5 S3P72H8X
S3C72K8XZ0-QW88 80QFP 8 1024 27 3/4 BT/WT/8TC Yes 40/8 Comx2 6MHz 2.0~5.5 S3P72K8X
S3C72M9XZ0-QA89 128QFP 32 3840 51 5/4 BT/WT/WDT/8T/16T Yes 80/16 Comx3 6MHz 1.8~5.5 S3P72M9X
S3C72N5XZ0-QW85 80QFP 16 512 40 3/3 BT/WT/8TC Yes 32/4 6MHz 1.8~5.5 S3P72N5X
S3C72P9XZ0-QX89 100QFP 32 1056 39 4/4 BT/WT/8TC/16TC Yes 56/16 6MHz 1.8~5.5 S3P72P9X
S3C72Q5XZ0-QX85 100QFP 16 5264 39 3/3 BT/WT/8TCx2 60/12 6MHz 1.8~5.5 S3P72Q5X
S3C7335XZ0-QW85 80QFP 16 512 56 4/4 BT/WT/WDT/8T Yes 28/4 8x4 6MHz 1.8~5.5 S3P7335X
S3C7414DZ0-AQ94 42SDIP 4 256 35 5/3 BT/WT/WDT/8Tx2 Yes 8x6 (8x1) 6MHz 1.8~5.5 S3P7414D
S3C7414DZ0-QZ84 44QFP
S3C7515DZ0-AT95 64SDIP 16 512 55 4/3 BT/WT/8Tx2 Yes Yes 6MHz 2.0~5.5 S3P7515D
S3C7515DZ0-QT85 64QFP
S3C7528DZ0-AQ98 42SDIP 8 768 35 3/3 BT/WT/WDT/8Tx2 Yes 6MHz 1.8~5.5 S3P7528D
S3C7528DZ0-QZ88 44QFP
S3C7544XZ0-AM94 24SDIP 4 512 17 2/2 BT/WDT/8T 6MHz 1.8~5.5 S3P7544X
S3C7544XZ0-SM94 24SOP
S3C7559XZ0-AT99 64SDIP 32 1024 55 4/3 BT/WT/WDT/8Tx2 Yes Yes 6MHz 1.8~5.5 S3P7559X
S3C7559XZ0-QT89 64QFP
S3C7588AZ0-C0C8 44Pellet 8 768 25 4/4 BT/WT/WDT/8TCx2 Yes 3.58MHz 2.7~5.5 S3P7588X
NOTES: *Under development. Contact Samsung
sales office for availability.
(1) ( ) S/W supported PWM
(2) SIO mode can be selected by S/W
(3) Flash: Writing endurance is 10K times
(4) MTP: Writing endurance is 100 times
Abbreviations:
ADC=Analog to Digital Converter
DTMF=Dual Tone Multi Frequency
CAS=CPE Alerting Signal
PWM=Pulse Width Modulation
SIO=Serial Input/Output
8T/16T=8-bit /16-bit Timer
BT/WT/WDT=Basic/Watch/Watchdog Timer
DAC=Digital to Analog Converter
ZCD=Zero Cross Detection circuit
Com=Comparator
FSK=Frequency Shift Keying
SYSTEM LSI
11
Microcontrollers
SAMSUNG SEMICONDUCTOR, INC.
AUGUST 2007 BR-07-ALL-002
8-BIT MICROCONTROLLER FAMILY
Part Name Package ROM RAM Interrupt Timer/ Serial LCD ADC PWM(1) Max. OSC. OTP or Flash
Type Kbytes Bytes I/O Pins (Int/Ext) Counter Interface (Seg/Com) (Bit x Ch) (BitxCh) Freq. Vdd (V) Equivalent
S3C9xxx (KS86) Series
S3C9228AZ0-AQ98 42SDIP 8 256 36 4/10 BT/WT/8TCx2 SIO 16x8 10x4 8MHz 2.0~5.5 S3P9228A
S3C9228AZ0-QZ88 44QFP
S3C9228AZ0-LR88 48ELP
S3C9234XZ0-QT84 64QFP 4 208 52 5/7 BT/WT/8TCx2 SIO 32/4 8MHz 2.0~5.5 S3P9234X
S3C9404DZ0-AV94 30SDIP 4 208 22 3/3 BT/WDT/8Tx2 8x8 (10x1) 10MHz 2.7~5.5 S3P9404D
S3C9404DZ0-SO94 32SOP
S3C9428XZ0-SN98 28SOP 8 208 24 5/4 BT/WDT/8Tx2 IIC, SIO 10x12 12x2, (8x1) 16MHz 1.8~5.5 S3P9428X
S3C9428XZ0-SO98 32SOP
S3C9428XZ0-AV98 30SDIP
S3C9434XZ0-DI94 18DIP 4 112 11/13 3/2 BT/WDT/8T SIO 10x5 12x1 16MHz 3.0~5.5 S3P9434X
S3C9434XZ0-DK94 20DIP
S3C9434XZ0-SK94 20SOP
S3C9444XZ0-SC94 8SOP 4 208 6 1/2 BT/8TC 10x3 10MHz 2.0~5.5 S3F9444X(4)
S3C9444XZ0-DC94 8DIP
S3C9454BZ0-DH94 16DIP 4 208 14/18 2/2 BT/8TC 10x9 8x1 10MHz 2.0~5.5 S3F9454B(4)
S3C9454BZ0-SH94 16SOP
S3C9454BZ0-RH94 16TSSOP
S3C9454BZ0-DK94 20DIP
S3C9454BZ0-SK94 20SOP
S3C9454BZ0-VK94 20SSOP
S3C9488XZ0-AO98 32SDIP 8 208 26/36/38 6/4 BT/8T UART 19/8 10x9 10MHz 2.2~5.5 S3F9488X(4)
S3C9488XZ0-SO98 32SOP
S3C9488XZ0-AQ98 42SDIP
S3C9488XZ0-QZ88 44QFP
S3C9498XZ0-SN98 28SOP 8 208 22/24/26 11/5 BT/8TCx4/16TC SIO, UART 10x8 12x1, (8x1) 8MHz 2.0~5.5 S3F9498X(4)
S3C9498XZ0-SO98 32SOP
S3C9498XZ0-AO98 32SDIP
S3C9498XZ0-AV98 30SDIP
S3C94A5XZ0-QZ85 44QFP 16 368 34 8/15 BT/WT/8TC/16TCx2 SIO 10x16 8x1, 16x2 12MHz 2.0 ~5.5 S3F94A5X(4)
S3C94A5XZ0-AQ95 42SDIP
S3C94A5XZ0-AO95 32SDIP
S3C9688XZ0-AQ98 42SDIP 8 208 32 15/14 BT/WDT/8T USB 6MHz 4.0~5.25 S3P9688X
S3C9688XZ0-QZ88 44QFP
S3C8xxx (KS88) Series
S3C80A5BZ0-SM95 24SOP 16 272 19 5/8 BT/WDT/8Tx2/16T 8x1 8MHz 2.0~3.6 S3P80A5A
S3C80A5BZ0-AM95 24SDIP
S3C80B5XZ0-SM95 24SOP 16 272 19 5/8 BT/WDT/8Tx2/16T 8x1 4MHz 1.7~3.6 S3P80B5X
S3C80B5XZ0-AM95 24SDIP
S3C80C5XZ0-SM95 24SOP 16 272 19 5/8 BT/WDT/8Tx2/16T 8x1 4MHz 1.7~3.6 S3P80C5X
S3C80C5XZ0-AM95 24SDIP
S3C80F9BZ0-SO99 32SOP 32 272 38 5/16 BT/8TC/16TC 8x1 8MHz 2.0~5.0 S3P80F9X
S3C80F9BZ0-AQ99 42SDIP
S3C80F9BZ0-QZ89 44QFP
S3C80F9BZ0-LR89 48ELP
S3C80G9BZ0-SN99 28SOP 32 272 38 5/16 BT/8TC/16TC 8x1 4MHz 1.7~3.6 S3P80G9X
S3C80G9BZ0-SO99 32SOP
S3C80G9BZ0-AQ99 42SDIP
S3C80G9BZ0-QZ89 44QFP
S3C80J9XZ0-SO99 32SOP 32 272 26 12/10 BT/8T/16T 8x1 8MHz 1.95~3.6 S3F80J9X(3)
S3C80J9XZ0-SN99 28SOP
S3C80JBBZ0-QZ8B 44QFP 64 272 38 14/10 BT/8T/16Tx2 COMx4 8x1 8MHz 1.95~3.6 S3F80JBB(3)
S3C80JBBZ0-SO9B 32SOP
S3F80K5XZ0-SM95 44QFP 16 272 22 16/8 BT/8T/16Tx2 8x1 8MHz 1.65~3.6 S3F80K5X(3)
S3F80K5XZ0-SN95 32SOP
S3F80K9XZ0-QZ89 44QFP 32 272 38 16/8 BT/8T/16Tx2 8x1 8MHz 1.65~3.6 S3F80K9X(3)
S3F80K9XZ0-SO99 32SOP
S3F80K9XZ0-SN99 28SOP
S3F80KBXZ0-QZ8B 44QFP 64 272 38 16/8 BT/8T/16Tx2 8x1 8MHz 1.65~3.6 S3F80KBX(3)
S3F80KBXZ0-SO9B 32SOP
S3F80L4XZ0-AO94 32SDIP 4 144 26 2/8 BT/8TC 8x1 8MHz 2.0~5.5 S3F80L4X(4)
S3F80L4XZ0-SO94 32SOP
S3F80L4XZ0-SN94 28SOP
S3C80M4XZ0-DK94 20DIP 4 128 15/11 2/4 BT/8TC 8x1 10MHz 2.0~5.5 S3F80M4X(4)
S3C80M4XZ0-SK94 20SOP
S3C80M4XZ0-DH94 16DIP
S3C80M4XZ0-SH94 16SOP
SYSTEM LSI
12
Microcontrollers
SAMSUNG SEMICONDUCTOR, INC. AUGUST 2007BR-07-ALL-002
8-BIT MICROCONTROLLER FAMILY
Part Name Package ROM RAM Interrupt Timer/ Serial LCD ADC PWM(1) Max. OSC. OTP or Flash
Type Kbytes Bytes I/O Pins (Int/Ext) Counter Interface (Seg/Com) (Bit x Ch) (BitxCh) Freq. Vdd (V) Equivalent
S3C8xxx (KS88) Series
S3C8235BZ0-QT85 64QFP 16 552 32 8/8 BT/8TCx2/16TC 24/8 10x8 8x2 8MHz 2.0~5.5 S3F8235X(4)
S3C8235BZ0-ET85 64LQFP
S3C8245AZ0-TW85 80TQFP 16 544 45 8/8 BT/WDT/8Tx2/16Tx2 SIO 32/4 10x8 (8x2, 16x1) 10MHz 1.8~5.5 S3P8245X
S3C8245AZ0-QW85 80QFP
S3C8249XZ0-TW89 80TQFP 32 1056 45 8/8 BT/WDT/8Tx2/16Tx2 SIO 32/4 10x8 (8x2, 16x1) 10MHz 1.8~5.5 S3P8249X
S3C8249XZ0-QW89 80QFP
S3C825ACZ0-TW8A 80TQFP 48 2096 67 11/12 BT/WT/8TC/16TC SIO, UART 28/8 10x4 (8x1, 16x1) 8MHz 2.0~5.5 S3P825AX
S3C825ACZ0-QW8A 80QFP
S3C826AXZ0-QC8A 144QFP 48 2k 128 9/12 BT/8TCx3/16TC SIO 80/16 8x4 8x2 8MHz 2.0~5.5 S3P826AX
S3C8274XZ0-QT84 64QFP 4 256 52 4/8 WT/BT/8TCx2 SIO 32/4 8MHz 2.0~3.6 S3F8274X(4)
S3C8274XZ0-ET84 64LQFP
S3C8275XZ0-QT85 64QFP 16 512 S3F8275X(3)
S3C8275XZ0-ET85 64LQFP
S3C8278XZ0-QT88 64QFP 8 256 S3F8278X(4)
S3C8278XZ0-ET88 64LQFP
S3C8285XZ0-QW85 80QFP 16 512 65 10/8 BT/WT/8TCx2/16TCx2 UART, SIO 32/8 10x8 8x1,16x1 11.1MHz 2.0~3.6 S3F8285X(4)
S3C8285XZ0-TW85 80TQFP
S3C8289XZ0-QW89 80QFP 32 1024 S3F8289X(4)
S3C8289XZ0-TW89 80TQFP
S3C828BXZ0-QW8B 80QFP 64 2560 S3F828BX(3)
S3C828BXZ0-TW8B 80TQFP
S3F82E5XZ0-QZ85 44QFP 16 208 38 5/4 BT/WT/8TC SIO 23/4 8MHz 2.0~3.6 S3F82E5X(4)
S3F82E5XZ0-TB85 48TQFP
S3F82F5XZ0-QX85 100QFP 16 2.5K 44 6/12 BT/WT/8TCx2/16TC SIO 60/16 8x1 8MHz 2.0~5.0 S3F82F5X(4)
S3F82F5XZ0-TX85 100TQFP
S3F82HBXZZ-QX8B 100QFP 64 2.5K 83 17/12 BT/WT/8TCx2/16TCx2 UARTx2, SIO 52/8 10x8 8x1, 16x2 12MHz 2.0~3.6 S3F82HBX(3)
S3F82HBXZZ-TX8B 100TQFP
S3F82I9XZZ-QW89 80QFP 32 1024 63 10/8 BT/WT/8TCx2/16TCx2 UART, SIO 32/8 10X8 8x1, 16x2 12MHz 2.0~3.6 S3F82I9X (3)
S3F82I9XZZ-TW89 80TQFP
S3C830AXZ0-QX8A 100QFP 48 2084 72 10/8 BT/WDT/8Tx2/16T SIOx2 40/4 8x4 8x1 4.5MHz 3.0~5.5 S3P830AX
S3F833BXZ0-QX8B 100QFP 64 2.5K 86 13/8 BT/WDT/WT/8Tx2/16T SIOx2, UARTx2 40/8 10x12 8x1 12MHz 2.0~3.6 Flash Only
S3F833BX(4)
S3F834BXZ0-TX8B 100TQFP 64 2.5K 86 13/8 BT/WDT/WT/8Tx2/16T SIOx2, UARTx2 40/8 10x12 8x1 12MHz 2.0~3.6 Flash Only
S3F834BX(4)
S3C8454XZ0-TW84 80TQFP 4 1040 42 8/8 BT/WDT/8Tx2/16Tx2 SIO 8x4 8x2, (16x2) 25MHz 4.5~5.5 S3P8454X
S3C8454XZ0-QW84 80QFP
S3C8469XZ0-AT99 64SDIP 32 528 56 11/10 BT/WDT/8Tx2/16Tx2 UART, SIO 10x8 14x2, (8x2) 12MHz 2.7~5.5 S3P8469X
S3C8469XZ0-QT89 64QFP
S3C8469XZ0-LT89 64ELP
S3C8475XZ0-AQ95 42SDIP 16 272 36 6/8 BT/WDT/8T/16T UARTx2 10x8 (8x1, 10x1) 12MHz 2.7~5.5 S3P8475X
S3C8475XZ0-QZ85 44QFP
S3C848AXZZ-AT9A 64SDIP 48 2064 56 15/14 BT/8TCx4/16Tx2 UARTx2 SIO 10x8 14x2, (8x2) 12MHz 2.7~5.5 S3P848AX
S3C848AXZZ-QT8A 64QFP
S3C84BBXZ0-TW8B 80TQFP 64 2064 70 14/10 BT/8TCx2/16TCx2/8Tx2 UARTx2, SIO 10x8 8*1 (DAC) 10MHz 2.7~5.5 S3F84BBX(3)
S3C84BBXZ0-QW8B 80QFP
S3C84DBXZ0-TW8B 100TQFP 64 2064 90 14/10 BT/8TCx4/16TCx2 UARTx2, SIO 48/8 10x8 8*1 (DAC) 10MHz 2.7~5.5 S3F84DBX(3)
S3C84DBXZ0-QW8B 100QFP
S3C84E9XZ0-AQ99 42SDIP 16 272 34/36 9/12 BT/WT/8T/8TC/16TCx2 UART 10x8 (8x1) 12MHz 2.7~5.5 S3P84E9X
S3C84E9XZ0-QZ89 44QFP
S3C84H5XZ0-AO95 32SDIP 16 272 22/20/18 12/4 BT/WT/8TCx2/16TCx2 UART, SIO 10x8 10x1 10MHz 2.4~5.5 S3F84H5X(4)
S3C84H5XZ0-SO95 32SOP
S3C84H5XZ0-LO85 32ELP
S3C84H5XZ0-AV95 30SDIP
S3C84H5XZ0-SN95 28SOP
S3C84I8XZ0-AQ98 42SDIP 8 292 34/32 12/4 BT/WT/8TCx2/16TCx2 UART, SIO 16/8 10x8 10x1 10MHz 2.4~5.5 S3F84I8X(4)
S3C84I8XZ0-QZ88 44QFP
S3C84I9XZ0-AQ99 42SDIP 32 528 S3F84I9X(3)
S3C84I9XZ0-QZ89 44QFP
S3F84K4XZ0-DH94 16DIP 4 208 11/18 2/2 BT/16(8X2)T 10x9 12x1 8MHz 2.0~5.5 Flash Only
S3F84K4X(4)
S3F84K4XZ0-SH94 16SOP
S3F84K4XZ0-RH94 16TSSOP
S3F84K4XZ0-DK94 20DIP
S3F84K4XZ0-SK94 20SOP
S3F84K4XZ0-VK94 20SSOP
SYSTEM LSI
13
Microntrollers
SAMSUNG SEMICONDUCTOR, INC.
AUGUST 2007 BR-07-ALL-002
8-BIT MICROCONTROLLER FAMILY
Part Name Package ROM RAM Interrupt Timer/ Serial LCD ADC PWM(1) Max. OSC. OTP or Flash
Type Kbytes Bytes I/O Pins (Int/Ext) Counter Interface (Seg/Com) (Bit x Ch) (BitxCh) Freq. Vdd (V) Equivalent
S3C8xxx (KS88) Series
S3F84MBXZ0-TW8B 80TQFP 64 2064 70 17/10 BT/8TCx2/16TCx2/8Tx2 UARTx3, SIOx2 10x5 8x2 10MHz 2.4~5.5 Flash Only
S3F84MBX(3)
S3F84MBXZ0-QW8B 80QFP
S3F84NBXZ0-AT9B* 64SDIP 64 2064 56 15/14 BT/8Tx316TCx2 UARTx2, SIO 10x8 10MHz 2.4~5.5 Flash Only
S3F84MBX(3)
S3F84NBXZ0-QT8B* 64QFP
S3F84P4XZ0-SC94 8SOP 4 208 6 2/2 BT/16(8X2)T 10x4 12x1 10MHz 2.0~5.5 Flash Only
S3F84P4X(4)
S3F84P4XZ0-DC94 8DIP
S3F84Q5XZZ-SN95* 28SOP 16 528 26 14/9 BT/WT/8TCx2/16TCx2 UART, SIO 10x8 14x1 10MHz 2.0~5.5 Flash Only
S3F84Q5X (3)*
S3F84Q5XZZ-AV95* 30SDIP
S3F84Q5XZZ-AO95* 32SDIP
S3F84Q5XZZ-SO95* 32SOP
S3F84S5XZZ-DH95* 16DIP 16 272 17/13 6 BT/8T 12x9 12x1 10MHz 2.4~5.5 Flash Only
S3F84S5X (3)*
S3F84S5XZZ-DK95* 20DIP
S3F84S5XZZ-SH95* 16SOP
S3F84S5XZZ-SK95* 20SOP
S3F84T5XZZ-SN95* 28SOP 16 272 18/20/22 16 BT/WT/8TCx2/16TCx2 UART, SIO 10x8 10x1 10MHz 2.4~5.5 Flash Only
S3F84T5X (3)*
S3F84T5XZZ-AO95* 32SDIP
S3F84T5XZZ-SO95* 32SOP
S3F84UAXZZ-QZ8A* 44QFP 48 528 32/30 12/12 BT/WDT/WT/ UARTx2, SIO 20/8 10x8 8x3 12MHz 1.8~5.5 Flash Only
8TCx3/16TCx2 S3F84UAX (3)*
S3F84UAXZZ-AQ9A* 42SDIP
S3F84VBXZZ-QT8B* 64QFP 64 2064 54 12/12 BT/WDT/WT/ UARTx2, SIO 10x8 8x3 12MHz 1.8~5.5 Flash Only
8TCx3/16TCx2 S3F84VBX (3)*
S3F84VBXZZ-AT9B* 64SDIP
S3F84V9XZZ-QT89* 64QFP 32 1040 54 12/12 BT/WDT/WT/ UARTx2, SIO 10x8 8x3 12MHz 1.8~5.5 Flash Only
8TCx3/16TCx2 S3F84V9X (3)*
S3F84V9XZZ-AT99* 64SDIP
S3F84YBXZZ-QW8B* 80TQFP 64 2064 70 13/12 BT/WDT/WT/ UARTx2, SIO 10x8 8x4 12MHz 1.8~5.5 Flash Only
8TCx4/16TCx2 S3F84YBX (3)*
S3F84YBXZZ-TW8B* 80QFP
S3F84ZBXZZ-TX8B* 100TQFP 64 2064 90 13/14 BT/WDT/WT/ UARTx2, SIO 10x8 8x4 12MHz 1.8~5.5 Flash Only
8TCx4/16TCx2 S3F84ZBX (3)*
S3F84ZBXZZ-QX8B* 100QFP
S3C851BXZ0-QD8B 160QFP 64 1808 42 1/7 BT/WDT/WT/8T/16T UART, SIO 56/34 10x4 3.58MHz 2.7~5.5 S3P851BX
S3C863AXZ0-AQ9A 42SDIP 48 1040 27 7/3 BT/8TC/8T/12C M/M IIC, 8x4 8x7 12MHz 3.0~5.5 S3P863AX
Slave IIC
S3C863AXZ0-QZ8A 44QFP
S3C8647XZ0-AO97 32SDIP 24 384 19 6/3 BT/8TC/8T/12C IIC 4x4 8x6 12MHz 4.0~5.5 S3F8647X(4)
S3C866BXZ0-AQ9B 42SDIP 64 1040 30 9/2 BT/WDT/8TCx3 IIC 8x8 8x7 24MHz 2.3~3.6V S3F866BX(4)
S3C866BXZ0-QZ8B 44QFP
S3C866BXZ0-PZ9B 44PLCC
S3C880AXZ0-AQ9A 42SDIP 48 336 26 5/4 BT/8TCx2 8x4 14x2, 8MHz 4.5~5.5 S3F880AX(4)
8x4(8x1)
S3C8849XZ0-AQ99 42SDIP 32 272 26 5/4 BT/WDT/8Tx2 4x4 14x2, 8MHz 4.5~5.5 S3P8849X
8x4(8x1)
S3CKxxx (Calm8) Series
S3FK11XZZ-QA8F 128QFP 256 1K 90 13/8 BT/WT/8TCx2/16TC SIO 64/16 10x1 8x1 8MHz 2.4~3.6 Flash Only
S3FK11FX (4)
S3CK225XZ0-QT85 64QFP 16 384 48 9/4 BT/WT/8TCx2/16TC SIO 32/4 10x8 8x2, 16x1 8MHz 2.4~3.6 S3FK225X (4)
S3CK225XZ0-ET85 64LQFP
S3CK318XZ0-QZ88 44QFP 8 256 36 7/7 BT/WT/8TCx2/16TC SIO 16/8 10x4 16x1 8MHz 2.4~3.6 S3F318X (4)
NOTES:
1 *Under Development. Contact Samsung
sales office for availability
2 (1) ( ) S/W supported PWM
(2) SIO mode can be selected by S/W
(3) Flash: Writing endurance is 10K times
(4) MTP: Writing endurance is 100 times
3 Abbreviations:
LVR = Low Voltage Reset
ZCD=Zero Cross Detection circuit
FSK=Frequency Shift Keying
RDS=Radio Data System
DAC=Digital to Analog Converter
PWM=Pulse Width Modulation
SIO=Serial Input/Output
LIN=Local Interface Network
DTMF=Dual Tone Multi Frequency
DDC=Display Data Channel
SDT=Stuttered Dial Tone
BT/WT/WDT=Basic/Watch/Watchdog timer
8T/16T=8-bit /16-bit Timer
OSD=On Screen Display
ADC=Analog to Digital Converter
CAS=CPE Alerting Signal
LVD = Low Voltage Detector
PGM=Pattern Generation Module
Com=Comparator
SYSTEM LSI
14
Microntrollers
SAMSUNG SEMICONDUCTOR, INC.
NOTES:
1 *Under Development. Contact Samsung sales office for availability.
32-BIT MICROCONTROLLER FAMILY
General Purpose Application
Part Name CPU Package ROM RAM I/O Pins Interrupt Timer / Serial ADC PWM Max Vopr
Type (KByte) (KByte) (Int/Ext) Counter Interface OSC
S3F441FXZZ-ETRF ARM7TDMI 64LQFP 256 8 16 16/3 BT/WDT/16TCx6 UART 40MHz 3.0~3.6
S3F443FXZZ-ET8F ARM7TDMI 64LQFP 256 8 16 18/3 BT/WDT/16TCx6 UART 8x1 40MHz 3.0~3.6
S3F445HXZZ-TX8H ARM7TDMI 100TQFP 512 16 73 22/8 BT/WDT/16TCx6 UARTx2 10x8 40MHz 3.0~3.6
2 Abbreviations:
ADC=Analog to Digital Converter
BT/WT/WDT=Basic/Watch/
Watchdog timer
SST=Stamp Timer
GPT=General Purpose timer
SSP=Synchronous Serial Port
IMC=Inverter Motor Controller
ENC=Encoder Counter
LIN=Local Interface Network
16-BIT MICROCONTROLLER FAMILY
Part Name Package ROM RAM Interrupt Timer/ Serial LCD ADC PWM(1) Max. OSC. Other
Type Kbytes Bytes I/O Pins (Int/Ext) Counter Interface (Seg/Com) (Bit x Ch) (BitxCh) Freq. Vdd (V) Features
S3FC11BXZZ-QX8F 100QFP 64 10k 77 8/9 BT/WT/8TCx3 SIO 36/8 10X4 8x1 40MHz 2.0~3.6 MAC1616
S3FC11BXZZ-TX8F 100TQFP
S3CC34DXZZ-QX8D 100QFP 128 4 90 20/16 BT/WT/8TCx3/16TCx3 UART, SIOx4 10X16 8x3, 16x3 12MHz 2.4~5.5
S3CC34DXZZ-TX8D 100TQFP
S3FC40DXZZ-QX8D 100QFP 128 6 90 30/16 BT/WT/8TCx2/16TCx8 UARTx3, SIOx2 10X24 8x2, 16x8 12MHz 2.4~5.5
S3FC40DXZZ-TX8D 100TQFP
S3FC40DXZZ-QA8D 128QFP
NOTES:
1 *Under Development. Contact
Samsung sales office for availability.
2 (1) ( ) S/W supported PWM
(2) SIO mode can be selected by S/W
(3) Flash: Writing endurance is 10K times
(4) MTP: Writing endurance is 100 times
3 Abbreviations:
LVR = Low Voltage Reset
ZCD=Zero Cross Detection circuit
FSK=Frequency Shift Keying
RDS=Radio Data System
DAC=Digital to Analog Converter
PWM=Pulse Width Modulation
SIO=Serial Input/Output
LIN=Local Interface Network
DTMF=Dual Tone Multi Frequency
DDC=Display Data Channel
SDT=Stuttered Dial Tone
BT/WT/WDT=Basic/Watch/
Watchdog timer
8T/16T=8-bit /16-bit Timer
OSD=On Screen Display
ADC=Analog to Digital Converter
CAS=CPE Alerting Signal
LVD = Low Voltage Detector
PGM=Pattern Generation Module
Com=Comparator
32-BIT MICROCONTROLLER FAMILY
Network Application
Part Name CPU Package System I/O Interrupt Ethernet HDLC USB Timer Serial DES PCI SAR GDMA Max. Vopr
Type Manager Pins (Int/Ext) (10/100M) Counter Interface 3DES OSC
S3C4510B-QE80 ARM7TDMI 208QFP SDRAM Memory 18 17/4 1ch 2ch 32bit 2ch UARTx2, IIC 2ch 50MHz 3.3V
(NOR,SRAM) IF
S3C4530A-QE80 ARM7TDMI 208QFP SDRAM Memory 26 17/4 1ch 2ch 32bit 2ch UARTx2, IIC 2ch 50MHz 3.3V
(NOR,SRAM) IF
SS3C2510A-GB80 ARM940T 416PBGA SDRAM Memory 64 30/6 2ch 1 Device (F-speed) 32bit 2ch, UARTx3, IIC Yes Yes "UTOPIA I/F 6ch 166Mhz 1.8/3/3V
(NOR,SRAM) IF 1 Host (F-speed, WDT
support 2device)
Inverter Motor Application
Part Name CPU Package ROM / Flash RAM I/O Pins Interrupt IMC ENC Timer / Serial ADC Max. Vopr
Type (KByte) (KByte) (Int/Ext) Counter Interface OSC
S3F401FXZZ-QX8F* ARM7TDMI 100QFP 256 20 66 59/31 2ch 2ch BT/WDT/16BTx6 UARTx2, SSPx2 12x15 90MHz 3.0~3.6
S3F401FXZZ-TX8F* 100TQFP
CAN/LIN Application
Part Name CPU Package ROM/Flash Data Flash RAM I/O Interrupt CAN / LIN Stepper Timer / Serial LCD ADC PWM Max Vopr
Type (KByte) (KByte) (KByte) Pins (Int/Ext) Motor Counter Interface OSC
S3F4A0KRZZ-EC8K ARM7TDMI 144LQFP 1024 32 32 111 44/20 4ch/3ch "6ch WDT(16x1) SPI0(8X1) 40/4 10x16 8x12 40MHz 3.0~5.5
(Driver 4ch) ST0(16x2) SPI1(16x1) 16x2
ST1(16x2) IIC(2ch)
ST2(16x2)
GPT(16x3)
STT(32x1)
S3F4A0KJZZ-EC8K
S3F4A1HRZZ-TX8H ARM7TDMI 100TQFP 512 32 16 74 52/12 2ch/3ch 4ch WDT(16x1) SPI0(8X1) 30/4 10x16 8X8 40MHz 3.0~5.5
ST0(16x2) SPI1(16x1) 16x2
ST1(16x2) IIC(2ch)
GPT(16x3)
STT(32x1)
S3F4A1HJZZ-TX8H
S3F4A2FRZZ-TW8F* ARM7TDMI 80TQFP 256 8 59 54/10 1ch/2ch WDT(16x1) SPI0(8X1) 10x16 16x8 20MHz 3.0~5.5
ST0(16x2) SPI1(16x1)
ST1(16x2) IIC(2ch)
GPT(16x3)
STT(32x1)
S3F4A2FJZZ-TW8F*
SYSTEM LSI
15
Microcontroller Ordering Information
SAMSUNG SEMICONDUCTOR, INC.
MICROCONTROLLER ORDERING INFORMATION
S 3 X X X X X X X X - X X X X X X X
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
1. System LSI (S)
2. Large Classification: Microcontroller(3)
3. Small Classification
C: MASK ROM E: EVA-CHIP
F: FLASH P: OTP
3: MCP
4. Core
1: 51 4-bit 2: 32-bit ARM9
3: 17 16-bit 4: 32 32-bit
5: 32-bit ARM10 6: 56 4-bit
7: 57 4-bit 8: 88 8-bit
9: 86 8-bit A: 15 Other
B: 8-bit CALM RISC MAC
C: 16-bit CALM RISC MAC
D: 32-bit CALM RISC MAC
I: CUSTOM MCU
J: SC-200
K: 8-bit CALM RISC
L: 16-bit CALM RISC
R: 128-bit CALM RISC
S: SC-100
5~6. Application Category
0n: General Purpose 1n: Voice
2n: LCD 3n: Audio
4n: General A/D 5n: Telecom
6n: PC & Peripheral,OA 7n: VFD
8n: Video 9n: Special (IC Card)
An: General Purpose-1 Cn: C
Fn: Telecom-1 Nn: Intel Application
Zn: Assignment Code
* "n": Serial No (1°„Z)
7. Rom Master
0: 0K byte 1: 1K byte
2: 2K byte 3: 12K byte
4: 4K byte 5: 16K byte
6: 6K byte 7: 24K byte
8: 8K byte 9: 32K byte
A: 48K byte B: 64K byte
C: 96K byte D: 128K byte
F: 256K byte G: 384K byte
H: 512K byte J: 1M byte
K: 1M byte
8. Version
A~Z
*1st Version °˜ X
9~10. Mask Option
11. (-- )
12. Package Type
A: SDIP B: LGA
C: CHIP BIZ D: DIP
E: LQFP F: WQFP
G: BGA H: CSP
J: BQFP K: UELP
L: ELP M: QFPH
N: COB P: PLCC
Q: QFP S: SOP
T: TQFP V: TEBGA
W: WAFER Y: FBGA
Z: SBGA
3. Package Pin
Wafer/CHIP BIZ = 0(NONE)
- SDIP
B: 56 M: 24 O: 32
Q: 42 T: 64 V: 30
- LGA
A: 88 C: 83 J: 176
- DIP
C: 8 H: 16 I: 18
K: 20 N: 28 P: 40
- LQFP
C: 144 D: 160 E: 208
G: 256 J: 176 R: 48
T: 64 W: 80 X: 100
- WQFP
T: 64
- BGA
A: 272 B: 416
- CSP
J: 176
- BQFP
B: 132
-UELP
T: 64
- ELP
R: 48 T: 64
- QFPH
D: 160 F: 240
- COB
C: 8 D: 8CNCL
- PLCC
C: 52 Z: 44
- QFP
A: 128 C: 144 D: 160
E: 208 G: 256 R: 48
T: 64 U: 304 W: 80
X: 100 Z: 44
- SOP
C: 8 H: 16 I: 18
K: 20 M: 24 N: 28
O: 32
- TQFP
A: 128 T: 64 W: 80
X: 100
- TEBGA
X: 492
- FBGA
A: 337 B: 81 C: 144
D: 160 E: 208 F: 180
G: 285 H: 320 K: 105
L: 400 O: 272 P: 504
Q: 289 T: 64
- SBGA
A: 432
- WAFER
0: None 1: Cust1 2: Cust2
14. Packing
B: Tube
U: Bulk
R: Tray
T: Tape & Reel
S: Tape & Reel Reverse
C: Chip Biz
D: Chip Biz (3 Inch tray)
E: Chip Biz (4 Inch tray)
F: Chip Biz (Reverse)
W: WF Biz Draft Wafer
X: WF Biz Full Cutting
7: Tape & Reel (Pb-Free PKG)
8: Tray (Pb-Free PKG)
9: Tube (Pb-Free PKG)
15. ROM Size
0: 0K byte 1: 1K byte
2: 2K byte 3: 12K byte
4: 4K byte 5: 16K byte
6: 6K byte 7: 24K byte
8: 8K byte 9: 32K byte
A: 48K byte B: 64K byte
C: 96K byte D: 128K byte
E: Extended F: 256K byte
G: 384K byte H: 512K byte
J: 1M byte K: 1M byte
M: Military N: Industrial
X: Special MK3 Y: Special MK2
Z: Special MK1
* Smart Card IC: EEPROM Size
* X,Y,Z: Special Marking ( MASKROM)
SYSTEM LSI
SERIAL EEPROMS
Write Cycle
Part Number Density (bit) Write Protection Vopr (V) Time (Max) Interface Package
S524A40X20-RC70 2K by Hardware & Software 1.8 ~ 5.5 5 ms
S524A40X21-DC90
S524A40X21-SC90
S524A40X21-SC70 /
S524A40X41-DC90 4K by Hardware 1.8 ~ 5.5 5 ms I2C BUS
S524A40X41-SC90
S524A40X41-SC70
S524A60X51-DC90 16K by Hardware 1.8 ~ 5.5 5 ms
S524A60X51-SC90
S524A60X51-SC70
S524A60X81-DC90 8K by Hardware 1.8 ~ 5.5 5 ms
S524A60X81-SC90
S524A60X81-SC70
S524A90X91-DC90 32K by Hardware 1.8 ~ 5.5 5 ms
S524A90X91-SC90
S524A90X91-SC70
S524A90XB1-DC90 64K by Hardware 1.8 ~ 5.5 5 ms
S524A90XB1-SC90
S524A90XB1-SC70
S524AD0XF1-RC70 256K by Hardware 1.8 ~ 5.5 5 ms
S524AE0AH1-RC70 512K by Hardware 1.8 ~ 5.5 5 ms
NOTES: All listed products are in production
Temperature: -25 ~ 70c
All products offer 100-year data retention, a 16M page buffer and two-wired serial I2C-bus interfaces.
All products operate at 100KHz, 400KHz clock frequency.
Package: DCBO=8DIP
DC90 = 8DIP
SC90 = 8SOP
SC70 = 8SOP (T&R)
RC70 = 8TSSOP (T&R)
16 SAMSUNG SEMICONDUCTOR, INC. AUGUST 2007BR-07-ALL-002
EEPROMs
SYSTEM LSI
Samsung’s broad line of logic products
features System-on-Chip and ASIC solutions
manufactured using some of the world’s most
advanced processes. Samsung’s mobile
application processors, ASICs, microcon-
trollers, image sensors and other System LSI
products are found in a wide range of digital
devices such as some of today’s most coveted
handhelds. Samsung also offers custom logic
chip design and production in a dedicated
foundry that employs the latest technologies.
For more information, visit our website: www.usa.samsungsemi.com
Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the
time of publication. Samsung assumes no responsibility, however, for possible errors or omissions, or for any conse-
quences resulting from the use of the information contained herein. Samsung reserves the right to make changes in
its products or product specifications with the intent to improve function or design at any time and without notice
and is not required to update this documentation to reflect such changes. This publication does not convey to a pur-
chaser of semiconductor devices described herein any license under the patent rights of Samsung or others.
Samsung makes no warranty, representation, or guarantee regarding the suitability of its products for any particular
purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and
specifically disclaims any and all liability, including without limitation any consequential or incidental damages.
www.usa.samsungsemi.com
Copyright 2007. Samsung and Samsung Semiconductor, Inc. are registered trademarks of Samsung Electronics, Co., Ltd. All other names and brands may be claimed as the
property of others. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice.
BR-07-ALL-002 Printed 8/07
