KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
KAI - 1003M
1024 (H) x 1024 (V) Pixel
Megapixel Interline CCD Image Sensor
Performance Specification
Eastman Kodak Company
Image Sensor Solutions
Rochester, New York 14650-2010
Revision 4.1
July 15, 2005
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
2 Revision 4.1
CONTENTS
1.1 Features.................................................................................................................................................................................3
1.2 Description............................................................................................................................................................................3
1.3 Image Acquisition................................................................................................................................................................. 4
1.4 Charge Transport ..................................................................................................................................................................4
1.5 Output Structure ...................................................................................................................................................................4
1.6 Non-Imaging Pixels..............................................................................................................................................................4
2.1 Package Drawing..................................................................................................................................................................7
2.3 Cover Glass Specification.....................................................................................................................................................9
3.1 Absolute Maximum Ratings ............................................................................................................................................... 10
3.2 DC Operating Conditions ................................................................................................................................................... 11
3.3 AC Clock Level Conditions................................................................................................................................................11
3.4 Electronic Shutter Operation .............................................................................................................................................. 11
3.5 Calculated Clock Capacitance ............................................................................................................................................12
3.6 AC Timing Requirements...................................................................................................................................................12
3.7 CCD Clock Waveform Conditions.....................................................................................................................................13
Non-binning........................................................................................................................................................................ 13
2 x 2 Binning ...................................................................................................................................................................... 13
4.1 Performance Specifications ................................................................................................................................................ 23
4.3 Defect Specifications..........................................................................................................................................................25
Defect Test Conditions ....................................................................................................................................................... 25
Defect Definitions .............................................................................................................................................................. 25
Defect Proximity ................................................................................................................................................................25
5.1 Quality Assurance and Reliability ......................................................................................................................................26
5.2 Ordering Information..........................................................................................................................................................26
Appendix 1 Part Number Availability......................................................................................................................................27
Revision Changes ...................................................................................................................................................................... 27
FIGURES
Figure 1 - KAI-1003M Sensor Architecture................................................................................................................................3
Figure 2 - Horizontal CCD Registers ..........................................................................................................................................5
Figure 3 - Package Drawing ........................................................................................................................................................ 7
Figure 4 - Package Pin Designations - Top View........................................................................................................................ 8
Figure 5 - CCD Clock Waveform..............................................................................................................................................13
Figure 6 - Frame Timing - 1 x 1 ................................................................................................................................................14
Figure 7 - Line Timing - 1 x 1 - Dual Outputs, In-phase...........................................................................................................15
Figure 8 - Line Timing - 1 x 1 - Dual Outputs, Out-of-phase ................................................................................................... 16
Figure 9 - Line Timing - 1 x 1 - Single Output ......................................................................................................................... 17
Figure 10 - Pixel Timing - 1 x 1 ................................................................................................................................................18
Figure 11 - Frame Timing - 2 x 2 ..............................................................................................................................................19
Figure 12 - Line Timing - 2 x 2 ................................................................................................................................................. 20
Figure 13 - Pixel Timing - 2 x 2 ................................................................................................................................................21
Figure 14 - Electronic Shutter Timing.......................................................................................................................................22
Figure 15 - Quantum Efficiency Spectrum................................................................................................................................24
Figure 16 - Angular Dependence of Quantum Efficiency......................................................................................................... 24
TABLES
Table 1 - KAI-1003M Calculated Clock Parameters..................................................................................................................6
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
3 Revision 4.1
1.1 Features
• 1 Megapixel Progressive Scan Interline CCD
• 1024 (H) x 1024 (V) Imaging Pixels
• 12.8 µm Square Pixels
• 13.1 mm Square Imaging Area
• Microlenses for Increased Sensitivity
• Large capacity (170ke)
• Split Horizontal Register for 1 or 2 Outputs
• Binning to 1 x 2 or 2 x 2
1.2 Description
The KAI-1003M is a high-performance, interline
charge-coupled device (CCD) designed for a wide
range of medical imaging and machine vision
applications. The device is built using an advanced
two-phase, double-polysilicon, NMOS CCD
technology. The p+npn- photodiodes eliminate image
lag while providing antiblooming protection and
electronic shutter capability. The 12.8µm square pixels
with microlenses provide high sensitivity and large
dynamic range. The two output, split horizontal register
and several binning modes enable a 15 to 60 frame per
second (fps) video rate with this megapixel progressive
scan imager.
2 light shielded rows
2 buffer rows
14 light shielded columns
2 buffer columns
1024 x 1024
imaging pixels
2 buffer rows
2 buffer columns
1024 2 1414 22
2 empty pixels
Single Output
14 light shielded columns
2 light shielded rows
2 empty pixels
512 2 1414 22
Video A
Dual Output
Video B
512
or 2
Figure 1 - KAI-1003M Sensor Architecture
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
4 Revision 4.1
1.3 Image Acquisition
An electronic representation of an image is formed
when incident photons falling on the sensor plane
create electron-hole pairs within the individual silicon
photodiodes. These photoelectrons are collected locally
by the formation of potential wells at each photodiode.
Below photodiode saturation, the number of
photoelectrons collected at each pixel is linearly
dependent on light level and integration time and
nonlinearly dependent on wavelength. When the
photodiode’s charge capacity is reached, excess
electrons are discharged into the substrate to prevent
blooming. The integration time can be decreased below
the frame time by using an electronic shutter, which is a
voltage pulse applied to the substrate to empty the
photodiodes.
1.4 Charge Transport
The integrated charge from each photodiode is
transported to the output by a three-step process. The
charge is first transferred from the photodiodes to the
vertical shift registers by applying a large positive
voltage to one of the vertical CCD phases. This transfer
occurs simultaneously for all photodiodes. The charge
is then transported from the vertical CCD registers to
the horizontal CCD line by line in parallel. Finally, the
horizontal CCD register transports each line of charge
pixel by pixel serially to one or both of the output
structures.
The single horizontal CCD register is split into two
halves to allow a variety of line readout modes, as
shown in Figures 1 and 2. The A output half of the
register is a true two-phase design, which results in
unidirectional transport using phases H1A and H2A.
The B output half of the register is a pseudo two-phase
design, which allows bi-directional transport using
phases H1B, H2B, H1C and H2C. Dual output is
achieved with all of the first phases identical and all the
second phases identical. If the clocks of H1A and H2A
phases are shifted by one half cycle, the output remains
dual with the outputs alternating, so that only one
analog-to-digital converter is necessary. Finally, single
output of the entire image from the A output is obtained
by complementing the C phases, which reverses
transport in the B half of the horizontal CCD.
Binning can be used in a 1x2 and a 2x2 mode. Two
successive vertical transfers vertically bin the charge
directly onto the horizontal CCD, as shown in Figures
11 and 12. Horizontal binning is accomplished by two
successive horizontal transfers onto the H22 gate,
which then transfers the charge to the output structure,
as shown in Figure 13.
Combinations of output modes, binning and horizontal
clock frequency allow the range of frame rates listed in
Table 1.
1.5 Output Structure
Charge presented to the floating diffusion (FD) is
converted into a voltage and current amplified in order
to drive off-chip loads. The resulting voltage change
seen at the output is linearly related to the amount of
charge placed on the FD. Once the signal has been
sampled by the system electronics, the reset gate (φR) is
clocked to remove the signal and the FD is reset to the
potential applied by the reset drain (RD). More signal
at the floating diffusion reduces the voltage seen at the
output pin. In order to activate the output structure, an
off-chip load must be added to the output pin of the
device.
1.6 Non-Imaging Pixels
In addition to the 1024 (H) by 1024 (V) imaging pixels,
there are active buffer, light shielded and empty pixels,
as shown in Figure 1. A two-pixel border of active
buffer pixels surrounds the imaging area. These buffer
pixels respond to illumination but are not tested for
defects and non-uniformities. Two light shielded rows
lead and follow each frame, and 14 light shielded
columns lead and follow each line. The light shielded
columns are tested for column defects and can be used
for dark reference. Only the center 10 columns by 1028
rows of light shielded region on each side can be used
for dark reference due to light leakage into the border
of two pixels at the edges. Finally, two empty pixels
occur at the beginning of each line, which are empty
shift register cycles not associated with any vertical
CCD columns. Empty pixels may also occur at the end
of the line, depending on the timing.
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
5 Revision 4.1
φH2A
φH1A
φH2A
φH1A
φH1C
φH1B
φH2C
φH2B
φH1C
φH1B
φH2C
φH2B
Dual Outputs
In phase
H1A = H1B = H1C
H2A = H2B = H2C
Out-of-phase
H1A - ½ = H1B = H1C
H2A - ½ = H2B = H2C
φH2A
φH1A
φH2A
φH1A
φH1C
φH1B
φH2C
φH2B
φH1C
φH1B
φH2C
φH2B
Single Output
H1A = H1B = H2C
H2A = H2B = H1C
Figure 2 - Horizontal CCD Registers
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
6 Revision 4.1
Table 1 - KAI-1003M Calculated Clock Parameters
Binning (H x V) 1 x 1 1 x 2 2 x 2 2 x 2 1 x 1 Units
Output Dual Dual Dual Dual Single
HORIZONTAL CLOCK
Frequency 20 20 20 40 20 MHz
Period actual 50 50 50 25 50 ns
effective 50 50 100 50 50 ns
Pixel counts actual 532 532 532 532 1060
effective 532 532 266 266 1060
VERTICAL TO HORIZONTAL TRANSFER (Horizontal Retrace Time)
Equivalent H-clock counts (m) 80 80 80 160 80
Duration 4.0 4.0 4.0 4.0 4.0 µs
HORIZONTAL LINE TIME
Total H-clock counts 612 612 612 692 1140
Line time 30.6 30.6 30.6 17.3 57.0 µs
VERTICAL CLOCK
Line counts actual 1032 1032 1032 1032 1032
effective 1032 516 516 516 1032
PHOTODIODE READ (Vertical Retrace Time)
Equivalent line counts (n) 4 4 4 7 2
Duration 122.4 122.4 122.4 121.1 114.0 µs
FRAME RATE
Total effective line counts 1036 520 520 523 1034
Frame time 31.7 15.9 15.9 9.0 58.9 ms
Frame rate 31.5 62.8 62.8 110.5 17.0 frames/s
Notes:
• Time values have been rounded.
• The number of counts (n and m) shown here are nominal integers, but in general they do not need be integers. They
can be adjusted for frame time, so long as the horizontal and vertical retrace times exceed the minimums specified in
§3.6.
• Operation at 40MHz will have increased readout noise.
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
7 Revision 4.1
2.1 Package Drawing
Figure 3 - Package Drawing
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
8 Revision 4.1
2.2 Pin Description
Pin Label Pin Label
1 φV1 15
φH22B
2 GND 16
φH2B
3 SUB 17
φH2C
4 VDD 18
φH1C
5 VOUTA 19
φH1B
6 VLG 20 OGB
7 RDA 21
φRB
8 φRA 22 RDB
9 OGA 23 VSS
10 SUB 24 VOUTB
11 φH1A 25 VMIN
12 φH2A 26 SUB
13 φH22A 27 GND
14 GND 28
φV2
VSS
RDB
VMIN
φV2
SUB
GND
OGB
φH22B
VOUTB
1
15
28
φRB
φH2B
φH2C
φH1C
φH1B
VLG
RDA
VDD
φV1
SUB
GND
OGA
GND
VOUTA
φRA
φH22A
φH2A
φH1A
SUB
14
Pixel
(1,1)
Pin 1 Designation
Figure 4 - Package Pin Designations - Top View
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
9 Revision 4.1
2.3 Cover Glass Specification
Item Specification
Substrate Corning 7059 or equivalent
Thickness 0.030˝ ± 0.002˝
Coating Double-sided anti-reflecting coating on a 0.660” x 0.660” square for a transmission
minimum of 98% in the 400 to 700nm wavelength.
Scratch No scratch greater than 10 microns
Caution: Cover Glass Care and Cleanliness:
1. The cover glass is highly susceptible to particles and other contamination. Perform all assembly operations
in a clean environment.
2. Touching the cover glass must be avoided
3. Improper cleaning of the cover glass may damage these devices. Refer to Application Note MTD/PS-0237
“Cover Glass Cleaning for Image Sensors
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
10 Revision 4.1
3.1 Absolute Maximum Ratings
Item Description Min. Max. Units Notes
Temperature Operation to Specification 0 40 °C
Operation Without Damage -10 70 °C
Storage -55 80 °C
Relative Humidity Operation Without Damage 0 95 % 1
Voltage SUB - GND -0.6 50 V 2
(Between Pins) VRD, VSS, VDD - GND -0.6 25 V
VMIN - GND -15 0.6 V
All Clocks - GND 17 V
φV1 - φV2 17 V 3
φH1 - φH2 17 V
φH1, φH2 - φV2 17 V
φH2 - OG 17 V
VLG, OG – GND 17 V
φR, φH1, φH2 - VMIN 17 V
Current Output Bias Current (IDD) ---------- 10 mA 4
Capacitance Output Load Capacitance (CLOAD) ---------- 10 pF 4
Notes:
1. Without condensation.
2. Under normal operating conditions, the substrate voltage should be maintained above 8.0V. The substrate voltage
should not remain above 25V for longer than 100µs.
3. Maximum of 20V for φV1H - φV2L, with 20 µs maximum duration.
4. Each output.
Caution: ESD
1. This device contains limited protection against Electrostatic Discharge (ESD). CCD image sensors can be
damaged by electrostatic discharge. Failure to do so may alter device performance and reliability.
2. Devices should be handled in accordance with strict ESD procedures for Class 0 (<250V per JESD22
Human Body Model test), or Class A (<200V JESD22 Machine Model test) devices.
Devices are shipped in static-safe containers and should only be handled at static-safe workstations.
3. See Application Note MTD/PS-0224 “ Electrostatic Discharge Control for Image Sensors” for proper
handling and grounding procedures. This application note also contains recommendations for workplace
modifications for the minimization of electrostatic discharge.
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
11 Revision 4.1
3.2 DC Operating Conditions
Description Symbol Min. Nom. Max. Units Notes
Output Gate OG 1.8 2.0 2.2 V
Reset Drain VRD 10.0 10.5 11.0 V
Output Amplifier Return VSS 0.0 V 1
Output Amplifier Load Gate VLG 1.4 1.5 1.6 V
Output Amplifier Supply VDD 14.5 15.0 15.5 V
Disable ESD Protection VMIN -8.5 V 2
Substrate VSUB 8.0 TBS 18.0 V 3,4
Ground, P-well GND 0.0 V 4
Notes:
1. Current sink.
2. Connect a 0.001 µF capacitor between VMIN and GND. VMIN must be more negative than the low voltage of any of
the φH clocks and should be established before the φH voltage is applied.
3. DC value when electronic shutter is not in use. See §3.2 for electronic shutter pulse voltage. The operating value of
the substrate voltage, VSUB, will be supplied with each shipment.
4. Ground and substrate biases should be established before other gate and diode potentials are applied.
3.3 AC Clock Level Conditions
Description Level Symbol Min. Nom. Max. Units Notes
High
φV2H 9.5 10.5 11.5 V 1
Vertical CCD Clocks Mid φV1M, φV2M -0.8 -0.5 0.0 V 1
Low
φV1L, φV2L -9.0 -8.5 -8.0 V 1
Horizontal CCD Clocks High φH1H, φH2H 4.5 5.0 5.5 V 1
Low
φH1L, φH2L -6.5 -6.0 -5.5 V 1
Reset clock Amplitude φRswing 5.0 V
Low
VφRlow 0 TBS 5.0 V 2
Electronic Shutter Pulse Shutter VShutter 37 40 45 V 3
Notes:
1. For best results, the CCD clock swings must be greater than or equal to the nominal values.
2. Reset clock low level voltage will be supplied with each shipment.
3. Electronic shutter pulse voltage referenced to GND. See §3.2 for DC level when electronic shutter is not in use.
3.4 Electronic Shutter Operation
Electronic shuttering is accomplished by pulsing the substrate voltage to empty the photodiodes. See Figure 14 for timing.
The pulse must not occur while useful information is being read from a line.
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
12 Revision 4.1
3.5 Calculated Clock Capacitance
Description Phase Symbol Typical Units Notes
1 to GND C φV1 55/37 nF 1
Vertical CCD Clocks 2 to GND C φV2 50/32 nF 1
1 to 2 C φV1 - φV2 4 nF
1A
C φH1A 58/21 pF 1,2
1B
C φH1B 41/13 pF 1,2
Horizontal CCD Clocks 1C C φH1C 15/10 pF 1,2
2A
C φH2A 48/22 pF 1,2
2B
C φH2B 30/11 pF 1,2
2C
C φH2C 18/13 pF 1,2
HCCD Summing Clock C φH22A/B 3 pF
Reset clock - GND C φRA/B 5 pF
Notes:
1. Accumulation/depletion capacitances.
2. Capacitance of this gate to GND and all other gates.
3.6 AC Timing Requirements
Description Symbol Min. Nom. Max. Units Notes
Vertical High Level Duration TV2H 15 20 µs
Vertical Transfer Time TV 1.0 2.0/1.0 µs 1
Vertical Pedestal Delay 1 & 3 TVPD1, TVPD3 40 µs
Vertical Pedestal Delay 2 TVPD2 15 µs
Horizontal Delay THD 1.5/0.5 µs 1
Reset Duration TR 10 ns 2
Horizontal CCD Clock Frequency fH 20 MHz 3
Pixel Time TH 50 ns
Line Time TL 4
Frame Time TF 4
Clamp Delay TCD ns 5
Sample Delay TSD ns 5
Electronic Shutter Pulse Duration TES 5 7.5 10 µs
Electronic Shutter Horizontal Delay TESHD 1.0 µs
Notes:
1. Non-binning/binning times.
2. The rising edge of φR should be coincident with the rising edge of φH22, within ±5 ns.
3. Horizontal CCD clock frequency can be increased to 40MHz, with increased readout noise.
4. See Table 1 for nominal line and frame time in each mode.
5. The clamp delay and sample delay should be adjusted for optimum results.
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
13 Revision 4.1
3.7 CCD Clock Waveform Conditions
Non-binning
Description Phase Symbol twh twl tr tf Units Notes
1
φV1M/L ------- 1.5 0.5 0.5 µs
Vertical CCD Clocks 2 φV2M/L 1.5 ------- 0.5 0.5 µs
2, High
φV2H 15 ------- 1.0 1.0 µs
1
φH1 20.5 21.5 4.0 4.0 ns
Horizontal CCD Clocks 2 φH2 20.5 21.5 4.0 4.0 ns
2, Binning
φH22 20.5 21.5 4.0 4.0 ns 1
Reset clock φR 5 39 3 3 ns
2 x 2 Binning
Description Phase Symbol twh twl tr tf Units Notes
1
φV1M/L 0.5 0.5 0.5 0.5 µs 2
Vertical CCD Clocks 2 φV2M/L 0.5 0.5 0.5 0.5 µs 2
2, High
φV2H 15 ------- 1.0 1.0 µs
1
φH1 20.5 21.5 4.0 4.0 ns
Horizontal CCD Clocks 2 φH2 20.5 21.5 4.0 4.0 ns
2, Binning
φH22 46.0 46.0 4.0 4.0 ns
Reset clock φR 5 89 3 3 ns
Notes:
• Typical values measured with clocks connected to image sensor device. The actual values should be optimized for
particular board layout.
1. φH22 may be connected to φH2 in 1x1 mode.
2. twh and twl for φV1M/L and φV2M/L are the time periods during the double pulses.
Low 0%
90%
10%
High 100%
tr twh tf twl
Figure 5 - CCD Clock Waveform
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
14 Revision 4.1
Frame Timing - 1 x 1
0
1031
1
2
3
4
1027
1028
1029
1030
1031
0
1
2
3
Light shielded line Buffer line Image line
φ
V1
φ
V2
n x T
L
T
F
= (1032 + n) x T
L
φ
V1
φ
V2
φ
H1
φ
H2
T
L
T
V2H
T
PD1
T
PD2
T
PD3
Line 1031 Line 0
n x T
L
Line 1030
Figure 6 - Frame Timing - 1 x 1
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
15 Revision 4.1
φ
V1
φ
V2 T
V
T
L
= (532 + m) x T
H
T
HD
φ
H1
φ
H2 &
φ
H22
φ
R
16
2
3
14
15
17
18
19
530
531
1
pixel
count
528
Line Timing - 1 x 1 - Dual Output, In-phase
530
531
0
529
2
1
0
Light shielded pixelsEmpty pixels Buffer pixels
m x T
H
Image pixels
Figure 7 - Line Timing - 1 x 1 - Dual Outputs, In-phase
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
16 Revision 4.1
φ
V1
φ
V2 T
V
T
L
= (532.5 + m) x T
H
T
HD
Line Timing - 1 x 1 - Dual Output, Out-of-phase
m x T
H
Light shielded pixelsEmpty pixels Buffer pixels Image pixels
φ
H2A &
φ
H22A
φ
H1B,C
φ
H2B,C &
φ
H22B
φ
H1A
φ
RA
16
2
3
14
15
17
18
19
530
531
1
pixel
count
528
530
531
0
529
2
1
0
16
2
3
14
15
17
18
19
530
531
1
528
530
531
0
529
2
1
0
φ
RB
pixel
count
Figure 8 - Line Timing - 1 x 1 - Dual Outputs, Out-of-phase
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
17 Revision 4.1
φ
V1
φ
V2 T
V
T
L
= (1060 + m) x T
H
T
HD
φ
H1A,B &
φ
H2C
φ
H2A,B &
φ
H1C &
φ
H22A,B
φ
R
16
2
3
14
15
17
18
19
1058
1059
1
pixel
count
1057
Line Timing - 1 x 1 - Single Output
1058
1059
0
1057
2
1
0
Light shielded pixelsEmpty pixels Buffer pixels
m x T
H
Image pixels
1056
1045
20
1044
1043
1042
1041
1040
Figure 9 - Line Timing - 1 x 1 - Single Output
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
18 Revision 4.1
Pixel Timing - 1 x 1
φ
H1
φ
H2 &
φ
H22
φ
R
VOUT
Clamp
Sample
Video after
correlated double
sampling (inverted)
T
R
Reference
level
Signal
Reference
level
Signal
T
H
T
CD
T
SD
Figure 10 - Pixel Timing - 1 x 1
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
19 Revision 4.1
Frame Timing - 2 x 2
0
1031
1
2
3
4
511
512
513
514
515
0
1
2
3
Light shielded line Buffer line Image line
φ
V1
φ
V2
n x T
L
T
F
= (516 + n) x T
L
φ
V1
φ
V2
φ
H1
φ
H2
T
L
T
V2H
T
PD1
T
PD2
T
PD3
Line 515 Line 0
n x T
L
Line 514
Figure 11 - Frame Timing - 2 x 2
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
20 Revision 4.1
φ
V1
φ
V2
φ
H1
φ
H2
Line Timing - 2 x 2
φ
R
pixel
count
Light shielded pixelsEmpty pixels Buffer pixels Image pixels
φ
H22
T
V
T
L
= (532 + m) x T
H
T
HD
m x T
H
8
1
7
9
265
264
265
0
0
1
10
11
12
Figure 12 - Line Timing - 2 x 2
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
21 Revision 4.1
φ
H22
φ
R
VOUT
Clamp
Sample
Video after
correlated double
sampling (inverted)
T
R
Reference
level
Signal
Reference
level
Signal
T
CD
T
SD
Pixel Timing - 2 x 2
φ
H1
2 x T
H
φ
H2
Figure 13 - Pixel Timing - 2 x 2
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
22 Revision 4.1
φ
V1
φ
V2 T
V
T
ES
T
HD
φ
H1
φ
H2 &
φ
H22
φ
R
Electronic Shutter Line Timing
φ
V2
Integration Time Definition
T
ESHD
Vshutter
VSUB
Integration Time
Vshutter
VSUB
Figure 14 - Electronic Shutter Timing
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
23 Revision 4.1
4.1 Performance Specifications
All values measured at 40°C and 30 frames/s (integration time = 33ms, fH = 20MHz) for nominal operating parameters
unless otherwise noted. These parameters exclude defective pixels.
Description Symbol Min. Nom. Max. Units Notes
Saturation charge capacity with blooming control Qsat 170 ke
Output gain 6.5 7.5 8.5 µV/e
Output voltage at the saturation level Vsat 1.3 V
Quantum efficiency at 500 nm 32 %
Quantum efficiency at 540 nm 30 %
Quantum efficiency at 600 nm 24 %
CCD readout noise with CDS 40 50 e rms
Dark current Idark 0.25 0.45 nA/cm2
Antiblooming factor Xab 100 1, 2
Vertical smear 0.005 0.01 % 2, 6
Nonuniformity of sensitivity 0.3 0.5 % rms 3, 4
Nonuniformity of dark current 14 e rms 4
Output signal nonlinearity 1 2 % 5
Gain difference between the two video outputs 10 % 5
Nonuniformity of gain between the two outputs 0.5 1.5 % 5
Notes:
1. The illumination required to bloom the image sensor reported as a multiple of the saturation intensity. Blooming is
defined as doubling the vertical height of a spot that is 10% of the vertical CCD height at the saturation intensity.
2. Measured with continuous green light centered at 550 nm, F/4 optics and a spot size that is 10% of the vertical CCD
height.
3. Measured at 90% of 150ke output.
4. Measured in the center 50 x 50 pixels.
5. Between 10% and 90% of 150ke output.
6. Measured without electronic shutter operation.
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
24 Revision 4.1
4.2 Typical Quantum Efficiency
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
400 500 600 700 800 900 1000 1100
Wavelength (nm)
Absolute
Quantum
Efficiency
With Cover Glass
Figure 15 - Quantum Efficiency Spectrum
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25 30 35 40 45
Angle (degrees)
Relative
Quantum
Efficiency
(% )
Horizontal
Figure 16 - Angular Dependence of Quantum Efficiency
For the curve marked “Horizontal”, the incident light angle is varied in a plane parallel to the HCCD.
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
25 Revision 4.1
4.3 Defect Specifications
Defect Test Conditions
Temperature 40°C
Integration time 33ms (20 MHz HCCD frequency, no binning, 30fps frame rate)
Light source Continuous green light centered at 550nm
Operation Nominal voltages and timing
Defect Definitions
Name Maximum
Number
Definition
Major Defective
Pixel
20 A pixel whose signal deviates by more than 25mV from the mean value of all
active pixels under dark field condition or by more than 8% from the mean value of
all active pixels under uniform illumination at 105ke- output signal.
Minor Defective
Pixel
100 A pixel whose signal deviates by more than 8mV from the mean value of all active
pixels under dark field condition.
Cluster Defect 4 A group of 2 to 6 contiguous major defective pixels, but no more than 2 adjacent
defects horizontally.
Column Defect 0 A group of more than 6 contiguous major defective pixels along a single column.
Defect Proximity
Minimum distance between defective clusters 2 pixels in all directions without major pixel defects
Minimum distance between defective columns 3 columns without column defects or cluster defects
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
26 Revision 4.1
5.1 Quality Assurance and Reliability
5.1.1 Quality Strategy: All image sensors will conform to the specifications stated in this document. This will be
accomplished through a combination of statistical process control and inspection at key points of the production
process. Typical specification limits are not guaranteed but provided as a design target. For further information refer
to ISS Application note MTD/PS-0292, Quality and Reliability.
5.1.2 Replacement: All devices are warranted against failure in accordance with the terms of Terms of Sale. This does
not include failure due to mechanical and electrical causes defined as the liability of the customer below.
5.1.3 Liability of the Supplier: A reject is defined as an image sensor that does not meet all of the specifications in this
document upon receipt by the customer.
5.1.4 Liability of the Customer: Damage from mechanical (scratches or breakage), electrostatic discharge (ESD) damage,
or other electrical misuse of the device beyond the stated absolute maximum ratings, which occurred after receipt of
the sensor by the customer, shall be the responsibility of the customer.
5.1.5 ESD Precautions: Devices are shipped in static-safe containers and should only be handled at static-safe
workstations. See ISS Application Note MTD/PS-0224 for handling recommendations.
5.1.6 Reliability: Reliability results are available from Image Sensor Solutions and can be supplied upon request. For
further information refer to ISS Application Note MTD/PS-0292, Quality and Reliability.
5.1.7 Test Data Retention: Image sensors shall have an identifying number traceable to a test data file. Test data shall be
kept for a period of 2 years after date of delivery.
5.1.8 Mechanical: The device assembly drawing is provided as a reference. The device will conform to the published
package tolerances.
5.2 Ordering Information
See Appendix 1 for available part numbers.
Address all inquiries and purchase orders to:
Image Sensor Solutions
Eastman Kodak Company
Rochester, New York 14650-2010
Phone: (585) 722-4385
Fax: (585) 477-4947
E-mail: imagers@kodak.com
Kodak reserves the right to change any information contained herein without notice. All information furnished by Kodak is
believed to be accurate.
WARNING: LIFE SUPPORT APPLICATIONS POLICY
Kodak image sensors are not authorized for and should not be used within Life Support Systems without the specific
written consent of the Eastman Kodak Company. Product warranty is limited to replacement of defective components and
does not cover injury or property or other consequential damages.
KAI-1003M
Performance Specification
Eastman Kodak Company – Image Sensor Solutions - Rochester, NY 14650-2010
Phone (585) 722-4385 Fax (585) 477-4947
Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
27 Revision 4.1
Appendix 1 Part Number Availability
Note:
This appendix may be updated independently of the performance specification. Contact Eastman Kodak for the latest
revision.
Device Name Available Part Numbers Features
KAI-1003M 2H4544 Monochrome Microlens Sealed
KAI-1003M 2H4825 Monochrome Microlens Taped Cover Glass
KAI-1003 2H4828 Monochrome - Taped Cover Glass
Revision Changes
Revision Description of Changes
4.0 • Page 3 Figure 1 – Changed caption from “Pixel Architecture” to “Sensor
Architecture”
• Page 8 Figure 4 – Package Pin Designations – Top View Corrected Pixel 1,1
location
• Page 11 DC Operating Conditions, note 2 – changed µf to µF.
• Page 23 Performance Specifications – added frequency used to obtain 30
frames per second operation, fH = 20MHz.
• Page 26 – Updated Quality Assurance and Reliability section.
• Updated web site, e-mail and phone number information.
4.1 • Page 9 – Add cover glass cleanliness caution.
• Page 10 – Added to the maximum absolute rating table φR, φH1, φH2 –
VMIN.
• Page 10 – Update ESD caution.
• Page 25 – Updated major defective pixel definition. Changed bright field
threshold from 15% to 8%.
