CbyR-relay/C.fm 2 y [ W Q O O O N W R oe @ j oe @ V S W " RF (Radio Frequency) C (by) x R 10 Type FEATURES 4.30.2 .169.008 1. In addition to lower output capacitance between terminals than ever before, the PhotoMOS relay achieves low ON-resistance. Output capacitance(C): 1.0pF (typ.) ON resistance(R): 9.5 (typ.) 2. High speed switching Turn on time: 30s Turn off time: 30s 4.40.2 .173.008 2.10.2 .083.008 mm inch PhotoMOS RELAYS 3. SO package 4-pin type in super miniature design 4. Low-level off state leakage current The SSR has an off state leakage current of several milliamperes, where as this PhotoMOS relay has only 10pA (typical) even with the rated load voltage 5. Controls low-level analog signals 6. Low thermal electromotive force (Approx. 1 V) TYPICAL APPLICATIONS Measuring and testing equipment 1. Testing equipment for semiconductor performance IC tester, Liquid crystal driver tester, semiconductor performance tester 2. Board tester Bear board tester, In-circuit tester, function tester 3. Medical equipment Ultrasonic wave diagnostic machine 4. Multi-point recorder Warping, thermo couple TYPES Circuit arrangement Type 1 Form A AC/DC Output rating* Load Load voltage current 40 V 120 mA Tape and reel packing style Picked from the Picked from the 1/2-pin side 3/4-pin side AQY221N2SX AQY221N2SZ Packing quantity in tape and reel 1,000 pcs. * Indicate the peak AC and DC values. Notes: (1) Tape package is the standard packing style. Also available in tube. (Part No. suffix "X" or "Z" is not needed when ordering; Tube: 100 pcs.; Case: 2,000 pcs.) (2) For space reasons, the initial letters of the product number "AQY and S", the package type indicator "X" and "Z" are omitted from the seal. RATING 1. Absolute maximum ratings (Ambient temperature: 25C 77F) Item LED forward current Input Output AQY221N2S 50mA LED reverse voltage VR 3V Peak forward current IFP 1A Power dissipation Pin 75mW Load voltage (peak AC) VL 40V Continuous load current IL 0.12A Peak AC,DC Peak load current Ipeak 0.30A 100 ms (1 shot), VL= DC Power dissipation Pout 300mW Total power dissipation PT 350mW I/O isolation voltage Viso 1,500V AC Temperature limits 2 Symbol IF Operating Topr -40C to +85C -40F to +185F Storage Tstg -40C to +100C -40F to +212F Remarks f=100 Hz, Duty factor=0.1% Non-condensing at low temperatures CbyR-relay/C.fm 3 y [ W Q O O O N W R oe @ j oe @ V S W " 2. Electrical characteristics (Ambient temperature: 25C 77F) Item LED turn off current LED dropout voltage Output AQY221N2S Condition IFon 0.9 mA 3.0mA 0.2 mA 0.85mA IL = 80 mA Minimum Typical Maximum Minimum Typical Maximum Minimum Typical Maximum LED operate current Input Symbol IFoff IL = 80 mA VF 1.14V (1.25 V at IF = 50mA) 1.5 V IF = 5mA 9.5 12.5 Within 1 s on time IF = 5mA IL = 80 mA On resistance Minimum Typical Maximum Ron Output capacitance Minimum Typical Maximum Cout 1.0 pF 1.5 pF IF = 0 VB = 0 V f = 1 MHz Off state leakage current Minimum Typical Maximum ILeak 0.01 nA 10 nA IF = 0 VL = Max. Turn on time* Minimum Typical Maximum Ton 0.03 ms 0.5 ms IF = 5mA VL = 10V RL = 125 Turn off time* Minimum Typical Maximum Toff 0.03ms 0.2 ms IF = 5mA VL = 10V RL = 125 Ciso 0.8 pF 1.5pF 1,000M Switching speed Transfer characteristics Minimum Typical Maximum Minimum Typical Maximum I/O capacitance Initial I/O isolation resistance Riso f = 1MHz VB = 0 500V DC *Turn on/Turn off time Input 90% 10% Output Toff Ton REFERENCE DATA 1. Load current vs. ambient temperature characteristics 2. Load current vs. Load voltage characteristics Ambient temperature: 25C 77F Allowable ambient temperature: -40C to +85C -40F to +185F 3. On resistance vs. ambient temperature characteristics Measured portion: between terminals 3 and 4 LED current: 5 mA; Load voltage: Max. (DC); Load current: 80mA (DC) 140 200 25 160 20 80 60 On resistance, 100 Load current, mA Load current, mA 120 120 80 15 10 40 40 20 0 -40 -20 0 20 40 60 8085 100 Ambient temperature, C 0 5 0 10 20 30 40 Load voltage, V 50 0 -40 -20 0 20 40 60 8085 Ambient temperature, C 3 4 y [ W Q O O O N W 4. Turn on time vs. ambient temperature characteristics j oe @ LED current: 5 mA; Load voltage: 10V (DC); Continuous load current: 80mA (DC) 0.1 0.08 0.08 0.04 0.02 0 S W " 5. Turn off time vs. ambient temperature characteristics 0.1 0.06 V Continuous load current: 80mA (DC) Turn off time, ms Turn on time, ms Measured portion: between terminals 3 and 4 LED current: 5 mA; Load voltage: 10V (DC); R oe @ 6. LED operate current vs. ambient temperature characteristics Load voltage: Max. (DC); Continuous load current: 80mA (DC) 2 LED operate current, mA CbyR-relay/C.fm 0.06 0.04 0.02 -40 -20 0 20 40 60 0 8085 -40 -20 Ambient temperature, C 0 20 40 60 1.5 1 0.5 0 8085 -40 -20 Ambient temperature, C 0 20 40 60 8085 Ambient temperature, C 7. LED turn off current vs. ambient temperature characteristics 8. LED dropout voltage vs. ambient temperature characteristics 9. Voltage vs. current characteristics of output at MOS portion Load voltage: Max. (DC); Continuous load current: 80mA (DC) LED current: 5 to 50 mA Measured portion: between terminals 3 and 4 Ambient temperature: 25C 77F 120 1.5 2 1.5 1 0.5 current LED dropout voltage, V LED turn off current, mA 100 1.4 -40 -20 0 20 40 60 20 -3.0-2.5 -2.0 -1.5-1.0 -0.5 1.2 0.5 1 1.5 2.0 2.5 3.0 -20 voltage 50mA 30mA 20mA 10mA 5mA 1.1 0 8085 60 40 1.3 -40 -60 -80 1.0 0 80 -100 -40 -20 Ambient temperature, C 0 20 40 60 -120 80 85 100 Ambient temperature, C 10. Off state leakage current 11. LED forward current vs. turn on time characteristics 12. LED forward current vs. turn off time characteristics Measured portion: between terminals 3 and 4 Ambient temperature: 25C 77F Measured portion: between terminals 3 and 4 Load voltage: 10V (DC); Continuous load current: 80mA (DC); Ambient temperature: 25C 77F Measured portion: between terminals 3 and 4 Load voltage: 10V (DC); Continuous load current: 80mA (DC); Ambient temperature: 25C 77F 10-6 10-9 Turn off time, ms Turn on time, ms Off state leakage current, A 0.1 0.16 10-3 0.12 0.08 0.04 0.08 0.06 0.04 0.02 10-12 0 0 10 20 30 40 50 0 0 10 20 Load voltage, V 30 40 50 13. Applied voltage vs. output capacitance characteristics 14. Isolation characteristics (50 impedance) Measured portion: between terminals 3 and 4 Ambient temperature: 25C 77F 2 80 1.5 40 0.5 20 30 40 50 60 Measured portion: between terminals 3 and 4 Ambient temperature: 25C 77F 2 60 1 20 15. Insertion loss characteristics (50 impedance) Insertion loss, dB 100 Isolation, dB 2.5 10 LED forward current, mA LED forward current, mA Measured portion: between terminals 3 and 4 Frequency: 1 MHz, 30m Vrms; Ambient temperature: 25C 77F Output capacitance, pF 0 60 1.5 1 0.5 0 0 10 20 30 40 Applied boltage, V 4 50 0 4 10 105 106 107 Frequency, Hz 108 0 104 105 106 Frequency, Hz 107 CbyR-relay/C.fm 5 y [ W Q O O O N W R oe @ j oe @ V S W " 16. On resistance distribution 17. Turn on time distribution 18. Turn off time distribution Measured portion: between terminals 3 and 4 Continuous load current: 80mA(DC) Quantity, n=60; Ambient temperature: 25C 77F Load voltage: 10V(DC); Continuous load current: 80mA(DC) Quantity, n=60; Ambient temperature: 25C 77F Load voltage: 10V(DC); Continuous load current: 80mA(DC) Quantity, n=60; Ambient temperature: 25C 77F 40 35 60 35 30 50 Quantity, n Quantity, n 25 20 25 20 15 15 10 10 5 5 0 8.6 9 9.4 9.8 Quantity, n 30 30 20 10 0 0.01 10.2 40 0.02 0.03 0.04 0.05 0 0.018 0.06 0.022 Turn on time, ms On resistance, 0.026 0.03 0.034 0.038 Turn off time, ms 19. LED operate current distribution Load voltage: 10V(DC); Continuous load current: 80mA(DC) Quantity, n=60; Ambient temperature: 25C 77F 30 Quantity, n 25 20 15 10 5 0 0.4 0.6 0.8 1 1.2 LED operate current, mA 1.4 mm inch DIMENSIONS Recommended mounting pad (TOP VIEW) 0.5 .020 4.30.2 .169.008 4.40.2 .173.008 2.10.2 .083.008 4.40.2 .173009 0.8 .032 2.54 .100 0.5 .020 4.30.2 .169.009 2.00.2 .079.009 mm inch 6.0 1.2 .236 .047 6.80.4 .268016 Tolerance:0.1 .004 Terminal thickness = 0.15 .006 0.4 .016 2.54 .100 0.1 0.4 .004 .016 General tolerance: 0.1 .004 SCHEMATIC AND WIRING DIAGRAMS * E1: Power source at input side; VIN: Input voltage; IF: LED forward current; IIN: Input current; VL: Load voltage; IL: Load current Output configuration Schematic 1 Wiring diagram 4 1a 2 Load 3 AC/DC E1 1 4 2 3 IF 4 IL VL (AC,DC) Load IL VL (AC,DC) 3 Load 5 CbyR-relay/C.fm 6 y [ W Q O O O N W R oe @ j oe @ V S W " CAUTIONS FOR USE 1. Short across terminals Do not short circuit between terminals when relay is energized, since there is possibility of breaking of the internal IC. 2. Surge voltages at the input If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage. 1 4 2 3 2) Even if spike voltages generated at the load are limited with a clamp diode if the circuit wires are long, spike voltages will occur by inductance. Keep wires as short as possible to minimize inductance. 6. Cleaning solvents compatibility Dip cleaning with an organic solvent is recommended for removal of solder flux, dust, etc. Select a cleaning solvent from the following table. If ultrasonic cleaning must be used, the severity of factors such as frequency, output power and cleaning solvent selected may cause loose wires and other defects. Make sure these conditions are correct before use. For details, please consult us. Compatability Cleaning solvent 3. Recommended LED forward current (IF) It is recommended that the LED forward current (IF) should be kept at 5mA. 4. Ripple in the input power supply If ripple is present in the input power supply, observe the following: 1) For LED operate current at Emin, maintain the value mentioned in the table of "Note 3. Recommended LED forward current (IF)." 2) Keep the LED operate current at 50 mA or less at Emax. Emin. Emax. 5. Output spike voltages 1) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage must be limited. Typical circuits are shown below. 1 4 2 3 1 4 2 3 Adueous Alcoholbase Others ( * I.I.I. Trichloroethlene (Chloroethlene) * Trichloroethlene (Trichlene) * Perchloroethlene * Methlene chloride * Indusco 624, 1000 * Hollis 310 * Lonco Terg * IPA * Ethanol * Thinner * Gasoline Load Add a clamp diode to the load Load ) T3 T2 T1 t1 t2 T1 = 155 to 165C 311 to 329F T2 = 180C 200C 356 to 392F T3 = 245C 473F or less t1 = 120 s or less t2 = 30 s or less (2) Vapor phase soldering method T2 T1 t1 t2 T1 = 180 to 200C 366 to 392F T2 = 215C 419F or less t1 = 40 s t2 = 40 s or less (3) Double wave soldering method x 7. Input wiring pattern This relays, avoid installing the input (LED side) wiring pattern to the bottom side of the package if you require the specified I/O isolation voltage (Viso) after mounting the PC board. Since part of the frame on the output side is exposed, it may cause fluctuations in the I/O isolation voltage. Portion of output side frame (Output terminal side) Input wiring (Input terminal pattem side) Add a CR snubber circuit to the load 6 Chlorinebase :Yes x :No 8. Soldering When soldering this terminals, the following conditions are recommended. (1) IR (Infrared reflow) soldering method May not allow the prescribed I/O withstand voltage (Viso) to be achieved T2 T1 t1 t2 t3 T1 = 155 to 165C 311 to 329F T2 = 260C 500F or less t1 = 60 s or less t2+t3 = 5 s or less (4) Soldering iron method Tip temperature: 280 to 300C 536 to 572 F Wattage: 30 to 60 W Soldering time: within 5 s (5) Others Check mounting conditions before using other soldering methods (hot-air, hot plate, pulse heater, etc.) * The temperature profile indicates the temperature of the soldered terminal on the surface of the PC board. The ambient temperature may increase excessively. Check the temperature under mounting conditions. * The conditions for the infrared reflow soldering apply when preheating using the VPS method. CbyR-relay/C.fm 7 y [ W Q O O O N W R oe @ j oe @ V S W " 9. The following shows the packaging format 1) Tape and reel Type mm inch Tape dimensions Tractor feed holes 1.550.05 dia. .061.002 dia. Dimensions of paper tape reel 210.8 .827.031 801 dia. 3.150.039 dia. Direction of picking 1.750.1 .069.004 7.20.1 .284.004 0.30.05 .012.002 20.5 .079.020 Device mounted on tape 2.80.3 .110.012 120.3 .472.012 40.1 .157.004 20.1 .079.004 1.550.1 dia. .061.004 dia. (1) When picked from 1/2-pin side: Part No.AQYSX (Shown adove) (2) When picked from 3/4-pin side: Part No. AQYSZ 2) Tube (1) Devices are packaged in a tube so pin No. 1 is on the stopper B side. Observe correct orientation when mounting them on PC boards. (SOP type) StopperB (green) StopperA (gray) 2) Storage PhotoMOS relays implemented in SO packages are sensitive to moisture and come in sealed moisture-proof packages. Observe the following cautions on storage. * After the moisture-proof package is unsealed, take the devices out of storage as soon as possible (within 1 month at the most). * If the devices are to be left in storage for a considerable period after the moistureproof package has been unsealed, it is recommended to keep them in another moisture-proof bag containing silica gel (within 3 months at the most). 10. Transportation and storage 1) Extreme vibration during transport will warp the lead or damage the relay. Handle the outer and inner boxes with care. 0803/2000 2502 dia. 9.843.079 dia. 801 dia. 3.150.039 dia. 5.50.1 .217.004 4.70.1 120.1 .185.004.472.004 SO package 4-pin type 2) Storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the characteristics. The following storage conditions are recommended: * Temperature: 0 to 45C 32 to 113F * Humidity: Less than 70% R.H. * Atomosphere: No harmful gasses such as sulfurous acid gas, minimal dust. 11. Applying stress that exceeds the absolute maximum rating If the voltage or current value for any of the terminals exceeds the absolute maximum rating, internal elements will deteriorate because of the excessive voltage or current. In extreme cases, wiring may melt, or silicon P/N junctions may be destroyed. As a result, the design should ensure that the absolute maximum ratings will never be exceeded, even momentarily. (Use at 15 VDC or lower and 9 VAC or lower is recommended.) 12. Deterioration and destruction caused by discharge of static electricity This phenomenon is generally called static electricity destruction, and occurs when static electricity generated by various factors is discharged while the relay terminals are in contact, producing internal destruction of the element. 130.5 dia. .512.020 dia. 141.5 .551.059 20.5 .079.020 To prevent problems from static electricity, the following precautions and measures should be taken when using your device. 1) Employees handling relays should wear anti-static clothing and should be grounded through protective resistance of 500 k to 1 M. 2) A conductive metal sheet should be placed over the work table. Measuring instruments and jigs should be grounded. 3) When using soldering irons, either use irons with low leakage current, or ground the tip of the soldering iron. (Use of lowvoltage soldering irons is also recommended.) 4) Devices and equipment used in assembly should also be grounded. 5) When packing printed circuit boards and equipment, avoid using high-polymer materials such as foam styrene, plastic, and other materials which carry an electrostatic charge. 6) When storing or transporting relays, the environment should not be conducive to generating static electricity (for instance, the humidity should be between 45 and 60%), and relays should be protected using conductive packing materials. 7 All Rights Reserved, (c)Copyright Matsushita Electric Works, Ltd. Go to online catalog