2
RF (Radio Frequency)
C × R 10 Type
(by) PhotoMOS
RELAYS
Measuring and testing equipment
1. Testing equipment for semiconductor performance
IC tester, Liquid crystal driver tester, semiconductor performance tester
2. Board tester
Bear board tester, In-circuit tester, function tester
3. Medical equipment
Ultrasonic wave diagnostic machine
4. Multi-point recorder
Warping, thermo couple
TYPICAL APPLICATIONS
FEATURES
1. In addition to lower output capaci-
tance between terminals than ever
before, the PhotoMOS relay achieves
low ON-resistance.
Output capacitance(C): 1.0pF (typ.)
ON resistance(R): 9.5
Ω
(typ.)
2. High speed switching
Turn on time: 30
µ
s
Turn off time: 30
µ
s
3. SO package 4-pin type in super min-
iature design
4. Low-level off state leakage current
The SSR has an off state leakage current
of several milliamperes, where as this
PhotoMOS relay has only 10pA (typical)
even with the rated load voltage
5. Controls low-level analog signals
6. Low thermal electromotive force
(Approx. 1
µ
V)
4.4±0.2
.173±.008
2.1±0.2
.083±.008
4.3±0.2
.169±.008
mm inch
* Indicate the peak AC and DC values.
Notes: (1) Tape package is the standard packing style. Also available in tube.
(Part No. suffix “X” or “Z” is not needed when ordering; Tube: 100 pcs.; Case: 2,000 pcs.)
(2) For space reasons, the initial letters of the product number “AQY and S”, the package type indicator “X” and “Z” are omitted from the seal.
Circuit
arrangement Type Output rating* Tape and reel packing style Packing quantity
in tape and reel
Load
voltage Load
current Pick ed from the
1/2-pin side Pick ed from the
3/4-pin side
1 Form A AC/DC 40 V 120 mA AQY221N2SX AQY221N2SZ 1,000 pcs.
TYPES
Item Symbol AQY221N2S Remarks
Input
LED forward current I
F
50mA
LED reverse voltage V
R
3V
Peak forward current I
FP
1A f=100 Hz, Duty factor=0.1%
Power dissipation P
in
75mW
Output
Load voltage (peak AC) V
L
40V
Continuous load current I
L
0.12A Peak AC,DC
Peak load current I
peak
0.30A 100 ms (1 shot), VL= DC
Power dissipation P
out
300mW
Total power dissipation P
T
350mW
I/O isolation voltage V
iso
1,500V AC
Temperature
limits Operating T
opr
–40°C to +85°C –40°F to +185°F Non-condensing at low temperatures
Storage T
stg
–40°C to +100°C –40°F to +212°F
RATING
1. Absolute maximum ratings
(Ambient temperature: 25°C 77°F)
CbyR-relay/C.fm 2 y [ W QOOONW Rœ@ jœ@ ªV SW“
3
Item Symbol AQY221N2S Condition
Input
LED operate current Minimum
Typical
Maximum I
Fon
0.9 mA
3.0mA I
L
= 80 mA
LED turn off current Minimum
Typical
Maximum I
Foff
0.2 mA
0.85mA I
L
= 80 mA
LED dropout voltage Minimum
Typical
Maximum V
F
1.14V (1.25 V at I
F
= 50mA)
1.5 V I
F
= 5mA
Output
On resistance Minimum
Typical
Maximum R
on
9.5
Ω
12.5
Ω
I
F
= 5mA
I
L
= 80 mA
Within 1 s on time
Output capacitance Minimum
Typical
Maximum C
out
1.0 pF
1.5 pF
I
F
= 0
V
B
= 0 V
f = 1 MHz
Off state leakage current Minimum
Typical
Maximum I
Leak
0.01 nA
10 nA
I
F
= 0
V
L
= Max.
Transfer
characteristics
Switching
speed
Turn on
time* Minimum
Typical
Maximum T
on
0.03 ms
0.5 ms
I
F
= 5mA
V
L
= 10V
R
L
= 125
Ω
Turn off
time* Minimum
Typical
Maximum T
off
0.03ms
0.2 ms
I
F
= 5mA
V
L
= 10V
R
L
= 125
Ω
I/O capacitance Minimum
Typical
Maximum C
iso
0.8 pF
1.5pF f = 1MHz
V
B
= 0
Initial I/O isolation
resistance Minimum
Typical
Maximum R
iso
1,000M
Ω
500V DC
2. Electrical characteristics
(Ambient temperature: 25°C 77°F)
*Turn on/Turn off time
Toff
Input
Output
Ton
90%
10%
REFERENCE DATA
0
60
80
140
0204060
8085
100-40 -20
40
20
100
120
Load current, mA
Ambient temperature, °C
0
5
10
15
20
25
02040608085-40 -20
On resistance, Ω
Ambient temperature, °C
0
80
200
10 20 30 40 500
40
120
160
Load current, mA
Load voltage, V
1. Load current vs. ambient temperature char-
acteristics
Allowable ambient temperature: –40°C to +85
°
C
–40°F to +185°F
2. Load current vs. Load voltage characteristics
Ambient temperature: 25°C
77°F
3. On resistance vs. ambient temperature char-
acteristics
Measured portion: between terminals 3 and 4
LED current: 5 mA; Load voltage: Max. (DC);
Load current: 80mA (DC)
CbyR-relay/C.fm 3 y [ W QOOONW Rœ@ jœ@ ªV SW“
4
4.
Turn on time vs. ambient temperature characteris-
tics
Measured portion: between terminals 3 and 4
LED current: 5 mA; Load voltage: 10V (DC);
Continuous load current: 80mA (DC)
5. Turn off time vs. ambient temperature characteristics
LED current: 5 mA; Load voltage: 10V (DC);
Continuous load current: 80mA (DC)
6. LED operate current vs. ambient tempera-
ture characteristics
Load voltage: Max. (DC); Continuous load current: 80mA (DC)
0
0.04
0.06
-40 -20
0.1
020406080
0.02
0.08
85
Turn on time, ms
Ambient temperature, °C
0
0.04
0.06
-40 -20
0.1
02040608085
0.02
0.08
Turn off time, ms
Ambient temperature, °C
0
0.5
1
-40 -20
2
0204060
8085
1.5
LED operate current, mA
Ambient temperature, °C
7. LED turn off current vs. ambient temperature
characteristics
Load voltage: Max. (DC); Continuous load current: 80mA (DC)
8. LED dropout voltage vs. ambient tempera-
ture characteristics
LED current: 5 to 50 mA
9. Voltage vs. current characteristics of output
at MOS portion
Measured portion: between terminals 3 and 4
Ambient temperature: 25°C
77°F
0
0.5
1
-40 -20
2
0204060
8085
1.5
LED turn off current, mA
Ambient temperature, °C
0
1.0
1.1
1.2
1.3
-40 -20 020406080
1.4
50mA
30mA
20mA
10mA
5mA
1.5
85 100
LED dropout voltage, V
Ambient temperature, °C
-0.5
120
100
80
60
40
20
-20
-40
-60
-80
-100
-120
0.5 1 1.5 2.0 2.5 3.0
-1.0-1.5-2.0-2.5-3.0
voltage
current
10. Off state leakage current
Measured portion: between terminals 3 and 4
Ambient temperature: 25°C
77°F
11. LED forward current vs. turn on time characteristics
Measured portion: between terminals 3 and 4
Load voltage: 10V (DC); Continuous load current: 80mA (DC);
Ambient temperature: 25
°
C 77°F
12. LED forward current vs. turn off time characteristics
Measured portion: between terminals 3 and 4
Load voltage: 10V (DC); Continuous load current:
80mA (DC);
Ambient temperature: 25
°
C 77°F
40302010
10-12
10-9
10-6
10-3
050
Off state leakage current, A
Load voltage, V
0
0.04
0.12
0.08
100203040
0.16
50 60
Turn on time, ms
LED forward current, mA
0
0.02
0.08
0.04
0.06
100203040
0.1
50 60
Turn off time, ms
LED forward current, mA
13. Applied voltage vs. output capacitance characteristics
Measured portion: between terminals 3 and 4
Frequency: 1 MHz, 30m Vrms;
Ambient temperature: 25
°
C 77°F
14. Isolation characteristics (50
Ω
impedance)
Measured portion: between terminals 3 and 4
Ambient temperature: 25°C
77°F
15. Insertion loss characteristics (50
Ω
imped-
ance)
Measured portion: between terminals 3 and 4
Ambient temperature: 25°C
77°F
0
0.5
2.5
2010 30 40 50
1
1.5
0
2
Output capacitance, pF
Applied boltage, V
010 10 10
68
10
7
10
40
60
80
20
100
45
Isolation, dB
Frequency, Hz
010 10 10
67
10
1
1.5
2
0.5
45
Insertion loss, dB
Frequency, Hz
CbyR-relay/C.fm 4 y [ W QOOONW Rœ@ jœ@ ªV SW“
5
16. On resistance distribution
Measured portion: between terminals 3 and 4
Continuous load current: 80mA(DC)
Quantity, n=60; Ambient temperature: 25
°
C 77°F
17. Turn on time distribution
Load voltage: 10V(DC);
Continuous load current: 80mA(DC)
Quantity, n=60; Ambient temperature: 25
°
C 77°F
18. Turn off time distribution
Load voltage: 10V(DC);
Continuous load current: 80mA(DC)
Quantity, n=60; Ambient temperature: 25
°
C 77°F
8.6 9 9.4 9.8 10.2
20
25
35
30
15
10
5
0
Quantity, n
On resistance, Ω
0.01 0.02 0.03 0.04 0.060.05
20
25
40
35
30
15
10
5
0
Quantity, n
Turn on time, ms
0.018 0.022 0.026 0.03 0.034 0.038
20
40
60
50
30
10
0
Quantity, n
Turn off time, ms
19. LED operate current distribution
Load voltage: 10V(DC);
Continuous load current: 80mA(DC)
Quantity, n=60; Ambient temperature: 25
°
C 77°F
0.4 0.6 0.8 1 1.2 1.4
20
25
30
15
10
5
0
Quantity, n
LED operate current, mA
DIMENSIONS
4.4±0.2
.173±009
4.3±0.2
.169±.009 2.0±0.2
.079±.009
2.54
.100
0.1
.004
0.4
.016
6.8±0.4
.268±016
0.5
.020
0.5
.020
0.4
.016
1.2
.047
0.8
.032
2.54
.100
6.0
.236
4.4±0.2
.173±.008
2.1±0.2
.083±.008
4.3±0.2
.169±.008
mm inch Terminal thickness = 0.15 .006
General tolerance: ±0.1 ±.004
Tolerance:±0.1 ±.004
Recommended mounting pad (TOP VIEW)
SCHEMATIC AND WIRING DIAGRAMS
• E
1
: Power source at input side; V
IN
: Input voltage; I
F
: LED forward current; I
IN
: Input current; V
L
: Load voltage; I
L
: Load current
mm inch
Schematic Output
configuration Load Wiring diagram
1a AC/DC
1
2
4
3
1
IFIL
23
4
VL (AC,DC)
Load
Load
IL
4
3VL (AC,DC)
E1
CbyR-relay/C.fm 5 y [ W QOOONW Rœ@ jœ@ ªV SW“
6
CAUTIONS FOR USE
1. Short across terminals
Do not short circuit between terminals
when relay is energized, since there is
possibility of breaking of the internal IC.
2. Surge voltages at the input
If reverse surge voltages are present at
the input terminals, connect a diode in re-
verse parallel across the input terminals
and keep the reverse voltages below the
reverse breakdown voltage.
3. Recommended LED f orward current
(I
F
)
It is recommended that the LED forward
current (I
F
) should be kept at 5mA.
4. Ripple in the input power supply
If ripple is present in the input power sup-
ply, observe the following:
1) For LED operate current at E
min,
maintain the value mentioned in the tab le
of “Note 3. Recommended LED forward
current (I
F
).”
2) Keep the LED operate current at 50
mA or less at E
max.
5. Output spike voltages
1) If an inductive load generates spike
voltages which exceed the absolute max-
imum rating, the spike voltage must be
limited.
Typical circuits are shown below.
2) Even if spik e v oltages generated at the
load are limited with a clamp diode if the
circuit wires are long, spike voltages will
occur by inductance . K eep wires as short
as possible to minimize inductance.
6. Cleaning solvents compatibility
Dip cleaning with an organic solvent is
recommended for removal of solder flux,
dust, etc. Select a cleaning solvent from
the following table. If ultrasonic cleaning
must be used, the se verity of f actors such
as frequency, output power and cleaning
solvent selected may cause loose wires
and other defects. Make sure these con-
ditions are correct bef ore use. F or details,
please consult us.
7. Input wiring pattern
This relays, avoid installing the input
(LED side) wiring pattern to the bottom
side of the package if you require the
specified I/O isolation voltage (V
iso
) after
mounting the PC board. Since part of the
frame on the output side is exposed, it
may cause fluctuations in the I/O isolation
voltage.
8. Soldering
When soldering this terminals, the follow-
ing conditions are recommended.
(1) IR (Infrared reflow) soldering method
(2) Vapor phase soldering method
(3) Double wave soldering method
(4) Soldering iron method
Tip temperature: 280 to 300°C 536 to
572 °F
Wattage: 30 to 60 W
Soldering time: within 5 s
(5) Others
Check mounting conditions before using
other soldering methods (hot-air, hot
plate, pulse heater, etc.)
• The temperature profile indicates the
temperature of the soldered terminal on
the surf ace of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
• The conditions for the infrared reflow
soldering apply when preheating using
the VPS method.
1
2
4
3
Emin. Emax.
1
2
4
Load
Add a clamp diode
to the load
Add a CR snubber
circuit to the load
Load
3
1
2
4
3
Portion of output side frame
(Output
terminal side)
Input wiring
pattem (Input terminal
side)
May not allow the prescribed I/O withstand
voltage (Viso) to be achieved
T1
T2
T3
T1 = 155 to 165°C 311 to 329°F
T2 = 180°C 200°C 356 to 392°F
T3 = 245°C 473°F or less
t1 = 120 s or less
t2 = 30 s or less
t1t2
T2
T1
t1t2
T1 = 180 to 200°C 366 to 392°F
T2 = 215°C 419°F or less
t1 = 40 s
t2 = 40 s or less
T2
T1
t1t2t3
T1 = 155 to 165°C 311 to 329°F
T2 = 260°C 500°F or less
t1 = 60 s or less
t2+t3 = 5 s or less
Cleaning solvent
Compatability
❍
:Yes
×
:No
Chlorine-
base
•
I.I.I. Trichloroethlene
(Chloroethlene)
• Trichloroethlene
(Trichlene)
• Perchloroethlene
• Methlene chloride
❍
Adueous • Indusco 624, 1000
• Hollis 310
• Lonco Terg
❍
Alcohol-
base • IPA
• Ethanol
❍
Others • Thinner
• Gasoline
×
()
CbyR-relay/C.fm 6 y [ W QOOONW Rœ@ jœ@ ªV SW“
7
9. The following shows the packaging format
1) Tape and reel
Type Tape dimensions Dimensions of paper tape reel
SO package
4-pin type
(1)
When picked from 1/2-pin side: Part No.AQY
❍❍❍
SX (Shown adove)
(2) When picked from 3/4-pin side: Part No. AQY
❍❍❍
SZ
0.3±0.05
.012±.002
Tractor feed holes Direction of picking
7.2±0.1
.284±.004 1.75±0.1
.069±.004
1.55±0.05 dia.
.061±.002 dia.
2.8±0.3
.110±.012
Device mounted
on tape
5.5
±
0.1
.217
±
.004
4.7
±
0.1
.185
±
.004
12±0.1
.472±.004
1.55±0.1 dia.
.061±.004 dia.
4±0.1
.157±.004
2±0.1
.079±.004
12±0.3
.472±.012
21±0.8
.827±.031 80±1 dia.
3.150±.039 dia.
2±0.5
.079±.020
13±0.5 dia.
.512±.020 dia. 14±1.5
.551±.059 2±0.5
.079±.020
250±2 dia.
9.843±.079 dia.
80±1 dia.
3.150±.039 dia.
2) Tube
(1) De vices are pac kaged in a tube so pin
No. 1 is on the stopper B side.
Observe correct orientation when mount-
ing them on PC boards.
(SOP type)
2) Storage
PhotoMOS relays implemented in SO
packages are sensitive to moisture and
come in sealed moisture-proof packages.
Observe the following cautions on stor-
age.
• After the moisture-proof package is un-
sealed, take the de vices out of stor age as
soon as possible (within 1 month at the
most).
• If the de vices are to be left in storage for
a considerable period after the moisture-
proof package has been unsealed, it is
recommended to keep them in another
moisture-proof bag containing silica gel
(within 3 months at the most).
10. Transportation and storage
1) Extreme vibration during transport will
warp the lead or damage the relay. Han-
dle the outer and inner boxes with care.
2) Storage under extreme conditions will
cause soldering degradation, external ap-
pearance def ects, and deterioration of the
characteristics. The following stor age con-
ditions are recommended:
• Temperature: 0 to 45°C 32 to 113°F
• Humidity: Less than 70% R.H.
• Atomosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
11. Applying stress that exceeds the
absolute maximum rating
If the voltage or current value for any of
the terminals exceeds the absolute maxi-
mum rating, internal elements will deterio-
rate because of the excessive voltage or
current. In extreme cases, wiring may
melt, or silicon P/N junctions may be de-
stroyed.
As a result, the design should ensure that
the absolute maximum ratings will never
be exceeded, even momentarily.
(Use at 15 VDC or lower and 9 VAC or
lower is recommended.)
12. Deterioration and destruction
caused by discharge of static
electricity
This phenomenon is generally called stat-
ic electricity destruction, and occurs when
static electricity generated by various fac-
tors is discharged while the relay termi-
nals are in contact, producing internal
destruction of the element.
To pre vent problems from static electricity,
the following precautions and measures
should be taken when using your device.
1) Employees handling relays should
wear anti-static clothing and should be
grounded through protectiv e resistance of
500 k
Ω
to 1 M
Ω
.
2) A conductive metal sheet should be
placed over the work table. Measuring in-
struments and jigs should be grounded.
3) When using soldering irons, either use
irons with low leakage current, or ground
the tip of the soldering iron. (Use of low-
voltage soldering irons is also recom-
mended.)
4) De vices and equipment used in assem-
bly should also be grounded.
5) When packing printed circuit boards
and equipment, avoid using high-polymer
materials such as foam styrene, plastic,
and other materials which carry an elec-
trostatic charge.
6) When storing or transporting relays, the
environment should not be conducive to
generating static electricity (for instance,
the humidity should be between 45 and
60%), and relays should be protected us-
ing conductive packing materials.
StopperB (green) StopperA (gray)
mm inch
0803/2000
Go to online catalog
All Rights Reserved, ©Copyright Matsushita Electric Works, Ltd.
CbyR-relay/C.fm 7 y [ W QOOONW Rœ@ jœ@ ªV SW“
