2SD300C17Ax 2SD300C17Ax Preliminary Datasheet Dual-Channel High-quality and Low-cost SCALE-2 Driver Core Abstract The SCALE-2 dual-driver core 2SD300C17Ax is a second source to Infineon's 2ED300C17-S and 2ED300C17ST. The driver is fully pin and function-compatible to the 2ED300C17-S/2ED300C17-ST and was designed for applications in which high reliability is expected. The use of CONCEPT's highly integrated SCALE-2 chipset allows 63% of the components to be dispensed with compared to the 2ED300C17-S/2ED300C17-ST. This advantage is impressively reflected in increased reliability (function and MTBF) with simultaneously lower costs. The 2SD300C17Ax combines a complete two-channel driver core with all components required for driving, such as an isolated DC/DC converter, short-circuit protection, failure soft shut down, short pulse suppression as well as supply voltage monitoring. Each of the two output channels is electrically isolated from the primary side and the other secondary channel. The driver provides a gate voltage swing of 15V. An output current of 30A and 4W drive power is available per channel. Its outstanding EMC with a dv/dt strength of more than 50V/ns allows safe and reliable operation in even the demanding industrial applications Product Highlights [ Dual channel driver [ Highly integrated SCALE-2 chipset [ Switching frequency up to 60kHz [ Gate current 30A [ 4W output power per channel [ Direct and half-bridge mode [ IGBT short-circuit protection [ Failure soft shut down [ Isolated DC/DC converter [ Safe isolation to EN 50178 [ UL compliant [ Reliable, long service life www.IGBT-Driver.com Applications [ 1:1 replacement of 2ED300C17-S [ 1:1 replacement of 2ED300C17-ST [ IGBTs up to 1700V Page 1 2SD300C17Ax Preliminary Data Sheet Safety Notice! The data contained in this data sheet is intended exclusively for technically trained staff. Handling all highvoltage equipment involves risk to life. Strict compliance with the respective safety regulations is mandatory! Any handling of electronic devices is subject to the general specifications for protecting electrostatic-sensitive devices according to international standard IEC 60747-1, Chapter IX or European standard EN 100015 (i.e. the workplace, tools, etc. must comply with these standards). Otherwise, this product may be damaged. Important Product Documentation This data sheet contains only product-specific data. For a detailed description, must-read application notes and important information that apply to this product, please refer to "2SD300C17 Description & Application Manual" on www.igbt-driver.com/go/2SD300C17 Absolute Maximum Ratings Parameter Remarks Supply voltage VDC VDC to GND Supply voltage VDD Logic input voltages Logic output voltages SOx current Gate peak current Iout Gate resistance IGBT gate charge Average supply current IDC Output power VDD to GND INA, INB and Mod to GND SOA and SOB to GND Failure condition, total current Note 1 Turn-on and turn-off Switching frequency F Test voltage (50Hz/1min.) |dV/dt| Operating voltage Operating temperature Storage temperature www.IGBT-Driver.com Notes 2, 3 Ambient temperature <70C (Notes 4, 5) Ambient temperature 85C (Note 4) Primary to secondary (Note 13) Secondary to secondary (Note 13) Rate of change of input to output voltage (Note 6) Primary and secondary to secondary side Note 5 Min Max Unit 0 16 V 0 16 V -0.5 20 V -0.5 VDD+0.5 V 20 mA -30 +30 A 1 50 C 540 mA 4 W 3 W 60 kHz 5000 VAC(eff) 4000 VAC(eff) 50 kV/s 1700 Vpeak -40 +85 C -40 +90 C Page 2 2SD300C17Ax Preliminary Data Sheet Recommended Operating Conditions Power Supply Remarks Min Typ Max Unit Supply voltage VDC Supply voltage VDD Input logic level Input logic level VDC to GND 14 15 16 V VDD to GND INx and Mod to GND, high level INx and Mod to GND, low level 14 15 VDD 0 16 V V V Min Typ Max Unit Electrical Characteristics All data refer to +25C and VDC = VDD = 15V unless otherwise specified. Power supply Remarks Supply current IDC Without load 65 mA Supply current IDD Supply current IDD Coupling capacitance Cio Direct mode, F = 0Hz Direct mode, F = 60kHz Primary to secondary, per channel Secondary to secondary 14 21 31 29 mA mA pF pF Power Supply Monitoring Remarks Min Typ Max Unit Supply threshold VDD Primary side, clear fault 11.9 12.6 13.3 V 11.3 0.35 12.1 11.5 0.35 5 4.7 0.15 12.0 12.7 12.6 12.0 13.1 12.5 5.15 4.85 5.3 5 Monitoring hysteresis Primary side, set fault (Note 7) Primary side, set/clear fault Secondary side, clear fault Secondary side, set fault (Note 8) Secondary side, set/clear fault Secondary side, clear fault Secondary side, set fault (Note 8) Secondary side, set/clear fault V V V V V V V V Logic Inputs and Outputs Remarks Min Typ Max Unit Input impedance Turn-on threshold Turn-off threshold SOx output voltage INx and Mod V(INx) V(INx) Failure condition, I(SOx)<20mA 0.7 k V V V Short-Circuit Protection Remarks Max Unit Rth value Between RCx and COM x 70 k Blocking time Note 12 Monitoring hysteresis Supply threshold Vx+-VCOMx Monitoring hysteresis Supply threshold VCOMx-Vx- www.IGBT-Driver.com 3.9 8.1 4.8 Min Typ 2 27 ms Page 3 2SD300C17Ax Preliminary Data Sheet External Fault input Remarks Threshold level Between E.x and COM x Timing Characteristics Remarks Turn-on delay td(on) Direct mode (Note 9) 630 ns Turn-off delay td(off) Short pulse suppression Dead time between channels Direct mode (Note 9) Turn-on command pulse width Turn-off command pulse width Half-bridge mode, with CA=CB=0pF (Note 15) 490 470 300 1.3 ns ns ns s Transmission delay of fault state Note 10 450 ns Output Voltage Remarks Turn-on voltage Gate x to COM x 15 V Turn-off voltage Gate x to COM x -15 V Electrical Isolation Remarks Min Typ Max Unit Test voltage (50Hz/1s) Primary to secondary side (Note 13) 5000 5050 5100 Veff Secondary to secondary side (Note 13) Primary to secondary side (Note 14) Secondary to secondary side (Note 14) Primary to secondary side Secondary to secondary side Primary to secondary side Secondary to secondary side 4000 1768 1700 16.2 14.2 16.2 6.5 4050 4100 Veff Vpeak Vpeak mm mm mm mm Output Remarks Min Typ Max Unit Blocking capacitance Vx+ to COMx 9.4 F COMx to Vx- 9.4 F Partial discharge extinction volt. Creepage distance Clearance distance Min Typ Max 5 Min Min Typ Typ Unit V Max Max Unit Unit Footnotes to the Key Data 1) 2) 3) 4) 5) The maximum peak gate current refers to the highest current level occurring during the product lifetime. It is an absolute value and does also apply for short pulses. The average supply input current is limited for thermal reasons. Higher values than specified by the absolute maximum rating are permissible (e.g. during power supply start up) if the average remains below the given value, provided the average is taken over a time period which is shorter than the thermal time constants of the driver in the application. There is no means of actively controlling or limiting the input current in the driver. In the case of start-up with very high blocking capacitor values, or in case of short circuit at the output, the supply input current has to be limited externally. The maximum output power must not be exceeded at any time during operation. The absolute maximum rating must also be observed for time periods shorter than the thermal time constants of the driver in the application. An extended output power range is specified for maximum ambient temperatures of 70C. www.IGBT-Driver.com Page 4 2SD300C17Ax Preliminary Data Sheet 6) 7) 8) 9) 10) 11) 12) 13) 14) 15) This specification guarantees that the drive information will be transferred reliably even at a high DClink voltage and with ultra-fast switching operations. Undervoltage monitoring of the primary-side supply voltage (VDD to GND). If the voltage drops below this limit, a fault is transmitted to both outputs SOA and SOB and the IGBTs are switched off. Undervoltage monitoring of the secondary-side supply voltage (Vx+ to COMx and COMx to Vx- which correspond with the approximate turn-on and turn-off gate-emitter voltages). If the corresponding voltage drops below this limit, the IGBT is switched off and a fault is transmitted to the corresponding SOx output on the primary side. The delay time is measured between 50% of the input signal and 10% (turn-on) or 90% (turn-off) of the corresponding output. Transmission delay of fault state from the secondary side to the primary status output. The test voltage of 4000VAC(eff)/50Hz may be applied only once during one minute. It should be noted that with this (strictly speaking obsolete) test method, some (minor) damage occurs to the insulation layers due to the partial discharge. Consequently, this test is not performed at CONCEPT as a series test. In the case of repeated isolation tests (e.g. module test, equipment test, system test), the subsequent tests should be performed with a lower test voltage: the test voltage is reduced by 400V for each additional test. The more modern if more elaborate partial-discharge measurement is preferable to such test methods as it is almost entirely non-destructive. The blocking time sets a minimum time span between the end of any fault state and the start of normal operation (remove fault from pin SOx). The value of the blocking time is programmed on the driver and cannot be modified externally. HiPot testing (= dielectric testing) must generally be restricted to suitable components. This gate driver is suited for HiPot testing. Nevertheless, it is strongly recommended to limit the testing time to 1s slots as stipulated by EN 50178. Excessive HiPot testing at voltages much higher than 1200VAC(eff) may lead to insulation degradation. No degradation has been observed over 1min. testing at 5000VAC(eff). Every production sample shipped to customers has undergone 100% testing at the given value for 1s. Partial discharge measurement is performed in accordance with IEC 60270 and isolation coordination specified in EN 50178. The partial discharge extinction voltage between primary and either secondary side is coordinated for safe isolation to EN 50178. The dead time is measured between 50% voltage swing of the gate-emitter voltage which is turned off and 50% voltage swing of the gate-emitter voltage which is turned-on. Legal Disclaimer This data sheet specifies devices but cannot promise to deliver any specific characteristics. No warranty or guarantee is given - either expressly or implicitly - regarding delivery, performance or suitability. CT-Concept Technologie AG reserves the right to make modifications to its technical data and product specifications at any time without prior notice. The general terms and conditions of delivery of CT-Concept Technologie AG apply. www.IGBT-Driver.com Page 5 2SD300C17Ax Preliminary Data Sheet Ordering Information The general terms and conditions of delivery of CT-Concept Technologie AG apply. Type Designation Description 2SD300C17A1 Dual-channel SCALE-2 driver core (PCB thickness: 1.55mm) Product home page: www.IGBT-Driver.com/go/2SD300C17 Refer to www.IGBT-Driver.com/go/nomenclature for information on driver nomenclature Information about Other Products For other drivers, product documentation, and application support Please click: www.IGBT-Driver.com Manufacturer CT-Concept Technologie AG A Power Integrations Company Johann-Renfer-Strasse 15 2504 Biel-Bienne Switzerland Phone Fax +41 - 32 - 344 47 47 +41 - 32 - 344 47 40 E-mail Internet Info@IGBT-Driver.com www.IGBT-Driver.com (c) 2009...2013 CT-Concept Technologie AG - Switzerland. We reserve the right to make any technical modifications without prior notice. www.IGBT-Driver.com All rights reserved. Version 2.0 from 2013-04-11 Page 6 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Power Integrations: 2SD300C17A0 2SD300C17A0-T