EP4SGX230DF29C3NES - Altera Corporation

Section I. Stratix IV Device Datasheet

and Addendum

This section includes the following chapters:

■Chapter 1, DC and Switching Characteristics

■Chapter 2, Addendum to the Stratix IV Device Handbook

Revision History

Refer to each chapter for its own specific revision history. For information on when

each chapter was updated, refer to the Chapter Revision Dates section, which appears

in the full handbook.

I–2 Section I: Stratix IV Device Datasheet and Addendum

Stratix IV Device Handbook Volume 4 © February 2010 Altera Corporation

1. DC and Switching Characteristics

Electrical Characteristics

This chapter covers the electrical and switching characteristics for Stratix® IV devices.

Electrical characteristics include operating conditions and power consumption.

Switching characteristics include transceiver specifications, core, and periphery

performance. This chapter also describes I/O timing, including programmable I/O

element (IOE) delay and programmable output buffer delay.

fFor information regarding the densities and packages of devices in the Stratix IV

family, refer to Table 1-1 and Table 1-2 of the Stratix IV Device Family Overview chapter.

Operating Conditions

When you use Stratix IV devices, they are rated according to a set of defined

parameters. To maintain the highest possible performance and reliability of the

Stratix IV devices, you must consider the operating requirements described in this

chapter.

Stratix IV devices are offered in both commercial and industrial grades. Commercial

devices are offered in –2 (fastest), –2×, –3, and –4 speed grades. Industrial devices are

offered in –1, –2, –3, and –4 speed grades.

Absolute Maximum Ratings

Absolute maximum ratings define the maximum operating conditions for Stratix IV

devices. The values are based on experiments conducted with the devices and

theoretical modeling of breakdown and damage mechanisms. The functional

operation of the device is not implied for these conditions.

cConditions other than those listed in Table 1–1, Table 1–2, and Table 1–3 may cause

permanent damage to the device. Additionally, device operation at the absolute

maximum ratings for extended periods of time may have adverse effects on the

device.

Table 1 –1 . Absolute Maximum Ratings for Stratix IV Devices (Part 1 of 2)

Symbol Description Minimum Maximum Unit

VCC Core voltage and periphery circuitry power supply -0.5 1.35 V

VCCPT Power supply for programmable power technology -0.5 1.8 V

VCCPGM Configuration pins power supply -0.5 3.75 V

VCCAUX Auxiliary supply for the programmable power technology -0.5 3.75 V

VCCBAT Battery back-up power supply for design security volatile key register -0.5 3.75 V

VCCPD I/O pre-driver power supply -0.5 3.75 V

VCCIO I/O power supply -0.5 3.9 V

VCC_CLKIN Differential clock input power supply -0.5 3.75 V

VCCD_PLL PLL digital power supply -0.5 1.35 V

SIV54001-4.1

1–2 Chapter 1: DC and Switching Characteristics

Electrical Characteristics

Stratix IV Device Handbook Volume 4 © February 2010 Altera Corporation

VCCA_PLL PLL analog power supply -0.5 3.75 V

VIDC input voltage -0.5 4.0 V

IOUT DC output current per pin -25 40 mA

TJOperating junction temperature -55 125 °C

TSTG Storage temperature (No bias) -65 150 °C

Table 1 –1 . Absolute Maximum Ratings for Stratix IV Devices (Part 2 of 2)

Symbol Description Minimum Maximum Unit

Table 1 –2 . Transceiver Power Supply Absolute Maximum Ratings for Stratix IV GX Devices

Symbol Description Minimum Maximum Unit

VCCA_L Transceiver high voltage power (left side) -0.5 3.75 V

VCCA_R Transceiver high voltage power (right side) -0.5 3.75 V

VCCHIP_L Transceiver HIP digital power (left side) -0.5 1.35 V

VCCHIP_R Transceiver HIP digital power (right side) -0.5 1.35 V

VCCR_L Receiver power (left side) -0.5 1.35 V

VCCR_R Receiver power (right side) -0.5 1.35 V

VCCT_L Transmitter power (left side) -0.5 1.35 V

VCCT_R Transmitter power (right side) -0.5 1.35 V

VCCL_GXBLn (1) Transceiver clock power (left side) -0.5 1.35 V

VCCL_GXBRn (1) Transceiver clock power (right side) -0.5 1.35 V

VCCH_GXBLn (1) Transmitter output buffer power (left side) -0.5 1.8 V

VCCH_GXBRn (1) Transmitter output buffer power (right side) -0.5 1.8 V

Note to Tab l e 1–2:

(1) n = 0, 1, 2, or 3.

Table 1 –3 . Transceiver Power Supply Absolute Maximum Ratings for Stratix IV GT Devices (Note 1) (Part 1 of 2)

Symbol Description Minimum Maximum Unit

VCCA_L Transceiver high voltage power (left side) -0.5 3.75 V

VCCA_R Transceiver high voltage power (right side) -0.5 3.75 V

VCCHIP_L Transceiver HIP digital power (left side) -0.5 1.35 V

VCCHIP_R Transceiver HIP digital power (right side) -0.5 1.35 V

VCCR_L Receiver power (left side) -0.5 1.35 V

VCCR_R Receiver power (right side) -0.5 1.35 V

VCCT_L Transmitter power (left side) -0.5 1.35 V

VCCT_R Transmitter power (right side) -0.5 1.35 V

VCCL_GXBLn (2) Transceiver clock power (left side) -0.5 1.35 V

VCCL_GXBRn (2) Transceiver clock power (right side) -0.5 1.35 V

VCCH_GXBLn

(2) Transmitter output buffer power (left side) -0.5 1.8 V

Chapter 1: DC and Switching Characteristics 1–3

Electrical Characteristics

Maximum Allowed Overshoot and Undershoot Voltage

During transitions, input signals may overshoot to the voltage shown in Table 1–4 and

undershoot to -2.0 V for input currents less than 100 mA and periods shorter than

20 ns.

Table 1–4 lists the maximum allowed input overshoot voltage and the duration of the

overshoot voltage as a percentage of device lifetime. The maximum allowed

overshoot duration is specified as a percentage of high time over the lifetime of the

device. A DC signal is equivalent to 100% duty cycle. For example, a signal that

overshoots to 4.3 V can only be at 4.3 V for ~5% over the lifetime of the device; for a

device lifetime of 10 years, this amounts to half of a year.

Recommended Operating Conditions

This section lists the functional operation limits for AC and DC parameters for

Stratix IV devices. Table 1–5 shows the steady-state voltage and current values

expected from Stratix IV devices. Power supply ramps must all be strictly monotonic,

without plateaus.

VCCH_GXBRn (2) Transmitter output buffer power (right side) -0.5 1.8 V

Notes to Ta bl e 1– 3 :

(1) For absolute maximum ratings for Stratix IV GT engineering sample (ES1) devices, contact your local Altera sales representative.

(2) n = 0, 1, 2, or 3.

Table 1 –3 . Transceiver Power Supply Absolute Maximum Ratings for Stratix IV GT Devices (Note 1) (Part 2 of 2)

Symbol Description Minimum Maximum Unit

Table 1 –4 . Maximum Allowed Overshoot During Transitions

Symbol Description Condition Overshoot Duration as % of

High Time Unit

Vi (AC) AC input voltage

4.0 V 100.000 %

4.05 V 79.330 %

4.1 V 46.270 %

4.15 V 27.030 %

4.2 V 15.800 %

4.25 V 9.240 %

4.3 V 5.410 %

4.35 V 3.160 %

4.4 V 1.850 %

4.45 V 1.080 %

4.5 V 0.630 %

4.55 V 0.370 %

4.6 V 0.220 %

Table 1 –5 . Recommended Operating Conditions for Stratix IV Devices (Part 1 of 2)

Symbol Description Condition Minimum Typical Maximum Unit

VCC

(Stratix IV GX

and Stratix IV E)

Core voltage and periphery circuitry power

supply — 0.870.900.93V

VCC

(Stratix IV GT)

Core voltage and periphery circuitry power

supply — 0.920.950.98V

Chapter 1: DC and Switching Characteristics 1–4

Electrical Characteristics

Table 1–6 shows the transceiver power supply recommended operating conditions for

Stratix IV GX devices.

VCCPT

Power supply for programmable power

technology — 1.451.501.55V

VCCAUX

Auxiliary supply for the programmable

power technology — 2.375 2.5 2.625 V

VCCPD

(2) I/O pre-driver (3.0 V) power supply — 2.85 3.0 3.15 V

I/O pre-driver (2.5 V) power supply — 2.375 2.5 2.625 V

VCCIO

I/O buffers (3.0 V) power supply — 2.85 3.0 3.15 V

I/O buffers (2.5 V) power supply — 2.375 2.5 2.625 V

I/O buffers (1.8 V) power supply — 1.71 1.8 1.89 V

I/O buffers (1.5 V) power supply — 1.425 1.5 1.575 V

I/O buffers (1.2 V) power supply — 1.14 1.2 1.26 V

VCCPGM

Configuration pins (3.0 V) power supply — 2.85 3.0 3.15 V

Configuration pins (2.5 V) power supply — 2.375 2.5 2.625 V

Configuration pins (1.8 V) power supply — 1.71 1.8 1.89 V

VCCA_PLL PLL analog voltage regulator power supply — 2.375 2.5 2.625 V

VCCD_PLL

(Stratix IV GX

and Stratix IV E)

PLL digital voltage regulator power supply — 0.870.900.93V

VCCD_PLL

(Stratix IV GT) PLL digital voltage regulator power supply — 0.920.950.98V

VCC_CLKIN Differential clock input power supply — 2.375 2.5 2.625 V

VCCBAT

(1) Battery back-up power supply (For design

security volatile key register) —1.2—3.3V

VIDC input voltage — –0.5 — 3.6 V

VOOutput voltage —0—V

CCIO V

(Stratix IV GX

and Stratix IV E) Operating junction temperature Commercial 0 — 85 °C

Industrial –40 — 100 °C

TJ (Stratix IV GT) Operating junction temperature Industrial 0 — 100 °C

tRAMP Power supply ramp time

Normal POR

(PORSEL=0) 0.05 — 100 ms

Fast POR

(PORSEL=1) 0.05 — 4 ms

Notes to Ta bl e 1– 5 :

(1) Altera recommends a 3.0-V nominal battery voltage when connecting VCCBAT to a battery for volatile key backup. If you do not use the volatile

security key, you may connect the VCCBAT to either GND or a 3.0-V power supply.

(2) VCCPD must be 2.5 V when VCCIO is 2.5, 1.8, 1.5, or 1.2 V. VCCPD must be 3.0 V when VCCIO is 3.0 V.

Table 1 –5 . Recommended Operating Conditions for Stratix IV Devices (Part 2 of 2)

Symbol Description Condition Minimum Typical Maximum Unit

Table 1 –6 . Transceiver Power Supply Operating Conditions for Stratix IV GX Devices (Part 1 of 2) (Note 4)

Symbol Description Minimum Typical Maximum Unit

VCCA_L Transceiver high voltage power (left side) 2.85/2.375 3.0/2.5(2) 3.15/2.625 V

VCCA_R Transceiver high voltage power (right side)

Chapter 1: DC and Switching Characteristics 1–5

Electrical Characteristics

Table 1–7 shows the recommended operating conditions for the Stratix IV GT

transceiver power supply.

VCCHIP_L Transceiver HIP digital power (left side) 0.87 0.9 0.93 V

VCCHIP_R Transceiver HIP digital power (right side) 0.87 0.9 0.93 V

VCCR_L Receiver power (left side) 1.05 1.1 1.15 V

VCCR_R Receiver power (right side) 1.05 1.1 1.15 V

VCCT_L Transmitter power (left side) 1.05 1.1 1.15 V

VCCT_R Transmitter power (right side) 1.05 1.1 1.15 V

VCCL_GXBLn (1) Transceiver clock power (left side) 1.05 1.1 1.15 V

VCCL_GXBRn (1) Transceiver clock power (right side) 1.05 1.1 1.15 V

VCCH_GXBLn (1) Transmitter output buffer power (left side) 1.33/1.425 1.4/1.5(3) 1.47/1.575 V

VCCH_GXBRn (1) Transmitter output buffer power (right side)

Notes to Ta bl e 1– 6 :

(1) n = 0, 1, 2, or 3.

(2) VCCA_L/R must be connected to a 3.0-V supply if the CMU PLL, receiver CDR, or both, are configured at a base data rate > 4.25 Gbps. For data

rates up to 4.25 Gbps, you can connect VCCA_L/R to either 3.0 V or 2.5 V.

(3) VCCH_GXBL/R must be connected to a 1.4-V supply if the transmitter channel data rate is > 6.25 Gbps. For data rates up to 6.25 Gbps, you can

connect VCCH_GXBL/R to either 1.4 V or 1.5 V.

(4) Transceiver power supplies do not have power-on-reset (POR) circuitry. After initial power-up, violating the transceiver power supply operating

conditions could lead to unpredictable link behavior.

Table 1 –6 . Transceiver Power Supply Operating Conditions for Stratix IV GX Devices (Part 2 of 2) (Note 4)

Symbol Description Minimum Typical Maximum Unit

Table 1 –7 . Transceiver Power Supply Operating Conditions for Stratix IV GT Devices (Note 1), (3)

Symbol Description Minimum Typical Maximum Unit

VCCA_L Transceiver high voltage power (left side) 3.25 3.3 3.35 V

VCCA_R Transceiver high voltage power (right side) 3.25 3.3 3.35 V

VCCHIP_L Transceiver HIP digital power (left side) 0.92 0.95 0.98 V

VCCHIP_R Transceiver HIP digital power (right side) 0.92 0.95 0.98 V

VCCR_L Receiver power (left side) 1.15 1.2 1.25 V

VCCR_R Receiver power (right side) 1.15 1.2 1.25 V

VCCT_L Transmitter power (left side) 1.15 1.2 1.25 V

VCCT_R Transmitter power (right side) 1.15 1.2 1.25 V

VCCL_GXBLn (2) Transceiver clock power (left side) 1.15 1.2 1.25 V

VCCL_GXBRn

(2) Transceiver clock power (right side) 1.15 1.2 1.25 V

VCCH_GXBLn (2) Transmitter output buffer power (left side) 1.33 1.4 1.47 V

VCCH_GXBRn (2) Transmitter output buffer power (right side) 1.33 1.4 1.47 V

Notes to Ta bl e 1– 7 :

(1) For recommended operating conditions for Stratix IV GT engineering sample (ES1) devices, contact your local Altera sales representative.

(2) n = 0, 1, 2, or 3.

(3) Transceiver power supplies do not have power-on-reset (POR) circuitry. After initial power-up, violating the transceiver power supply operating

conditions could lead to unpredictable link behavior.

Chapter 1: DC and Switching Characteristics 1–6

Electrical Characteristics

DC Characteristics

This section lists the supply current, I/O pin leakage current, input pin capacitance,

on-chip termination tolerance, and hot socketing specifications.

Supply Current

Standby current is the current drawn from the respective power rails used for power

budgeting. Use the Excel-based Early Power Estimator (EPE) to get supply current

estimates for your design because these currents vary greatly with the resources you

use.

fFor more information about power estimation tools, refer to the PowerPlay Early Power

Estimator User Guide and the PowerPlay Power Analysis chapter in the Quartus II

Handbook.

I/O Pin Leakage Current

Table 1–8 defines the Stratix IV I/O pin leakage current specifications.

Bus Hold Specifications

Table 1–9 shows the Stratix IV device family bus hold specifications.

Table 1 –8 . I/O Pin Leakage Current for Stratix IV Devices

Symbol Description Conditions Min Typ Max Unit

IIInput pin VI = 0V to VCCIOMAX -20 — 20 µA

IOZ Tri-stated I/O pin VO = 0V to VCCIOMA X -20 — 20 µA

Table 1 –9 . Bus Hold Parameters

Parameter Symbol Conditions

VCCIO

Unit

1.2 V 1.5 V 1.8 V 2.5 V 3.0 V

Min Max Min Max Min Max Min Max Min Max

Low

sustaining

current

ISUSL

VIN > VIL

(maximum) 22.5 — 25.0 — 30.0 — 50.0 — 70.0 — µA

High

sustaining

current

ISUSH

VIN

< VIH

(minimum) -22.5—-25.0—-30.0—-50.0—-70.0— µA

Low

overdrive

current

IODL 0V < VIN < VCCIO —120—160—200—300—500µA

High

overdrive

current

IODH 0V < VIN < VCCIO — -120 — -160 — -200 — -300 — -500 µA

Bus-hold trip

point VTRIP —0.45 0.95 0.50 1.00 0.68 1.07 0.70 1.70 0.80 2.00 V

Chapter 1: DC and Switching Characteristics 1–7

Electrical Characteristics

On-Chip Termination (OCT) Specifications

If you enable OCT calibration, calibration is automatically performed at power-up for

I/Os connected to the calibration block. Table 1–10 lists the Stratix IV OCT

termination calibration accuracy specifications.

The calibration accuracy for calibrated series and parallel OCTs are applicable at the

moment of calibration. When process, voltage, and temperature (PVT) conditions

change after calibration, the tolerance may change. Table 1–11 lists the Stratix IV OCT

without calibration resistance tolerance to PVT changes.

Table 1–10. Stratix IV On-Chip Termination Calibration Accuracy Specifications (Note 1)

Symbol Description Conditions Calibration Accuracy Unit

C2 C3,I3 C4,I4

25-Ω RS (2)

3.0, 2.5, 1.8, 1.5, 1.2

Internal series termination

with calibration (25-Ω setting)

VCCIO = 3.0, 2.5, 1.8,

1.5, 1.2 V ± 8 ± 8 ± 8 %

50-Ω RS

3.0, 2.5, 1.8, 1.5, 1.2

Internal series termination

with calibration (50-Ω setting)

VCCIO = 3.0, 2.5, 1.8,

1.5, 1.2 V ± 8 ± 8 ± 8 %

50-Ω RT

2.5, 1.8, 1.5, 1.2

Internal parallel termination

with calibration (50-Ω setting)

VCCIO = 2.5, 1.8, 1.5,

1.2 V ± 10 ± 10 ± 10 %

20-Ω, 40-Ω, and

60-Ω RS (3)

3.0, 2.5, 1.8, 1.5, 1.2

Expanded range for internal

series termination with

calibration (20-Ω, 40-Ω,

and 60-Ω RS setting)

VCCIO = 3.0, 2.5, 1.8,

1.5, 1.2 V ± 10 ± 10 ± 10 %

25-Ω RS_left_shift

3.0, 2.5, 1.8, 1.5, 1.2

Internal left shift series

termination with calibration

(25-Ω RS_left_shift setting)

VCCIO = 3.0, 2.5, 1.8,

1.5, 1.2 V ± 10 ± 10 ± 10 %

Notes to Ta bl e 1– 10 :

(1) OCT calibration accuracy is valid at the time of calibration only.

(2) 25-Ω RS is not supported for 1.5 V and 1.2 V in Row I/O.

(3) 20-Ω RS is not supported for 1.5 V and 1.2 V in Row I/O.

Table 1–11. Stratix IV On-Chip Termination Without Calibration Resistance Tolerance Specifications (Part 1 of 2)

Symbol Description Conditions Resistance Tolerance Unit

C2 C3,I3 C4,I4

25-Ω RS

3.0 and 2.5

Internal series termination

without calibration (25-Ω

setting)

VCCIO = 3.0 and 2.5 V ± 30 ± 40 ± 40 %

25-Ω RS

1.8 and 1.5

Internal series termination

without calibration (25-Ω

setting)

VCCIO = 1.8 and 1.5 V ± 30 ± 40 ± 40 %

25-ΩRS

1.2

Internal series termination

without calibration (25-Ω

setting)

VCCIO = 1.2 V ± 35 ± 50 ± 50 %

50-Ω RS

3.0 and 2.5

Internal series termination

without calibration (50-Ω

setting)

VCCIO = 3.0 and 2.5 V ± 30 ± 40 ± 40 %

50-Ω RS

1.8 and 1.5

Internal series termination

without calibration (50-Ω

setting)

VCCIO = 1.8 and 1.5 V ± 30 ± 40 ± 40 %

Chapter 1: DC and Switching Characteristics 1–8

Electrical Characteristics

OCT calibration is automatically performed at power-up for OCT-enabled I/Os.

Table 1–12 lists OCT variation with temperature and voltage after power-up

calibration. Use Table 1–12 to determine the OCT variation after power-up calibration

and Equation 1–1 to determine the OCT variation without re-calibration.

Table 1–12 shows the on-chip termination variation after the power-up calibration.

50-Ω RS

1.2

Internal series termination

without calibration (50-Ω

setting)

VCCIO = 1.2 V ± 35 ± 50 ± 50 %

100-Ω RD

2.5

Internal differential

termination (100-Ω setting) VCCIO = 2.5 V ± 25 ± 25 ± 25 %

Table 1–11. Stratix IV On-Chip Termination Without Calibration Resistance Tolerance Specifications (Part 2 of 2)

Symbol Description Conditions Resistance Tolerance Unit

C2 C3,I3 C4,I4

Equation 1–1. OCT Variation Without Re-Calibration (Note 1), (2), (3), (4), (5), (6)

Notes to Equation 1–1:

(1) The ROC T value calculated from Equation 1–1 shows the range of OCT resistance with the variation of temperature

and VCCIO.

(2) RSCAL is the OCT resistance value at power-up.

(3) ΔT is the variation of temperature with respect to the temperature at power-up.

(4) ΔV is the variation of voltage with respect to the VCCIO at power-up.

(5) dR/dT is the percentage change of RSCAL with temperature.

(6) dR/dV is the percentage change of RSCAL with voltage.

Table 1–12. On-Chip Termination Variation after Power-Up Calibration (Note 1)

Symbol Description VCCIO

(V) Typical Unit

dR/dV OCT variation with voltage without

re-calibration

3.0 0.0297

%/mV

2.5 0.0344

1.8 0.0499

1.5 0.0744

1.2 0.1241

dR/dT OCT variation with temperature

without re-calibration

3.0 0.189

%/°C

2.5 0.208

1.8 0.266

1.5 0.273

1.2 0.317

Note to Tab l e 1–12:

(1) Valid for VCCIO range of ±5% and temperature range of 0° to 85°C.

ROCT RSCAL 1dR

-------ΔT×〈〉

-------ΔV×〈〉±+

⎝⎠

⎛⎞

Chapter 1: DC and Switching Characteristics 1–9

Electrical Characteristics

Pin Capacitance

Table 1–13 shows the Stratix IV device family pin capacitance.

Hot Socketing

Table 1–14 shows the hot socketing specifications for Stratix IV devices.

Internal Weak Pull-Up Resistor

Table 1–15 lists the weak pull-up resistor values for Stratix IV devices.

Table 1–13. Pin Capacitance for Stratix IV Devices

Symbol Description Typical Unit

CIOTB Input capacitance on top/bottom I/O pins 4pF

CIOLR Input capacitance on left/right I/O pins 4pF

CCLKTB Input capacitance on top/bottom non-dedicated clock input pins 4pF

CCLKLR Input capacitance on left/right non-dedicated clock input pins 4pF

COUTFB Input capacitance on dual-purpose clock output/feedback pins 5pF

CCLK1, CCLK3, CCLK8, and

CCLK10

Input capacitance for dedicated clock input pins 2pF

Table 1–14. Hot Socketing Specifications for Stratix IV Devices

Symbol Description Maximum

IIOPIN (DC) DC current per I/O pin 300 μA

IIOPIN (AC) AC current per I/O pin 8 mA (1)

IXCVR- TX (DC) (2) DC current per transceiver TX pin 100 mA

IXCVR- RX (DC) (2) DC current per transceiver RX pin 50 mA

Notes to Ta bl e 1– 14 :

(1) The I/O ramp rate is 10 ns or more. For ramp rates faster than 10 ns, |IIOPIN | = C dv/dt, in which C is the I/O pin

capacitance and dv/dt is the slew rate.

(2) These specifications are preliminary.

Table 1–15. Stratix IV Internal Weak Pull-Up Resistor (Note 1), (3)

Symbol Description Conditions Min Typ Max Unit

RPU

Value of the I/O pin pull-up resistor before

and during configuration, as well as user

mode if the programmable pull-up resistor

option is enabled.

VCCIO = 3.0 V ±5% (2) —25—

kΩ

VCCIO = 2.5 V ±5% (2) —25—

kΩ

VCCIO = 1.8 V ±5% (2) —25—

kΩ

VCCIO = 1.5 V ±5% (2) —25—

kΩ

VCCIO = 1.2 V ±5% (2) —25—

kΩ

Notes to Ta bl e 1– 15 :

(1) All I/O pins have an option to enable weak pull-up except configuration, test, and JTAG pins.

(2) Pin pull-up resistance values may be lower if an external source drives the pin higher than VCCIO.

(3) The internal weak pull-down feature is only available for the JTAG TCK pin. The typical value for this internal weak pull-down resistor is

approximately 25 kΩ.

Chapter 1: DC and Switching Characteristics 1–10

Electrical Characteristics

I/O Standard Specifications

Table 1–16 through Table 1–21 list input voltage (VIH and VIL), output voltage (VOH and

VOL), and current drive characteristics (IOH and IOL) for various I/O standards

supported by Stratix IV devices. These tables also show the Stratix IV device family

I/O standard specifications. VOL and VOH values are valid at the corresponding IOH and

IOL, respectively.

For an explanation of terms used in Table 1–16 through Table 1–21, refer to “Glossary”

on page 1–54.

Table 1–16. Single-Ended I/O Standards

I/O

Standard

VCCIO

(V) VIL (V) VIH (V) VOL

(V) VOH

(V) IOL

(mA) IOH (mA)

Min Typ Max Min Max Min Max Max Min

LVTTL 2.85 3 3.15 -0.3 0.8 1.7 3.6 0.4 2.4 2 -2

LVCMOS 2.85 3 3.15 -0.3 0.8 1.7 3.6 0.2 VCCIO - 0.2 0.1 -0.1

2.5 V 2.375 2.5 2.625 -0.3 0.7 1.7 3.6 0.4 2 1 -1

1.8 V 1.71 1.8 1.89 -0.3 0.35 *

VCCIO

0.65 *

VCCIO

VCCIO +

0.3 0.45 VCCIO - 0.45 2 -2

1.5 V 1.425 1.5 1.575 -0.3 0.35 *

VCCIO

0.65 *

VCCIO

VCCIO +

0.3

0.25 *

VCCIO

0.75 *

VCCIO

2-2

1.2 V 1.14 1.2 1.26 -0.3 0.35 *

VCCIO

0.65 *

VCCIO

VCCIO +

0.3

0.25 *

VCCIO

0.75 *

VCCIO

2-2

3.0-V PCI 2.85 3 3.15 — 0.3 *

VCCIO

0.5 *

VCCIO

3.6 0.1 *

VCCIO

0.9 * VCC IO 1.5 -0.5

3.0-V

PCI-X 2.85 3 3.15 — 0.35 *

VCCIO

0.5 *

VCCIO

—0.1 *

VCCIO

0.9 * VCC IO 1.5 -0.5

Table 1–17. Single-Ended SSTL and HSTL I/O Reference Voltage Specifications

I/O Standard VCCIO(V) VREF(V) VTT(V)

Min Typ Max Min Typ Max Min Typ Max

SSTL-2

Class I, II 2.375 2.5 2.625 0.49 * VCCIO 0.5 * VCC IO

0.51 *

VCCIO

VREF - 0.04 VREF VREF + 0.04

SSTL-18

Class I, II 1.71 1.8 1.89 0.833 0.9 0.969 VREF - 0.04 VREF VREF + 0.04

SSTL-15

Class I, II 1.425 1.5 1.575 0.47 * VCCIO 0.5 * VCC IO

0.53 *

VCCIO

0.47 *

VCCIO

VREF

0.53 *

VCCIO

HSTL-18

Class I, II 1.71 1.8 1.89 0.85 0.9 0.95 — VCC IO /2 —

HSTL-15

Class I, II 1.425 1.5 1.575 0.68 0.75 0.9 — VCC IO /2 —

HSTL-12

Class I, II 1.14 1.2 1.26 0.47 * VCCIO 0.5 * VCC IO

0.53 *

VCCIO

—V

CCIO /2 —

Chapter 1: DC and Switching Characteristics 1–11

Electrical Characteristics

Table 1–18. Single-Ended SSTL and HSTL I/O Standards Signal Specifications

I/O Standard VIL(DC)(V) VIH(DC)(V) VIL(AC)(V) VIH(AC)(V) VOL(V) VOH (V) Iol (mA) Ioh (mA)

Min Max Min Max Max Min Max Min

SSTL-2

Class I -0.3 VREF -

0.15

VREF +

0.15

VCCIO +

0.3 VREF - 0.31 VREF

+ 0.31 VTT -

0.57

VTT +

0.57 8.1 -8.1

SSTL-2

Class II -0.3 VREF -

0.15

VREF +

0.15

VCCIO +

0.3 VREF - 0.31 VREF

+ 0.31 VTT -

0.76

VTT +

0.76 16.2 -16.2

SSTL-18

Class I -0.3 VREF -

0.125

VREF +

0.125

VCCIO +

0.3 VREF - 0.25 VRE F + 0.25 VTT -

0.475

VTT +

0.475 6.7 -6.7

SSTL-18

Class II -0.3 VREF -

0.125

VREF +

0.125

VCCIO +

0.3 VREF - 0.25 VRE F + 0.25 0.28 VCCIO -

0.28 13.4 -13.4

SSTL-15

Class I —VREF -

0.1

VREF +

0.1 —VREF -

0.175 VREF + 0.175 0.2 *

VCCIO

0.8 *

VCCIO

8-8

SSTL-15

Class II —VREF -

0.1

VREF +

0.1 —VREF -

0.175 VREF + 0.175 0.2 *

VCCIO

0.8 *

VCCIO

16 -16

HSTL-18

Class I —V

REF -0.1 VREF +

0.1 —V

REF - 0.2 VREF + 0.2 0.4 VCCIO -

0.4 8-8

HSTL-18

Class II —VREF -

0.1

VREF +

0.1 —V

REF - 0.2 VREF + 0.2 0.4 VCCIO -

0.4 16 -16

HSTL-15

Class I —VREF -

0.1

VREF +

0.1 —V

REF - 0.2 VREF + 0.2 0.4 VCCIO -

0.4 8-8

HSTL-15

Class II —VREF -

0.1

VREF +

0.1 —V

REF - 0.2 VREF + 0.2 0.4 VCCIO -

0.4 16 -16

HSTL-12

Class I -0.15 VREF -

0.08

VREF +

0.08

VCCIO +

0.15 VREF - 0.15 VREF

+ 0.15 0.25*

VCCIO

0.75*

VCCIO

8-8

HSTL-12

Class II -0.15 VREF -

0.08

VREF +

0.08

VCCIO +

0.15 VREF - 0.15 VREF

+ 0.15 0.25*

VCCIO

0.75*

VCCIO

16 -16

Table 1–19. Differential SSTL I/O Standards

I/O

Standard

VCCIO(V) VSWING(DC)(V) VX(AC)(V) VSWING(AC)(V) VOX(AC)(V)

Min Typ Max Min Max Min Typ Max Min Max Min Typ Max

SSTL-2

Class I, II 2.375 2.5 2.625 0.3 VCC IO +

0.6

VCCIO

- 0.2 —VCCIO/2 +

0.2 0.62 VCCIO +

0.6

VCCIO

- 0.15 —VCCIO/2

+ 0.15

SSTL-18

Class I, II 1.71 1.8 1.89 0.25 VCCIO +

0.6

VCCIO

0.175

—VCCIO/2 +

0.175 0.5 VCCIO +

0.6

VCCIO

0.125

—

VCCIO/2

0.125

SSTL-15

Class I, II 1.425 1.5 1.575 0.2 — — VCC IO /2 — 0.35 — — VCCIO /2 —

Table 1–20. Differential HSTL I/O Standards (Part 1 of 2)

I/O

Standard

VCCIO(V) VDIF(DC)(V) VX(AC)(V) VCM(DC)

(V) VDIF(AC )(V)

Min Typ Max Min Max Min Typ Max Min Typ Max Min Max

HSTL-18

Class I 1.71 1.8 1.89 0.2 — 0.78 — 1.12 0.78 — 1.12 0.4 —

Chapter 1: DC and Switching Characteristics 1–12

Electrical Characteristics

HSTL-15

Class I, II 1.425 1.5 1.575 0.2 — 0.68 — 0.9 0.68 — 0.9 0.4 —

HSTL-12

Class I, II 1.14 1.2 1.26 0.16 VCCIO +

0.3 —0.5*

VCCIO

—0.4*

VCCIO

0.5*

VCCIO

0.6*

VCCIO

0.3 VCCIO +

0.48

Table 1–20. Differential HSTL I/O Standards (Part 2 of 2)

I/O

Standard

VCCIO(V) VDIF(DC)(V) VX(AC)(V) VCM(DC)

(V) VDIF(AC )(V)

Min Typ Max Min Max Min Typ Max Min Typ Max Min Max

Table 1–21. Differential I/O Standard Specifications (Note 1), (2)

I/O

Standard

VCCIO(V) VID(mV) VICM(DC)(V) VOD(V) (3) VOCM(V) (3)

Min Typ Max Min Condition Max Min Condition Max Min Typ Max Min Typ Max

PCML Transmitter, receiver, and input reference clock pins of high-speed transceivers use PCML I/O standard. For transmitter, receiver, and

reference clock I/O pin specifications, refer to Table 1–22 on page 1–14 and Table 1–23 on page 1–21.

2.5 V

LVDS

(HIO)

2.375 2.5 2.625 100 VCM =

1.25 V

—0.05 DMAX

≤

700 Mbps 1.8 0.247 — 0.6 1.125 1.25 1.375

—1.05 DMAX >

700 Mbps 1.55 0.247 — 0.6 1.125 1.25 1.375

2.5 V

LVDS

(VIO)

2.375 2.5 2.625 100 VCM =

1.25 V

—0.05 DMAX

≤

700 Mbps 1.8 0.247 — 0.6 1 1.25 1.5

—1.05 DMAX>

700 Mbps 1.55 0.247 — 0.6 1 1.25 1.5

RSDS

(HIO) 2.375 2.5 2.625 100 VCM =

1.25 V — 0.3 — 1.4 0.1 0.2 0.6 0.5 1.2 1.4

RSDS

(VIO) 2.375 2.5 2.625 100 VCM =

1.25 V — 0.3 — 1.4 0.1 0.2 0.6 0.5 1.2 1.5

Mini-

LVDS

(HIO)

2.375 2.5 2.625 200 — 600 0.4 — 1.325 0.25 — 0.6 1 1.2 1.4

Mini-

LVDS

(VIO)

2.375 2.5 2.625 200 — 600 0.4 — 1.325 0.25 — 0.6 1 1.2 1.5

LVPECL

2.375 2.5 2.625 300 — — 0.6 DMAX≤

700 Mbps

1.8

(4) ——————

2.375 2.5 2.625 300 — — 1 DMA X >

700 Mbps

1.6

(4) ——————

Notes to Ta bl e 1– 21 :

(1) Vertical (VIO) is top and bottom I/Os; horizontal I/O (HIO) is left and right I/Os.

(2) 1.4-V/1.5-V PCML transceiver I/O standard specifications are described in “Transceiver Performance Specifications” on page 1–14.

(3) RL range: 90 ≤ RL ≤ 110 Ω.

(4) For DMAX > 700 Mbps, the minimum input voltage is 0.85 V; the maximum input voltage is 1.75 V. For FMAX ≤700 Mbps, the minimum input voltage is 0.45

V; the maximum input voltage is 1.95 V.

Chapter 1: DC and Switching Characteristics 1–13

Switching Characteristics

Power Consumption

Altera offers two ways to estimate power consumption for a design: the Excel-based

Early Power Estimator and the Quartus® II PowerPlay Power Analyzer feature.

1You typically use the interactive Excel-based Early Power Estimator before designing

the FPGA to get a magnitude estimate of the device power. The Quartus II PowerPlay

Power Analyzer provides better quality estimates based on the specifics of the design

after you complete place-and-route. The PowerPlay Power Analyzer can apply a

combination of user-entered, simulation-derived, and estimated signal activities that,

combined with detailed circuit models, yields very accurate power estimates.

fFor more information about power estimation tools, refer to the PowerPlay Early Power

Estimator User Guide for Stratix III and Stratix IV FPGAs and the PowerPlay Power

Analysis chapter in the Quartus II Handbook.

Switching Characteristics

This section provides performance characteristics of Stratix IV core and periphery

blocks for commercial grade devices.

These characteristics can be designated as Preliminary or Final.

■Preliminary characteristics are created using simulation results, process data, and

other known parameters. The title of these tables show the designation as

“Preliminary”.

■Final numbers are based on actual silicon characterization and testing. The

numbers reflect the actual performance of the device under worst-case silicon

process, voltage, and junction temperature conditions. There are no designations

on finalized tables.

Chapter 1: DC and Switching Characteristics 1–14

Switching Characteristics

Transceiver Performance Specifications

This section describes transceiver performance specifications.

Table 1–22 lists the Stratix IV GX transceiver specifications.

Table 1–22. Transceiver Specifications for Stratix IV GX Devices (Part 1 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/Industrial

and

–2× Commercial

Speed Grade (1)

–4 Commercial/Industrial

Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Reference Clock

Supported I/O Standards 1.2 V PCML, 1.5 V PCML, 2.5 V PCML, Differential LVPECL, LVDS, HCSL

Input frequency from

REFCLK input pins — 50— 69750— 69750—637.5MHz

Phase frequency detector

(CMU PLL and receiver

CDR)

— 50— 42550— 32550—325MHz

Absolute VMAX for a

REFCLK pin ———1.6——1.6——1.6V

Operational VMAX for a

REFCLK pin ———1.5——1.5——1.5V

Absolute VMIN for a

REFCLK pin — -0.4— — -0.4— — -0.4— — V

Rise/fall time (19) ———0.2——0.2——0.2UI

Duty cycle — 45 — 55 45 — 55 45 — 55 %

Peak-to-peak differential

input voltage — 200 — 1600 200 — 1600 200 — 1600 mV

Spread-spectrum

modulating clock

frequency

PCI Express 30 — 33 30 — 33 30 — 33 kHz

Spread-spectrum

downspread PCI Express — 0 to

-0.5% ——

0 to

-0.5% ——

0 to

-0.5% ——

On-chip termination

resistors — — 100 — — 100 — — 100 — Ω

VICM (AC coupled) — 1100 ± 10% 1100 ± 10% 1100 ± 10% mV

VICM (DC coupled)

HCSL I/O

standard for

PCI Express

reference clock

250 — 550 250 — 550 250 — 550 mV

Transmitter REFCLK Phase

Noise

10 Hz — — -50 — — -50 — — -50 dBc/Hz

100 Hz — — -80 — — -80 — — -80 dBc/Hz

1 KHz — — -110 — — -110 — — -110 dBc/Hz

10 KHz ——-120——-120——-120dBc/Hz

100 KHz ——-120——-120——-120dBc/Hz

≥ 1 MHz — — -130 — — -130 — — -130 dBc/Hz

RREF ——

2000

±1% ——

2000

± 1% ——

2000

± 1% —Ω

Chapter 1: DC and Switching Characteristics 1–15

Switching Characteristics

Transceiver Clocks

Calibration block clock

frequency — 10— 12510— 12510—125MHz

fixedclk clock

frequency

PCI Express

Receiver Detect — 125 — — 125 — — 125 — MHz

reconfig_clk clock

frequency

Dynamic

reconfiguration

clock frequency

2.5/

37.5

(2)

—50

2.5/

37.5

(2)

—50

2.5/

37.5

(2)

—50 —

Delta time between

reconfig_clks (17) ———2——2——2ms

Transceiver block

minimum power-down

(gxb_powerdown)

pulse width

—1——1——1——µs

Receiver

Supported I/O Standards 1.4 V PCML, 1.5 V PCML, 2.5 V PCML, LVPECL, LVDS

Data rate (Single width,

non-PMA Direct) — 600 — 3750 600 — 3750 600 — 3750 Mbps

Data rate (Double width,

non-PMA Direct) — 1000 — 8500 1000 — 6500 1000 — 6375

(20) Mbps

Data rate (Single width,

PMA Direct) — 600 — 3250 600 — 3250 600 — 3250 Mbps

Data rate (Double width,

PMA Direct) — 1000 — 6500 1000 — 6500 1000 — 6375 Mbps

Absolute VMAX for a

receiver pin (3) ———1.6——1.6——1.6V

Operational VMAX for a

receiver pin ———1.5——1.5——1.5V

Absolute VMIN for a

receiver pin — -0.4— — -0.4— — -0.4— — V

Maximum peak-to-peak

differential input voltage

VID (diff p-p) before device

configuration

———1.6——1.6——1.6V

Maximum peak-to-peak

differential input voltage

VID (diff p-p) after device

configuration

VICM = 0.82 V

setting —— 2.7 —— 2.7 —— 2.7 V

VICM =1.1 V

setting (4) —— 1.6 —— 1.6 —— 1.6 V

Minimum peak-to-peak

differential input voltage

VID (diff p-p) (18)

Data Rate =

600 Mbps to

5Gbps

100 — — 100 — — 165 — — mV

Data Rate

>5Gbps 165 — — 165 — — 165 — — mV

Table 1–22. Transceiver Specifications for Stratix IV GX Devices (Part 2 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/Industrial

and

–2× Commercial

Speed Grade (1)

–4 Commercial/Industrial

Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–16

Switching Characteristics

VICM

VICM = 0.82 V

setting 820 ± 10% 820 ± 10% 820 ± 10% mV

VICM = 1.1 V

setting (4) 1100 ± 10% 1100 ± 10% 1100 ± 10% mV

Receiver DC Coupling

Support — For more information about receiver DC coupling support, refer to the “DC-Coupled Links” section

in the Stratix IV Transceiver Architecture chapter.

Differential on-chip

termination resistors

85−Ω setting 85 ± 20% 85 ± 20% 85 ± 20% Ω

100−Ω setting 100 ± 20% 100 ± 20% 100 ± 20% Ω

120−Ω setting 120 ± 20% 120 ± 20% 120 ± 20% Ω

150-Ω setting 150 ± 20% 150 ± 20% 150 ± 20% Ω

Differential and common

mode return loss

PCI Express

(PIPE) (Gen 1

and Gen 2),

XAUI,

HiGig+,

CEI SR/LR,

Serial RapidIO

SR/LR,

CPRI LV/HV,

OBSAI,

SATA

Compliant —

Programmable PPM

detector (5) —± 62.5, 100, 125, 200,

250, 300, 500, 1000 ppm

Run length — — — 200 — — 200 — — 200 UI

Programmable

equalization (16) — —— 16—— 16——16 dB

tLTR (6) — —— 75—— 75——75 µs

tLTR_LTD_Manual (7) — 15— — 15— — 15— — µs

tLTD_Manual (8) — — — 4000 — — 4000 — — 4000 ns

tLTD_Auto (9) — ——4000——4000——4000ns

Receiver CDR

3 dB Bandwidth in

lock-to-data (LTD) mode

PCI Express

(PIPE) Gen1 20 - 35 MHz

PCI Express

(PIPE) Gen2 40 - 65 MHz

(OIF) CEI PHY at

6.375 Gbps 20 - 35 MHz

XAUI 10 - 18 MHz

Serial RapidIO

1.25 Gbps 10 - 18 MHz

Serial RapidIO

2.5 Gbps 10 - 18 MHz

Serial RapidIO

3.125 Gbps 6 - 10 MHz

GIGE 6 - 10 MHz

SONET OC12 3 - 6 MHz

SONET OC48 14 - 19 MHz

Table 1–22. Transceiver Specifications for Stratix IV GX Devices (Part 3 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/Industrial

and

–2× Commercial

Speed Grade (1)

–4 Commercial/Industrial

Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–17

Switching Characteristics

Receiver buffer and CDR

offset cancellation time

(per channel)

— — — 17000 — — 17000 — — 17000

recon

fig_

clk

cycles

Programmable DC gain

DC Gain Setting

= 0 —0 ——0 ——0 — dB

DC Gain Setting

= 1 —3 ——3 ——3 — dB

DC Gain Setting

= 2 —6 ——6 ——6 — dB

DC Gain Setting

= 3 —9 ——9 ——9 — dB

DC Gain Setting

= 4 —12 — —12 — —12 — dB

EyeQ Max Data Rate — 600 — 3250 600 — 3250 600 — 3250 Mbps

Transmitter

Supported I/O Standards 1.4 V PCML, 1.5 V PCML

Data rate (Single width,

non-PMA Direct) — 600 — 3750 600 — 3750 600 — 3750 Mbps

Data rate (Double width,

non-PMA Direct) — 1000 — 8500 1000 — 6500 1000 — 6375

(20) Mbps

Data rate (Single width,

PMA Direct) — 600 — 3250 600 — 3250 600 — 3250 Mbps

Data rate (Double width,

PMA Direct) (10) — 1000 — 6500 1000 — 6500 1000 — 6375 Mbps

VOCM 0.65 V setting — 650 — — 650 — — 650 — mV

Differential on-chip

termination resistors

85−Ω setting 85 ± 15% 85 ± 15% 85 ± 15% Ω

100−Ω setting 100 ± 15% 100 ± 15% 100 ± 15% Ω

120−Ω setting 120 ± 15% 120 ± 15% 120 ± 15% Ω

150-Ω setting 150 ± 15% 150 ± 15% 150 ± 15% Ω

Differential and common

mode return loss

PCI Express

(PIPE) Gen1 and

Gen2 (TX VOD=4),

XAUI (TX VOD=6),

HiGig+

(TX VOD =6),

CEI SR/LR

(TX VOD =8),

Serial RapidIO

SR (VOD=6),

Serial RapidIO

LR (VOD=8),

CPRI LV (VOD=6),

CPRI HV

(VOD=2),

OBSAI (VOD=6),

SATA (VOD=4),

Compliant —

Rise time (11) — 50— 20050— 20050—200 ps

Fall time (11) — 50— 20050— 20050—200 ps

Table 1–22. Transceiver Specifications for Stratix IV GX Devices (Part 4 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/Industrial

and

–2× Commercial

Speed Grade (1)

–4 Commercial/Industrial

Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–18

Switching Characteristics

Intra-differential pair skew — — — 15 — — 15 — — 15 ps

Intra-transceiver block

transmitter

channel-to-channel skew

×4 PMA and PCS

bonded mode

Example: XAUI,

PCI EXpress

(PIPE), ×4,

Basic ×4

— — 120 — — 120 — — 120 ps

Inter-transceiver block

transmitter

channel-to-channel skew

×8 PMA and PCS

bonded mode

Example:

PCI Express

(PIPE) ×8,

Basic ×8

— — 500 — — 500 — — 500 ps

Inter-transceiver block

skew in Basic (PMA

Direct) ×N mode (12)

N < 18 channels

located across

three transceiver

blocks with the

source CMU PLL

located in the

center

transceiver block

— — 400 — — 400 — — 400 ps

N ≥ 18 channels

located across

four transceiver

blocks with the

source CMU PLL

located in one of

the two center

transceiver

blocks

— — 650 — — 650 — — 650 ps

CMU PLL0 and CMU PLL1

Supported Data Range — 600 — 8500 600 — 6500 600 — 6375 Mbps

pll_powerdown

minimum pulse width

(tpll_powerdown)

—1μs

CMU PLL lock time from

pll_powerdown

de-assertion

— — — 100 — — 100 — — 100 μs

Table 1–22. Transceiver Specifications for Stratix IV GX Devices (Part 5 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/Industrial

and

–2× Commercial

Speed Grade (1)

–4 Commercial/Industrial

Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–19

Switching Characteristics

-3 dB Bandwidth

PCI Express

(PIPE) Gen1 2.5 - 3.5 MHz

PCI Express

(PIPE) Gen2 6 - 8 MHz

(OIF) CEI PHY at

4.976 Gbps 7 - 11 MHz

(OIF) CEI PHY at

6.375 Gbps 5 - 10 MHz

XAUI 2 - 4 MHz

Serial RapidIO

1.25 Gbps 3 - 5.5 MHz

Serial RapidIO

2.5 Gbps 3 - 5.5 MHz

Serial RapidIO

3.125 Gbps 2 - 4 MHz

GIGE 2.5 - 4.5 MHz

SONET OC12 1.5 - 2.5 MHz

SONET OC48 3.5 - 6 MHz

ATX PLL (6G)

Supported Data Range

(14)

/L = 1 4800-5400 and

6000-6500

4800-5400 and

6000-6500 —Mbps

/L = 2 2400-2700 and

3000-3250

2400-2700 and

3000-3250 —Mbps

/L = 4 1200-1350 and

1500-1625

1200-1350 and

1500-1625 —Mbps

-3 dB Bandwidth

PCI Express

(PIPE) Gen 2 — 1.5 — — 1.5 — allows LC MHz

(OIF) CEI PHY at

6.375 Gbps 3 - 4.5 3 - 4.5 allows LC MHz

Transceiver-FPGA Fabric Interface

Interface speed

(non-PMA Direct)

— 25 — 265.625 25 — 250 25 — 250 MHz

Interface speed

(PMA Direct)

— 50— 32550— 32550—325MHz

Table 1–22. Transceiver Specifications for Stratix IV GX Devices (Part 6 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/Industrial

and

–2× Commercial

Speed Grade (1)

–4 Commercial/Industrial

Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–20

Switching Characteristics

Digital reset pulse width — Minimum is two parallel clock cycles —

Notes to Ta bl e 1– 22 :

(1) The –2× speed grade is the fastest speed grade offered in the following Stratix IV GX devices: EP4SGX70DF29, EP4SGX110DF29, EP4SGX110FF35,

EP4SGX230DF29, EP4SGX110FF35, EP4SGX230DF29, EP4SGX230FF35, EP4SGX290FF35, EP4SGX290FH29, EP4SGX360FF35, and EPSGX360FH29.

(2) The minimum reconfig_clk frequency is 2.5 MHz if the transceiver channel is configured in transmitter only mode. The minimum reconfig_clk

frequency is 37.5 MHz if the transceiver channel is configured in receiver only or receiver and transmitter mode. For more information, refer to the Stratix IV

Dynamic Reconfiguration chapter in volume 2 of the Stratix IV Device Handbook.

(3) The device cannot tolerate prolonged operation at this absolute maximum.

(4) You must use the 1.1-V RX VICM setting if the input serial data standard is LVDS.

(5) The rate matcher supports only up to ±300 ppm.

(6) Time taken to rx_pll_locked goes high from rx_analogreset de-assertion. Refer to Figure 1–2 on page 1–28.

(7) Time for which the CDR must be kept in lock-to-reference mode after rx_pll_locked goes high and before rx_locktodata is asserted in manual

mode. Refer to Figure 1–2 on page 1–28.

(8) Time taken to recover valid data after the rx_locktodata signal is asserted in manual mode. Refer to Figure 1–2 on page 1–28.

(9) Time taken to recover valid data after the rx_freqlocked signal goes high in automatic mode. Refer to Figure 1–3 on page 1–28.

(10) A GPLL may be required to meet PMA-FPGA fabric interface timing above certain data rates. Refer to the "Left/Right PLL Requirements in Basic (PMA Direct)

Mode" section in the Stratix IV GX Transceiver Clocking chapter in volume 2 of the Stratix IV Device Handbook.

(11) The Quartus II software automatically selects the appropriate slew rate depending on the configured data rate or functional mode.

(12) For applications that require low transmit lane-to-lane skew, use Basic (PMA Direct) xN to achieve PMA-Only bonding across all channels in the link. You

can bond all channels on one side of the device by configuring them in Basic (PMA Direct) xN mode. For more information about clocking requirements in

this mode, refer to the “Basic (PMA Direct) Mode Clocking” section in the Stratix IV GX Transceiver Clocking chapter in volume 2 of the Stratix IV Device

Handbook.

(13) Pending Characterization.

(14) The Quartus II software automatically selects the appropriate /L divider depending upon the configured data.

(15) The maximum Transceiver-FPGA Fabric interface speed of 265.625 MHz is allowed only in Basic Low-Latency PCS mode with a 32-bit interface width. For

more information, refer to the “Basic Double-Width Mode Configurations” section in the Stratix IV Transceiver Architecture chapter in volume 2 of the

Stratix IV Device Handbook.

(16) Figure 1–1 shows the AC gain curves for each of the 16 available equalization settings.

(17) If your design uses more than one dynamic reconfiguration controller (altgx_reconfig) instances to control the transceiver (altgx) channels

physically located on the same side of the device AND if you use different reconfig_clk sources for these altgx_reconfig instances, the delta

time between any two of these reconfig_clk sources becoming stable must not exceed the maximum specification listed.

(18) The outer envelope of the eye diagram measured at the receiver input pins must meet the minimum VID specifications if RX equalization is enabled. The

inner envelope of the eye diagram measured at the receiver input pins must meet the minimum VID specifications if RX equalization is not enabled.

(19) The rise and fall time transition is specified from 20% to 80%.

(20) Stratix IV GX devices in -4 speed grade support Basic mode and Deterministic Latency mode transceiver configurations up to 6375 Mbps. These

configurations are shown in the figures 1-90, 1-92, 1-94, 1-96, and 1-101 in the Stratix IV Transceiver Architecture chapter.

Table 1–22. Transceiver Specifications for Stratix IV GX Devices (Part 7 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/Industrial

and

–2× Commercial

Speed Grade (1)

–4 Commercial/Industrial

Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–21

Switching Characteristics

Figure 1–1 shows the top-to-bottom AC gain curve for equalization settings 0 to 15.

Table 1–23 lists the Stratix IV GT transceiver specifications.

Figure 1–1. AC Gain Curves for Equalization Settings 0 to 15 (Bottom to Top)

Table 1–23. Transceiver Specifications for Stratix IV GT Devices (Part 1 of 7)

Symbol/

Description Conditions –1 Industrial Speed Grade –2 Industrial Speed Grade –3 Industrial Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Reference Clock

Supported I/O Standards 1.2 V PCML, 1.5 V PCML, 2.5 V PCML, Differential LVPECL, LVDS

Input frequency from

REFCLK input pins — 50 — 706.25 50 — 706.25 50 — 706.25 MHz

Phase frequency

detector (CMU PLL and

receiver CDR)

— 50 — 425 50 — 425 50 — 425 MHz

Absolute VMAX for a

REFCLK pin — — — 1.6 — — 1.6 — — 1.6 V

Operational VMAX for a

REFCLK pin — — — 1.5 — — 1.5 — — 1.5 V

Absolute VMIN for a

REFCLK pin — -0.3 — — -0.3 — — -0.3 — — V

Rise/fall time — — 0.2 — — — 0.2 — — 0.2 UI

Duty cycle — 45 — 55 45 — 55 45 — 55 %

Chapter 1: DC and Switching Characteristics 1–22

Switching Characteristics

Peak-to-peak differential

input voltage after device

configuration

— 200 — 1600 200 — 1600 200 — 1600 mV

Max peak-to-peak

differential input voltage

before device

configuration

— — — 900 — — 900 — — 900 mV

On-chip termination

resistors — — 100 — — 100 — — 100 — Ω

VICM — 1200 ± 10% 1200 ± 10% 1200 ± 10% mV

RREF ———

2000 ±

1% —2000 ±

1% ——

2000

± 1% —Ω

Transceiver Clocks

Calibration block clock

frequency — 10 — 125 10 — 125 10 — 125 MHz

reconfig_clk clock

frequency

Dynamic

reconfigura

tion clock

frequency

2.5/

37.5

(1)

——

2.5/

37.5

(1)

—50

2.5/

37.5

(1)

—50MHz

fixedclk clock

frequency

PCI

Express

Receiver

Detect

— 125 — — 125 — — 125 — MHz

Delta time between

reconfig_clks

(13)

———2——2——2ms

Transceiver block

minimum

(gxb_powerdown)

power-down pulse width

——1——1——1—µs

Receiver

Supported I/O

Standards 1.4 V PCML, 1.5 V PCML, 2.5 V PCML, LVPECL, LVDS

Data rate (Single width,

non-PMA Direct) — 600 — 3750 600 — 3750 600 — 3750 Mbps

Data rate (Double width,

non-PMA Direct) — 1000 — 11300 1000 - 10312.5 1000 — 8500 Mbps

Data rate (Single width,

PMA Direct) — 600 - 3250 600 - 3250 600 — 3250 Mbps

Data rate (Double width,

PMA Direct) — 1000 - 6500 1000 - 6500 1000 — 6500 Mbps

Absolute VMAX for a

receiver pin (2) — — — 1.6 — — 1.6 — — 1.6 V

Operational VMAX for a

receiver pin — — — 1.5 — — 1.5 — — 1.5 V

Absolute VMIN for a

receiver pin — — -0.4 —-0.4— — -0.4— — V

Table 1–23. Transceiver Specifications for Stratix IV GT Devices (Part 2 of 7)

Symbol/

Description Conditions –1 Industrial Speed Grade –2 Industrial Speed Grade –3 Industrial Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–23

Switching Characteristics

Maximum peak-to-peak

differential input voltage

VID (diff p-p) before

device configuration

— — — 1.6 — — 1.6 — — 1.6 V

Maximum peak-to-peak

differential input voltage

VID (diff p-p) after device

configuration

VICM = 0.82

V setting — — 2.7 — — 2.7 — — 2.7 V

VICM = 1.2 V

setting (3) — — 1.2 — — 1.2 — — 1.2 V

Minimum peak-to-peak

differential input voltage

VID (diff p-p)

Data Rate =

2488 Mbps

to 5 Gbps

100 — — 100 — — 100 — — mV

Data Rate >

5Gbps 165 — — 165 — — 165 — — mV

VICM

VICM = 0.82

V setting 820 ± 10% 820 ± 10% 820 ± 10% mV

VICM = 1.2 V

setting (3) 1200 ± 10% 1200 ± 10% 1200 ± 10% mV

Differential on-chip

termination resistors

85−Ω

setting 85 ± 20% 85 ± 20% 85 ± 20% Ω

100−Ω

setting 100 ± 20% 100 ± 20% 100 ± 20% Ω

120−Ω

setting 120 ± 20% 120 ± 20% 120 ± 20% Ω

150-Ω

setting 150 ± 20% 150 ± 20% 150 ± 20% Ω

Differential and common

mode return loss

PCI

Express

(PIPE)

(Gen 1 and

Gen 2),

XAUI,

HiGig+,

CEI SR/LR,

Serial

RapidIO

SR/LR,

CPRI

LV/HV,

OBSAI,

SATA

Compliant —

Programmable PPM

detector (4) —— ± 62.5, 100, 125, 200,

250, 300, 500, 1000 ppm

Run length — — — 200 — — 200 — — 200 UI

Programmable

equalization ———16——16——16dB

tLTR (5) ———75——75——75µs

tLTR_LTD_Manual

(6) — 15— —15— — 15— — µs

tLTD_Manual (7) — — — 4000 — — 4000 — — 4000 ns

tLTD_Auto (8) — — — 4000 — — 4000 — — 4000 ns

Table 1–23. Transceiver Specifications for Stratix IV GT Devices (Part 3 of 7)

Symbol/

Description Conditions –1 Industrial Speed Grade –2 Industrial Speed Grade –3 Industrial Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–24

Switching Characteristics

Receiver buffer and CDR

offset cancellation time

(per channel)

— — — 17000 — — 17000 — — 17000

recon

fig_c

cycles

Programmable DC gain

DC Gain

Setting = 0 —0 ——0 ——0 —dB

DC Gain

Setting = 1 —3 ——3 ——3 —dB

DC Gain

Setting = 2 —6 ——6 ——6 —dB

DC Gain

Setting = 3 —9 ——9 ——9 —dB

DC Gain

Setting = 4 — 12 — —12 — —12 — dB

EyeQ Max Data Rate — — — 4.0 — — 4.0 — — 4.0 Gbps

Transmitter

Supported I/O Standards 1.4 V PCML

Data rate (Single width,

non-PMA Direct) — 600 — 3750 600 — 3750 600 — 3750 Mbps

Data rate (Double width,

non-PMA Direct) — 1000 — 11300 1000 — 10312.5 1000 — 8500 Mbps

Data rate (Single width,

PMA Direct) — 600 — 3250 600 — 3250 600 — 3250 Mbps

Data rate (Double width,

PMA Direct) (9) — 1000 — 6500 1000 — 6500 1000 — 6500 Mbps

VOCM

0.65 V

setting — 650 — — 650 — — 650 — mV

Differential on-chip

termination resistors

85−Ω

setting 85 ± 15% 85 ± 15% 85 ± 15% Ω

100−Ω

setting 100 ± 15% 100 ± 15% 100 ± 15% Ω

120−Ω

setting 120 ± 15% 120 ± 15% 120 ± 15% Ω

150-Ω

setting 150 ± 15% 150 ± 15% 150 ± 15% Ω

Table 1–23. Transceiver Specifications for Stratix IV GT Devices (Part 4 of 7)

Symbol/

Description Conditions –1 Industrial Speed Grade –2 Industrial Speed Grade –3 Industrial Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–25

Switching Characteristics

Differential and common

mode return loss

PCI

Express

(PIPE)

Gen1 and

Gen2 (TX

VOD =4),

XAUI (TX

VOD =6),

HiGig+

(TX VOD=6),

CEI SR/LR

(TX VOD=8),

Serial

RapidIO SR

(VOD=6),

Serial

RapidIO LR

(VOD=8),

CPRI LV

(VOD=6),

CPRI HV

(VOD=2),

OBSAI

(VOD=6),

SATA

(VOD=4),

Compliant —

Rise time (10) — 50 — 200 50 — 200 50 — 200 ps

Fall time (10) — 50 — 200 50 — 200 50 — 200 ps

Intra-differential pair

skew ———15——15——15ps

Intra-transceiver block

transmitter

channel-to-channel skew

×4 PMA

and PCS

bonded

mode

Example:

XAUI, PCI

EXpress

(PIPE), ×4,

Basic ×4

——120——120——120ps

Inter-transceiver block

transmitter

channel-to-channel skew

×8 PMA

and PCS

bonded

mode

Example:

PCI Expres

s (PIPE) ×8,

Basic ×8

——500——500——500ps

Table 1–23. Transceiver Specifications for Stratix IV GT Devices (Part 5 of 7)

Symbol/

Description Conditions –1 Industrial Speed Grade –2 Industrial Speed Grade –3 Industrial Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–26

Switching Characteristics

Inter-transceiver block

skew in Basic (PMA

Direct) ×N mode (11)

N < 18

channels

located

across

three

transceiver

blocks with

the source

CMU PLL

located in

the center

transceiver

block

——400——400——400ps

N ≥ 18

channels

located

across four

transceiver

blocks with

the source

CMU PLL

located in

one of the

two center

transceiver

blocks

——650——650——650ps

CMU PLL0 and CMU PLL1

Supported data range — 600 600 600 Mbps

CMU PLL lock time from

pll_powerdown

de-assertion

— — — 100 — — 100 — — 100 μs

ATX PLL (6G)

Supported Data Range

/L = 1 4800-5400 and

6000-6500

4800-5400 and

6000-6500 —Mbps

/L = 2 2400-2700 and

3000-3250

2400-2700 and

3000-3250 —Mbps

/L = 4 1200-1350 and

1500-1625

1200-1350 and

1500-1625 —Mbps

ATX PLL (10G)

Supported Data Range — 9900 — 11300 9900 — 10312.5 — Mbps

Transceiver-FPGA Fabric Interface

Interface speed

(non-PMA Direct)

— 62.2 — — 62.2 — 265.625 62.2 — 265.625 MHz

Interface speed

(PMA Direct)

— 124.4 — — 124.4 — 325 124.4 — 325 MHz

Table 1–23. Transceiver Specifications for Stratix IV GT Devices (Part 6 of 7)

Symbol/

Description Conditions –1 Industrial Speed Grade –2 Industrial Speed Grade –3 Industrial Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–27

Switching Characteristics

Digital reset pulse width — — — — Minimum is two parallel clock cycles —

Notes to Ta bl e 1– 23 :

(1) The minimum reconfig_clk frequency is 2.5 MHz if the transceiver channel is configured in transmitter only mode. The minimum

reconfig_clk frequency is 37.5 MHz if the transceiver channel is configured in receiver only or receiver and transmitter mode. For more

information, refer to the Stratix IV Dynamic Reconfiguration chapter in volume 1 of the Stratix IV Device Handbook.

(2) The device cannot tolerate prolonged operation at this absolute maximum.

(3) You must use the 1.2-V RXVICM setting if the input serial data standard is LVDS.

(4) The rate matcher supports only up to ±300 ppm.

(5) Time taken to rx_pll_locked goes high from rx_analogreset de-assertion. Refer to Figure 1–2 on page 1–28.

(6) Time for which the CDR must be kept in lock-to-reference mode after rx_pll_locked goes high and before rx_locktodata is asserted in

manual mode. Refer to Figure 1–2 on page 1–28.

(7) Time taken to recover valid data after the rx_locktodata signal is asserted in manual mode. Refer to Figure 1–2 on page 1–28.

(8) Time taken to recover valid data after the rx_freqlocked signal goes high in automatic mode. Refer to Figure 1–3 on page 1–28.

(9) A GPLL may be required to meet PMA-FPGA fabric interface timing above certain data rates. Refer to the "Left/Right PLL Requirements in Basic (PMA

Direct) Mode" section in the Stratix IV GX Transceiver Clocking chapter in volume 2 of the Stratix IV Device Handbook.

(10) The Quartus II software automatically selects the appropriate slew rate depending on the configured data rate or functional mode.

(11) For applications that require low transmit lane-to-lane skew, use Basic (PMA Direct) xN to achieve PMA-Only bonding across all channels in the link.

You can bond all channels on one side of the device by configuring them in Basic (PMA Direct) xN mode. For more information about clocking

requirements in this mode, refer to the “Basic (PMA Direct) Mode Clocking” section in the Stratix IV GX Transceiver Clocking chapter in volume 2 of

the Stratix IV Device Handbook.

(12) Pending Characterization.

(13) If your design uses more than one dynamic reconfiguration controller (altgx_reconfig) instances to control the transceiver (altgx) channels

physically located on the same side of the device AND if you use different reconfig_clk sources for these altgx_reconfig instances, the

delta time between any two of these reconfig_clk sources becoming stable must not exceed the maximum specification listed.

Table 1–23. Transceiver Specifications for Stratix IV GT Devices (Part 7 of 7)

Symbol/

Description Conditions –1 Industrial Speed Grade –2 Industrial Speed Grade –3 Industrial Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–28

Switching Characteristics

Figure 1–2 shows the lock time parameters in manual mode.

1LTD = Lock-To-Data; LTR = Lock-To-Reference

Figure 1–3 shows the lock time parameters in automatic mode.

Figure 1–2. Lock Time Parameters for Manual Mode

LTR LTD

Invalid Data

Valid data

r x_locktodata

LTD_Manual

CDR status

r x_dataout

rx_pll_locked

r x_analogreset

LTR

LTR_LTD_Manual

Figure 1–3. Lock Time Parameters for Automatic Mode

LTR LTD

Invalid data Valid data

r x_freqlocked

LTD_Auto

r x_dataout

CDR status

Chapter 1: DC and Switching Characteristics 1–29

Switching Characteristics

Table 1–24 through Table 1–27 show the typical differential VOD termination settings

for Stratix IV GX and GT devices.

Table 1–28 shows typical transmitter pre-emphasis levels in dB for the first post tap

under the following conditions (low-frequency data pattern [five 1s and five 0s] at

6.25 Gbps). The levels shown in Table 1–28 are a representation of possible

pre-emphasis levels under the specified conditions only and it should be noted that

the pre-emphasis levels may change with data pattern and data rate.

fTo predict the pre-emphasis level for your specific data rate and pattern, run

simulations using the Stratix IV HSSI HSPICE models.

Table 1–24. Typical VOD Setting, TX Term = 85 Ω

Symbol VOD Setting (mV)

01234567

VOD differential peak-peak

Typic al (mV)

170 ±

20%

340 ±

20%

510 ±

20%

595 ±

20%

680 ±

20%

765 ±

20%

850 ±

20%

1020

± 20%

Table 1–25. Typical VOD Setting, TX Term = 100 Ω

Symbol VOD

Setting (mV)

01234567

VOD differential peak-peak

Typic al (mV)

200 ±

20%

400 ±

20%

600 ±

20%

700 ±

20%

800 ±

20%

900 ±

20%

1000

± 20%

1200

± 20%

Table 1–26. Typical VOD Setting, TX Term = 120 Ω

Symbol VOD Setting (mV)

0123456

VOD differential peak-peak

Typic al (mV)

240 ±

20%

480 ±

20%

720 ±

20%

840 ±

20%

960 ±

20%

1080 ±

20%

1200 ±

20%

Table 1–27. Typical VOD Setting, TX Term = 150 Ω

Symbol VOD Setting (mV)

012345

VOD differential peak-peak

Typic al (mV)

300 ±

20%

600 ±

20%

900 ±

20%

1050 ±

20%

1200 ±

20%

1350 ±

20%

Table 1–28. Transmitter Pre-Emphasis Levels for Stratix IV Devices (Part 1 of 2)

Pre-

Emphasis

1st

Post-Tap

Setting

VOD Setting

01234567

000000000

1N/A0.7000000

2N/A10.300000

3N/A1.50.600000

4N/A20.70.30000

Chapter 1: DC and Switching Characteristics 1–30

Switching Characteristics

5 N/A 2.7 1.2 0.5 0.3 0 0 0

6 N/A 3.1 1.3 0.8 0.5 0.2 0 0

7 N/A 3.7 1.8 1.1 0.7 0.4 0.2 0

8 N/A 4.2 2.1 1.3 0.9 0.6 0.3 0

9 N/A 4.9 2.4 1.6 1.2 0.8 0.5 0.2

10 N/A 5.4 2.8 1.9 1.4 1 0.7 0.3

11 N/A 6 3.2 2.2 1.7 1.2 0.9 0.4

12 N/A 6.8 3.5 2.6 1.9 1.4 1.1 0.6

13 N/A 7.5 3.8 2.8 2.1 1.6 1.2 0.6

14 N/A 8.1 4.2 3.1 2.3 1.7 1.3 0.7

15 N/A 8.8 4.5 3.4 2.6 1.9 1.5 0.8

16 N/A N/A 4.9 3.7 2.9 2.2 1.7 0.9

17 N/A N/A 5.3 4 3.1 2.4 1.8 1.1

18 N/A N/A 5.7 4.4 3.4 2.6 2 1.2

19 N/A N/A 6.1 4.7 3.6 2.8 2.2 1.4

20 N/A N/A 6.6 5.1 4 3.1 2.4 1.5

21 N/A N/A 7 5.4 4.3 3.3 2.7 1.7

22 N/A N/A 8 6.1 4.8 3.8 3 2

23 N/A N/A 9 6.8 5.4 4.3 3.4 2.3

24 N/A N/A 10 7.6 6 4.8 3.9 2.6

25 N/A N/A 11.4 8.4 6.8 5.4 4.4 3

26 N/A N/A 12.6 9.4 7.4 5.9 4.9 3.3

27 N/A N/A N/A 10.3 8.1 6.4 5.3 3.6

28 N/A N/A N/A 11.3 8.8 7.1 5.8 4

29 N/A N/A N/A 12.5 9.6 7.7 6.3 4.3

30N/AN/AN/AN/A11.4 9 7.4N/A

31N/AN/AN/AN/A12.910 8.2N/A

Table 1–28. Transmitter Pre-Emphasis Levels for Stratix IV Devices (Part 2 of 2)

Pre-

Emphasis

1st

Post-Tap

Setting

VOD Setting

01234567

Chapter 1: DC and Switching Characteristics 1–31

Switching Characteristics

Table 1–29 lists the Stratix IV GX transceiver jitter specifications for all supported

protocols. For protocols supported by Stratix IV GT industrial speed grade devices,

refer to the Stratix IV GX –2 commercial speed grade column in Table 1–29.

Table 1–29. Transceiver Block Jitter Specifications for Stratix IV GX Devices (Note 1), (2) (Part 1 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/

Industrial and

–2× Commercial

Speed Grade

–4 Commercial/

Industrial Speed

Grade Unit

Min Typ Max Min Typ Max Min Typ Max

SONET/SDH Transmit Jitter Generation (3)

Peak-to-peak jitter at 622.08

Mbps Pattern = PRBS15 —— 0.1 — — 0.1 —— 0.1 UI

RMS jitter at 622.08 Mbps Pattern = PRBS15 — — 0.01 — — 0.01 — — 0.01 UI

Peak-to-peak jitter at

2488.32 Mbps Pattern = PRBS15 —— 0.1 — — 0.1 —— 0.1 UI

RMS jitter at 2488.32 Mbps Pattern = PRBS15 — — 0.01 — — 0.01 — — 0.01 UI

SONET/SDH Receiver Jitter Tolerance (3)

Jitter tolerance at

622.08 Mbps

Jitter frequency = 0.03 KHz

Pattern = PRBS15 > 15 > 15 > 15 UI

Jitter frequency = 25 KHZ

Pattern = PRBS15 > 1.5 > 1.5 > 1.5 UI

Jitter frequency = 250 KHz

Pattern = PRBS15 > 0.15 > 0.15 > 0.15 UI

Jitter tolerance at

2488.32 Mbps

Jitter frequency = 0.06 KHz

Pattern = PRBS15 > 15 > 15 > 15 UI

Jitter frequency = 100 KHZ

Pattern = PRBS15 > 1.5 > 1.5 > 1.5 UI

Jitter frequency = 1 MHz

Pattern = PRBS15 > 0.15 > 0.15 > 0.15 UI

Jitter frequency = 10 MHz

Pattern = PRBS15 > 0.15 > 0.15 > 0.15 UI

Fibre Channel Transmit Jitter Generation (4), (12)

Total jitter FC-1 Pattern = CRPAT — — 0.23 — — 0.23 — — 0.23 UI

Deterministic jitter FC-1 Pattern = CRPAT — — 0.11 — — 0.11 — — 0.11 UI

Total jitter FC-2 Pattern = CRPAT — — 0.33 — — 0.33 — — 0.33 UI

Deterministic jitter FC-2 Pattern = CRPAT —— 0.2 — — 0.2 —— 0.2 UI

Total jitter FC-4 Pattern = CRPAT — — 0.52 — — 0.52 — — 0.52 UI

Deterministic jitter FC-4 Pattern = CRPAT — — 0.33 — — 0.33 — — 0.33 UI

Fibre Channel Receiver Jitter Tolerance (4), (13)

Deterministic jitter FC-1 Pattern = CJTPAT > 0.37 > 0.37 > 0.37 UI

Random jitter FC-1 Pattern = CJTPAT > 0.31 > 0.31 > 0.31 UI

Sinusoidal jitter FC-1 Fc/25000 > 1.5 > 1.5 > 1.5 UI

Fc/1667 > 0.1 > 0.1 > 0.1 UI

Chapter 1: DC and Switching Characteristics 1–32

Switching Characteristics

Deterministic jitter FC-2 Pattern = CJTPAT > 0.33 > 0.33 > 0.33 UI

Random jitter FC-2 Pattern = CJTPAT > 0.29 > 0.29 > 0.29 UI

Sinusoidal jitter FC-2 Fc/25000 > 1.5 > 1.5 > 1.5 UI

Fc/1667 > 0.1 > 0.1 > 0.1 UI

Deterministic jitter FC-4 Pattern = CJTPAT > 0.33 > 0.33 > 0.33 UI

Random jitter FC-4 Pattern = CJTPAT > 0.29 > 0.29 > 0.29 UI

Sinusoidal jitter FC-4 Fc/25000 > 1.5 > 1.5 > 1.5 UI

Fc/1667 > 0.1 > 0.1 > 0.1 UI

XAUI Transmit Jitter Generation (5)

Total jitter at 3.125 Gbps Pattern = CJPAT —— 0.3 —— 0.3 —— 0.3 UI

Deterministic jitter at

3.125 Gbps Pattern = CJPAT — — 0.17 — — 0.17 — — 0.17 UI

XAUI Receiver Jitter Tolerance (5)

Total jitter — > 0.65 > 0.65 > 0.65 UI

Deterministic jitter — > 0.37 > 0.37 > 0.37 UI

Peak-to-peak jitter Jitter frequency = 22.1 KHz > 8.5 > 8.5 > 8.5 UI

Peak-to-peak jitter Jitter frequency = 1.875 MHz > 0.1 > 0.1 > 0.1 UI

Peak-to-peak jitter Jitter frequency = 20 MHz > 0.1 > 0.1 > 0.1 UI

PCI Express Transmit Jitter Generation (6)

Total jitter at 2.5 Gbps

(Gen1)—×1, ×4, and ×8 Compliance pattern — — 0.25 — — 0.25 — — 0.25 UI

Total jitter at 5 Gbps

(Gen2)—×1, ×4, and ×8 (14) Compliance pattern — — 0.25 — — 0.25 — — — UI

PCI Express Receiver Jitter Tolerance (6)

Total jitter at 2.5 Gbps

(Gen1) Compliance pattern > 0.6 > 0.6 — UI

Total jitter at 5 Gbps (Gen2) Compliance pattern Compliant Compliant Compliant UI

PCI Express (Gen 1) Electrical Idle Detect Threshold

VRX-IDLE-DETDIFFp-p (15) Compliance pattern 65 — 175 65 — 175 65 — 175 UI

Serial RapidIO Transmit Jitter Generation (7)

Deterministic jitter

(peak-to-peak)

Data Rate = 1.25, 2.5,

3.125 Gbps

Pattern = CJPAT

— — 0.17 — — 0.17 — — 0.17 UI

Total jitter (peak-to-peak)

Data Rate = 1.25, 2.5,

3.125 Gbps

Pattern = CJPAT

— — 0.35 — — 0.35 — — 0.35 UI

Table 1–29. Transceiver Block Jitter Specifications for Stratix IV GX Devices (Note 1), (2) (Part 2 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/

Industrial and

–2× Commercial

Speed Grade

–4 Commercial/

Industrial Speed

Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–33

Switching Characteristics

Serial RapidIO Receiver Jitter Tolerance (7)

Deterministic jitter tolerance

(peak-to-peak)

Data Rate = 1.25, 2.5,

3.125 Gbps

Pattern = CJPAT

> 0.37 > 0.37 > 0.37 UI

Combined deterministic and

random jitter tolerance

(peak-to-peak)

Data Rate = 1.25, 2.5,

3.125 Gbps

Pattern = CJPAT

> 0.55 > 0.55 > 0.55 UI

Sinusoidal jitter tolerance

(peak-to-peak)

Jitter Frequency = 22.1 KHz

Data Rate = 1.25, 2.5,

3.125 Gbps

Pattern = CJPAT

> 8.5 > 8.5 > 8.5 UI

Jitter Frequency = 1.875 MHz

Data Rate = 1.25, 2.5,

3.125 Gbps

Pattern = CJPAT

> 0.1 > 0.1 > 0.1 UI

Jitter Frequency = 20 MHz

Data Rate = 1.25, 2.5,

3.125 Gbps

Pattern = CJPAT

> 0.1 > 0.1 > 0.1 UI

GIGE Transmit Jitter Generation (8)

Deterministic jitter

(peak-to-peak) Pattern = CRPAT — — 0.14 — — 0.14 — — 0.14 UI

Total jitter (peak-to-peak) Pattern = CRPAT — — 0.279 — — 0.279 — — 0.279 UI

GIGE Receiver Jitter Tolerance (8)

Deterministic jitter tolerance

(peak-to-peak) Pattern = CJPAT > 0.4 > 0.4 > 0.4 UI

Combined deterministic and

random jitter tolerance

(peak-to-peak)

Pattern = CJPAT > 0.66 > 0.66 > 0.66 UI

HiGig Transmit Jitter Generation (9)

Deterministic jitter

(peak-to-peak)

Data Rate = 3.75 Gbps

Pattern = CJPAT ——0.17 —— — —— — UI

Total jitter (peak-to-peak) Data Rate = 3.75 Gbps

Pattern = CJPAT ——0.35 —— — —— — UI

HiGig Receiver Jitter Tolerance (9)

Deterministic jitter tolerance

(peak-to-peak)

Data Rate = 3.75 Gbps

Pattern = CJPAT > 0.37 — — — — — — UI

Table 1–29. Transceiver Block Jitter Specifications for Stratix IV GX Devices (Note 1), (2) (Part 3 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/

Industrial and

–2× Commercial

Speed Grade

–4 Commercial/

Industrial Speed

Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–34

Switching Characteristics

Combined deterministic and

random jitter tolerance

(peak-to-peak)

Data Rate = 3.75 Gbps

Pattern = CJPAT > 0.65 — — — — — — UI

Sinusoidal jitter tolerance

(peak-to-peak)

Jitter Frequency = 22.1 KHz

Data Rate = 3.75 Gbps

Pattern = CJPAT

> 8.5 — — — — — — UI

Jitter Frequency = 1.875MHz

Data Rate = 3.75 Gbps

Pattern = CJPAT

> 0.1 — — — — — — UI

Jitter Frequency = 20 MHz

Data Rate = 3.75 Gbps

Pattern = CJPAT

> 0.1 — — — — — — UI

(OIF) CEI Transmitter Jitter Generation (10)

Total jitter (peak-to-peak) Data Rate = 6.375 Gbps

Pattern = PRBS15 BER = 10-12 —— 0.3 —— N/A —— N/A UI

(OIF) CEI Receiver Jitter Tolerance (10)

Deterministic jitter tolerance

(peak-to-peak)

Data Rate = 6.375 Gbps

Pattern = PRBS31 BER = 10-12 > 0.675 N/A — — N/A — — UI

Combined deterministic and

random jitter tolerance

(peak-to-peak)

Data Rate = 6.375 Gbps

Pattern=PRBS31

BER = 10-12

> 0.988 N/A — — N/A — — UI

Sinusoidal jitter tolerance

(peak-to-peak)

Jitter Frequency = 38.2 KHz

Data Rate = 6.375 Gbps

Pattern = PRBS31 BER = 10-12

> 5 N/A — — N/A — — UI

Jitter Frequency = 3.82 MHz

Data Rate = 6.375 Gbps

Pattern = PRBS31 BER = 10-12

> 0.05 N/A — — N/A — — UI

Jitter Frequency = 20 MHz

Data Rate= 6.375 Gbps

Pattern = PRBS31 BER = 10-12

> 0.05 N/A — — N/A — — UI

Table 1–29. Transceiver Block Jitter Specifications for Stratix IV GX Devices (Note 1), (2) (Part 4 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/

Industrial and

–2× Commercial

Speed Grade

–4 Commercial/

Industrial Speed

Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–35

Switching Characteristics

SDI Transmitter Jitter Generation (11)

Alignment jitter

(peak-to-peak)

Data Rate = 1.485 Gbps (HD)

Pattern = Color Bar

Low-Frequency Roll-Off =

100 KHz

0.2 — — 0.2 — — 0.2 — — UI

Data Rate = 2.97 Gbps (3G)

Pattern = Color Bar

Low-Frequency Roll-Off =

100 KHz

0.3 — — 0.3 — — 0.3 — — UI

SDI Receiver Jitter Tolerance (11)

Sinusoidal jitter tolerance

(peak-to-peak)

Jitter Frequency = 15 KHz

Data Rate = 2.97 Gbps (3G)

Pattern = Single Line

Scramble Color Bar

> 2 > 2 > 2 UI

Jitter Frequency = 100 KHz

Data Rate = 2.97 Gbps (3G)

Pattern = Single Line

Scramble Color Bar

> 0.3 > 0.3 > 0.3 UI

Jitter Frequency = 148.5 MHz

Data Rate = 2.97 Gbps (3G)

Pattern = Single Line

Scramble Color Bar

> 0.3 > 0.3 > 0.3 UI

Sinusoidal jitter tolerance

(peak-to-peak)

Jitter Frequency = 20 KHz

Data Rate = 1.485 Gbps (HD)

Pattern = 75% Color Bar

> 1 > 1 > 1 UI

Jitter Frequency = 100 KHz

Data Rate = 1.485 Gbps (HD)

Pattern = 75% Color Bar

> 0.2 > 0.2 > 0.2 UI

Jitter Frequency = 148.5 MHz

Data Rate = 1.485 Gbps (HD)

Pattern = 75% Color Bar

> 0.2 > 0.2 > 0.2 UI

SAS Transmit Jitter Generation (16)

To tal j it ter at 1.5 G bps (G1) Pattern = CJPAT — — 0.55 — — 0.55 — — 0.55 UI

Dete rminis tic j itt e r at

1. 5 Gbps (G1) Pattern = CJPAT — — 0.35 — — 0.35 — — 0.35 UI

To tal j it ter at 3.0 G bps (G2) Pattern = CJPAT — — 0.55 — — 0.55 — — 0.55 UI

Dete rminis tic j itt e r at

3. 0 Gbps (G2) Pattern = CJPAT — — 0.35 — — 0.35 — — 0.35 UI

SAS Receiver Jitter Tolerance (16)

Tot al Jit ter tolerance at

1. 5 Gbps (G1) Pattern = CJPAT > 0.65 > 0.65 > 0.65 UI

Table 1–29. Transceiver Block Jitter Specifications for Stratix IV GX Devices (Note 1), (2) (Part 5 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/

Industrial and

–2× Commercial

Speed Grade

–4 Commercial/

Industrial Speed

Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–36

Switching Characteristics

Deterministic Jitter tolerance

at 1. 5 Gbps (G 1) Pattern = CJPAT > 0.35 > 0.35 > 0.35 UI

Sinusoidal Jit ter tolerance at

1. 5 Gbps (G1) Jitter Frequency = 900 KHz -

5MHz

Pattern = CJTPAT BER = 1E-12

> 0.1 > 0.1 > 0.1 UI

CPRI Transmit Jitter Generation (17)

Total Jitter

E.6.HV, E.12.HV

Pattern = CJPAT — — 0.279 — — 0.279 — — 0.279 UI

E.6.LV, E.12.LV, E.24.LV,

E.30.LV

Pattern = CJTPAT

— — 0.35 — — 0.35 — — 0.35 UI

Deterministic Jitter

E.6.HV, E.12.HV

Pattern = CJPAT — — 0.14 — — 0.14 — — 0.14 UI

E.6.LV, E.12.LV, E.24.LV,

E.30.LV

Pattern = CJTPAT

— — 0.17 — — 0.17 — — 0.17 UI

CPRI Receiver Jitter Tolerance (17)

Tot al ji tter t olerance E.6.HV, E.12.HV

Pattern = CJPAT > 0.66 > 0.66 > 0.66 UI

Determinis tic jitte r t olera n c e E.6.HV, E.12.HV

Pattern = CJPAT > 0.4 > 0.4 > 0.4 UI

Tot al ji tter t olerance E.6.LV, E.12.LV, E.24.LV,

E.30.LV

Pattern = CJTPAT

> 0.65 > 0.65 > 0.65 UI

Determinis tic jitte r t olera n c e E.6.LV, E.12.LV, E.24.LV,

E.30.LV

Pattern = CJTPAT

> 0.37 > 0.37 > 0.37 UI

C omb ined determini stic and

random ji tter t oleranc e E.6.LV, E.12.LV, E.24.LV,

E.30.LV

Pattern = CJTPAT

> 0.55 > 0.55 > 0.55 UI

OBSAI Transmit Jitter Generation (18)

To tal j it ter at 768 Mbps,

1536 Mbps, and 3072 Mbps REFCLK = 153.6MHz

Pattern = CJPAT — — 0.35 — — 0.35 — — 0.35 UI

Dete rminis tic j itt e r at

768 Mbps, 1536 Mbps, and

3072 Mbps

REFCLK = 153.6MHz

Pattern = CJPAT — — 0.17 — — 0.17 — — 0.17 UI

Table 1–29. Transceiver Block Jitter Specifications for Stratix IV GX Devices (Note 1), (2) (Part 6 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/

Industrial and

–2× Commercial

Speed Grade

–4 Commercial/

Industrial Speed

Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–37

Switching Characteristics

OBSAI Receiver Jitter Tolerance (18)

Determinis tic jitte r t olera n c e

at 768 Mbps, 1536 Mbps, and

3072 Mbps Pattern = CJPAT > 0.37 > 0.37 > 0.37 UI

C omb ined determini stic and

random ji tter t oleranc e at

768 Mbps, 1536 Mbps, and

3072 Mbps

Pattern = CJPAT > 0.55 > 0.55 > 0.55 UI

Sinusoidal Jitter tolerance at

768 Mbps

Jitter Frequency = 5.4 KHz

Pattern = CJPAT > 8.5 > 8.5 > 8.5 UI

Jitter Frequency = 460 MHz -

20 MHz

Pattern = CJPAT

> 0.1 > 0.1 > 0.1 UI

Sinusoidal Jitter tolerance at

1536 Mbps

Jitter Frequency = 10.9 KHz

Pattern = CJPAT > 8.5 > 8.5 > 8.5 UI

Jitter Frequency = 921.6 MHz

- 20 MHz

Pattern = CJPAT

> 0.1 > 0.1 > 0.1 UI

Sinusoidal Jitter tolerance at

3072 Mbps

Jitter Frequency = 21.8 KHz

Pattern = CJPAT > 8.5 > 8.5 > 8.5 UI

Jitter Frequency =

1843.2 MHz - 20 MHz

Pattern = CJPAT

> 0.1 > 0.1 > 0.1 UI

Notes to Ta bl e 1– 29 :

(1) Dedicated refclk pins were used to drive the input reference clocks.

(2) The Jitter numbers are valid for the stated conditions only.

(3) The jitter numbers for SONET/SDH are compliant to the GR-253-CORE Issue 3 Specification.

(4) The jitter numbers for Fibre Channel are compliant to the FC-PI-4 Specification revision 6.10.

(5) The jitter numbers for XAUI are compliant to the IEEE802.3ae-2002 Specification.

(6) The jitter numbers for PCI Express are compliant to the PCIe Base Specification 2.0.

(7) The jitter numbers for Serial RapidIO are compliant to the RapidIO Specification 1.3.

(8) The jitter numbers for GIGE are compliant to the IEEE802.3-2002 Specification.

(9) The jitter numbers for HiGig are compliant to the IEEE802.3ae-2002 Specification.

(10) The jitter numbers for (OIF) CEI are compliant to the OIF-CEI-02.0 Specification.

(11) The HD-SDI and 3G-SDI jitter numbers are compliant to the SMPTE292M and SMPTE424M Specifications.

(12) The fibre channel transmitter jitter generation numbers are compliant to the specification at δT interoperability point.

(13) The fibre channel receiver jitter tolerance numbers are compliant to the specification at δR interoperability point.

(14) You must use the ATX PLL adjacent to the transceiver channels to meet the transmitter jitter generation compliance in PCI Express Gen2 ×8 modes.

(15) Stratix IV PCI Express receivers are compliant to this specification provided the VTX-CM-DC-ACTIVEIDLE-DELTA of the upstream transmitter is less than

50mV.

(16) The jitter numbers for Serial Attached SCSI (SAS) are compliant to the SAS-2.1 Specification.

(17) The jitter numbers for CPRI are compliant to the CPRI Specification V3.0.

(18) The jitter numbers for OBSAI are compliant to the OBSAI RP3 Specification V4.1.

Table 1–29. Transceiver Block Jitter Specifications for Stratix IV GX Devices (Note 1), (2) (Part 7 of 7)

Symbol/

Description Conditions

–2 Commercial

Speed Grade

–3 Commercial/

Industrial and

–2× Commercial

Speed Grade

–4 Commercial/

Industrial Speed

Grade Unit

Min Typ Max Min Typ Max Min Typ Max

Chapter 1: DC and Switching Characteristics 1–38

Switching Characteristics

Table 1–30 lists transceiver jitter specifications for protocols supported by

Stratix IV GT devices.

Transceiver Datapath PCS Latency

fFor more information about:

■Basic mode PCS latency, refer to Figure 1-90 through Figure 1-97 in the Stratix IV

Transceiver Architecture chapter.

■PCI Express (PIPE) mode PCS latency, refer to Figure 1-102 in the Stratix IV

Transceiver Architecture chapter.

■XAUI mode PCS latency, refer to Figure 1-119 in the Stratix IV Transceiver

Architecture chapter.

■GIGE mode PCS latency, refer to Figure 1-128 in the Stratix IV Transceiver

Architecture chapter.

■SONET/SDH mode PCS latency, refer to Figure 1-136 in the Stratix IV Transceiver

Architecture chapter.

■SDI mode PCS latency, refer to Figure 1-141 in the Stratix IV Transceiver Architecture

chapter.

■(OIF) CEI PHY mode PCS latency, refer to Figure 1-143 in the Stratix IV Transceiver

Architecture chapter.

Table 1–30. Transceiver Jitter Specifications for Protocols by Stratix IV GT Devices

Symbol/

Description Conditions

-1 Industrial Speed Grad -2 Industrial Speed Grade -3 Industrial Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

XLAUI/CAUI Transmit Jitter Generation (1)

Total Jitter Pattern = PRBS-

31 — — 0.32 — — 0.32 — — 0.32 UI

Deterministic

Jitter

Pattern = PRBS-

31 — — 0.17 — — 0.17 — — 0.17 UI

XLAUI/CAUI Receiver Jitter Tolerance (1)

Sinusoidal Jitter

tolerance

Jitter Frequency

= 40 KHz

Pattern = PRBS-

31 BER = 1E-12

> 5 > 5 — UI

Jitter Frequency

= 4 MHz

Pattern = PRBS-

BER = 1E-12

> 0.05 > 0.05 — UI

Note to Tab l e 1–30:

(1) The jitter numbers for XLAUI/CAUI are compliant to the IEEE P802.3ba specification.

Chapter 1: DC and Switching Characteristics 1–39

Switching Characteristics

Core Performance Specifications

This section describes the clock tree, phase-locked loop (PLL), digital signal

processing (DSP), TriMatrix, configuration, and JTAG specifications.

Clock Tree Specifications

Table 1–31 lists the clock tree specifications for Stratix IV devices.

1For the Stratix IV GT –1 and –2 speed grade specifications, refer to the –2/–2× speed

grade column. For the Stratix IV GT –3 speed grade specifcation, refer to the –3 speed

grade column.

PLL Specifications

Table 1–32 describes the Stratix IV PLL specifications when operating in both the

commercial junction temperature range (0° to 85°C) and the industrial junction

temperature range (-40° to 100°C).

Table 1–31. Clock Tree Performance for Stratix IV Devices—Preliminary

Performance Unit

Symbol –2/–2× Speed Grade –3 Speed Grade –4 Speed Grade

GCLK and RCLK 800 700 500 MHz

PCLK 550 500 450 MHz

Table 1–32. PLL Specifications for Stratix IV Devices (Part 1 of 3)—Preliminary

Symbol Parameter Min Typ Max Unit

fIN

Input clock frequency (–2/–2x speed grade) 5 — 800 (1) MHz

Input clock frequency (–3 speed grade) 5 — 717 (1) MHz

Input clock frequency (–4 speed grade) 5 — 717 (1) MHz

fINPFD Input frequency to the PFD 5— 325 MHz

fVCO

PLL VCO operating range (–2 speed grade) 600 — 1600 MHz

PLL VCO operating range (–3 speed grade) 600 — 1300 MHz

PLL VCO operating range (–4 speed grade) 600 — 1300 MHz

tEINDUTY Input clock or external feedback clock input duty cycle 40 — 60 %

fOUT

Output frequency for internal global or regional clock

(–2/–2x speed grade) ——800 (2) MHz

Output frequency for internal global or regional clock

(–3 speed grade) ——717 (2) MHz

Output frequency for internal global or regional clock

(–4 speed grade) ——717 (2) MHz

fOUT_EXT

Output frequency for external clock output (–2 speed grade) ——800 (2) MHz

Output frequency for external clock output (–3 speed grade) ——717 (2) MHz

Output frequency for external clock output (–4 speed grade) ——717 (2) MHz

tOUTDUTY Duty cycle for external clock output (when set to 50%) 45 50 55 %

tFCOMP External feedback clock compensation time — — 10 ns

tCONFIGPLL Time required to reconfigure scan chain —3.5 — scanclk

cycles

1–40 Chapter 1: DC and Switching Characteristics

Switching Characteristics

Stratix IV Device Handbook Volume 4 © February 2010 Altera Corporation

tCONFIGPHASE Time required to reconfigure phase shift —1 — scanclk

cycles

fSCANCLK scanclk frequency —— 100 MHz

tLOCK

Time required to lock from end-of-device configuration or

de-assertion of areset —— 1 ms

tDLOCK

Time required to lock dynamically (after switchover or

reconfiguring any non-post-scale counters/delays) —— 1 ms

fCLBW

PLL closed-loop low bandwidth —0.3 — MHz

PLL closed-loop medium bandwidth —1.5 — MHz

PLL closed-loop high bandwidth (6) —4 — MHz

tPLL_PSERR Accuracy of PLL phase shift —— ±50 ps

tARESET Minimum pulse width on the areset signal 10 — — ns

tINCCJ (3) Input clock cycle to cycle jitter (FREF ≥ 100 MHz) — — 0.15 UI (p-p)

Input clock cycle to cycle jitter (FREF < 100 MHz) — — ±750 ps (p-p)

tOUTPJ_DC (4) Period Jitter for dedicated clock output (FOUT ≥ 100 MHz) —— 175 ps (p-p)

Period Jitter for dedicated clock output (FOUT < 100 MHz) — — 17.5 mUI (p-p)

tOUTCCJ_DC (4)

Cycle to Cycle Jitter for dedicated clock output

(FOUT ≥100 MHz) —— 175 ps (p-p)

Cycle to Cycle Jitter for dedicated clock output

(FOUT <100MHz) — — 17.5 mUI (p-p)

tOUTPJ_IO (4),

(7)

Period Jitter for clock output on regular I/O

(FOUT ≥100 MHz) —— 600 ps (p-p)

Period Jitter for clock output on regular I/O

(FOUT <100MHz) — — 60 mUI (p-p)

tOUTCCJ_IO (4),

(7)

Cycle to Cycle Jitter for clock output on regular I/O

(FOUT ≥100 MHz) —— 600 ps (p-p)

Cycle to Cycle Jitter for clock output on regular I/O

(FOUT <100MHz) — — 60 mUI (p-p)

tCASC_OUTPJ_DC

(4), (5)

Period Jitter for dedicated clock output in cascaded PLLs

(FOUT ≥100MHz) —— 250 ps (p-p)

Period Jitter for dedicated clock output in cascaded PLLs

(FOUT < 100MHz) — — 25 mUI (p-p)

Table 1–32. PLL Specifications for Stratix IV Devices (Part 2 of 3)—Preliminary

Symbol Parameter Min Typ Max Unit

Chapter 1: DC and Switching Characteristics 1–41

Switching Characteristics

tCONFIGPHASE Time required to reconfigure phase shift —1 — scanclk

cycles

fSCANCLK scanclk frequency —— 100 MHz

tLOCK

Time required to lock from end-of-device configuration or

de-assertion of areset —— 1 ms

tDLOCK

Time required to lock dynamically (after switchover or

reconfiguring any non-post-scale counters/delays) —— 1 ms

fCLBW

PLL closed-loop low bandwidth —0.3 — MHz

PLL closed-loop medium bandwidth —1.5 — MHz

PLL closed-loop high bandwidth (6) —4 — MHz

tPLL_PSERR Accuracy of PLL phase shift —— ±50 ps

tARESET Minimum pulse width on the areset signal 10 — — ns

tINCCJ (3) Input clock cycle to cycle jitter (FREF ≥ 100 MHz) — — 0.15 UI (p-p)

Input clock cycle to cycle jitter (FREF < 100 MHz) — — ±750 ps (p-p)

tOUTPJ_DC (4) Period Jitter for dedicated clock output (FOUT ≥ 100 MHz) —— 175 ps (p-p)

Period Jitter for dedicated clock output (FOUT < 100 MHz) — — 17.5 mUI (p-p)

tOUTCCJ_DC (4)

Cycle to Cycle Jitter for dedicated clock output

(FOUT ≥100 MHz) —— 175 ps (p-p)

Cycle to Cycle Jitter for dedicated clock output

(FOUT <100MHz) — — 17.5 mUI (p-p)

tOUTPJ_IO (4),

(7)

Period Jitter for clock output on regular I/O

(FOUT ≥100 MHz) —— 600 ps (p-p)

Period Jitter for clock output on regular I/O

(FOUT <100MHz) — — 60 mUI (p-p)

tOUTCCJ_IO (4),

(7)

Cycle to Cycle Jitter for clock output on regular I/O

(FOUT ≥100 MHz) —— 600 ps (p-p)

Cycle to Cycle Jitter for clock output on regular I/O

(FOUT <100MHz) — — 60 mUI (p-p)

tCASC_OUTPJ_DC

(4), (5)

Period Jitter for dedicated clock output in cascaded PLLs

(FOUT ≥100MHz) —— 250 ps (p-p)

Period Jitter for dedicated clock output in cascaded PLLs

(FOUT < 100MHz) — — 25 mUI (p-p)

Table 1–32. PLL Specifications for Stratix IV Devices (Part 2 of 3)—Preliminary

Symbol Parameter Min Typ Max Unit

1–42 Chapter 1: DC and Switching Characteristics

Switching Characteristics

Stratix IV Device Handbook Volume 4 © February 2010 Altera Corporation

DSP Block Specifications

Table 1–33 shows the Stratix IV DSP block performance specifications.

fDRIFT

Frequency drift after PFDENA is disabled for duration of

100 us —— ±10 %

Notes to Ta bl e 1– 32 :

(1) This specification is limited in the Quartus II software by the I/O maximum frequency. The maximum I/O frequency is different for each I/O

standard.

(2) This specification is limited by the lower of the two: I/O FMA X or FOUT of the PLL.

(3) A high input jitter directly affects the PLL output jitter. To have low PLL output clock jitter, you need to provide a clean clock source that is less

than 120 ps.

(4) Peak-to-peak jitter with a probability level of 10–12 (14 sigma, 99.99999999974404 % confidence level). The output jitter specification applies

to the intrinsic jitter of the PLL, when an input jitter of 30 ps is applied. The external memory interface clock output jitter specifications use a

different measurement method and are available in Table 1–47 on page 1–52.

(5) The cascaded PLL specification is only applicable with the following condition:

a. Upstream PLL: 0.59Mhz ≤ Upstream PLL BW < 1 MHz

b. Downstream PLL: Downstream PLL BW > 2 MHz

(6) High bandwidth PLL settings are not supported in external feedback mode.

(7) External memory interface clock output jitter specifications use a different measurement method, which is available in Table 1–45 on

page 1–52.

Table 1–32. PLL Specifications for Stratix IV Devices (Part 3 of 3)—Preliminary

Symbol Parameter Min Typ Max Unit

Table 1–33. Block Performance Specifications for Stratix IV DSP Devices (Note 1)—Preliminary

Mode

Resources

Used Performance

Unit

Number of

Multipliers

–2/–2×

Speed Grade

–3

Speed Grade

–4

Speed Grade

9×9-bit multiplier 1 520 460 400 MHz

12×12-bit multiplier 1 540 500 440 MHz

18×18-bit multiplier 1 600 550 480 MHz

36×36-bit multiplier 1 480 440 380 MHz

18×18-bit multiply accumulator 4 490 440 380 MHz

18×18-bit multiply adder 4 510 470 410 MHz

18×18-bit multiply adder-signed full precision 2 490 450 390 MHz

18×18-bit multiply adder with loopback (2) 2 390 350 310 MHz

36-bit shift (32-bit data) 1 490 440 380 MHz

Double mode 1 480 440 380 MHz

Notes to Ta bl e 1– 33 :

(1) Maximum is for fully pipelined block with Round and Saturation disabled.

(2) Maximum for loopback input registers disabled, Round and Saturation disabled, and pipeline and output registers enabled.

Chapter 1: DC and Switching Characteristics 1–43

Switching Characteristics

TriMatrix Memory Block Specifications

Table 1–34 lists the Stratix IV TriMatrix memory block specifications.

Table 1–34. TriMatrix Memory Block Performance Specifications for Stratix IV Devices—Preliminary (Note 1) (Part 1 of 2)

Memory Mode

Resources Used Performance

ALUTs TriMatrix

Memory

–2 /–2×

Commercial/

Industrial

Speed Grade

(MHz)

–3

Commercial/

Industrial

Speed Grade

(MHz)

–4

Commercial/

Industrial

Speed Grade

(MHz)

–3

Industrial

Speed Grade

(MHz) (2)

–4

Industrial

Speed Grade

(MHz) (2)

MLAB

(3)

Single port 64×10 0 1 600 500 450 500 450

Simple dual-port

32×20 0 1 600 500 450 500 450

Simple dual-port

64×10 0 1 600 500 450 500 450

ROM 64×10 0 1 600 500 450 500 450

ROM 32×20 0 1 600 500 450 500 450

M9K

Block (3)

Single-port 256×36 0 1 600 540 475 540 475

Simple dual-port

256×36 0 1 550 490 420 490 420

Simple dual-port

256×36, with the

read-during-write

option set to Old Data

0 1 375 340 300 340 300

True dual port 512×18 0 1 490 430 370 430 370

True dual-port 512×18,

with the read-during-

write option set to Old

Data

0 1 375 335 290 335 290

ROM 1 Port 0 1 600 540 475 540 475

ROM 2 Port 0 1 600 540 475 540 475

Min Pulse Width (clock

high time) — — 750 800 850 800 850

Min Pulse Width (clock

low time) — — 500 625 690 625 690

1–44 Chapter 1: DC and Switching Characteristics

Switching Characteristics

1For the Stratix IV GT –1 and –2 speed grade specifications, refer to the –2/–2× speed

grade column. For the Stratix IV GT –3 speed grade specifcation, refer to the –3 speed

grade column.

Configuration and JTAG Specifications

Table 1–35 lists the Stratix IV configuration mode specifications.

M144K

(3)

Single-port 2K×72 0 1 475 440 380 400 350

Simple dual-port

2K×72 0 1 465 435 385 375 325

Simple dual-port

2K×72, with the

read-during-write

option set to Old Data

0 1 260 240 205 225 200

Simple dual-port

2K×64 (with ECC) 0 1 335 300 255 295 250

True dual-port 4K×36 0 1 400 375 330 350 310

True dual-port 4K×36,

with the read-during-

write option set to Old

Data

0 1 245 230 205 225 200

ROM 1 Port 0 1 540 500 435 450 420

ROM 2 Port 0 1 500 465 400 425 400

Min Pulse Width (clock

high time) — — 700 755 860 860 950

Min Pulse Width (clock

low time) — — 500 625 690 690 690

Notes to Ta bl e 1– 34 :

(1) To achieve the maximum memory block performance, use a memory block clock that comes through global clock routing from an on-chip PLL

set to 50% output duty cycle. Use the Quartus II software to report timing for this and other memory block clocking schemes.

(2) This is only applicable to the Stratix IV E and GX devices.

(3) When you use the error detection CRC feature, there is no degradation in FMA X.

Table 1–34. TriMatrix Memory Block Performance Specifications for Stratix IV Devices—Preliminary (Note 1) (Part 2 of 2)

Memory Mode

Resources Used Performance

ALUTs TriMatrix

Memory

–2 /–2×

Commercial/

Industrial

Speed Grade

(MHz)

–3

Commercial/

Industrial

Speed Grade

(MHz)

–4

Commercial/

Industrial

Speed Grade

(MHz)

–3

Industrial

Speed Grade

(MHz) (2)

–4

Industrial

Speed Grade

(MHz) (2)

Table 1–35. Configuration Mode Specifications for Stratix IV Devices—Preliminary

Programming Mode DCLK FMAX Unit

Passive serial 125 MHz

Fast passive parallel 125 MHz

Fast active serial 40 MHz

Remote update only in fast AS mode 10 MHz

Chapter 1: DC and Switching Characteristics 1–45

Switching Characteristics

Table 1–36 shows the JTAG timing parameters and values for Stratix IV devices.

Temperature Sensing Diode Specifications

Table 1–37 lists the specifications for the Stratix IV temperature sensing diode.

Periphery Performance

This section describes periphery performance, including high-speed I/O and external

memory interface.

I/O performance supports several system interfaces, such as the LVDS high-speed

I/O interface, external memory interface, and the PCI/PCI-X bus interface.

General-purpose I/O standards such as 3.3-, 2.5-, 1.8-, and 1.5-LVTTL/LVCMOS are

capable of typical 167 MHz and 1.2 LVCMOS at 100 MHz interfacing frequency with

10 pF load.

1Actual achievable frequency depends on design- and system-specific factors. You

need to perform HSPICE/IBIS simulations based on your specific design and system

setup to determine the maximum achievable frequency in your system.

Table 1–36. JTAG Timing Parameters and Values for Stratix IV Devices —Preliminary

Symbol Description Min Max Unit

tJCP TCK clock period 30 — ns

tJCH TCK clock high time 14 — ns

tJCL TCK clock low time 14 — ns

tJPSU (TDI) TDI JTAG port setup time 1—ns

tJPSU (TMS) TMS JTAG port setup time 3—ns

tJPH JTAG port hold time 5—ns

tJPCO JTAG port clock to output —11 (1) ns

tJPZX JTAG port high impedance to valid output —14 (1) ns

tJPXZ JTAG port valid output to high impedance —14 (1) ns

Note to Tab l e 1–36:

(1) A 1 ns adder is required for each VCC IO voltage step down from 3.0 V. For example, tJPC O = 12 ns if VCCIO

of the TDO

I/O bank = 2.5 V, or 13 ns if it equals 1.8 V.

Table 1–37. External Temperature Sensing Diode Specifications—Preliminary

Description Min Typ Max Unit

Ibias, diode source current 8 —500μA

Vbias, voltage across diode 0.3 —0.9V

Series resistance — —< 5Ω

Diode ideality factor — —1.030—

1–46 Chapter 1: DC and Switching Characteristics

Switching Characteristics

High-Speed I/O Specification

Table 1–38 shows high-speed I/O timing for Stratix IV devices.

Table 1–38. High-Speed I/O Specifications (Note 1), (2), (10) (Part 1 of 2)—Preliminary

Symbol Conditions –2/–2× Speed Grade –3 Speed Grade –4 Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

fHSCLK_in

(input clock

frequency) True

Differential I/O

Standards

Clock boost factor W = 1 to 40

(3) 5 — 800 5 — 717 5 — 717 MHz

fHSCLK_in (input clock

frequency) Single

Ended I/O

Standards (9)

Clock boost factor W = 1 to 40

(3) 5 — 800 5 — 717 5 — 717 MHz

fHSCLK_in (input clock

frequency) Single

Ended I/O

Standards (9)

Clock boost factor W = 1 to 40

(3) 5 — 520 5 — 420 5 — 420 MHz

fHSCLK_OUT (output

clock frequency) —5—800

(7) 5—

717

(7) 5—717

(7) MHz

Transmitter

True Differential I/O

Standards - fHSDR

(data rate)

SERDES factor J = 3 to 10 (8) (4) —1600(4) —1250(4) — 1250 Mbps

SERDES factor J = 2, Uses DDR

Registers (4) —(4) (4) —(4) (4) —(4) Mbps

SERDES factor J = 1, Uses SDR

Emulated

Differential I/O

Standards with

Three External

Output Resistor

Networks - fHSDR

(data rate) (5) SERDES factor J = 4 to 10

(4) —1250(4) —1152(4) —800Mbps

Emulated

Differential I/O

Standards with One

External Output

Resistor - fHSDR

(data rate)

(4) —311(4) —200(4) —200Mbps

tx Jitter - True

Differential I/O

Standards

Total Jitter for Data Rate,

600 Mbps - 1.6 Gbps — — 160 — — 160 — — 160 ps

Total Jitter for Data Rate,

< 600 Mbps —— 0.1 —— 0.1 —— 0.1 UI

tx Jitter - Emulated

Differential I/O

Standards with Three

External Output

Resistor Network

Total Jitter for Data Rate,

600 Mbps - 1.25 Gbps — — 300 — — 300 — — 325 ps

Total Jitter for Data Rate

< 600 Mbps —— 0.2 —— 0.2 ——0.25 UI

Chapter 1: DC and Switching Characteristics 1–47

Switching Characteristics

tx Jitter - Emulated

Differential I/O

Standards with One

External Output

Resistor Network

— — — 0.125 — — 0.15 — — 0.15 UI

tDUTY

Tx output clock duty cycle for

both True and Emulated

Differential I/O Standards

45 50 55 45 50 55 45 50 55 %

tRISE & tFALL

True Differential I/O Standards — — 160 — — 200 — — 200 ps

Emulated Differential I/O

Standards with Three External

Output Resistor Networks

— — 250 — — 250 — — 300 ps

Emulated Differential I/O

Standards with One External

Output Resistor

— — 460 — — 500 — — 500 ps

TCCS

True Differential I/O Standards — — 100 — — 100 — — 100 ps

Emulated Differential I/o

Standards — — 250 — — 250 — — 250 ps

Receiver

True Differential I/O

Standards - fHSDRDPA

(data rate)

SERDES factor J = 3 to 10 150 — 1600 150 — 1250 150 — 1250 Mbps

fHSDR (data rate) SERDES factor J = 3 to 10 (4) (6) (4) (6) (4) (6) Mbps

DPA Mode

DPA run length — — — 10000 — — 10000 — — 10000 UI

Soft CDR mode

Soft-CDR PPM

tolerance — — — 300 — — 300 — — 300 ±

PPM

Non DPA Mode

Sampling Window — — — 300 — — 300 — — 300 ps

Notes to Ta bl e 1– 38 :

(1) When J = 3 to 10, use the SERDES block.

(2) When J = 1 or 2, bypass the SERDES block.

(3) Clock Boost Factor (W) is the ratio between input data rate to the input clock rate.

(4) The minimum specification depends on the clock source (for example, PLL and clock pin) and the clock routing resource (global, regional, or local) that

you use. The I/O differential buffer and input register do not have a minimum toggle rate.

(5) You must calculate the leftover timing margin in the receiver by performing link timing closure analysis. You must consider the board skew margin,

transmitter channel-to-channel skew, and receiver sampling margin to determine leftover timing margin.

(6) You can estimate the achievable maximum data rate for non-DPA mode by performing link timing closure analysis. You should consider the board skew

margin, transmitter delay margin, and the receiver sampling margin to determine the maximum data rate supported.

(7) This is achieved by using the LVDS and DPA clock network.

(8) If the receiver with DPA enabled and transmitter are using shared PLLs, the minimum data rate is 150 Mbps.

(9) This only applies to DPA and soft-CDR modes.

(10) This only applies to LVDS source synchronous mode.

Table 1–38. High-Speed I/O Specifications (Note 1), (2), (10) (Part 2 of 2)—Preliminary

Symbol Conditions –2/–2× Speed Grade –3 Speed Grade –4 Speed Grade Unit

Min Typ Max Min Typ Max Min Typ Max

1–48 Chapter 1: DC and Switching Characteristics

Switching Characteristics

1For the Stratix IV GT –1 and –2 speed grade specifications, refer to the –2/–2× speed

grade column. For the Stratix IV GT –3 speed grade specifcation, refer to the –3 speed

grade column.

Table 1–39 lists the DPA lock time specifications for Stratix IV ES devices.

Figure 1–4 shows the DPA lock time specifications with DPA PLL calibration enabled.

Table 1–39. DPA Lock Time Specifications—Stratix IV ES Devices Only (Note 1), (2), (3)

Standard Training Pattern

Number of Data

Transitions in one

repetition of

training pattern

Number of

repetitions

per 256

data

transitions

(4)

Condition Maximum

SPI-4 00000000001111111111 2 128

without DPA PLL

calibration 256 data transitions

with DPA PLL

calibration

3x256 data transitions +

2x96 slow clock cycles (5)

Parallel Rapid I/O

00001111 2 128

without DPA PLL

calibration 256 data transitions

with DPA PLL

calibration

3x256 data transitions +

2x96 slow clock cycles (5)

10010000 4 64

without DPA PLL

calibration 256 data transitions

with DPA PLL

calibration

3x256 data transitions +

2x96 slow clock cycles (5)

Miscellaneous

10101010 8 32

without DPA PLL

calibration 256 data transitions

with DPA PLL

calibration

3x256 data transitions +

2x96 slow clock cycles (5)

01010101 8 32

without DPA PLL

calibration 256 data transitions

with DPA PLL

calibration

3x256 data transitions +

2x96 slow clock cycles (5)

Notes to Ta bl e 1– 39 :

(1) The DPA lock time is for one channel.

(2) One data transition is defined as a 0-to-1 or 1-to-0 transition.

(3) The DPA lock time applies to both commercial and industrial grade.

(4) This is the number of repetition for the stated training pattern to achieve 256 data transitions.

(5) Slow clock = Data rate (Mbps)/Deserialization factor.

Figure 1–4. DPA Lock Time Specification with DPA PLL Calibration Enabled

rx_dpa_locked

rx_reset

DPA Lock Time

256 data

transitions 96 slow

clock cycles 256 data

transitions 256 data

transitions

96 slow

clock cycles

Chapter 1: DC and Switching Characteristics 1–49

Switching Characteristics

Table 1–40 lists the DPA lock time specifications for Stratix IV GX adn GT devices.

Figure 1–5 shows the LVDS soft-CDR/DPA sinusoidal jitter tolerance specification for

a data rate equal to or higher than 1.25 Gbps. Table 1–41 lists this information in table

form.

Table 1–40. DPA Lock Time Specifications—Stratix IV GX and GT Devices Only (Note 1), (2), (3)

Standard Training Pattern

Number of Data

Transitions in One

Repetition of the

Training Pattern

Number of Repetitions

per 256 Data Transitions

(4)

Maximum

SPI-4 00000000001111111111 2 128 640 data transitions

Parallel Rapid I/O 00001111 2 128 640 data transitions

10010000 4 64 640 data transitions

Miscellaneous 10101010 8 32 640 data transitions

01010101 8 32 640 data transitions

Notes to Ta bl e 1– 40 :

(1) The DPA lock time is for one channel.

(2) One data transition is defined as a 0-to-1 or 1-to-0 transition.

(3) The DPA lock time stated in the table applies to both commercial and industrial grade.

(4) This is the number of repetitions for the stated training pattern to achieve the 256 data transitions.

Figure 1–5. LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specification for a Data Rate Equal to or Higher Than 1.25 Gbps

LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specification

F1 F2 F3 F4

Jitter Frequency (Hz)

Jitter Amphlitude (UI)

0.1

0.35

8.5

1–50 Chapter 1: DC and Switching Characteristics

Switching Characteristics

Table 1–41 lists the LVDS soft-CDR/DPA sinusoidal jitter tolerance specification for a

data rate equal to or higher than 1.25 Gbps.

Figure 1–6 shows the LVDS soft-CDR/DPA sinusoidal jitter tolerance specification for

a data rate less than 1.25 Gbps.

DLL and DQS Logic Block Specifications

Table 1–42 lists the DLL frequency range specifications for Stratix IV devices.

Table 1–41. LVDS Soft-CDR/DPA Sinusoidal Jitter Mask Values for a Data Rate Equal to or Higher

than 1.25 Gbps

Jitter Frequency (Hz) Sinusoidal Jitter (UI)

F1 10,000 25.000

F2 17,565 25.000

F3 1,493,000 0.350

F4 50,000,000 0.350

Figure 1–6. LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specification for a Data Rate Less than 1.25 Gbps

0.1 UI P-P

data rate/1667 20 MHz Frequency

Sinusoidal Jitter Amplitude

20db/dec

Table 1–42. DLL Frequency Range Specifications for Stratix IV Devices—Preliminary (Part 1 of 2)

Frequency

Mode

Frequency Range (MHz)

Available Phase Shift

DQS Delay

Buffer

Mode (1)

Number

of Delay

Chains

–2/–2× Speed

Grade

–3 Speed

Grade

–4 Speed

Grade

0 90-140 90-130 90-120 22.5°, 45°, 67.5°, 90° Low 16

1 120-180 120-170 120-160 30°, 60°, 90°, 120° Low 12

2 150-220 150-210 150-200 36°, 72°, 108°, 144° Low 10

3 180-280 180-260 180-240 45°, 90°,135°, 180° Low 8

4 240-350 240-320 240-290 30°, 60°, 90°, 120° High 12

5 290-430 290-380 290-360 36°, 72°, 108°, 144° High 10

6 360-540 360-450 360-450 45°, 90°, 135°, 180° High 8

Chapter 1: DC and Switching Characteristics 1–51

Switching Characteristics

1For the Stratix IV GT –1 and –2 speed grade specifications, refer to the –2/–2× speed

grade column. For the Stratix IV GT –3 speed grade specifcation, refer to the –3 speed

grade column.

Table 1–43 describes the DQS phase offset delay per stage for Stratix IV devices.

1For the Stratix IV GT –1 and –2 speed grade specifications, refer to the –2/–2× speed

grade column. For the Stratix IV GT –3 speed grade specifcation, refer to the –3 speed

grade column.

Table 1–44 lists the DQS phase shift error for Stratix IV devices.

1For the Stratix IV GT –1 and –2 speed grade specifications, refer to the –2/–2× speed

grade column. For the Stratix IV GT –3 speed grade specifcation, refer to the –3 speed

grade column.

7 470-700 470-630 470-590 60°, 120°, 180°, 240° High 6

Note to Tab l e 1–42:

(1) Low indicates a 6-bit DQS delay setting; high indicates a 5-bit DQS delay setting.

Table 1–42. DLL Frequency Range Specifications for Stratix IV Devices—Preliminary (Part 2 of 2)

Frequency

Mode

Frequency Range (MHz)

Available Phase Shift

DQS Delay

Buffer

Mode (1)

Number

of Delay

Chains

–2/–2× Speed

Grade

–3 Speed

Grade

–4 Speed

Grade

Table 1–43. DQS Phase Offset Delay Per Setting for Stratix IV Devices (Note 1), (2), (3)

Speed Grade Min Max Unit

–2/–2× 7 13 ps

–3 7 15 ps

–4 7 16 ps

Notes to Ta bl e 1– 43 :

(1) The valid settings for phase offset are -64 to +63 for frequency modes 0 to 3 and -32 to +31 for frequency modes

4 to 6.

(2) The typical value equals the average of the minimum and maximum values.

(3) The delay settings are linear, with a cumulative delay variation of 40 ps for all speed grades. For example, when

using a –2 speed grade and applying a 10 phase offset settings to a 90° phase shift at 400 MHz, the expected

average cumulative delay is [625 ps + (10 × 10.5 ps) ± 20 ps] = 730 ps ± 20 ps.

Table 1–44. DQS Phase Shift Error Specification for DLL-Delayed Clock (tDQS_PSERR) for Stratix IV

Devices (Note 1)

Number of DQS Delay Buffer –2/–2X Speed Grade –3 Speed Grade –4 Speed Grade Unit

1262830ps

2525660ps

3788490ps

4 104 112 120 ps

Note to Tab l e 1–44:

(1) This error specification is the absolute maximum and minimum error. For example, skew on three DQS delay

buffers in a –2/–2x speed grade is ± 78 ps or ± 39 ps.

1–52 Chapter 1: DC and Switching Characteristics

Switching Characteristics

Table 1–45 lists the memory output clock jitter specifcations for Stratix IV devices.

1For the Stratix IV GT –1 and –2 speed grade specifications, refer to the –2/–2× speed

grade column. For the Stratix IV GT –3 speed grade specifcation, refer to the –3 speed

grade column.

OCT Calibration Block Specifications

Table 1–46 lists the OCT calibration block specifications for Stratix IV devices.

Duty Cycle Distortion (DCD) Specifications

Table 1–47 lists the worst-case DCD for Stratix IV devices.

Table 1–45. Memory Output Clock Jitter Specification for Stratix IV Devices (Note 1), (2), (3)

Parameter Clock

Network Symbol

–2/–2X Speed Grade –3 Speed Grade –4 Speed Grade

Unit

Min Max Min Max Min Max

Clock period jitter Regional tJIT(per) -75 75 -85 85 -100 100 ps

Cycle-to-cycle period jitter Regional tJIT(cc) -150 150 -170 170 -190 190 ps

Duty cycle jitter Regional tJIT(duty) -80 80 -90 90 -100 100 ps

Clock period jitter Global tJIT(per) -113 113 -128 128 -150 150 ps

Cycle-to-cycle period jitter Global tJIT(cc) -225 225 -255 255 -285 285 ps

Duty cycle jitter Global tJIT(duty) -120 120 -135 135 -150 150 ps

Notes to Table 1– 45 :

(1) The memory output clock jitter measurements are for 200 consecutive clock cycles, as specified in the JEDEC DDR2/DDR3 SDRAM standard.

(2) The clock jitter specification applies to memory output clock pins generated using differential signal-splitter and DDIO circuits clocked by a PLL

output routed on a regional or global clock network as specified. Altera recommends using regional clock networks whenever possible.

(3) The memory output clock jitter stated in Table 1–45 is applicable when an input jitter of 30 ps is applied.

Table 1–46. OCT Calibration Block Specifications for Stratix IV Devices

Symbol Description Min Typ Max Unit

OCTUSRCLK Clock required by OCT calibration blocks ——20MHz

TOCTCAL

Number of OCTUSRCLK clock cycles required for OCT RS/RT

calibration —1000—Cycles

TOCTSHIFT

Number of OCTUSRCLK clock cycles required for OCT code

to shift out —28—Cycles

TRS_RT

Time required between the dyn_term_ctrl and oe signal

transitions in a bidirectional I/O buffer to dynamically switch

between OCT RS and RT

—2.5— ns

Table 1–47. Worst-Case DCD on Stratix IV I/O Pins

Symbol –2/–2× Speed Grade –3 Speed Grade –4 Speed Grade Unit

Min Max Min Max Min Max

Output Duty Cycle 45 55 45 55 45 55 %

Chapter 1: DC and Switching Characteristics 1–53

I/O Timing

Altera offers two ways to determine I/O timing: the Excel-based I/O Timing and the

Quartus II Timing Analyzer.

Excel-based I/O Timing provides pin timing performance for each device density and

speed grade. The data is typically used prior to designing the FPGA to get an estimate

of the timing budget as part of the link timing analysis. The Quartus II Timing

Analyzer provides a more accurate and precise I/O timing data based on the specifics

of the design after you complete place-and-route.

fThe Excel-based I/O Timing spreadsheet is downloadable from the Stratix IV Devices

Literature webpage.

Programmable IOE Delay

Table 1–48 shows Stratix IV IOE programmable delay settings.

Programmable Output Buffer Delay

Table 1–49 lists the delay chain settings that control the rising and falling edge delays

of the output buffer. The default delay is 0 ps.

Table 1–48. IOE Programmable Delay for Stratix IV Devices

Parameter

(1)

Available

Settings

Min Offset

(2)

Fast Model Slow Model

Industrial Commercial

(3) C2 (3) C3 C4 I3 I4 Unit

D1 15 0 0.462 0.505 0.732 0.795 0.857 0.801 0.864 ps

D2 7 0 0.234 0.232 0.337 0.372 0.407 0.371 0.405 ps

D3 7 0 1.700 1.769 2.695 2.927 3.157 2.948 3.178 ps

D4 15 0 0.508 0.554 0.813 0.882 0.952 0.889 0.959 ps

D5 15 0 0.473 0.500 0.746 0.812 0.875 0.818 0.882 ps

D6 6 0 0.186 0.195 0.294 0.319 0.345 0.321 0.347 ps

Notes to Ta bl e 1– 48 :

(1) You can set this value in the Quartus II software by selecting D1, D2, D3, D4, D5, and D6 in the Assignment Name column.

(2) Minimum offset does not include the intrinsic delay.

(3) For the EP4SGX530 device density, the IOE programmable delays have an additional 5% maximum offset.

Table 1–49. Programmable Output Buffer Delay (Note 1)

Symbol Parameter Typical Unit

DOUTBUF

Rising and/or falling edge

delay

0 (default) ps

50 ps

100 ps

150 ps

Note to Tab l e 1–49:

(1) You can set the programmable output buffer delay in the Quartus II software by setting the Output Buffer Delay

Control assignment to either positive, negative, or both edges, with the specific values stated here (in ps) for the

Output Buffer Delay assignment.

1–54 Chapter 1: DC and Switching Characteristics

Glossary

Table 1–50 shows the glossary for this chapter.

Table 1–50. Glossary Table (Part 1 of 4)

Letter Subject Definitions

A——

B——

C——

DDifferential I/O

Standards

Receiver Input Waveforms

Transmitter Output Waveforms

E——

fHSCLK Left/right PLL input clock frequency.

fHSDR

High-speed I/O block: Maximum/minimum LVDS data transfer rate

(fHSDR = 1/TUI), non-DPA.

fHSDRDPA

High-speed I/O block: Maximum/minimum LVDS data transfer rate

(fHSDRDPA = 1/TUI), DPA.

G——

H——

I——

Single-Ended W aveform

Differential W aveform

Positive Channel (p) = VIH

Negative Channel (n) = VIL

Ground

VID

p − n = 0 V

VCM

Single-Ended W aveform

Differential W aveform

Positive Channel (p) = VOH

Negative Channel (n) = VOL

Ground

VOD

p − n = 0 V

VCM

Chapter 1: DC and Switching Characteristics 1–55

Glossary

J High-speed I/O block: Deserialization factor (width of parallel data bus).

JTAG Timing

Specifications

JTAG Timing Specifications:

K——

L——

M——

N——

O——

PPLL

Specifications

Diagram of PLL Specifications (1)

Note:

(1) Core Clock can only be fed by dedicated clock input pins or PLL outputs.

Q——

RRLReceiver differential input discrete resistor (external to Stratix IV device).

Table 1–50. Glossary Table (Part 2 of 4)

Letter Subject Definitions

TDO

TCK

tJPZX tJPCO

tJPH

tJPXZ

tJCP tJPSU

tJCL

tJCH

TDI

TMS

Core Clo ck

Ex te rnal Feedback

Reconfigurable in User Mode

Key

CLK

PFD

Switchover

VCO

CP LF

CLKOUT Pi ns

GCLK

RCLK

INPFD

VCO

OUT

OUT_EXT

Counters

C0..C9

1–56 Chapter 1: DC and Switching Characteristics

Glossary

SW (sampling

window)

Timing Diagram—the period of time during which the data must be valid in order to capture

it correctly. The setup and hold times determine the ideal strobe position within the sampling

window, as shown:

Single-ended

voltage

referenced I/O

standard

The JEDEC standard for SSTl and HSTL I/O defines both the AC and DC input signal values.

The AC values indicate the voltage levels at which the receiver must meet its timing

specifications. The DC values indicate the voltage levels at which the final logic state of the

receiver is unambiguously defined. After the receiver input has crossed the AC value, the

receiver changes to the new logic state.

The new logic state is then maintained as long as the input stays beyond the AC threshold.

This approach is intended to provide predictable receiver timing in the presence of input

waveform ringing, as shown:

Single-Ended Voltage Referenced I/O Standard

tCHigh-speed receiver/transmitter input and output clock period.

TCCS (channel-

to-channel-skew)

The timing difference between the fastest and slowest output edges, including tCO variation

and clock skew, across channels driven by the same PLL. The clock is included in the TCCS

measurement (refer to the Timing Diagram figure under SW in this table).

tDUTY

High-speed I/O block: Duty cycle on high-speed transmitter output clock.

Timing Unit Interval (TUI)

The timing budget allowed for skew, propagation delays, and data sampling window.

(TUI = 1/(Receiver Input Clock Frequency Multiplication Factor) = tC/w)

tFALL Signal high-to-low transition time (80-20%)

tINCCJ Cycle-to-cycle jitter tolerance on the PLL clock input

tOUTPJ_IO Period jitter on the general purpose I/O driven by a PLL

tOUTPJ_DC Period jitter on the dedicated clock output driven by a PLL

tRISE Signal low-to-high transition time (20-80%)

U——

Table 1–50. Glossary Table (Part 3 of 4)

Letter Subject Definitions

Bit Time

0.5 x TCCS RSKM Sampling Window

(SW) RSKM 0.5 x TCCS

IH(AC)

IH(DC)

REF V

IL(DC)

IL(AC)

CCIO

Chapter 1: DC and Switching Characteristics 1–57

Glossary

VCM(DC) DC Common mode input voltage.

VIC M Input Common mode voltage—The common mode of the differential signal at the receiver.

VID

Input differential voltage swing—The difference in voltage between the positive and

complementary conductors of a differential transmission at the receiver.

VDIF(AC) AC differential input voltage—Minimum AC input differential voltage required for switching.

VDIF(DC) DC differential input voltage— Minimum DC input differential voltage required for switching.

VIH

Voltage input high—The minimum positive voltage applied to the input which is accepted by

the device as a logic high.

VIH ( AC ) High-level AC input voltage

VIH( D C) High-level DC input voltage

VIL

Voltage input low—The maximum positive voltage applied to the input which is accepted by

the device as a logic low.

VIL(AC) Low-level AC input voltage

VIL( D C) Low-level DC input voltage

VOCM

Output Common mode voltage—The common mode of the differential signal at the

transmitter.

VOD

Output differential voltage swing—The difference in voltage between the positive and

complementary conductors of a differential transmission at the transmitter.

VSWING Differential input voltage

VXInput differential cross point voltage

VOX Output differential cross point voltage

WW High-speed I/O block: Clock Boost Factor

X——

Y——

Z——

Table 1–50. Glossary Table (Part 4 of 4)

Letter Subject Definitions

1–58 Chapter 1: DC and Switching Characteristics

Document Revision History

Table 1–51 shows the revision history for this chapter.

Table 1–51. Document Revision History

Date Document Version Changes Made

February 2010 4.1

■Updated Ta ble 1–11, Ta ble 1– 22, Table 1–23, Table 1–24, Table 1–25,

Table 1–26, Table 1–27, Table 1–29, Table 1–31, Table 1–32, Table 1–33,

Table 1–34, Ta ble 1– 38, Table 1–39, Table 1–42, Table 1–45, and

Table 1–48.

■Added Stratix IV GT speed grade note to Ta ble 1– 31 , Table 1–34,

Table 1–38, Ta ble 1– 42, Table 1–43, Table 1–44, and Table 1–45.

■Added Table 1–28 and Table 1–30.

■Minor text edits.

November 2009 4.0

■Added Table 1–9, Table 1–15, Table 1–38, and Table 1–39.

■Added Figure 1–5 and Figure 1–6.

■Added the “Transceiver Datapath PCS Latency” section.

■Updated the “Electrical Characteristics”, “Operating Conditions”, and

“I/O Timing” sections.

■All tables updated except Table 1–16, Table 1–24, Table 1–25,

Table 1–26, Table 1–27, Table 1–33, Table 1–34, and Table 1–45.

■Updated Figure 1–2 and Figure 1–3.

■Updated Equation 1–1.

■Deleted Table 1-28, Table 1-29, Table 1-30, Table 1-42, Table 1-43, and

Table 1-44.

■Minor text edits.

June 2009 3.1

■Added “Preliminary Specifications” to the footer of each page.

■Updated Table 1–1, Table 1–2, Table 1–7, Table 1–10, Table 1–11,

Table 1–12, Table 1–21, Table 1–22, Table 1–23, Table 1–25, Table 1–37,

Table 1–38, Table 1–39, Table 1–40, and Table 1–44.

■Minor text edits.

March 2009 3.0

■Replaced Table 1–31 and Table 1–37.

■Updated Table 1–1, Table 1–2, Table 1–5, Table 1–19, Table 1–41,

Table 1–44, Table 1–45, Table 1–49, and Table 1–51.

■Added Table 1–21, Table 1–46, and Table 1–47

■Added Figure 1–3.

■Removed “Timing Model”, “Preliminary and Final Timing”, “I/O Timing

Measurement Methodology”, “I/O Default Capacitive Loading”, and

“Referenced Documents” sections.

December 2009 2.1 Minor changes.

November 2008 2.0

■Minor text edits.

■Updated Table 1–19, Table 1–32, Table 1–34 - Table 1–39.

■Minor text edits.

Chapter 1: DC and Switching Characteristics 1–59

Document Revision History

August 2008 1.1

■Updated Table 1–1, Table 1–2, Table 1–4, Table 1–5, and Table 1–26.

■Removed figures from “Transceiver Performance Specifications” on

page 1–10 that are repeated in the glossary.

■Minor text edits and an additional note to Table 1–26.

May 2008 1.0 Initial release.

Table 1–51. Document Revision History

Date Document Version Changes Made

1–60 Chapter 1: DC and Switching Characteristics

Document Revision History

2. Addendum to the Stratix IV Device

Handbook

This chapter describes changes to the published version of the Stratix IV Device

Handbook. It describes the following:

■VCCAUX power supply setting for the power-on reset (POR) circuitry (including a

correction to the POR signal pulse width delay times)

■Correct power-up sequence

■On-chip termination (OCT) assignment summary

■JTAG pull-up resistor value specification

Table 2–1 lists the changes and related chapters described in this addendum.

1Any information not contained in this addendum is considered the same as the

information contained in the published version of the Stratix IV Device Handbook.

Table 2 –1 . Changes to the Stratix IV Handbook

Change Chapter

Power-On Reset Circuitry Hot Socketing and Power-On Reset in Stratix IV Devices

Power-On Reset Specifications Hot Socketing and Power-On Reset in Stratix IV Devices

Correct Power-Up Sequence for Production Devices Hot Socketing and Power-On Reset in Stratix IV Devices

Power-On Reset Circuit Configuration, Design Security, Remote System Upgrades

with Stratix IV Devices

Summary of OCT Assignments I/O Features in Stratix IV Devices

JTAG TMS and TDI Pin Pull-Up Resistor Value Specification Configuration, Design Security, Remote System Upgrades

with Stratix IV Devices

SIV54002-1.1

2–2 Chapter 2: Addendum to the Stratix IV Device Handbook

Power-On Reset Circuitry

Figure 2–1 shows the addition of the VCCAUX power supply to “Figure 9-2: Simplified

POR Diagram for Stratix IV Devices”.

Power-On Reset Specifications

Table 2–2 lists the addition of the VCCAUX power supply setting to “Table 9-1: Power

Supplies Monitored by the POR Circuitry”.

fAll power supply specifications not contained in this addendum remain the same as

in “Table 9-1: Power Supplies Monitored by the POR Circuitry” of the Hot Socketing

and Power-On Reset in Stratix IV Devices chapter.

Correction to POR Signal Pulse Width Delay Times

Table 2–3 lists the corrected POR signal pulse delay times (the changes are shown in

bold).

Figure 2–1. Simplified POR Diagram for Stratix IV Devices

Regulator POR

Satellite POR POR Pulse

Setting

PORSEL

POR

Main POR

VCCPGM

VCCPD

VCC

VCCPT

VCCAUX

Table 2 –2 . Power Supplies Monitored by the POR Circuitry

Power Supply Description Setting (V)

VCCAUX Auxiliary supply for the programmable power technology 2.5

Table 2 –3 . Corrections to Chapter 9: Hot Socketing and Power-On Reset in Stratix IV Devices

Page # Section Name Change

Page 5 Power-On Reset Specifications

Corrected: When the PORSEL pin is connected to GND, the POR delay time is

100 to 300 ms. When the PORSEL pin is set to high, the POR delay time is 4 to

12 ms.

Chapter 2: Addendum to the Stratix IV Device Handbook 2–3

Correct Power-Up Sequence for Production Devices

In order to successfully power-up and to exit POR on production Stratix IV devices,

you must fully power up VCC before VCCAUX begins to ramp. Table 2–4 lists the

corrections made to the Hot Socketing and Power-On Reset in Stratix IV Devices chapter

in order to record this new specification (the changes are shown in bold).

fAll the power-on reset sequence specifications not contained in this addendum

remain the same as in the Hot Socketing and Power-On Reset in Stratix IV Devices

chapter.

Table 2 –4 . Corrections to Chapter 9: Hot Socketing and Power-On Reset in Stratix IV Devices

Page # Section Name Change

Page 1

Second Paragraph

Stratix IV devices offer hot socketing, also known as hot plug-in or hot swap,

and power sequencing support without the use of external devices (provided VCC

powers up fully before VCCAUX).

Third Paragraph Removed: With the Stratix IV hot-socketing feature, you no longer have to

ensure a proper power-up sequence for each device on the board.

Second bullet Support for any power-up sequence (with the exception that VCC must power up

fully before VCCAUX for all Stratix IV production devices).

Stratix IV Hot-Socketing

Specifications

Stratix IV devices are hot-socketing compliant (provided VCC powers up fully

before VCCAUX) without the need for external components or special design

requirements.

Page 2

Stratix IV Devices can be Driven

Before Power Up

Removed: Stratix IV devices support power-up or power-down of the VCCIO, VCC,

VCCPGM, and VCCPD power supplies in any sequence in order to simplify

system-level design.

Insertion or Removal of a

Stratix IV Device from a

Powered-up System

Added: To successfully power-up and exit POR on production devices, fully

power VCC before VCCAUX begins to ramp.

Removed: For more information about the hot-socketing specification, refer to

the DC and Switching Characteristics and the Hot Socketing and Power

Sequencing Feature and Testing for Altera Devices white paper.

Hot-Socketing Feature

Implementation in Stratix IV

Devices

The hot-socketing feature turns off the output buffer during power up and power

down of the VCC , VC CAUX, VCCIO, VCCPGM, or VCCPD

power supplies. The hot-socketing

circuitry generates an internal HOTSCKT signal when the VCC

, VCCAUX, VCCIO,

VCCPGM, or VCCPD power supplies are below the threshold voltage.

Page 3

The POR circuit monitors the voltage level of the power supplies (VCC, VC CAUX,

VCCIO, VCCPGM, or VCCPD) and keeps the I/O pins tri-stated until the device is in user

mode.

The 3.0-V tolerance control circuit permits the I/O pins to be driven by 3.0 V

before the VCC, VCCAUX, VCCIO, VCCPGM

, or VCCPD supplies are powered.

Added: To successfully power-up and exit POR on production devices, fully

power VCC before VCCAUX begins to ramp.

Page 4 Power-On Reset Circuitry Added: The satellite POR also monitors the VCCAUX power supply which is the

auxiliary supply for the programmable power technology.

2–4 Chapter 2: Addendum to the Stratix IV Device Handbook

Power-On Reset Circuit

Table 2–5 lists the addition of VCCAUX to the power-on reset information (the change is

shown in bold).

fAll the power-on reset circuit information not contained in this addendum remains

the same as in the Configuration, Design Security, Remote System Upgrades with

Stratix IV Devices chapter.

Summary of OCT Assignments

Table 2–6 lists the OCT assignments for the Quartus II software version 9.1 and later.

fAll on-chip termination support and I/O termination schemes not contained in this

addendum remain the same as in the I/O Features in Stratix IV Devices chapter.

JTAG TMS and TDI Pin Pull-Up Resistor Value Specification

This correction changes the current JTAG TMS and TDI pin pull-up resistor value

specification from 10 kΩ to a range of from 1 k to 10 kΩ..

Figure 2–2 shows the addition of Note 5 to “Figure 10-16: JTAG Configuration of a

Single Device Using a Download Cable” found in the JTAG Configuration section of

the Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices

chapter (the change is shown in bold).

Table 2 –5 . Correction to Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices

Page # Section Name Change

Page 4 Power-On Reset Circuit

After power-up, the device does not release nSTATUS until VCC, VCCAUX, VCCPT

VCCPGM, and VCCPD are above the device’s POR trip point. On power down,

brown-out occurs if the VCC, VCCAUX, VCCPT

, VCCPGM, or VCCPD drops below the

threshold voltage.

Table 2 –6 . Summary of OCT Assignments in the Quartus II Software

Assignment Name Value Applies To

Input Termination

Parallel 50 Ω with calibration Input buffers for single-ended and

differential HSTL/SSTL standards

Differential Input buffers for LVDS receivers on

row I/O banks (1)

Output Termination

Series 25 Ωwithout calibration

Output buffers for single-ended

LVTTL/LVCMOS and HSTL/SSTL

standards as well as differential

HSTL/SSTL standards

Series 50 Ωwithout calibration

Series 25 Ωwith calibration

Series 40 Ωwith calibration

Series 50 Ωwith calibration

Series 60 Ωwith calibration

Note to Tab l e 2–6:

(1) You can enable differential OCT RD in row I/O banks when both VCCIO and VCCPD are set to 2.5 V.

Chapter 2: Addendum to the Stratix IV Device Handbook 2–5

JTAG TMS and TDI Pin Pull-Up Resistor Value Specification

Figure 2–2. JTAG Configuration of a Single Device Using a Download Cable

Notes to Figure 2–2:

(1) Connect the pull-up resistor to the same supply voltage as the USB Blaster, MasterBlaster (VIO pin), ByteBlaster II, ByteBlasterMV, or

EthernetBlaster cable. The voltage supply can be connected to the VCCPD of the device.

(2) Connect the nCONFIG and MSEL[2..0] pins to support a non-JTAG configuration scheme. If you only use the JTAG configuration, connect

nCONFIG to VCCPGM and MSEL[2..0] to GND. Pull DCLK either high or low, whichever is convenient on your board.

(3) Pin 6 of the header is a VIO reference voltage for the MasterBlaster output driver. VIO must match the device’s VCCP D. For more information about

this value, refer to the MasterBlaster Serial/USB Communications Cable User Guide. In the USB-Blaster, ByteBlaster II, and ByteBlasterMV cable,

this pin is a no connect.

(4) You must connect nCE to GND or driven low for successful JTAG configuration.

(5) The pull-up resistor value can vary from 1 k to 10 kΩ.

nCE (4)

MSEL[2..0]

nCONFIG

CONF_DONE

VCCPD (1)

GND

(2)

VCCPD (1)

10 kΩ

nSTATUS

Pin 1

Download Cable

10-Pin Male Header

(JTAG Mode)

(Top View)

GND

TCK

TDO

TMS

TDI

1 kΩ

GND

VIO (3)

Stratix IV Device

nCE0

N.C.

TRST

DCLK

(2)

VCCPGM

VCCPD (1)

(5)

2–6 Chapter 2: Addendum to the Stratix IV Device Handbook

JTAG TMS and TDI Pin Pull-Up Resistor Value Specification

Figure 2–3 shows the addition of Note 5 to “Figure 10-17: JTAG Configuration of

Multiple Devices Using a Download Cable” found in the JTAG Configuration section of

the Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices

chapter (the change is shown in bold).

fAll other JTAG configuration specifications not contained in this addendum remain

the same as in the Configuration, Design Security, and Remote System Upgrades in

Stratix IV Devices chapter.

Figure 2–3. JTAG Configuration of Multiple Devices Using a Download Cable

Notes to Figure 2–3:

(1) Connect the pull-up resistor to the same supply voltage as the USB Blaster, MasterBlaster (VIO pin), ByteBlaster II, ByteBlasterMV, or

EthernetBlaster cable. Connect the voltage supply to VCCPD of the device.

(2) Connect the nCONFIG and MSEL[2..0] pins to support a non-JTAG configuration scheme. If you only use JTAG configuration, connect

nCONFIG to VCCPGM and MSEL[2..0] to GND. Pull DCLK either high or low, whichever is convenient on your board.

(3) Pin 6 of the header is a VIO reference voltage for the MasterBlaster output driver. VIO must match the device’s VCCP D. For more information about

this value, refer to the MasterBlaster Serial/USB Communications Cable User Guide. In the USB-Blaster, ByteBlaster II, and ByteBlasterMV cables,

this pin is a no connect.

(4) You must connect nCE to GND or drive it low for successful JTAG configuration.

(5) The pull-up resistor value can vary from 1 k to 10 kΩ.

TMS TCK

Download Cable

10-Pin Male Header

(JTAG Mode)

TDI TDO

VCCPD

VCCPD (1)

Pin 1

nSTATUS

nCONFIG

MSEL[2..0]

nCE (4)

VCCPGM

CONF_DONE

TMS TCK

TDI TDO

nSTATUS

nCONFIG

MSEL[2..0]

nCE (4)

CONF_DONE

TMS TCK

TDI TDO

nSTATUS

nCONFIG

MSEL[2..0]

nCE (4)

CONF_DONE

(1)

(2)

VIO

(3)

Stratix IV DeviceStratix IV Device Stratix II or Stratix II GX

Device

TRST TRST TRST

10 kΩ10 kΩ10 kΩ10 kΩ10 kΩ

1 kΩ

10 kΩ

DCLK DCLK DCLK

(2) (2) (2)

Stratix IV Device

VCCPD (1)

VCCPD (1) VCCPD (1) VCCPD (1)

VCCPGM VCCPGM VCCPGM VCCPGM VCCPGM

(5)

Chapter 2: Addendum to the Stratix IV Device Handbook 2–7

Document Revision History

Table 2–7 shows the revision history for this chapter.

Table 2 –7 . Document Revision History

Date Document Version Changes Made

February 2010 1.1

■Added the “Power-On Reset Circuitry”, “Power-On Reset Specifications”,

“Correction to POR Signal Pulse Width Delay Times”, “Correct Power-Up

Sequence for Production Devices”, “Power-On Reset Circuit”, “Summary

of OCT Assignments”, and “JTAG TMS and TDI Pin Pull-Up Resistor Value

Specification” sections.

■Minor text edits.

November 2009 1.0

■Stratix IV GX enhanced transceiver data rate specifications in –4

commercial speed grade.

■Initial release.