Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
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Copyright © 2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc.
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Cree PLCC4 1 in 1 SMD LED
CLM4B-BKW/GKW
REFLOW SOLDERING
• The CLM4B-BKW GKW is rated as a MSL 5a product.
• Therecommendedoorlifeoutofbagis24hrs.
• Thetemperatureproleisasbelow.
Use only with CLM4B-BKW GKW
Solder
Average ramp-up rate = 4ºC/s max
Preheat temperature = 150ºC ~200ºC
Preheat time = 120s max
Ramp-down rate = 6ºC/s max
Peak temperature = 235ºC max
Time within 5ºC of actual Peak Temperature = 10s max
Duration above 217ºC is 45s max
Melting-point
Pre-heat Soak Reflow Cooling
Temperature
Use all SMD besides LP6-NPP1-01-N1
Solder = Sn63-Pb37 Solder = Lead-free
Average ramp-up rate = 4ºC/s max. Average ramp-up rate = 4ºC/s max
Preheat temperature = 100ºC ~150ºC Preheat temperature = 150ºC ~200ºC
Preheat time = 100s max. Preheat time = 100s max.
Ramp-down rate = 6ºC/s max. Ramp-down rate = 6ºC/s max.
Peak temperature = 230ºC max. Peak temperature = 250ºC max.
Time within 5ºC of actual Peak Temperature = 10s max. Time within 5ºC of actual Peak Temperature = 10s max.
Duration above 183ºC is 80s max. Duration above 217ºC is 80s max.
Only use LP6-NPP1-01-N1 [13]
Solder = Low Lead-free
Average ramp-up rate = 3ºC/s max.
Preheat temperature = 130ºC ~170ºC
Preheat time = 120s max.
Ramp-down rate = 6ºC/s max.
Peak temperature = 213ºC max.
Time within 3ºC of actual Peak Temperature = 25s max.
Duration above 200ºC is 40s max.
Recommended solder pad design for heat dissipation (2-pin SMD LED):
0.5
7.5
7.0
4.5
2.6
1.5
Recommended solder pad design for heat dissipation (4-pin SMD LED)
Referto"http://www.cree.com/led-components/media/documents/sh-HB.pdf"forsoldering&handlingdetails.