MicrelMIC5841/5842
7-42 October 1998
MIC5841/5842
8-Bit Serial-Input Latched Drivers
Features
• 3.3 MHz Minimum Data-Input Rate
• CMOS, PMOS, NMOS, TTL Compatible
• Internal Pull-Up/Pull-Down Resistors
• Low-Power CMOS Logic and Latches
• High-Voltage Current-Sink Outputs
• Output Transient-Protection Diodes
• Single or Split Supply Operation
Functional Diagram Pin Configuration
(DIP, SOIC)
DD
1
2
3
4
5
6
7
14
13
12
11
10
V
1
OUT
2
OUT
3
OUT
4
OUT
CLOCK
SERIAL DATA OUT
SS
V
8
9
15
16
17
18
5
OUT
6
OUT
7
OUT
8
OUT
K
EE
V
SERIAL DATA IN
STROBE
OUTPUT ENABLE
EE
V
C
DD
V
SS
V
SUB
SUB
ST
OE
8-BIT SERIAL-PARALLEL SHIFT REGISTER 6
SERIAL
DATA OUT
CLK
1
3
4
SERIAL
DATA IN
V
SS
11
V
DD
STROBE
OUTPUT ENABLE
(ACTIVE LOW)
Bipolar
MOS
LATCHES
OUT
8
12131415161718
OUT
7
OUT
6
OUT
5
OUT
4
OUT
3
OUT
2
OUT
1
5
7
8
Sub
V
EE9
1
10
K
General Description
Using BiCMOS technology, the MIC5841/5842 integrated
circuits were fabricated to be used in a wide variety of
peripheral power driver applications. The devices each have
an eight-bit CMOS shift register, CMOS control circuitry,
eight CMOS data latches, and eight bipolar current-sink
Darlington output drivers.
These two devices differ only in maximum voltage ratings.
The MIC5842 offers premium performance with a minimum
output breakdown voltage rating of 80V (50V sustaining). The
drivers can be operated with a split supply where the negative
supply is down to –20V.
The 500 mA outputs, with integral transient-suppression
diodes, are suitable for use with lamps, relays, solenoids and
other inductive loads.
These devices have improved speed characteristics. With a
5V logic supply, they will typically operate faster than 5 MHz.
With a 12V supply, significantly higher speeds are obtained.
The CMOS inputs are compatible with standard CMOS,
PMOS, and NMOS logic levels. TTL or DTL circuits may
require the use of appropriate pull-up resistors. By using the
serial data output, the drivers can be cascaded for interface
applications requiring additional drive lines.
The MIC5840 family is available in DIP, PLCC, and SOIC
packages. Because of limitations on package power dissipa-
tion, the simultaneous operation of all drivers at maximum
rated current might require a reduction in duty cycle. A
copper-alloy lead frame provides for maximum package
power dissipation.
Ordering Information
Part Number Temperature Range Package
MIC5841BN –40°C to +85°C 18-Pin Plastic DIP
MIC5841BV –40°C to +85°C 20-Pin PLCC
MIC5841BWM –40°C to +85°C 18-Pin Wide SOIC
MIC5842BN –40°C to +85°C 18-Pin Plastic DIP
MIC5842BV –40°C to +85°C 20-Pin PLCC
MIC5842BWM –40°C to +85°C 18-Pin Wide SOIC