T4-LDS-0102-1, Rev. 1 (121485) ©2012 Microsemi Corporation Page 1 of 9
2N7224U, 2N7225U, 2N7227U & 2N7228U
Compliant N-CHANNEL MOSFET
Qualified per MIL-PRF-19500/592
JAN, JANT X, and
JANTXV
This family of switching transistors is military qualified up to the JANTXV level for high-
relia bi li ty applic a tions . These devices are also available in a thru hole TO-254AA package.
Microsemi also offers numerous other transistor products to meet higher and lower power
ratings with various switching speed requirements in both through-hole and surface-mount
packages.
U (SMD-1 or
TO-267AB)
Package
Also available in:
TO-254AA package
(leaded)
2N7224 & 2N7228
Important: For the latest information, vis it our website http://www.microsemi.com.
• Surface mount equivalent of JEDEC registered 2N 7224, 2N7225, 2N7227 and 2N7228 number
series.
• JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/592.
(See part nomenclature for all available options.)
• RoHS compliant by design.
• Low-profile design.
• Military and other high-reliabi lity applica tions.
MAXIMUM RATINGS @ TA = +25 ºC unless otherwise stated
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters / Test Conditions
Operating & Storage Junction Temperature Range
Thermal Resi stan ce Jun cti on-to-Case
Total Power Dissipation
@ TA = +25 °C
(1)
PT 4
W
Drain Current, dc @ TC = +25 ºC
2N7224U
2N7225U
2N7227U
ID1
34.0
27.4
14.0
A
Drain Current, dc @ TC = +100 ºC
2N7224U
2N7225U
2N7227U
ID2
21
17
9
A
Off-State Current (Peak Total Value)
2N7224U
2N7225U
2N7227U
IDM
136
110
56
A (pk)
2N7225U
2N7227U
IS
27.4
14.0
A
NOTES: 1. Derated linearly by 1.2 W/ºC fo r TC > +25 ºC.
2. The foll owing form ul a derives the maximum theoret ical ID limit. I D is limit ed by package and internal
wires and may also be limited by pin diameter:
3. IDM = 4 x I D1 as calculated in note 2.