Technical Data
Sheet
QUARTZ SERIES – LATCHING SMT Power Micro-SPDT 26.5GHz
PAGE 1/6
ISSUE 31-07-20
SERIES Micro-SPDT
PART NUMBER R516 X3X 10X
This document contains proprietary information and such information shall not be disclosed to any third party for any purpose whatsoever or used for manufacturing purposes without prior written agreement
from Radiall. The data defined in this document are given as an indication, in the effort to improve our products; we reserve the right to make any changes judged necessary.
R516 series: the RAMSES concept merges with the SLIM LINE
technology, breaking up the frequency limits of SMT switches :
- FULL SMT TECHNOLOGY COMPATIBLE
- High frequency
- High life span
- High repeatability
- High power applications
(All dimensions are in mm [inches])
PART NUMBER SELECTION
TYPICAL OUTLINE DRAWING
R 516 _ _ _ 1 0 _
Frequency range :
3 : DC – 8GHz
4 : DC – 18GHz
7 : DC – 26.5GHz
TYPE :
3 : Latching, 2 coils
ACTUATOR VOLTAGE :
1 : 6Vdc
2 : 12Vdc
3 : 24Vdc
Actuator terminals :
0 : Not soldered
T : Soldered on a connectorized
test fixture (1)
ACTUAL SIZE
(1) See details about test fixture RF characteristics on page 3
Technical Data
Sheet
QUARTZ SERIES – LATCHING SMT Power Micro-SPDT 26.5GHz
PAGE 2/6
ISSUE 31-07-20
SERIES Micro-SPDT
PART NUMBER R516 X3X 10X
This document contains proprietary information and such information shall not be disclosed to any third party for any purpose whatsoever or used for manufacturing purposes without prior written agreement
from Radiall. The data defined in this document are given as an indication, in the effort to improve our products; we reserve the right to make any changes judged necessary.
GENERAL SPECIFICATION
Operating mode
Latching (Type 3)
Nominal operating voltage (Vdc)
(across operating temperature range)
6 (on request)
(5.1 to 6.6)
12
(10.2 to 13)
24
(20.5 to 30)
Coil resistance (+/-10%) (Ohms)
55
205
865
Operating current at 23°C (mA)
108
58
32
RF and command ports
gold plated access, infrared reflow, forced air oven or hand soldering
(Compatible with “lead free” soldering processes)
Switching time
(Nomial voltage)
Making contacts
Max 5ms, including contact bounce time
Breaking contacts
3ms
Life
Cold switching
(Max 120 cycles/min)
3 million cycles (5 million cycles typical at low level)
Hot switching
(Max 20 cycles/min)
500.000 cycles (1W, impedance 50 , V.S.W.R. <1.25)
Insulation
Dielectric test voltage
300Vrms
Insulation resistance at 500Vdc
> 100MOhms
Environmental protection
“LEAD FREE » construction”
Waterproofness according to IEC 60529 / IP64
immersion resistance 10min / 1m
Mass
7.5g
Operating temperature range (°C)
-40 to +85
(With no icing nor condensation)
Storage temperature range (°C)
-55 to +85
Shocks
(According to MIL STD 202, method 213B,
Cond C)
100g / 6ms, ½ sine No change of state
Sine vibration
(MIL STD 202, method 204)
Condition D : 10-2000Hz, 20g Operating
Condition G : 10-2000Hz, 30g Non Operating
Random vibration
(MIL STD 202, method 214A, Profile I)
- Condition F : 50-2000Hz, 20.71grms Operating
- Condition H : 50-2000Hz, 29.28grms Non-operating
PIN IDENTIFICATION (TOP VIEW)
Voltage
RF Continuity
-1 +1
C ↔ 1
-2 +2
C ↔ 2
Latching model
(TYPE 3)
Technical Data
Sheet
QUARTZ SERIES – LATCHING SMT Power Micro-SPDT 26.5GHz
PAGE 3/6
ISSUE 31-07-20
SERIES Micro-SPDT
PART NUMBER R516 X3X 10X
This document contains proprietary information and such information shall not be disclosed to any third party for any purpose whatsoever or used for manufacturing purposes without prior written agreement
from Radiall. The data defined in this document are given as an indication, in the effort to improve our products; we reserve the right to make any changes judged necessary.
RF PERFORMANCES (1)
(1) : at high frequency, manual soldering may generate spikes and RF characteristics degradation, due to air gaps
between PC board and relay ground.
TYPICAL RF PERFORMANCE - MEASUREMENT METHOD USING UOSM 2.92mm CALIBRATION (2)
Inputs/Outputs of the calibration board and test fixture are
equipped with coaxial type receptacle connectors. The length of
the RF tracks is the same on the calibration board and the test
fixture circuits. The insertion loss of the relay itself is calculated
by subtracting the insertion loss of the “calibration board” to the
insertion loss of the “relay welded on the test fixture”.
(2): Relay soldered on Test Fixture is available. To order,
please use the suffix "T" (part number R516 - - - - - T), as
explained in page 1.
All dimensions are in millimeters [inches]
Frequency Range
(GHz)
V.S.W.R
IL
Isolation
Average power
W
Third order
Inter
modulation
Impedance
(max)
(max) dB
(min) dB
hot
switching
Ohms
DC – 8
DC – 18
DC – 26.5
DC – 3
1.20
0.20
50
40
-110 dBc
Typical @ 1730
MHz
(2 carriers
20W)
50
3 – 6
1.35
0.40
40
25
6 – 8
1.40
0.50
40
5
8 – 12.4
1.50
0.60
40
3
12.4 – 18
1.70
1.00
40
1
18 – 26.5
2.00
1.60
40
1
Calibration board
Relay soldered on test fixture (2)
Isolation
Technical Data
Sheet
QUARTZ SERIES – LATCHING SMT Power Micro-SPDT 26.5GHz
PAGE 4/6
ISSUE 31-07-20
SERIES Micro-SPDT
PART NUMBER R516 X3X 10X
This document contains proprietary information and such information shall not be disclosed to any third party for any purpose whatsoever or used for manufacturing purposes without prior written agreement
from Radiall. The data defined in this document are given as an indication, in the effort to improve our products; we reserve the right to make any changes judged necessary.
RF POWER RATING FOR COLD SWITCHING USE
(Impedance 50 Ohms, V.S.W.R. < 1.25)
Power level depends on environmental conditions :
- R516 series have been designed to be used without a cooling fan even for high power applications. However, the power capability
may be still improved by using the appropriate cooling fan.
RELAY PACKAGING
According to IEC 286-3 standard
For quantities up to 50 relays: packaged in tape without reel
For upper quantities: packaged in tape and reel, maximum 200 relays per reel
MATERIALS
Reel : polyester
Carrier tape : PVC
Cover tape : polyester
Technical Data
Sheet
QUARTZ SERIES – LATCHING SMT Power Micro-SPDT 26.5GHz
PAGE 5/6
ISSUE 31-07-20
SERIES Micro-SPDT
PART NUMBER R516 X3X 10X
This document contains proprietary information and such information shall not be disclosed to any third party for any purpose whatsoever or used for manufacturing purposes without prior written agreement
from Radiall. The data defined in this document are given as an indication, in the effort to improve our products; we reserve the right to make any changes judged necessary.
All dimensions are in millimeters [inches].
PC BOARD MOUNTING
Substrate Types
Recommended substrates are ROGERS RO4003.,
Thickness 0.508 mm Cu double side 17.5µm.
Recommended total thickness of RF tracks
(copper over thickness + plating) : 40µm.
Other substrates may be used
Board layout general outline
DXF or GERBER format file
available upon request
Relay soldering
DXF format file available upon request
Optionnal fixing system : 2 screws M1.2
(see details on page 7 / B-4)
Video shadow of the relay
Aspiration area
Technical Data
Sheet
QUARTZ SERIES – LATCHING SMT Power Micro-SPDT 26.5GHz
PAGE 6/6
ISSUE 31-07-20
SERIES Micro-SPDT
PART NUMBER R516 X3X 10X
This document contains proprietary information and such information shall not be disclosed to any third party for any purpose whatsoever or used for manufacturing purposes without prior written agreement
from Radiall. The data defined in this document are given as an indication, in the effort to improve our products; we reserve the right to make any changes judged necessary.
RECOMMENDED SOLDERING PROCEDURE
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(16)
(17)
(18)
(19)
(20)
(21)
(22)
(23)
(24)
(25)
(26)
(27)
(28)
(29)
(30)
(31)
(32)
(33)
(34)
(35)
(36)
(37)
(38)
(39)
(40)
(41)
(42)
(43)
(44)
(45)
(46)
(47)
(48)
(49)
(50)
(51)
(52)
(53)
(54)
(55)
(56)
A – Soldering procedure using automatic pick and place
equipment
1-Solder paste :
R516 series are « Lead Free », and Lead Free Sn-Ag3.5-Cu0.7
solder cream may be used as well as standard Sn63–Pb35–
Ag2. RADIALL recommends using a « no clean - low residue »
solder cream (5% solid residue of flux quantity) that will permit
the elimination of the cleaning operation step after soldering.
Note : Due to the gold plating of the switch PCB interface, it is
important to use a paste made with silver. This will help in
avoiding formation of intermetallics as part of the solder joint.
2-Solder paste deposition :
Solder cream may be applied on the board with screen printing
or dispenser technologies. For either method, the solder paste
must be coated to appropriate thickness and shapes to achieve
good solder wetting. Please optically verify that the edges of the
zone are clean and without contaminates, and that the PCB
zoned areas have not oxydated. The design of the mounting
pads and the stenciling area are available upon request, for a
thickness of the silk-screen printing of 0.15 mm (0.006 ‘’).
3-Placement of the component :
For small lightweight components such as chip components, a
self-alignment effect can be expected if small placement errors
exist. However, this effect is not as expected for relays
components and they require a accurate positioning on their
soldering pads, typically +/- 0.1mm (+/-0.004’’).
Place the relay onto the PCB with automatic pick and place
equipment. Various types of suction can be used.
RADIALL does not recommend using adhesive agents on the
component or on the PCB.
4-Soldering : infra-red process
Please follow the RADIALL recommended max temperature
profile for infra-red reflow or forced air convection :
Higher temperature (>260°C) and longer
process duration would damage
permanently the switches.
5-Cleaning procedure :
On miniature relays, high frequency cleaning may cause the
contacts to stick. If cleaning is needed, please avoid
ultrasonic cleaning and use alcohol based cleaning solutions.
In-line cleaning process, spraying, immersion,
especially under temperature, may cause a
risk of degradation of internal contacts. For
such cleaning process please contact us.
6-Quality check :
Verify by visual inspection that the component is centred on
the mounting pads.
Solder joints : verify by visual inspection that the formation of
meniscus on the pads are proper.
B – Soldering procedure by manual operation
: manual soldering is not recommended for
high frequencies, as it generates resonance
and lower RF characteristics due to gaps
between PC board and relay grounds,.
1-Solder paste and flux deposition :
Refer to procedure A – 1
Deposit a thin layer of flux on solder pad area. Allow the flux
to evaporate a few seconds before applying the solder paste,
it will prevent dilution of the paste.
2-Solder paste deposition :
RADIALL recommends depositing a small amount of solder
paste on solder pad area by syringe, according to the
manual soldering pattern (available upon request).
Be careful, not to apply solder paste outside of the zone
area.
3-Placement of the component :
During manipulation, avoid contaminating gold surfaces by
contact with fingers.
Place the component on the mounting zone by pressing on
the top of the relay lid.
4-Hand soldering :
Iron wattage 30 to 60 W.
To keep better RF characteristics, apply pressure on the
relay lid during all the soldering stage, so as to reduce the air
gap between the PC board and the relay.
If possible, fix the ground plane of the relay on the board with
two M1.2 screws before the soldering stage. On each side of
the central RF access, the RF body edge must be soldered to
the ground of the PC board. To improve RF characteristics
and avoid soldering the RF body on the ground, a conductive
gasket may be used (please contact us for detailed
application note).
5-Cleaning procedure :
Refer to procedure A – 5.
6-Quality check:
Verify by visual inspection that component is centred on the
mounting pads.
Solder joints : verify by visual inspection that there is no
solder excess on the RF pads.
