R1VO
VIN -
+
R3
VS
RPULL-UP
R2
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM397
SNOS977F –MAY 2001–REVISED MAY 2016
LM397 Single General-Purpose Voltage Comparator
1
1 Features
1• TA= 25°C. Typical Values Unless Otherwise
Specified.
• 5-Pin SOT-23 Package
• Industrial Operating Range −40°C to +85°C
• Single or Dual Power Supplies
• Wide Supply Voltage Range 5 V to 30 V
• Low Supply Current 300 µA
• Low Input Bias Current 7 nA
• Low Input Offset Current ±1 nA
• Low Input Offset Voltage ±2 mV
• Response Time 440 ns (50-mV Overdrive)
• Input Common-Mode Voltage 0 to VS– 1.5 V
2 Applications
• A/D Converters
• Pulse, Square-Wave Generators
• Peak Detector
• Industrial Applications
3 Description
The LM397 device is a single voltage comparator
with an input common mode that includes ground.
The LM397 is designed to operate from a single 5-V
to 30-V power supply or a split power supply. Its low
supply current is virtually independent of the
magnitude of the supply voltage.
The LM397 features an open-collector output stage.
This allows the connection of an external resistor at
the output. The output can directly interface with TTL,
CMOS and other logic levels, by tying the resistor to
different voltage levels (level translator).
The LM397 is available in the space-saving 5-Pin
SOT-23 package and is pin-compatible to TI’s TL331,
a single differential comparator.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM397 SOT-23 (5) 2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Circuit
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 6
7 Detailed Description.............................................. 7
7.1 Overview................................................................... 7
7.2 Functional Block Diagram......................................... 7
7.3 Feature Description................................................... 7
7.4 Device Functional Modes.......................................... 8
8 Application and Implementation .......................... 9
8.1 Application Information.............................................. 9
8.2 Typical Application ................................................... 9
9 Power Supply Recommendations...................... 11
10 Layout................................................................... 11
10.1 Layout Guidelines ................................................. 11
10.2 Layout Example .................................................... 11
11 Device and Documentation Support................. 12
11.1 Community Resources.......................................... 12
11.2 Trademarks........................................................... 12
11.3 Electrostatic Discharge Caution............................ 12
11.4 Glossary................................................................ 12
12 Mechanical, Packaging, and Orderable
Information........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (October 2015) to Revision F Page
• Changed incorrect Pin Functions table entries. Pins 4 and 5 were swapped........................................................................ 3
Changes from Revision D (March 2013) to Revision E Page
• Added ESD Rating table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
Changes from Revision C (March 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format ............................................................................................................. 8
OUTPUT
1
2
3
5
4
VIN-
GND
VS
VIN+
3
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5 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
GND 2 P Ground
OUTPUT 4 O Output
VIN+ 3 I Noninverting Input
VIN– 1 I Inverting Input
VS5 P Supply
4
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is
PD= (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN differential 30 30 V
Supply voltages ±15 30 V
Voltage at input pins −0.3 30 V
Junction temperature(3) 150 ºC
Soldering
information Infrared or Convection (20 sec.) 235 ºC
Wave Soldering (10 sec.) 260 ºC
Storage Temperature, Tstg −65 150 ºC
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic
discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V
Machine Model(1)(2) ±200
(1) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is
PD= (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.
6.3 Recommended Operating Conditions MIN MAX UNIT
Supply voltage, VS5 30 V
Temperature(1) −40 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is
PD= (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.
6.4 Thermal Information
THERMAL METRIC(1) LM397
UNITDBV (SOT-23)
5 PINS
RθJA Junction-to-ambient thermal resistance(2) 186 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 92.8 °C/W
RθJB Junction-to-board thermal resistance 38.9 °C/W
ψJT Junction-to-top characterization parameter 5.6 °C/W
ψJB Junction-to-board characterization parameter 38.4 °C/W
5
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(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped
production material.
(3) The input common-mode voltage of either input should not be permitted to go below the negative rail by more than 0.3V. The upper end
of the common-mode voltage range is VS– 1.5 V at 25°C.
6.5 Electrical Characteristics
Unless otherwise specified, all limits are ensured for TA= 25°C, VS= 5 V, V−= 0 V, VCM = V+/2 = VO.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
VOS Input offset voltage VS= 5 V to 30 V,
VO= 1.4 V, VCM = 0 V TA= 25ºC 2 7 mV
At the temperature extremes 10
IOS Input offset current VO= 1.4 V, VCM = 0 V TA= 25ºC 1.6 50 nA
At the temperature extremes 250
IBInput bias current VO= 1.4 V, VCM = 0 V TA= 25ºC 10 250 nA
At the temperature extremes 400
ISSupply current RL= open, VS= 5 V 0.25 0.7 mA
RL= open, VS= 30 V 0.3 2
IOOutput sink current VIN+= 1 V, VIN−= 0 V, VO= 1.5 V 6 13 mA
ILEAKAGE Output leakage current VIN+= 1 V, VIN−= 0 V, VO= 5 V 0.1 nA
VIN+= 1 V, VIN−= 0 V, VO= 30 V 1 µA
VOL Output voltage low IO=−4 mA, VIN+= 0 V,
VIN−= 1 V TA= 25ºC 180 400 mV
At the temperature extremes 700
VCM Common-mode input
voltage range VS= 5 V to 30 V(3) TA= 25ºC 0 VS– 1.5 V
At the temperature extremes 0 VS– 2
AVVoltage gain VS= 15 V, VO= 1.4 V to 11.4 V,
RL> = 15 kΩconnected to VS120 V/mV
tPHL Propagation delay
(high to low)
Input overdrive = 5 mV
RL= 5.1 kΩconnected to 5 V, CL= 15 pF 900 ns
Input overdrive = 50 mV
RL= 5.1 kΩconnected to 5 V, CL= 15 pF 250
tPLH Propagation delay
(low to high)
Input Overdrive = 5 mV
RL= 5.1 kΩconnected to 5 V, CL= 15 pF 940 µs
Input overdrive = 50 mV
RL= 5.1 kΩconnected to 5 V, CL= 15 pF 440 ns
110 100
0.01
0.1
1
OUTPUT SATURATION VOLTAGE (V)
OUTPUT SINK CURRENT (mA)
-40RC25RC
85RC
0510 15 2
025 30
SUPPLY VOLTAGE (V)
1
1.5
2.5
INPUT OFFSET VOLTAGE (mV)
2
-40°C
85°C
25°C
05 10 15 20 25 30
SUPPLY VOLTAGE (V)
0
2
4
6
8
10
12
14
INPUT BIAS CURRENT (nA)
-40°C
25°C
85°C
6
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6.6 Typical Characteristics
TA= 25°C. Unless otherwise specified.
Figure 1. Supply Current vs Supply Voltage Figure 2. Input Bias Current vs Supply Current
Figure 3. Output Saturation Voltage vs Output Sink Current Figure 4. Input Offset Voltage vs Supply Voltage
VIN+
VIN-
VS
GND
OUTPUT
VOLTS
VREF
VO
TIME
VIN
VREF
VIN
VO
-
+
V-
RPULL-UP
VS
7
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7 Detailed Description
7.1 Overview
A comparator is often used to convert an analog signal to a digital signal. The comparator compares an input
voltage (VIN) at the noninverting pin to the reference voltage (VREF) at the inverting pin. If VIN is less than VREF
the output (VO) is low (VOL). However, if VIN is greater than VREF, the output voltage (VO) is high (VOH). Refer to
Figure 6.
Figure 5. Basic Comparator
Figure 6. Basic Comparator Output
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Input Stage
The LM397 has a bipolar input stage. The input common-mode voltage range is from 0 to (VS– 1.5 V).
7.3.2 Output Stage
The LM397 has an open-collector grounded-emitter NPN output transistor for the output stage. This requires an
external pullup resistor connected between the positive supply voltage and the output. The external pullup
resistor should be high enough resistance so to avoid excessive power dissipation. In addition, the pullup resistor
should be low enough resistance to enable the comparator to switch with the load circuitry connected. Because it
is an open-collector output stage, several comparator outputs can be connected together to create an OR’ing
function output. With an open collector, the output can be used as a simple SPST switch to ground. The amount
of current which the output can sink is approximately 10 mA. When the maximum current limit is reached, the
output transistor will saturate and the output will rise rapidly (Figure 7).
VO
0VIN
VT2 VT1
110 100
OUTPUT SINK CURRENT (mA)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
OUTPUT SATURATION VOLTAGE (V)
85°C
25°C
-40°C
8
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Feature Description (continued)
Figure 7. Output Saturation Voltage vs Output Sink Current
7.4 Device Functional Modes
7.4.1 Hysteresis
The basic comparator configuration may oscillate or produce a noisy output if the applied differential input is near
the input offset voltage of the comparator. This tends to occur when the voltage on the input is equal or very
close to the other input voltage. Adding hysteresis can prevent this problem. Hysteresis creates two switching
thresholds (one for the rising input voltage and the other for the falling input voltage). Hysteresis is the voltage
difference between the two switching thresholds. When both inputs are nearly equal, hysteresis causes one input
to effectively move quickly pass the other. Thus, effectively moving the input out of region that oscillation may
occur.
For an inverting configured comparator, hysteresis can be added with a three resistor network and positive
feedback. When input voltage (VIN) at the inverting node is less than non-inverting node (VT), the output is high.
The equivalent circuit for the three resistor network is R1in parallel with R3and in series with R2. The lower
threshold voltage VT1 is calculated by Equation 1:
VT1 = ((VSR2) / (((R1R3) / (R1+ R3)) + R2)) (1)
When VIN is greater than VT, the output voltage is low. The equivalent circuit for the three resistor network is R2
in parallel with R3and in series with R1. The upper threshold voltage VT2 is calculated by Equation 2:
VT2 = VS((R2R3) / (R2+ R3)) / (R1+ ((R2R3) / (R2+ R3))) (2)
The hysteresis is defined in Equation 3:
ΔVIN = VT1 – VT2 (3)
Figure 8. Inverting Configured Comparator - LM397
R1VO
VIN -
+
R3
VS
RPULL-UP
R2
9
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
LM397 will typically be used to compare a single signal to a reference or two signals against each other.
8.2 Typical Application
Figure 9. Inverting Comparator With Hysteresis
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 1 as the input parameters.
Table 1. Design Parameters
DESIGN
PARAMETER EXAMPLE VALUE
Input voltage range 0 V to VS– 1.5 V
Supply voltage 5 V to 30 V
Logic supply voltage
(RPULLUP voltage) 5 V to 30 V
Output current
(VLOGIC/RPULLUP)1 µA to 20 mA
Input overdrive
voltage 100 mV
Reference voltage 5.5 V
8.2.2 Detailed Design Procedure
When using TL331 in a general comparator application, determine the following:
• Input voltage range
• Minimum overdrive voltage
• Output and drive current
200 400 800 1200 1400 2000
-100
-
50
0
50
10
0
0
2
4
6
8
10
OUTPUT (V)
TIME (ns)
VOD = 50mV
VOD = 5mV
OVERDRIVE
VOLTAGE (VOD)
VS = 5V, RPULL-UP = 5.1k: TO VS
CL = 15pF TO GND
INPUT (mV)
200 400 800 1200 1400 2000
-100
-
50
0
50
10
0
0
2
4
6
8
10
OUTPUT (V)
TIME (ns)
VOD = 50mV VOD = 5mV
OVERDRIVE
VOLTAGE (VOD)
VS = 5V, RPULL-UP = 5.1k: TO VS
CL = 15pF TO GND
INPUT (mV)
10
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8.2.2.1 Input Voltage Range
When choosing the input voltage range, the input common mode voltage range (VCM) must be taken in to
account. If temperature operation is above or below 25°C the VCM can range from 0 V to VS– 1.5 V. This limits
the input voltage range to as high as VS– 1.5 V and as low as 0 V. Operation outside of this range can yield
incorrect comparisons.
Below is a list of input voltage situation and their outcomes:
1. When both IN– and IN+ are both within the common mode range:
(a) If IN– is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking
current
(b) If IN– is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is
not conducting
2. When IN– is higher than common mode and IN+ is within common mode, the output is low and the output
transistor is sinking current
3. When IN+ is higher than common mode and IN– is within common mode, the output is high impedance and
the output transistor is not conducting
4. When IN– and IN+ are both higher than common mode, the output is low and the output transistor is sinking
current
8.2.2.2 Minimum Overdrive Voltage
Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the comparator
over the offset voltage. To make an accurate comparison; the overdrive voltage should be higher than the input
offset voltage. Overdrive voltage can also determine the response time of the comparator, with the response time
decreasing with increasing overdrive.
8.2.2.3 Output and Drive Current
Output current is determined by the pullup resistance (RPULLUP) and VSvoltage. The output current will produce a
output low voltage (VOL) from the comparator. In which VOL is proportional to the output current. Use Figure 3 to
determine VOL based on the output current. The output current can also effect the transient response.
8.2.3 Application Curves
Figure 10. Response Time for Various Input Overdrives –
tPHL
Figure 11. Response Time for Various Input Overdrives –
tPLH
IN+
IN-
V±
V+
OUT
VS+
GND
GND
Only needed for
dual-supply
operation
OUT
IN-
IN+
Run the input traces
as far away from
the supply lines
as possible Use low-ESR, ceramic
bypass capacitor
VS± or GND
11
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9 Power Supply Recommendations
Place 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high
impedance power supplies. For more detailed information on bypass capacitor placement; see the Layout
Guidelines section.
10 Layout
10.1 Layout Guidelines
Comparators are very sensitive to input noise. For best results, maintain the following layout guidelines:
• Use a printed-circuit-board (PCB) with a good, unbroken low-inductance ground plane. Proper grounding (use
of ground plane) helps maintain specified performance of the LM397.
• To minimize supply noise, place a decoupling capacitor (0.1-μF ceramic, surface-mount capacitor) as close
as possible to VSas shown in Figure 12.
• On the inputs and the output, keep lead lengths as short as possible to avoid unwanted parasitic feedback
around the comparator. Keep inputs away from the output.
• Solder the device directly to the PCB rather than using a socket.
• For slow-moving input signals, take care to prevent parasitic feedback. A small capacitor (1000 pF or less)
placed between the inputs can help eliminate oscillations in the transition region. This capacitor causes some
degradation to propagation delay when the impedance is low. Run the top-side ground plane between the
output and inputs.
• Run the ground pin ground trace under the device up to the bypass capacitor, shielding the inputs from the
outputs.
10.2 Layout Example
Figure 12. Comparator Board Layout
12
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11 Device and Documentation Support
11.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM397MF ACTIVE SOT-23 DBV 5 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 C397
LM397MF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 C397
LM397MFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 C397
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM397MF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM397MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM397MFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM397MF SOT-23 DBV 5 1000 210.0 185.0 35.0
LM397MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LM397MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2019
Pack Materials-Page 2
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PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.9
1.45
0.90
0.15
0.00 TYP
5X 0.5
0.3
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
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EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/E 09/2019
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
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EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
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