Intel® Desktop Board BA810
Technical Product Specificatio n
The Inte l ® Desktop Board BA810 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized
errata are documented in the Intel Desktop Board BA810 Specification Update.
March 2000
Order Number A15858-001
Revision History
Revision Revision History Date
-001 First Release of the Intel® Desktop Board BA810 Technical Product
Specification March 2000
This product specification applies to only standard BA810 boards with BIOS identifier
BA81010A.86A.
Changes to this specification will be published in the Intel Desktop Board BA810 Specification
Update before being incorporated into a revision of this document.
Inform ati on i n this docum e nt is provi ded i n connect i o n with Intel® products. No license, ex press or impl i ed, by estoppel or
otherwise, to any intellect ual propert y ri ghts is granted by this document. Except as provided i n Int el’s Terms and Conditions
of Sale for such products , Intel assumes no liability whatsoever, and Intel discl ai ms any ex press or i mplied warranty, rel ati ng
to sale and/or use of Inte l products including liabili ty or warranti es rel ating to fitness for a partic ul ar purpose, m erchantability,
or infringem ent of any patent, copyright or other i ntellectual property ri ght. Int el products are not intended for use in medi cal,
life saving, or l ife sust ai ni ng applications.
Intel may make changes t o specifications and product descri ptions at any time, without notice.
The Intel® Desktop Board BA810 may contain design defects or errors known as errata that m ay caus e the product t o
deviate from publi shed specifications. Current characterized errata are available on request.
Contact y our loc al I ntel sal es off ic e or your distri butor to obtain the latest specif i cations before placing your product order.
Copies of documents whic h have an ordering number and are referenced in this document, or other Int e l literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
†Third-party brands and names are the property of their respective owners.
Copyright 2000, Int el Corporati on. Al l Rights Reserved.
iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for the BA810 board. It describes the
standard BA810 board product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the board and its components
to the vendors, system integrators, and other engineers and technicians who need this level of
inform ation. It is specif ic all y not in ten ded for gene ral audiences.
What This Document Contains
Chapter Description
1 A descriptio n of the hardw are used on this boa rd
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, and POST codes
Typographical Co nventions
This section contains inform ation about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifica tions of this type.
Notes, Cautions, and Warnings
✏NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions which, if not observed, can cause personal injury.
Intel Desktop Board BA810 Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#).
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the board, and X is the instance of the particular part at that general
location. For example, J5J1 is a connector, located at 5J. It is the first connector in the 5J area.
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
GB Gigabyte (1,073,741,824 bytes)
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
†This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
v
Contents
1 Board Description
1.1 Overview ................................................................................................................... 10
1.1.1 Feature Summary........................................................................................ 10
1.1.2 Board Layout............................................................................................... 11
1.1.3 Block Diagram............................................................................................. 12
1.2 Online Support ........................................................................................................... 13
1.3 Design Specifications ................................................................................................ 13
1.4 Processor.................................................................................................................. 16
1.5 System Memory......................................................................................................... 17
1.6 Intel® 810 Chipset...................................................................................................... 18
1.6.1 Direct AGP.................................................................................................. 19
1.6.2 USB............................................................................................................. 19
1.6.3 USB Hub..................................................................................................... 20
1.6.4 IDE Support................................................................................................. 20
1.6.5 Real-Time Clock, CMOS SRAM, and Battery.............................................. 20
1.7 I/O Controller............................................................................................................. 21
1.8 Serial Port..................................................................................................................21
1.9 Graphics Subsystem.................................................................................................. 22
1.10 Audio Subsystem....................................................................................................... 23
1.10.1 AD1881 Analog Codec................................................................................ 24
1.10.2 Audio Connectors........................................................................................ 24
1.11 Modem Subsystem.................................................................................................... 25
1.11.1 Software Modem......................................................................................... 25
1.11.2 Modem Codec............................................................................................. 25
1.11.3 Modem AT Commands and S-Register Settings ......................................... 25
1.11.4 Modem Specifications................................................................................. 26
1.12 Power Management Features.................................................................................... 27
1.12.1 ACPI............................................................................................................ 27
1.12.2 APM............................................................................................................ 29
1.12.3 Hardware Support....................................................................................... 30
2 Technical Reference
2.1 Introduction................................................................................................................35
2.2 Memo ry Map.............................................................................................................. 35
2.3 I/O Map......................................................................................................................36
2.4 DMA Channels .......................................................................................................... 37
2.5 PCI Configuration Space Map ................................................................................... 38
2.6 Interrupts...................................................................................................................38
2.7 PCI Interrupt Routing Map......................................................................................... 39
2.8 Connectors................................................................................................................ 40
2.8.1 Back Panel I/O Connectors......................................................................... 41
2.8.2 Internal I/O Connectors ............................................................................... 44
2.8.3 External I/ O Connectors.............................................................................. 48
2.9 Jumper Block............................................................................................................. 51
Intel Desktop Board BA810 Technical Product Specification
vi
2.10 Mechanical Considerations........................................................................................ 53
2.10.1 FlexATX Form Factor.................................................................................. 53
2.10.2 I/O Shield.................................................................................................... 54
2.11 Electrical Considerations........................................................................................... 55
2.11.1 Power Consumption.................................................................................... 55
2.11.2 Power Supply Considerations...................................................................... 55
2.11.3 Fan Power Requirements............................................................................ 56
2.12 Thermal Considerations............................................................................................. 57
2.13 Reliability................................................................................................................... 58
2.14 Environmental............................................................................................................ 59
2.15 Regulatory Compliance ............................................................................................. 59
2.15.1 Safety Regulations...................................................................................... 59
2.15.2 EMC Regulations ........................................................................................ 60
2.15.3 Telecommunications Regulations................................................................ 60
2.15.4 Telecommunications Regulatory Information............................................... 61
2.15.5 Certification Markings.................................................................................. 64
3 Overview of BIOS Features
3.1 Introduction................................................................................................................65
3.2 BIOS Flash Memory Organization ............................................................................. 66
3.3 Resource Configuration............................................................................................. 67
3.3.1 PCI Autoconfiguration.................................................................................. 67
3.3.2 PCI IDE Support.......................................................................................... 67
3.4 System Management BIOS (SMBIOS) ...................................................................... 68
3.5 BIOS Updates............................................................................................................ 69
3.5.1 Language Support....................................................................................... 69
3.5.2 Custom Splash Screen................................................................................ 69
3.6 Recovering BIOS Data .............................................................................................. 70
3.7 Boo t Op ti ons.............................................................................................................. 71
3.7.1 Booting from CD-ROM................................................................................ 71
3.7.2 Booting Without Attached Devices .............................................................. 71
3.8 USB Legacy Support................................................................................................. 72
3.9 BIOS Security Features............................................................................................. 73
4 BIOS Setup Program
4.1 Introduction................................................................................................................75
4.2 Maintenance Menu.................................................................................................... 76
4.3 Main Menu................................................................................................................. 77
4.4 Advanced Menu......................................................................................................... 78
4.4.1 Boot Configuration Submenu....................................................................... 79
4.4.2 Peripheral Configuration Submenu.............................................................. 80
4.4.3 IDE Configuration........................................................................................ 81
4.4.4 Diskette Configuration Submenu................................................................. 83
4.4.5 Event Log Configuration.............................................................................. 84
4.5 Secu r i ty Me nu............................................................................................................ 85
4.6 Power Menu.............................................................................................................. 86
4.7 Boo t Me n u................................................................................................................. 87
4.8 Exit Menu .................................................................................................................. 88
Contents
vii
5 Error Messages and Beep Codes
5.1 BIOS Error Messages................................................................................................ 89
5.2 Bus Initialization Checkpoints.................................................................................... 91
5.3 Speaker.....................................................................................................................92
5.4 BIOS Beep Codes..................................................................................................... 93
Figures
1. Board Components.................................................................................................... 11
2. Block Diagram........................................................................................................... 12
3. Intel 810 Chipset Block Diagram................................................................................ 18
4. Block Diagram of Audio Subsystem with AD1881 Analog Codec............................... 23
5. Location of Standby Power Indicator LED.................................................................. 32
6. Back Panel I/O Connectors........................................................................................ 41
7. Internal I/O Connectors.............................................................................................. 44
8. External I/O Connectors ............................................................................................ 48
9. Location of the Jumper Block ..................................................................................... 51
10. Board Dimensions..................................................................................................... 53
11. I/O Shield Dimensions............................................................................................... 54
12. High Temperature Zones........................................................................................... 57
13. Memory Map of the Flash Memory Device ................................................................. 66
Tables
1. Feature Summary...................................................................................................... 10
2. Specifications ............................................................................................................ 13
3. Supported Processors............................................................................................... 16
4. System Memory Configu ra tion................................................................................... 17
5. Supported Graphics Refresh Rates........................................................................... 22
6. Modem Specifications................................................................................................ 26
7. Effects of Pressing the Power Switch ........................................................................ 27
8. Power States and Targeted System Power ............................................................... 28
9. ACPI Wake Up Devices and Events.......................................................................... 29
10. APM Wake Up Devices and Events........................................................................... 30
11. Fan Connector Descriptions ...................................................................................... 31
12. System Memory Ma p................................................................................................. 35
13. I/O Map......................................................................................................................36
14. DMA Channels .......................................................................................................... 37
15. PCI Configuration Space Map ................................................................................... 38
16. Interrupts...................................................................................................................38
17. PCI Interrupt Routing Map......................................................................................... 39
18. USB Connectors........................................................................................................ 42
19. VGA Port Connector.................................................................................................. 42
20. Audio Line Out Connector.......................................................................................... 43
21. Mic In Connector ....................................................................................................... 43
22. RJ-11 Telephone Jack............................................................................................... 43
23. Processor Fan Connector (J5J1)............................................................................... 45
24. Power Connector (J7G3)........................................................................................... 45
25. Diskette Drive Connector (J7D1) ............................................................................... 46
Intel Desktop Board BA810 Technical Product Specification
viii
26. IDE Connector (J7B1)................................................................................................ 47
27. Chassis Fan Connector (J1A1).................................................................................. 47
28. USB Port Connector (J7G1) ...................................................................................... 49
29. Front Panel Connector (J7G2)................................................................................... 49
30. Serial Port Connector (J7C1)..................................................................................... 49
31. States for a Single-colored Power LED...................................................................... 50
32. States for a Dual-colored Power LED........................................................................ 50
33. BIOS Setup Configuration Jumper Settings (J6A1).................................................... 52
34. Power Usage............................................................................................................. 55
35. Chassis Fan (J1A1) DC Power Requirements........................................................... 56
36. Thermal Considerations for Components................................................................... 58
37. Board Environmental Specifications .......................................................................... 59
38. Safety Regulations..................................................................................................... 59
39. EMC Regulations....................................................................................................... 60
40. Telecommunications Regulations.............................................................................. 60
41. Supervisor and User Password Functions................................................................. 73
42. BIOS Setup Program Menu Bar................................................................................. 75
43. BIOS Setup Program Function Keys.......................................................................... 76
44. Maintenance Menu.................................................................................................... 76
45. Main Menu................................................................................................................. 77
46. Advanced Menu......................................................................................................... 78
47. Boot Configuration Submenu..................................................................................... 79
48. Peripheral Configuration Submenu............................................................................ 80
49. IDE Device Configuration........................................................................................... 81
50. Primary IDE Master/Slave Submenus........................................................................ 82
51. Diskette Configurations Submenu .............................................................................. 83
52. Event Log Configuration Submenu............................................................................ 84
53. Secu ri ty Me nu............................................................................................................ 85
54. Power Menu.............................................................................................................. 86
55. Boo t Me n u................................................................................................................. 87
56. Exit Menu .................................................................................................................. 88
57. BIOS Error Messages................................................................................................ 89
58. Bus Initialization Checkpoints.................................................................................... 91
59. Upper Nibble High Byte Functions............................................................................. 91
60. Lower Nibble High Byte Functions............................................................................. 92
61. Beep Codes............................................................................................................... 93
9
1 Board Description
What This Chapter Contains
1.1 Overview ................................................................................................................... 10
1.2 Online Support ........................................................................................................... 13
1.3 Design Specifications ................................................................................................ 13
1.4 Processor.................................................................................................................. 16
1.5 System Memory......................................................................................................... 17
1.6 Intel® 810 Chipset...................................................................................................... 18
1.7 I/O Controller............................................................................................................. 21
1.8 Serial Port..................................................................................................................21
1.9 Graphics Subsystem.................................................................................................. 22
1.10 Audio Subsystem....................................................................................................... 23
1.11 Modem Subsystem.................................................................................................... 25
1.12 Power Management Features.................................................................................... 27
Intel Desktop Board BA810 Technical Product Specification
10
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the BA810 board’s major features.
Table 1. Feature Summary
Form Factor FlexATX (9.0 inches by 7.2 inches)
Processor Support for either an:
• Intel® Pentium® III processor with 256 KB L2 cache (in an FCPGA package)
• Intel® Cel eron™ processor with 128 KB L2 cache (in a PPGA package)
Memory • One 22° 168-pin dual inline memory module (DIMM) socket
• Supports up to 256 MB of 100 MHz non-ECC synchronous DRAM (SDRAM)
• Support for a serial presence detect (SPD) or a non-SPD DIMM
Chipset Intel® 810 Chipset, consisting of:
• Intel®
82810 Graphics/Memory Controller Hub (GMCH)
• Intel®
82801AA I/O Controller Hub (ICH)
• Intel®
82802AB 4 Mbit Firmware Hub (FWH)
Instantly
Available PC • Support for
PCI Local Bus Specification, Revision 2.2
• Suspend-to-RAM support
• Wake from USB
Accelerated
Graphics Port
(AGP) Video
• Intel 82810 GMCH graphics support
• 4 MB d ispl ay cach e
Audio Audio Codec ’97 (AC’97) compatible audio subsystem, consisting of the fol lowing:
• Intel 82801AA ICH (AC link output)
• Analog Devices AD1881 analog codec
I/O Controller IT8761E Low Pi n Count (LPC) I/O controller
Onboard modem • Motorola SM56 AC-L (AC link) software modem
• Silicon Laboratories Si3038 family MC ’97 modem codec
USB Hub TUSB2046
Peripheral
Interfaces • Four universal serial bus (USB) ports
• One IDE interface with Ultra DMA support
• One diskette drive interface
• One 9-pin serial port connector
BIOS • Intel/AMI BIOS stored in an Intel 82802AB 4 Mbit Firmware Hub (FWH)
• Support for Advanced Configuration and Power Interface (ACPI), Advanced Power
Management (APM), Plug and Play, and SMBIOS
✏NOTE
The BA810 board is designed to support only USB-aware operating systems.
For information about Refer to
The board’s compliance level with ACPI, APM, Plug and Play, and SMBIOS Table 2, page 13
Board Description
11
1.1.2 Board Layout
Figure 1 shows the location of the major components on the board.
OM09829
A
P
N
L
M
OC
B
E
D
IJ HK
F
G
Q
A Back panel connectors J Diskette drive connector
BIntel 82810 Graphics Memory
Controller Hub (GMCH) K IT8761E I/O controller
C Processor socket L IDE connector
D Battery M Intel 82801AA I/O Controller Hub (ICH)
E 22 DIMM socket N Intel 82802AB Firmware Hub (FWH)
F Speaker O 4 MB display cache
G USB hub P AD1881 analog codec
H Front panel connector Q Modem codec devices
I Power connector
Figure 1. Board Components
Intel Desktop Board BA810 Technical Product Specification
12
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
810 Chipset
Processor
Socket
DIMM
Socket
Primary IDE
LPC I/O
Controller
ATA-33/66
USB
Bus
66/100 MHz
System Bus
AC Link Analog
Codec
82801AA I/O Controller
Hub (ICH)
82810
Graphics Memory
Controller Hub
(GMCH)
82802AB
Firmware Hub
(FWH)
AHA
Bus
Display
Interface
VGA
Port
100 MHz
4 MB Display
Cache
Line Out
Mic In
Port 4
Port 3
USB
Hub
Controller
LPC
Bus
Diskette
Drive
Connector
Port 2
Port 1
Modem
Codec
Serial Port
Connector
RJ-11
Connector
100 MHz
SDRAM
Bus
OM09131
Figure 2. Block Diagram
Board Description
13
1.2 Online Support
Find information about Intel® desktop boards under “Product Info” or “Customer Support” at these
World Wide Web sites:
http://www.intel.com/design/motherbd
1.3 Design Specifications
Table 2 lists the specifications applicable to the BA810 board.
Table 2. Specifications
Description Specification Title Version, Revision Date,
and Ownership The specification is
available from…
AC ‘97
Audio Codec ‘97
Version 2.1,
May 22, 1998,
Intel Corporation.
http://developer.intel.com/
ial/scalableplatforms/
audio/index.htm
ACPI
Advanced Configuration
and Power Interface
Specification
Version 1.0b,
February 2, 1999,
Intel Corporation,
Microsoft Corporation,
and Toshiba Corporation.
http://www.teleport.com/
~acpi/
AGP
Accelerated Graphics
Port Interface
Specification
Version 2.0,
May 4, 1998,
Intel Corporation.
http://www.intel.com/
technology/agp/
agp_index.htm
AMI BIOS
American Megatrends
BIOS Specification
AMIBIOS 99,
June 1999,
American Megatrends, Inc.
http://www.ami.com/
amibios/bios.platforms.
desktop.html
APM
Advanced Power
Management
Specification
Version 1.2,
February, 1996,
Intel Corporation
and Microsoft Corporation.
http://www.microsoft.com/
hwdev/busbios/
amp_12.htm
ATAPI
Information Technology
AT Attachment with
Packet Interface
Extensions
T13/1153D
Version 18,
August 19, 1998,
Contact: T13 Chair,
Seagate Technology.
T13 Anonymous FTP Site:
ftp://fission.dt.wdc.com/
x3t13/project/
d1153r18.pdf
ATX
ATX Specification
Revision 2.01,
February 1997,
Intel Corporation.
http://developer.intel.com/
design/motherbd/atx.htm
El Torito
Bootable CD-ROM
Format Specification
Version 1.0,
January 25, 1995,
Phoenix Technologies Ltd.
and IBM Corporation.
the Phoenix Technologies
Web site at:
http://www.ptltd.com/
techs/specs.html
continued
Intel Desktop Board BA810 Technical Product Specification
14
Table 2. Specifications (continued)
Description Specification Title Version, Revision Date,
and Ownership The specification is
available from…
FlexATX
FlexATX addendum
Addendum version 1.0
to the microATX Specification
version 1.0,
March 12, 1999,
Intel Corporation.
http://www.teleport.com/
~ffsupprt/spec/
FlexATXaddn1_0.pdf
Intel Celeron
Processor
Int el Celeron Processor
January 2000,
Intel Corporation. http://developer.intel.com/
design/intarch/celeron/
nodoc.htm
Int el Celeron Processor
Specification Update
Version 22,
February 2000,
Intel Corporation.
http://developer.intel.com/
design/intarch/celeron/
nodoc.htm
Intel
Pentium III
Processor
Pentium III Processor for
the PGA370 Socket
January 2000,
Intel Corporation. http://developer.intel.com/
design/intarch/pentiumiii/
nodoc.htm
Pen tiu m III Processor
Specification Update
Version 13,
February 2000,
Intel Corporation.
http://developer.intel.com/
design/intarch/pentiumiii/
nodoc.htm
LPC
Low Pin Count Interface
Specification
Version 1.0,
September 29, 1997,
Intel Corporation.
http://www.intel.com/
design/chipsets/industry/
lpc.htm
MicroATX
microATX Motherboard
Interface Specification
Version 1.0,
December 1997,
Intel Corporation.
http://www.teleport.com/
~ffsupprt/spec/
microatxspecs.htm
SFX Power Supply
Design Guide
Version 1.1,
February 1998,
Intel Corporation.
http://www.teleport.com/
~ffsupprt/spec/
microatxspecs.htm
PCI
PCI Bus Power
Management Interf ac e
Specification
Version 1.1,
December 18, 1998,
PCI Special Interest Group.
http://www.pcisig.com/
tech/availspecs.html#5
PCI Local Bus
Specification
Version 2.2,
December 18, 1998,
PCI Special Interest Group.
http://www.pcisig.com/
tech/availspecs.html#5
Plug and
Play
Plug and Play BIOS
Specification
Version 1.0a,
May 5, 1994,
Compaq Computer Corp.,
Phoenix Technologies Ltd.,
and Intel Corporation.
http://www.microsoft.com/
hwdev/respec/
pnpspecs.htm
PC SDRAM Unbuffered
DIMM Specification
Revision 1.0,
February 1998,
Intel Corporation.
http://www.intel.com/
design/chipsets/memory/
pcsdram/spec/index.htm
SDRAM
DIMM
(64-and
72-bit)
PC SDRAM Serial
Presence Detect (SPD)
Specification
Revision 1.2B,
November 1999,
Intel Corporation.
http://www.intel.com/
design/chipsets/memory/
pcsdram/spec/index.htm
continued
Board Description
15
Table 2. Specifications (continued)
Description Specification Title Version, Revision Date,
and Ownership The specification is
available from…
SMBIOS
System Management
BIOS
Version 2.3.1
March 16, 1999,
American Megatrends Inc.,
Award Software International Inc.,
Compaq Computer Corporation,
Dell Computer Corporation,
Hewlett-Pa ckard Company,
Intel Corporation,
International Business Machines
Corporation,
Phoenix Technologies Limited,
and SystemSoft Corporation.
ftp://download.intel.com/
ial/wfm/smbios.pdf
UHCI
Universal Host Controller
Interface Design Guide
Version 1.1,
March 1996,
Intel Corporation.
http://developer.intel.com/
design/USB/UHCI11D.htm
USB
Universal Serial Bus
Specification
Version 1.1,
September 23, 1998,
Compaq Computer Corporation,
Intel Corporation,
Microsoft Corporation,
and NEC.
http://www.usb.org/
developers/docs.html
WfM
Wired for Management
Baseline
Version 2.0,
December 18, 1998,
Intel Corporation.
http://developer.intel.com/
ial/WfM/wfmspecs.htm
Intel Desktop Board BA810 Technical Product Specification
16
1.4 Processor
CAUTION
The board supports processors that draw a maximum of 19.4 A. Using a processor that draws
more than 19.4 A can damage the processor, the board, and the power supply. See the processor’s
data sheet for current usage requirements.
The board supports a single Celeron processor or a single Pentium III processor as shown in
Table 3. The system bus frequency is automatically selected.
Table 3. Supported Processors
Type Designation System Bus Frequency L2 Cache Size
Pentium III processor in a
FCPGA package 500E, 550E, 600E, 650,
700, 750, and 800 100 MHz 256 KB
Celeron processor in a
PPGA package 333, 366, 400, 433, 466,
500, 533, 566, and 600 66 MHz 128 KB
All supported onboard memory can be cached, up to the cachability limit of the processor.
For information about Refer to
Intel Celeron processor datasheets and specification updates Table 2, page 13
Intel Pentium III processor datasheets and specification updates Table 2, page 13
Processor support for the BA810 board http://support.intel.com/support/
motherboards/desktop
Board Description
17
1.5 System Memory
CAUTION
To be fully compliant with all applicable Intel® SDRAM memory specifications, the board should
be populated with a DIMM that supports the Serial Presence Detect (SPD) data structure. If your
memory module does not support SPD, you will see a notification to this effect on the screen at
power up. The BIOS will attempt to configure the memory controller for normal operation;
however, the DIMM may not function at the determined frequency.
CAUTION
Because the main system memory is also used as video memory, the board requires a 100 MHz
SDRAM DIMM even though the system bus frequency may be 66 MHz. It is highly recommended
that an SPD DIMM be used, since this allows the BIOS to read the SPD data and program the
chipset to accurately configure memory settings for optimum performance. If non-SPD memory is
installed, the BIOS will attempt to correctly configure the memory settings, but performance and
reliability may be impacted.
The board has one 22º DIMM socket. The minimum memory size is 32 MB and the maximum
memory size is 256 MB. The BIOS automatically detects memory type, size, and frequency.
The board supports the followi ng me mory fe atu res :
• 3.3 V, 168-pin DIMM with gold-plated contacts
• 100 MHz SDRAM
• Serial Presence Detect (SPD) or non-SPD memory (BIOS recovery requires SPD DIMM)
• Non-ECC (64-bit) memory
• Unbuffered single- or double-sided DIMM
The board is designed to support a DIMM in the configurations listed in Table 4 below.
Table 4. System Memory Configuration
DIMM Size Non-ECC Configuration
32 MB 4 Mbit x 64
64 MB 8 Mbit x 64
128 MB 16 Mbit x 64
256 MB 32 Mbit x 64
For information about Refer to
The
PC Serial Presence Detect Specification
Table 2, page 13
Obtaining copies of PC SDRAM specifications Table 2, page 13
Intel Desktop Board BA810 Technical Product Specification
18
1.6 Intel® 810 Chipset
The Intel 810 chipset consists of the following devices:
• 82810 Graphics Memory Controller Hub (GMCH) with accelerated hub architecture (AHA)
bus.
• 82801AA I/O Controller Hub (ICH) with AHA bus supports ATA-33 and ATA-66 devices,
Suspend-to-RAM, and Wake from USB.
• 82802AB Firmware Hub (FWH).
The chipset provides the system, memory, display, and I/O interfaces shown in Figure 3.
810 Chipset
82801AA I/O Controller
Hub (ICH)
82810
Graphics Memory
Controller Hub
(GMCH)
82802AB
Firmware Hub
(FWH)
100 MHz
SDRAM
Bus
AHA
Bus
ATA-33/66 USB
66/100 MHz
System Bus
AC Link
LPC Bus
Display
Interface
OM09235
Display
Cache
Figure 3. Intel 810 Chipset Block Diagram
For information about Re fer to
The Intel 810 chipset http://developer.intel.com
The resources used by the chipset Chapter 2
The chipset’s compliance with ACPI and AC ‘97 Table 2, page 13
Board Description
19
1.6.1 Direct AGP
Direct (integrated) AGP is a high-performance bus (independent of the PCI bus) for graphics-
intensive applications, such as 3D applications. AGP overcomes certain limitations of the PCI bus
related to handling large amount of graphics data with the following features:
• Pipelined memory read and write operations that hide memory access latency
• Demultiplexing of address and data on the bus for nearly 100 percent bus efficiency
For information about Refer to
The location of the VGA port connector Figure 6, page 41
Obtaining the
Accelerated Graphics Port Interface Specification
Table 2, page 13
1.6.2 USB
The board has an onboard USB hub and four USB ports; one USB peripheral can be connected to
each port. For more than four USB devices, an external hub can be connected to any of the ports.
Two of the USB ports are implemented with stacked back panel connectors. The other two ports
are routed to the front panel conne ctor; access ing thes e port s requires a cable fr om the pane l
connector to the front of the chassis. The board fully supports UHCI and uses UHCI-compatible
software drivers. USB features include:
• Self-identifying peripherals that can be plugged in while the computer is running
• Automatic mapping of function to driver and configuration
• Support for isochronous and asynchronous transfer types over the same set of wires
• Support for up to 127 physical devices
• Guaranteed bandwidth and low latencies appropriate for telephony, audio, and other
applications
• Error-handling and fault-recovery mechanisms built into the protocol
✏NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 6, page 41
The signal names of the USB connectors Table 18, page 42
The location of the front panel USB connector Figure 8, page 48
The signal names of the front panel USB connector Table 28, page 49
The USB and UHCI specifications Table 2, page 13
Intel Desktop Board BA810 Technical Product Specification
20
1.6.3 USB Hub
The TUSB2046 USB hub provides the following features:
• Universal Serial Bus version 1.1 compliant
• One upstream port and three downstream ports
• All downstream ports support full-speed and low-speed operations
• Suspend and resume operations support
For information about Refer to
The TUSB2046 USB Hub http://www.ti.com
1.6.4 IDE Support
The board has one bus-mastering IDE interface. This interface supports:
• ATAPI devices (such as CD-ROM drives)
• ATA devices using the transfer modes listed in Table 50 on page 82
The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The board supports laser servo (LS-120) diskette technology through its IDE interface. The LS-120
drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of
the followin g:
• ARMD-FDD (ATAPI removable media device – floppy disk drive)
• ARMD-HDD (ATAPI removable media device – hard disk drive)
For information about Refer to
The location of the IDE connector Figure 7, page 44
The signal names of the IDE connector Table 26, page 47
BIOS Setup program’s Boot menu Table 55, page 87
1.6.5 Real -Ti m e Clock, CMOS SRAM, and Battery
The real-time clock is compatible with DS1287 and MC146818 components. The clock provides a
time-of-day clock and a multicentury calendar with alarm features and century rollover. The
real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved
for BIOS use.
A coin-cell battery powers the real-time clock and CMOS memory. When the computer is not
plugged into a wall socket, the battery has an estimated life of three years. When the computer is
plugged in, the 3.3 V standby current from the power supply extends the life of the battery. The
clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values
can be returned to their defaults by using the BIOS Setup program.
Board Description
21
✏NOTE
If the battery and AC power fail, standard defaults, not custom defaults, will be loaded into CMOS
RAM at power on.
✏NOTE
The recommended method of accessing the date in systems with Intel desktop boards is indirectly
from the Real-Time Clock (RTC) via the BIOS. The BIOS on Intel desktop boards contains a
century checking and maintenance feature. This feature checks the two least significant digits of
the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80
(i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature
enables operating systems and applications using the BIOS date/time services to reliably
manipulate the year as a four-digit value.
For information about Refer to
Proper date access in systems with Intel desktop boards http://support.intel.com/support/year2000/
1.7 I/O Controller
The IT8761E I/O controller provides the following features:
• Low pin count (LPC) interface
• One serial port
• Plug and Play compatible register set
• Support for SERIRQ protocol
• Supports System Management Interrupt (SMI)
• Interface for one 1.2 MB, 1.44 MB, or 2.88 MB diskette drive
• Fan monitoring
The BIOS Setup program provides configuration options for the I/O controller.
For information about Refer to
The IT8761E I/O controller http://www.iteusa.com
1.8 Serial Port
The board has one 9-pin serial port connector. This is not accessible through the back panel. The
serial port’s NS16C550-compatible UART supports data transfers at rates of up to 115.2 kbits/sec
with BIOS support. The serial port can be assigned as COM1 (3F8h), COM2 (2F8h), COM3
(3E8h), or COM4 (2E8h).
For information about Refer to
The location of the serial port connector Figure 8, page 48
The signal names of the serial port connector Table 30, page 49
Intel Desktop Board BA810 Technical Product Specification
22
1.9 Graphics Subsystem
The graphics subsystem provides the following features:
• Intel 82810 GMCH graphics support, including:
Integrated 2D and 3D graphics engines
Integrated hardware motion compression engine
Integrated 230 MHz DAC
• 4 MB of SDRAM display cache, 100 MHz display cache for 66/100 MHz system bus processor
Table 5 lists the refresh rates supported by the graphics subsystem. Supported graphics refresh
rates may vary depending on BIOS and video driver version used.
Table 5. Supported Graphics Refresh Rates
Resolution Available Refresh Rates (Hz)
640 x 200 x 16 colors 70
640 x 350 x 16 colors 70
640 x 400 x 256 colors 60, 70, 75, 85
640 x 400 x 64 K colors 60, 70, 75, 85
640 x 400 x 16 M colors 70
640 x 480 x 16 colors 60, 72, 75, 85
640 x 480 x 256 colors 60, 70, 72, 75, 85
640 x 480 x 32 K colors 60, 75, 85
640 x 480 x 64 K colors 60, 70, 72, 75, 85
640 x 480 x 16 M colors 60, 70, 72, 75, 85
800 x 600 x 256 colors 60, 75, 85
800 x 600 x 32 K colors 60, 70, 72, 75, 85
800 x 600 x 64 K colors 60, 70, 72, 75, 85
800 x 600 x 16 M colors 60, 70, 72, 75, 85
1024 x 768 x 256 colors 60, 70, 75, 85
1024 x 768 x 32 K colors 60, 75, 85
1024 x 768 x 64 K colors 60, 70, 72, 75, 85
1024 x 768 x 16 M colors 60, 70, 72, 75, 85
1056 x 800 x 16 colors 70
1280 x 1024 x 256 colors 60, 70, 72, 75, 85
1280 x 1024 x 32 K colors 60, 75, 85
1280 x 1024 x 64 K colors 60, 70, 72, 75
1280 x 1024 x 16 M colors 60, 70, 72, 75, 85
For information about Refer to
Obtaining graphics software and utilities http://support.intel.com/support/motherboards/desktop
Board Description
23
1.10 Audio Subsystem
The board includes an Audio Codec ‘97 (AC ‘97) compatible SoundMAX† audio subsystem
consisting of the these devices:
• Intel 82801AA ICH (AC link output)
• Analog Devices AD1881 analog codec
Figure 4 is a block diagram of the audio subsystem.
82801AA
I/O Controller Hub (ICH)
AC Link AD1881
Analog
Codec Mic In
Line Out
OM09234
Figure 4. Block Diagram of Audio Subsystem with AD1881 Analog Codec
Features of the audio subsystem include:
• Independent channels for PCM in, PCM out, and Mic in
• 16-bit stereo I/O up to 48 kHz
• Multiple sample rates
For information about Refer to
Obtaining audio software and utilities http://support.intel.com/support/motherboards/desktop
Intel Desktop Board BA810 Technical Product Specification
24
1.10.1 AD1881 Analog Codec
The AD1881 is a fully AC ‘97 compliant codec. The codec's features include:
• 16-bit stereo full-duplex codec
• CD-quality audio
• Stereo line level output
• Power management support
• Full duplex variable sampling rate (7 kHz to 48 kHz) with 1 Hz resolution
• Phat† Stereo 3D stereo enhancement
For information about Refer to
The audio subsystem’s comp lia nce wi th AC ‘97 Table 2, page 13
1.10.2 Audio Connectors
The audio connectors, located on the back panel, include the following:
• Line out
• Mic in
✏NOTE
CD-ROM digital audio signals are routed through the IDE interface.
For information about Refer to
The location of the back panel audio connectors Figure 6, page 41
The signal names of the back panel audio connectors Section 2.8.1, page 41
Board Description
25
1.11 Modem Subsystem
The modem subsystem consists of the following:
• Motorola SM56 AC-L (AC link) software modem
• Silicon Laboratories Si3038 family MC ‘97 modem codec
• RJ-11 connector
1.11.1 Software Modem
The Motorola SM56 AC-L Software Modem is a Host Signal Processing (HSP) based modem with
both controller and datapump functions executed by the processor. The software driver works with
the Intel 82801AA ICH’s integrated AC-Link and the companion Si3038 family MC ‘97 modem
codec.
1.11.2 Modem Codec
The Silicon Laboratories Si3038 family consists of the following components:
• Si3014 Direct Access Arrangement (DAA) device (with a phone line interface)
• Si3024 (AC ‘97 interface)
Together, these devices provide a programmable line interface to meet international telephone line
requirements. The Si3038 family complies with international regulatory requirements and the
AC‘97/MC‘97 Interface Specification, Revision 2.1.
1.11.3 Modem AT Commands and S-Register Settings
Information on AT commands and S-register settings can be found in the Online SM56 User’s
Guide. The User’s Guide can be accessed by clicking on the Motorola SM56 Modem icon on the
desktop tray next to the time icon. Command information is available for the following:
• AT and AT& commands
• AT commands - basics
• AT#UD Unimodem diagnostic command
• AT% and AT\ commands
• AT* commands
• AT+ commands
• ATS (S-register) commands
Intel Desktop Board BA810 Technical Product Specification
26
1.11.4 Modem Specifications
Table 6 summarizes the modem’s features and capabilities.
Table 6. Modem Specifications
Data Modem V.90 and K56flex (up to 56 Kbps receive)
V.34 (33,600 bps - 2,400 bps)
V.32bis (14,400 bps - 4,800 bps)
V.32 (9,600 bps - 4,800 bps)
V.22bis (2,400 bps - 1,200 bps)
V.22 (1,200 bps)
V.23 (75/1,200 - 600 bps)
V.21 (300 bps)
Bell 212A (1,200 bps)
Bell 103 (300 bps)
Error Correction V.42, LAP-M and MNP 2-4
Data Compression V.42bis and MNP 5
Fax Modem Group III, Class 1
Class 1 fax error correction mo de
V.17 (14,400/12,000 bps)
V.29 (9,600/7,200 bps)
V.27ter (4,800/2,400 bps)
V.21 (300 bps)
Answering Machine 8 kHz PCM and IMA ADPCM
Concurrent DTMF detection
Voice/Silence detection
Video Phone Ready Modem V.80 sync access mode interface
Transparent and framed sub-modes
Voice call first supports Intel Video Phone with
Intel® ProShare® technology
Adaptive Connection Support V.8 automode negotiation
V.8 PRIME and V.8bis
Adaptive rate renegotiation
Automatically adjusts speeds up and down to accommodate
changing line conditions
Extensive Diagnostics Support AT&V, AT#UD- Call setup and phone line quality statistics
Real-time modem status with connect rate and retrain
indication
Last disconnect reason
Local Analog Loopback
(LAL)-Hardware board check
Other Telephony Features Tone detections: Dial tone, second dial tone
Ring back, busy
Data/Fax answering tones
DTMF
Enhanced Caller ID (U.S. and Canada) Supports name and number
Distinctive Ring Distinguish among data, fax, and voice
Windows† 98 SE Control Panel Applet Familiar Windows tabular interface
Easy to use on-line user’s guide
Real-time modem status
Flexible international country configuration
Essential product support information
Board Description
27
1.12 Power Management Features
Power management is implemented at several levels, including:
• Advanced Configuration and Power Interface (ACPI)
• Advanced Power Management (APM)
• Hardware support:
Power connector
Fan connectors
Instantly Available technology
Wake on Ring
Resume on Ring
Wake from USB
1.12.1 ACPI
If the board is used with an ACPI-aware operating system, the BIOS can provide ACPI support.
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with this board requires the support of an operating
system that provides full ACPI functionality. ACPI features include:
• Plug and Play (including bus and device enumeration) functionality normally contained in
the BIOS
• Power management control of individual devices, video displays, and hard disk drives
• Methods for achieving less than 30-watt system operation in the Power On Suspend sleeping
state, and less than 5-watt system operation in the Suspend to Disk sleeping state
• A Soft-off feature that enables the operating system to power off the computer
• Support for multiple wake up events (see Table 9 on page 29)
• Support for a front panel power and sleep mode switch. Table 7 lists the system states based on
how long the power switch is pressed, depending on how ACPI is configured with an
ACPI-aware operating system.
Table 7. Effects of Pressing the Power Switch
If the system is in this state… …and the power switch is
pressed for …the system enters this state
Off (ACPI G2/S5 state) Less than four seconds Power on
On (ACPI G0 state) Less than four seconds Soft off/Suspend
On (ACPI G0 state) More than four seconds Fail safe power off
Sleep (ACPI G1 state) Less than four seconds Wake up
Sleep (ACPI G1 state) More than four seconds Power off
For information about Refer to
The board’s compliance level with ACPI Table 2, page 13
Intel Desktop Board BA810 Technical Product Specification
28
1.12.1.1 System States and Po w e r States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 8 lists the power states supported by the board along with the associated system power
targets. See the ACPI specification for a complete description of the various system and power
states.
Table 8. Power States and Targeted System Power
Global States Sleeping States CPU States Device States Targeted System Power*
G0 – working
state. S0 – working. C0 – working. D0 – working
state. Full power > 30 W.
G1 – sleeping
state. S1 – CPU stopped. C1 – stop
grant. D1, D2, D3 –
device
specification
specific.
5 W < power < 30 W.
G1 – sleeping
state. S3 – Suspend-to-
RAM. Context
saved to RAM.
No power. D3 – no power
except for wake
up logic.
Power < 5W. **
G2/S5 S5 – Soft off.
Context not saved.
Cold boot is
required.
No power. D3 – no power
except for wake
up logic.
Power < 5 W. **
G3 –
mechanical off.
AC power is
disconnected
from the
computer.
No power to the
system. No power. D3 – no power for
wake up logic,
except when
provided by
battery or external
source.
No power to the system so
that service can be
performed.
* Tot al system power is dependent on the system confi guration, including add-i n boards and peripherals powered by the
syst em chassis ’ power supply .
** Dependent on the standby power consumpti on of wake-up devices used in the syst em.
Board Description
29
1.12.1.2 Wake Up Devices and Events
Table 9 lists the devices or specific events that can wake the computer from specific states.
Table 9. ACPI Wake Up Devices and Events
These devices/events can wake up the computer… …from this state
Power switch S3, S5
RTC alarm* S1, S3
Modem S1, S3
USB S1, S3
*Unattended Wak e Mode – display wil l be video BIOS ID st ri ng only
1.12.1.3 Plug and Play
In addition to power management, ACPI provides controls and information so that the operating
system can facilitate Plug and Play device enumeration and configuration. ACPI is used only to
enumerate and configure onboard devices that do not have other hardware standards for
enumeration and configuration. PCI devices on the board, for example, are not enumerated
by ACPI.
1.12.2 APM
APM makes it possible for the computer to enter an energy saving standby mode. The standby
mode can be initiated in the following ways:
• Time-out period specified in the BIOS Setup program
• Suspend/Resume switch connected to the front panel sleep connector
• From the operating system, such as the Suspend menu item in Windows 98 SE
In standby mode, the board can reduce power consumption by spinning down hard drives, and
reducing power to or turning off VESA† DPMS-compliant monitors. Power-management mode
can be enabled or disabled in the BIOS Setup program.
While in standby mode, the system retains the ability to respond to external interrupts and service
requests, such as incoming faxes or network messages. Any keyboard or mouse activity brings the
system out of standby mode and immediately restores power to the monitor.
The BIOS enables APM by defau lt, but the operat ing syste m must support an APM drive r for the
power-management features to work. For example, Windows 98 SE supports the power-
managemen t featu re s upon detecting tha t APM is enabled in the BIOS.
Intel Desktop Board BA810 Technical Product Specification
30
Table 10 lists the devices or specific events that can wake the computer from specific states.
Table 10. APM Wake Up Devices and Events
These devices/events can wake up the computer… …from this state
Power switch Soft-off
RTC alarm* Soft-off, suspend
Modem Soft-off, suspend
USB Suspend
*Unattended Wak e Mode – display wil l be video BIOS stri ng only
For information about Refer to
Enabling or disabling power management in the BIOS Setup program Section 4.6, page 86
The board’s compliance level with APM Table 2, page 13
1.12.3 Hardware Support
CAUTION
If Instantly Available technology feature is used, ensure that the power supply provides adequate
+5 V standby current. Failure to do so can damage the power supply. The total amount of standby
current required depends on the wake devices supported and manufacturing options. Refer to
Section 2.11.2 on page 55 for additional information.
The board provides several hardware features that support power management, including:
• Power connector
• Fan connectors
• Instantly Available technology
• Wake on Ring
• Resume on Ring
• Wake from USB
Instantly Available technology requires power from the +5 V standby line. The sections discussing
these features describe the incremental standby power requirements.
Wake on Ring and Resume on Ring enable telephony devices to access the computer when it is in a
power-managed state. The method used depends on the type of telephony device (external or
internal) and the ACPI or APM state being used.
✏NOTE
The use of Wake on Ring, Resume on Ring, and Wake from USB technologies from an ACPI state
require the support of an operat ing system and a peripheral device tha t provides ful l ACPI
functionality.
Board Description
31
1.12.3.1 Power Connector
When used with an ATX-compliant power supply that supports remote power on/off, the board can
turn off the system power through software control.
With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected
power cord, when power resumes, the computer returns to the power state it was in before power
was interrupted (on or off).
For information about Refer to
The location of the power connector Figure 7, page 44
The signal names of the power connector Table 24, page 45
The ATX specification Table 2, page 13
1.12.3.2 Fan Connectors
The board has two fan connectors. The functions of these connectors are described in Table 11.
Table 11. Fan Connector Descriptions
Connector Function
Processor fan Provides +12 V DC for a processor fan or active fan heatsink.
Chassis fan Provides + 12 V DC for a system or ch assis fan.
For information about Refer to
The location of the fan connectors Figure 7, page 44
The signal names of the processor fan connector Table 23, page 45
The signal names of the chassis fan connector Table 27, page 47
Intel Desktop Board BA810 Technical Product Specification
32
1.12.3.3 Instantly Available Technology
CAUTION
For Instantly Available technology, the 5-V standby line for the power supply must be capable of
delivering adequa te standby current. Failure to provide adequate standby cur rent when using this
feature can damage the power supply. Refer to Section 2.11.2 on page 55 for additional
information.
Instantly Available technology enables the board to enter the ACPI S3 (Suspend-to-RAM) state.
While in the S3 sleep-state, the computer will appear to be off (the power supply is off, the fans are
off, and the power LED is amber). When signaled by a wake-up device or event, the system
quickly returns to its last known wake state. Table 9 on page 29 lists the devices and events that
can wake the computer from the S3 state. The use of Instantly Available technology requires:
• Operating sys tem suppor t
• PCI 2.2 compliant devices and drivers
The optional standby power indicator LED (located between the power connector and the DIMM
socket) provides an indication that standby power is still present, even when the computer appears
to be off. Figure 5 shows the location of the standby power indicator LED.
OM09830
DS7F1
Figure 5. Location of Standby Power Indicator LED
Board Description
33
1.12.3.4 Wake on Ring
The operation of Wake on Ring can be summarized as follows:
• Wakes the computer from an ACPI S3 state or from APM soft-off mode
• Requires two calls to access the computer:
First call restores the computer from an ACPI S3 state or powers up the computer from
APM soft-off mode
Second call enables access (when the appropriate software is loaded)
• The onboard modem detects the incoming call through the AC ‘97 Wake Up feature
1.12.3.5 Resume on Ring
The operation of Resume on Ring can be summarized as follows:
• Resumes operation from the ACPI S1 state or APM suspend mode
• Requires only one call to access the computer
• The onboard modem detects the incoming call through the AC ‘97 Wake Up feature
1.12.3.6 Wake from USB
USB bus activity wakes the computer from an ACPI S1 or S3 state or APM suspend mode.
✏NOTE
Wake from USB requires the use of a USB peripheral that supports the Wake from USB feature.
Wake from USB is not supported in APM soft-off mode.
Intel Desktop Board BA810 Technical Product Specification
34
35
2 Technical Reference
What This Chapter Contains
2.1 Introduction................................................................................................................35
2.2 Memo ry Map.............................................................................................................. 35
2.3 I/O Map......................................................................................................................36
2.4 DMA Channels .......................................................................................................... 37
2.5 PCI Configuration Space Map ................................................................................... 38
2.6 Interrupts...................................................................................................................38
2.7 PCI Interrupt Routing Map......................................................................................... 39
2.8 Connectors................................................................................................................ 40
2.9 Jumper Block............................................................................................................. 51
2.10 Mechanical Considerations........................................................................................ 53
2.11 Electrical Considerations........................................................................................... 55
2.12 Thermal Considerations............................................................................................. 57
2.13 Reliability................................................................................................................... 58
2.14 Environmental............................................................................................................ 59
2.15 Regulatory Compliance ............................................................................................. 59
2.1 Introduction
Sections 2.2 – 2.6 contain several standalone tables. Table 12 describes the system memory map,
Table 13 shows the I/O map, Table 14 lists the DMA channels, Table 15 defines the PCI
configuration space map, and Table 16 describes the interrupts. The remaining sections in this
chapter are introduced by text found with their respective section headings.
2.2 Memory Map
Table 12. System Memory Map
Address Range (decimal) Address Range (hex) Size Description
1024 K – 262144 K 100000 – FFFFFFF 255 MB Extended memory
960 K – 1024 K F0000 – FFFFF 64 KB Runtime BIOS
896 K – 960 K E0000 – EFFFF 64 KB Reserved
800 K – 896 K C8000 – DFFFF 96 KB Available high DOS memory (open
to PCI bus)
640 K – 800 K A0000 – C7FFF 160 KB Video memory and BIOS
639 K – 640 K 9FC00 – 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K – 639 K 80000 – 9FBFF 127 KB Extended conventional memory
0 K – 512 K 00000 – 7FFFF 512 KB Conventional memory
Intel Desktop Board BA810 Technical Product Specification
36
2.3 I/O Map
Table 13. I/O Map
Address (hex) Size Description
0000 – 000F 16 bytes DMA controller
0020 – 0021 2 bytes Programmable Interrupt Controller (PIC)
0040 – 0043 4 bytes System timer
0060 1 byte Keyboard controller byte – reset IRQ
0061 1 byte System speaker
0064 1 byte Keyboard controller, CMD/STAT byte
0070 – 0071 2 bytes System CMOS / Real-Time Clock
0072 – 0073 2 bytes System CMOS
0080 – 008F 16 bytes DMA controller
0092 1 byte Fast A20 and PIC
00A0 – 00A1 2 bytes PIC
00C0 – 00DF 32 bytes DMA
00F0 1 byte Numeric data processor
01F0 – 01F7 8 bytes Primary IDE channel
02E8 – 02EF18 bytes COM4/video (8514A)
02F8 – 02FF18 bytes COM2
03B0 – 03BB 12 bytes Intel 82810 – Graphics/Memory Controller Hub (GMCH)
03C0 – 03DF 32 byte Intel 82810 – Graphics/Memory Controller Hub (GMCH)
03E8 – 03EF 8 bytes COM3
03F0 – 03F5 6 bytes Diskette channel 1
03F6 1 byte Primary IDE channel command port
03F8 – 03FF 8 bytes COM1
04D0 – 04D1 2 bytes Edge/level triggered PIC
0CF8 – 0CFB24 bytes PCI configuration address register
0CF931 byte Turbo and reset control register
0CFC – 0CFF 4 bytes PCI configuration data register
FFA0 – FFA7 8 bytes Primary bus master IDE registers
96 contiguous bytes starting on a
128-byte divis ibl e bound ary ICH (ACPI + TCO)
64 contiguous bytes starting on a
64-byte divisible boundary Onboard resources
256 contiguous bytes starting on
a 256-byte divisible boundary ICH audio mixer
64 contiguous bytes starting on a
64-byte divisible boundary ICH audio bus master
256 contiguous bytes starting on
a 256-byte divisible boundary ICH modem mixer
continued
Technical Reference
37
Table 13. I/O Map (continued)
Address (hex) Size Description
16 contiguous bytes starting on a
16-byte divisible boundary ICH (SMBus)
32 contiguous bytes starting on a
32-byte divisible boundary ICH (USB)
4096 contiguous bytes starting on
a 4096-byte divisible boundary Intel 82810 PCI Bridge
Notes:
1. Def aul t, but can be changed to another address range
2. Dword ac cess only
3. Byte access only
✏NOTE
Some additional I/O addresses are not available due to ICH addresses aliasing. For information
about ICH addressing, refer to the Web site at:
http://developer.intel.com/design/chipsets/datashts/
2.4 DMA Channels
Table 14. DMA Channels
DMA Channel Number Data Width System Resource
0 8 or 16 bits Open
1 8 or 16 bits Open
2 8 or 16 bits Diskette drive
3 8 or 16 bits Open
4 Reserved - cascade channel
5 16 bits Open
6 16 bits Open
7 16 bits Open
Intel Desktop Board BA810 Technical Product Specification
38
2.5 PCI Configuration Space Map
Table 15. PCI Configuration Space Map
Bus
Number (hex) Device
Number (hex) Function
Number (hex) Description
00 00 00 Memory controller of Intel 82810 component
00 01 00 Graphics controller of Intel 82810 component
00 1E 00 Link to PCI bridge
00 1F 00 PCI-to-LPC bridge
00 1F 01 IDE controller
00 1F 02 USB controller
00 1F 03 SMBus controller
00 1F 04 Reserved
00 1F 05 AC ’97 audio controller
00 1F 06 AC ’97 modem controller
2.6 Interrupts
Table 16. Interrupts
IRQ System Resource
NMI I/O channel check
0 Reserved, interval timer
1 Reserved, keyboard buffer full
2 Reserved, cascade interrupt from slave PIC
3 User available
4COM1*
5 User available
6 Diskette drive
7 User available
8 Real-Time Clock
9 Reserved for ICH system management bus
10 Audio / Modem
11 Video
12 User available
13 Reserved, math coprocessor
14 Primary IDE (if present, else user available)
15 Network / User available
* Defaul t , but c an be changed to another IRQ
Technical Reference
39
2.7 PCI Interrupt Routing Map
This section describes interrupt sharing and how the interrupt signals are connected between the
onboard PCI devices. The PCI specification specifies how interrupts can be shared between
devices attached to the PCI bus. In most cases, the small amount of latency added by interrupt
sharing does not affect the operation or throughput of the devices. In some special cases where
maximum performance is needed from a device, a PCI device should not share an interrupt with
other PCI devices.
PCI devices are categorized as follows to specify their interrupt grouping:
• INTA: By default, all add-in devices that require only one interrupt are in this category. For
almost all devices that require more than one interrupt, the first interrupt on the device is also
classified as INTA.
• INTB: Generally, the second interrupt on add-in devices that require two or more interrupts is
classified as INTB. (This is not an absolute requirement.)
• INTC and INTD: Generally, a third interrupt on add-in devices is classified as INTC and a
fourth interrupt is classified as INTD.
The ICH PCI-to-LPC bridge has four programmable interrupt request (PIRQ) input signals. Any
PCI interrupt source connects to one of these PIRQ signals. Because there are only four signals,
some PCI interrupt sources are mechanically tied together on the board and therefore share the
same interrupt. Table 17 lists the PIRQ signals and shows how the signals are connected to the
onboard PCI interrupt source s.
Table 17. PCI Interrupt Routing Map
ICH PIRQ Signal
PCI Interrupt Source PIRQA PIRQB PIRQC PIRQD
AGP Controller INTA
ICH Audio Controller INTB
ICH Modem Controller INTB
ICH USB Controller INTD
SM Bus INTB
✏NOTE
The ICH can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5, 7, 9, 10, 11, 14,
and 15). Typically, a device that does not share a PIRQ line will have a unique interrupt.
However, in certain interrupt-constrained situations, it is possible for two or more of the PIRQ
lines to be connected to the same IRQ signal.
Intel Desktop Board BA810 Technical Product Specification
40
2.8 Connectors
CAUTION
Only the back panel I/O connectors of this board have overcurrent protection. The internal board
connectors are not overcurrent protected, and should connect only to devices inside the computer
chassis, such as fans and internal peripherals. Do not use these connectors for powering devices
external to the computer chassis. A fault in the load presented by the external devices could cause
damage to the computer, the interconnecting cable, and the external devices themselves.
This section describes the board’s connectors. The connectors can be divided into the following
groups:
• Back panel I/O connectors (see page 41)
USB (2)
VGA
Audio line out
Mic in
RJ-11 telephone jack
• Internal I/O connectors (see page 44)
Fans (2)
Power
Diskette drive
IDE
• External I/O conne cto rs (see page 48)
USB ports
Front panel (Power/Sleep/Message waiting LED, power switch, hard drive activity LED,
reset switch, and infrared port)
Serial port
Technical Reference
41
2.8.1 Back Panel I/O Connectors
Figure 6 shows the location of the back panel connectors.
OM09831
C E
D
FA B
Item Description For more information, see…
A USB port 0 (ICH) Table 18, page 42
B USB port 1 (USB hub) Table 18, page 42
C VGA port Table 19, page 42
D Audio line out Table 20, page 43
E Mic in Table 21, page 43
F RJ-11 telephone jack Table 22, page 43
Figure 6. Back Panel I/O Connectors
✏NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers
only. Poor audio quality may occur if passive (non-amplified) speakers are connected to this
output.
Intel Desktop Board BA810 Technical Product Specification
42
Table 18. USB Connectors
Pin Signal Name
1 +5 V (fused)
2 USBP0# / USBP1#
3 USBP0 / USBP1
4 Ground
Table 19. VGA Port Connector
Pin Signal Name
1Red
2 Green
3Blue
4 No connect
5 Ground
6 Ground
7 Ground
8 Ground
9 Fused VCC
10 Ground
11 No connect
12 MONID1
13 HSYNC
14 VSYNC
15 MONID2
Technical Reference
43
Table 20. Audio Line Out Connector
Pin Signal Name
Tip Audio left out
Ring Audio right out
Sleeve Ground
Table 21. Mic In Connector
Pin Signal Name
Tip Microphone in
Ring Mic bias voltage
Sleeve Ground
Table 22. RJ-11 Telephone Jack
Pin Signal Name
1 No connect
2Tip
3Ring
4 No connect
✏NOTE
To comply with regulatory information a 26 AWG or larger telecommunication line cord must be
used.
Intel Desktop Board BA810 Technical Product Specification
44
2.8.2 Internal I/O Connectors
Figure 7 shows the location of the internal connectors.
OM09832
1
240
39
1
A
1
2
33
1
11
10
20
BC
D
34
1
E
Item Description Reference Designator For more information, see…
A Processor fan J5J1 Table 23, page 45
B Power J7G3 Table 24, page 45
C Diskette drive J7D1 Table 25, page 46
D IDE J7B1 Table 26, page 47
E Chassis fan J1A1 Table 27, page 47
Figure 7. Internal I/O Connectors
For information about Refer to
The power connector Section 1.12.3.1, page 31
The functions of the fan connectors Section 1.12.3.2, page 31
Technical Reference
45
Table 23. Processor Fan Connector (J5J1)
Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH1
Table 24. Power Connector (J7G3)
Pin Signal Name Pin Signal Name
1 +3.3 V 11 +3.3 V
2 +3.3 V 12 -12 V
3 Ground 13 Ground
4 +5 V 14 PS-ON# (power supply remote on/off)
5 Ground 15 Ground
6 +5 V 16 Ground
7 Ground 17 Ground
8 PWRGD (Power Good) 18 -5 V
9 +5 VSB 19 +5 V
10 +12 V 20 +5 V
Intel Desktop Board BA810 Technical Product Specification
46
Table 25. Diskette Drive Connector (J7D1)
Pin Signal Pin Signal
1 Ground 2 DENSEL
3 Ground 4 No connect
5Key 6FDEDIN
7 Ground 8 FDINDX# (Index)
9 Ground 10 FDM00# (Motor Enable A)
11 Ground 12 No connect
13 Ground 14 FDDS0# (Drive Select A)
15 Ground 16 No connect
17 No connect 18 FDDIR# (Stepper Motor Direction)
19 Ground 20 FDSTEP# (Step Pulse)
21 Ground 22 FDWD# (Write Data)
23 Ground 24 FDWE# (Write Enable)
25 Ground 26 FDTRK0# (Track 0)
27 No connect 28 FDWPD# (Write Protect)
29 Ground 30 FDRDATA# (Read Data)
31 Ground 32 FDHEAD# (Side 1 Select)
33 Ground 34 DSKCHG# (Diskette Change)
Technical Reference
47
Table 26. IDE Connector (J7B1)
Pin Signal Name Pin Signal Name
1 Reset IDE 2 Ground
3 Data 7 4 Data 8
5 Data 6 6 Data 9
7 Data 5 8 Data 10
9 Data 4 10 Data 11
11 Data 3 12 Data 12
13 Data 2 14 Data 13
15 Data 1 16 Data 14
17 Data 0 18 Data 15
19 Ground 20 Key
21 DDRQ0 22 Ground
23 I/O Write# 24 Ground
25 I/O Read# 26 Ground
27 IOCHRDY 28 Ground
29 DDACK0# 30 Ground
31 IRQ 14 32 Reserved
33 DAG1 (Address 1) 34 DMA66_DETECT
35 DAG0 (Address 0) 36 DAG2 (Address 2)
37 Chip Select 1P# 38 Chip Select 3P#
39 Activity# 40 Ground
Table 27. Chassis Fan Connector (J1A1)
Pin Signal Name
1 Ground
2 +12 V
3 Ground
Intel Desktop Board BA810 Technical Product Specification
48
2.8.3 External I/O Connectors
Figure 8 shows the location of the external connectors.
OM09833
107
2
1
A
BC
2
118
17
9
8
2
1
Item Description Reference Designator For more information, see…
A USB port J7G1 Table 28, page 49
B Front panel J7G2 Table 29, page 49
C Serial port J7C1 Table 30, page 49
Figure 8. External I/O Connectors
Technical Reference
49
Table 28. USB Port Connector (J7G1)
Pin Signal Name Pin Signal Name
1 VREG_USB2_PWR 2 VREG_USB2_PW
3 USB_DM3 4 USB_DM4
5 USB_DP3 6 USB_DP4
7 Ground 8 Ground
9 Key (no pin) 10 No connect
Table 29. Front Panel Connector (J7G2)
Pin Signal In/Out Description Pin Signal In/Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED pull-up
(330 Ω) to +5 V 2 HDR_BLNK_GRN Out Front panel
green LED
3 HDA# Out Hard disk active LED 4 HDR_BLNK_YEL Out Front pan el
yellow LED
Reset Switch On / Off Switch
5 GND Ground 6 SW_ON# In Front panel
power switch
7 FP_RESET# In Front panel Reset
button 8 GND Ground
Miscellaneous Miscellaneous
9 +5 V Out Power 10 N/C In Not connected
11 N/C Not connected 12 GND Ground
13 GND Ground 14 (Pin removed) Not connected
15 N/C Not connected 16 +5 V Out Power
17 +5 V Power 18 N/C Not connected
Table 30. Serial Port Connector (J7C1)
Pin Signal Name Pin Signal Name
1 DCD (Data Carrier Detect) 2 DSR (Data Set Ready)
3 SIN # (Serial Data In) 4 RTS (Request to Send)
5 SOUT # (Serial Data Out) 6 CTS (Clear to Send)
7 DTR (Data Terminal Ready) 8 RI (Ring Indicator)
9 Ground 10 Key (no pin)
Intel Desktop Board BA810 Technical Product Specification
50
2.8.3.1 Power / Sleep / Message Waiting LED Connector
Pins 2 and 4 of the front panel connector can be connected to a single- or dual-colored LED.
Table 31 shows the possible states for a single-colored LED. Table 32 shows the possible states for
a dual-colored LED.
Table 31. States for a Single-colored Power LED
LED State Description
Off Power off
Steady Green Running
Blinking Green Running/message waiting
Table 32. States for a Dual-colored Power LED
LED State Description
Off Power off
Steady Green Running
Blinking Green Running/Message waiting
Steady Yellow Sleeping
Blinking Yellow Sleeping/Message waiting
✏ NOTE
To use the message waiting function, ACPI must be enabled in the operating system and a message-
capturing application must be invoked.
2.8.3.2 Power Switch Connector
Pins 6 and 8 of the front panel connector can be connected to a front panel power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch
on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two
seconds must pass before the power supply will recognize another on/off signal.
2.8.3.3 Hard Drive Activity LED Connector
Pins 1 and 3 of the front panel connector can be connected to an LED to provide a visual indicator
that data is being read from or written to a hard drive. For the LED to function properly, an IDE
drive must be connected to the onboard IDE interface.
2.8.3.4 Reset Switch Connector
Pins 5 and 7 of the front panel connector can be connected to a momentary SPST type switch that is
normally open. When the switch is closed, the board resets and runs the POST.
Technical Reference
51
2.9 Jumper Block
CAUTION
Do not move any jumpers with the power on. Always turn off the power and unplug the power cord
from the computer before changing a jumper setting. Otherwise, the board could be damaged.
Figure 9 shows the location of the BIOS Setup jumper block. This 3-pin jumper block determines
the BIOS Setup program’s mode. Table 33 on page 52 describes the jumper settings for the three
modes: normal, configure, and recovery.
OM09834
1
3
J6A1
Figure 9. Location of the Jumper Block
Intel Desktop Board BA810 Technical Product Specification
52
Table 33. BIOS Setup Configuration Jumper Settings (J6A1)
Function/Mode Jumper Setting Configuration
Normal 1-2
1
3
The BIOS uses current configuration information and passwords
for booting.
Configure 2-3
1
3
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
Recovery None
1
3
The BIOS attempts to recover the BIOS configuration. A
recovery diskette is required.
For information about Refer to
How to access the BIOS Setup program Section 4.1, page 75
The maintenance menu of the BIOS Setup program Section 4.2, page 76
BIOS recovery Section 3.6, page 70
Technical Reference
53
2.10 Mechanical Considerations
2.10.1 Fl exATX Form Factor
The board is designed to fit into an ATX- or microATX-form-factor chassis. Figure 10 illustrates
the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer
dimensions are 9.0 inches by 7.2 inches (228.60 millimeters by 182.88 millimeters). Location of
the I/O connectors and mounting holes is in compliance with the FlexATX addendum of the
microATX specification (see Table 2, page 13).
OM09835
6.10[154.94]
6.80[172.72]
0.75[19.05] 8.25[209.55]
0.90[22.86]
0.40[10.16]
1.80[45.72] 8.00[203.20]
0.00
0.00
Figure 10. Board Dimensions
Intel Desktop Board BA810 Technical Product Specification
54
2.10.2 I/O Shield
The back panel I/O shield for the board must meet specific dimension and material requirements.
Systems based on this board need the back panel I/O shield to pass certification testing. Figure 11
shows the critical dimensions of the I/O shield. Dimensions are given in inches [millimeters]. For
dimensions given to two decimal places, the tolerance is ±0.02 inches; for dimensions given to
three decimal places, the tolerance is ±0.010 inches [0.254 millimeters]. The figure indicates the
position of each cutout. Additional design considerations for I/O shields relative to chassis
requirements are described in the ATX specification. See Table 2, page 13 for information about
the ATX specification.
OM09224
Pictorial
View
24.00[0.944]
12.027[0.473]
17.366[0.683]
22.45[0.883]
0.00
0.00
53.890[2.121]
3.410[0.143]
74.309[2.925]
133.646[5.261]
142.774[5.621]
157.340[6.194]
24.00[0.944]
22.45[0.883]
1.55[0.061]
Ref 159.20[6.267]
20.00 ± .26[0.787] Typ.
162.30 Ref [6.390]
48.00
[1.889]
Ref
2x Dia 8.50[0.334]
11.801
[0.464]
0.699
[0.027]
17.764
[0.669]
15.00 ± .26
[0.590] Typ
44.90
[1.767] Right-end
View
155.790[6.133]
R 0.50
[0.019]
Min Typ
4.960[0.195]
Figure 11. I/O Shield Dimensions
Technical Reference
55
2.11 Electrical Considerations
2.11.1 Power Consumption
Table 34 lists voltage and current specifications for a computer that contains the board and the
following:
• 700 MHz Intel Pentium III processor with a 256 KB cache
• 128 MB SDRAM
• 3.5-inch diskette drive
• 6.0 GB IDE hard disk drive
• 34X IDE CD-ROM drive
This information is provided only as a guide for calculating approximate power usage with
additional re sour ces added.
Values for the Windows 98 SE desktop mode are measured at 640 x 480 x 256 colors and 60 Hz
refresh rate. AC watts are measured with a typical 145 W power supply, nominal input voltage and
frequency, with true RMS wattmeter at the line input.
Table 34. Power Usage
DC Current at:
Mode AC Power +3.3 V +5 V +12 V -12 V +5 VSB
Windows 98 SE ACPI S0 31 W 1.54 A 0.48 A 0.167 A -0.0162 A 0.196 A
Windows 98 SE ACPI S1 26 W 1.50 A 0.38 A 0.167 A -0.0161 A 0.185 A
Windows 98 SE ACPI S3 3 W 0.0003 A -0.0003 A 0.0002 A 0.0001 A 0.180 A
Windows 98 SE APM On 46 W 1.49 A 2.77 A 0.173 A -0.016 A 0.228 A
Windows 98 SE APM 1* 33 W 1.43 A 2.75 A 0.173 A -0.016 A 0.228 A
Windows 98 SE APM 2** 25 W 1.40 A 0.36 A 0.172 A -0.016 A 0.196 A
* Video and hard drive timeout
** Start menu/S tandby
2.11.2 Power Supply Considerations
System integrators should refer to the power usage values listed in Table 34 when selecting a power
supply for use with this board. The power supply must comply with the following
recommendations found in the ATX Specification (see Table 2, page 13):
• The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2)
• The current capability of the +5 VSB line (Section 4.2.1.2)
• All timing parameters (Section 4.2.1.3)
• All voltage tolerances (Section 4.2.2)
Intel Desktop Board BA810 Technical Product Specification
56
2.11.3 Fan Power Requirements
Table 35 lists the maximum DC voltage and current requirements for the chassis fan when the
board is in normal operating mode, sleep mode, or Suspend-to-RAM state. Power consumption is
independent of the operating system used and other variables.
Table 35. Chassis Fan (J1A1) DC Power Requirements
Mode Voltage Maximum Current
Normal (S0) +12 VDC 0.132 A (current limited)
Sleep (S1) +12 VDC 0.132 A (current limited)
Suspend-to-RAM (S3) 0.0 VDC 0.0 A
For information about Refer to
The location of the chassis fan connector Figure 7, page 44
The signal names of the chassis fan connector Table 27, page 47
Technical Reference
57
2.12 Thermal Considerations
CAUTION
An ambient temperature that exceeds the board’s maximum operating temperature by 5 oC to 10 oC
could cause components to exceed their maximum case temperature and malfunction. For
information about the maximum operating temperature, see the environmental specifications in
Section 2.14.
CAUTION
The voltage regulator area can reach a temperature of up to 85 oC in an open chassis. System
integrators should ensure that proper airflow is maintained in the voltage regulator area (item A in
Figure 12). Failure to do so may result in damage to the voltage regulator circuit.
Figure 12 shows the localized high temperature zones.
OM09836
B
C
A
A Processor voltage regulator area
B Processor
C Intel 828 10 GMC H
Figure 12. High Temperature Zones
Intel Desktop Board BA810 Technical Product Specification
58
Table 36 provides maximum component case temperatures for board components that could be
sensitive to thermal changes. Case temperatures could be affected by the operating temperature,
current load, or operat ing fre quen cy. Maximu m case tem pe ra tur es are impor tan t when cons ide rin g
proper airflow to cool the board.
Table 36. Thermal Considerations for Components
Component Maximum Case Temperature
Intel Pentium III processor,
100 MHz host bus frequency
Intel Celeron processor
For processor case temperature, see
processor datasheets and processor
specific ation upd ates .
Intel 82810 GMCH 70 °C
Intel 82801AA ICH 70 °C
For information about Refer to
Intel Celeron processor datasheets and specification updates Table 2, page 13
Intel Pentium III processor datasheets and specification updates Table 2, page 13
2.13 Reliability
The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements. MTBF data is calculated from predicted data at 55 ºC.
Board MTBF: 153,873 hours
Technical Reference
59
2.14 Environmental
Table 37 lists the environmental specifications for the board.
Table 37. Board Environmental Specifications
Parameter Specification
Temperature
Non-Operating -40 °C to +70 °C
Operating 0 °C to +55 °C
Shock Unpackaged 30 g trapezoidal waveform
Velocity change of 170 inches/second
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
2.15 Regulatory Compliance
This section describes the board’s compliance with safety and EMC regulations.
2.15.1 Safety Regulations
Table 38 lists the safety regulations the board complies with when it is correctly installed in a
compatible host system.
Table 38. Safety Regulations
Regulation Title
UL 1950/CSA950, 2nd edition,
Dated 26 February 1993 Bi-National Standard for Safety of Information Technology Equipment
including Electrical Business Equipment. (USA and Canada)
EN 60950, 2nd Edition, 1992 (with
Amendments 1, 2, 3, and 4) The Standard for Safety of Information Technology Equipment including
Electrical Business Equipment. (European Community)
IEC 950, 2nd edition, 1991 (with
Amendments 1, 2, 3, and 4) The Standard for Safety of Information Technology Equipment including
Electrical Business Equipment. (International)
EMKO-TSE (74-SEC) 207/94 Summary of Nordic deviations to EN 60950. (Norway, Sweden,
Denmark, and Finland)
Intel Desktop Board BA810 Technical Product Specification
60
2.15.2 EMC Regulations
Table 39 lists the EMC regulations the board complies with when it is correctly installed in a
compatible host system.
Table 39. EMC Regulations
Regulation Title
FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B,
pertaining to unintentional radiators. (USA)
CISPR 22, 2nd Edition,
1993 (Class B) Limits and methods of measurement of Radio Interference Characteristics of
Information Technology Equipment. (International)
VCCI Class B (ITE) Implementation Regulations for Voluntary Control of Radio Interference by
Data Processing Equipment and Electronic Office Machines. (Japan)
EN55022 (1994) (Class B) Limits and methods of measurement of Radio Interference Characteristics of
Information Technology Equipment. (Europe)
EN50082-1 (1992) Generic Immunity Standard; Currently compliance is determined via testing to
IEC 801-2, -3, and -4. (Europe)
ICES-003 (1997) Interference-Causing Equipment Standard, Digital Apparatus, Class B
(Including CRC c.1374). (Canada)
AS/NZ 3548 Australian Communications Authority (ACA), Standard for Electromagnetic
Compatibility.
2.15.3 Telecommunications Regulations
Table 40 lists the telecommunications regulations the board complies with when it is correctly
installed in a compatible host system.
Table 40. Telecommunications Regulations
Regulation Title
FCC Part 68 Title 47 of the Code of Federal Regulations, Part 68, Connection of Terminal
Equipment to the Telephone Network
CS 03 Issue 8 (1996) Harmonized Requirements for Terminal Equipment, Terminal Systems, and
Certified Protection Circuitry
CTR21 Council Decision 98/482/EC On a Common Technical Regulation for the
Attachment Requirements for Connection to the Analogue Public Switched
Telephone Networks (PSTNs) of Terminal Equipment (Excluding Terminal
Equipment Supporting the Voice Telephony Justified Case Service) in Which
Network Addressing, if Provided, is by Means of Dual Tone Multi-Frequency
(DTMF) Signalling
ETSI Guide 201 121 Advisory Notes for CTR21
TS001 Safety Requirements for Customer Equipment
TS002 Analogue Interworking and Non-Interference
PTC200 Requirements for Analogue Telecommunications Equipment
TS PSTN1 Infocomm Development Authority (iDA) of Singapore Type Approval Specification
for Connection of Terminal Equipment to Public Switched Telephone Network
PW-TFI SIRIM
JATE Blue Book For Analog Telephone Terminals
Technical Reference
61
2.15.4 Telecommunications Regulatory Information
2.15.4.1 Safety
WARNING
To reduce the risk of fire, use only No. 26 AWG or larger telecommunication line cord.
Middle Path is the main construction option, developed to address the needs of the computer
segment of the ITE/Telecom Industry. It allows basic construction features, which have a proven
record of safety for the protection against over-voltage.
WARNING
Danger of explosion if the lithium battery is incorrectly replaced. Replace only with the same or
equivalent type recommended by the manufacturer. Dispose of used batteries according to the
manufacturer’s instructions.
2.15.4.2 FCC Regulatory Information
The BA810 desktop board complies with Part 68 of the Federal Communications Commission
Rules. The board has a label that contains, among other information, the FCC registration number,
Facility Interface Code (FIC), ringer equivalence number (REN), and Service Order Code (SOC).
This information must be provided to the telephone company.
FCC Registration No: TBD
FIC: TBD
REN: TBD
SOC: TBD
USOC Jack: RJ- 11 C Jack
An FCC-compliant telephone cord and modular plug must be provided with the board. The board
is designed to be connected to the telephone network or premises wiring using a compatible
modular jack which is Part 68 compliant. See installation instructions for details.
If the board causes har m to the telephone netw o rk, the tel epho ne comp any wi ll notify you in
advance that temporary discontinuance of service may be required. But, if advance notice is not
practical, the telephone company will notify the customer as soon as possible. Also, you will be
advised of your right to file a complaint with the FCC if you believe it is necessary.
The telephone company may make changes in its facilities, equipment, operations, or procedures
that could affect the operation of the board. If this happens, the telephone company will provide
advance notice in order for you to make necessary modifications in order to maintain uninterrupted
service.
If trouble is experienced with the board please contact Customer Support at 800-628-8086. If the
board is causing harm to the network, the telep hone com pany may request you to remove the boa rd
from t he network until the problem is resolved.
Intel Desktop Board BA810 Technical Product Specification
62
No repairs are to be made by you. Repairs are to be made only by Intel Corporation or its licensees.
Unauthorized repairs void registration and warranty.
The board cannot be used on public coin service provided by the telephone company. Connection
to Party Line Service is subject to state tariffs. (Contact the state public utility commission, public
service commission or corporation commission for information.)
We suggest the customer install an AC surge arrestor in the AC outlet to which the board is
connected. Telephone companies report that electrical surges, typically lightning transients, are
very destructi ve to custo mer terminal equipment connected to AC power sour ces and tha t this is a
major nationwide problem.
2.15.4.3 Canadian Equipment Attachment Limitations
✏NOTE
The Industry Canada label identifies certified equipment. This certification means that the
equipment meets telecommunications network protective, operational and safety requirements as
prescribed in the appropriate Terminal Equipment Technical Requirements document(s). The
department does not guarantee the equipment will operate to the user’s satisfaction.
Before installing the BA810 desktop board, users should ensure that it is permissible to be
connected to the facil itie s of the local te leco m mun ica tio ns comp any. The board must also be
installed using an acceptable method of connection. The customer should be aware that compliance
with the above conditions may not prevent degradation of service in some situations.
Repairs to certified equipment should be coordinated by a representative designated by the supplier.
Any repairs or alterations made by the user to this equipment, or equipment malfunctions, may give
the telecommunications company cause to request the user to disconnect the equipment.
Users should ensure for their own protection that the electrical ground connections of the power
utility, telephone lines and internal metallic water pipe system, if present, are connected together.
This precaution may be particularly important in rural areas.
WARNING
Users should not attempt to make such connections themselves, but should contact the appropriate
electric inspection authority, or electr ic ian, as appropri at e.
✏NOTE
The ringer equivalence number (REN) assigned to each terminal device provides an indication of
the maximum number of terminals allowed to be connected to a telephone interface. The
termination on an interface may consist of any combination of devices subject only to the
requirement that the sum of the ringer equivalence numbers of all the devices does not exceed 5.
Technical Reference
63
2.15.4.4 New Zealand Requirements
2.15.4.4.1 General Warning
The grant of a Telepermit for any item of terminal equipment indicates only that Telecom has
accepted that the item complies with minimum conditions for connection to its network. It
indicates no endorsement of the product by Telecom, nor does it provide any sort of warranty.
Above all, it provides no assurance that any item will work correctly in all respects with another
item of Telepermitted equipment of a different make or model, nor does it imply that any product is
compatible with all of Telecom’s network services.
The BA810 desktop board shall not be set up to make automatic calls to the Telecom ‘111’
Emergency Service.
✏NOTE
Under power failure conditions, this telephone device may not operate. Please ensure that a
separate telephone device, not dependent on local power, is available for emergency use.
Some parameters required for compliance with Telecom’s Telepermit requirements are dependent
on the equipment (PC) associated with this device. The associated equipment shall be set to
operate within the following limits for compliance with Telecom’s specifications:
(a) There shall be no more than 10 calls to the same number within any 30 minute period for any
single manu al cal l initi ation, and
(b) The equipment shall go on-hook for a period of not less than 30 seconds between the end of one
attempt and the beginning of the next attempt.
Some parameters required for compliance with Telecom’s Telepermit requirements are dependent
on the equipment (PC) associated with this device. In order to operate within the limits for
compliance with Telecom’s specifications, the associated equipment shall be set to ensure that
automatic calls to different numbers are spaced such that there is no less than 5 seconds between
the end of one call attempt and the beginning of another.
Some parameters required for compliance with Telecom’s Telepermit requirements are dependent
on the equipment (PC) associated with this device. In order to operate within the limits for
compliance with Telecom’s specifications, the associated equipment shall be set to ensure that calls
are answered between 3 and 30 seconds of receipt of ringing.
2.15.4.4.2 Compli ance Testing (6) and (7) (Functional Tests)
This equipment is not capable, under all operating conditions, of correct operation at the higher
speeds for which it is designed. Telecom will accept no responsibility should difficulties arise in
such circumstances.
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64
2.15.5 Certification Markings
This printed circuit assembly has the following produc t cert if ica tion mark ing s:
• UL Joint Recognition Mark: Consists of small c followed by a stylized backward UR and
followed by a small US (Component side).
• Manufacturer’s recognition mark: Consists of a unique UL recognized manufacturer’s logo,
along with a flammabi l ity ra ting (94V -0) (Solder side).
• UL File Number for desktop boards: E139761 (Component side).
• PB Part Number: Intel bare circuit board part number (Solder side) A02613-003.
• Battery “+ Side Up” markin g: located on the componen t side of the board in clo se proxi m ity to
the battery holder.
• FCC Part 15 Class B Logo/Declaration: (Solder side).
• FCC Part 68 Declaration: Includes the part 68 certificate number of the format
EJMxxx-xxxxx-xx-x, followed by the REN number in the format x.xB. In addition for
Canadian compliance add the Canadian REN number in the format x.xA.
• ACA (A-Tick) mark: Consists of a unique triangle, with a tick mark; followed by N-232.
Located on the component side of the board and on the shipping container.
• CE Mark with CTR21 additions: (Component side) This mark consists of the CE mark
followed by the number of the Notified Body that approved the product followed by the CTR21
symbol of “crossed hockey sticks”. The CE mark should also be on the shipping container.
The additions for CTR21 (Notified Body number and “crossed hockey sticks”) are not required
on the shipping container.
There are requirements for some countries in addition to the silk-screened items above. Some of
these requirements are additional labels that cannot be silk-screened onto the board, including the
following:
• The Canadian Telecommunication Label must be affixed to the board. These are purchased
separately from Canada.
• The Telepermit label must be on the board. It can be incorporated into a label that contains
other approval marks. It has color requirements. See Telepermit for size and color
requirements. There is an approval number in the format PTCxxx/xx/xxx.
• The TAS label or mark must be on the board. It can be incorporated into a label that contains
other approval marks. There is an approval number in the format xxxxx-xxxx-xx-xxxx-xx.
• The Japan Telecom label must be on the board. It can be incorporated into a label that contains
other approval marks. There is an approval number in the format xxx-xxxx-x.
65
3 Overview of BIOS Features
What This Chapter Contains
3.1 Introduction................................................................................................................65
3.2 BIOS Flash Memory Organization ............................................................................. 66
3.3 Resource Configuration............................................................................................. 67
3.4 System Management BIOS (SMBIOS) ...................................................................... 68
3.5 BIOS Updates............................................................................................................ 69
3.6 Recovering BIOS Data .............................................................................................. 70
3.7 Boo t Op ti ons.............................................................................................................. 71
3.8 USB Legacy Support................................................................................................. 72
3.9 BIOS Security Features............................................................................................. 73
3.1 Introduction
The board uses an Intel/AMI BIOS, which is stored in flash memory and can be updated using a
disk-based program. In addition to the BIOS, the flash memory contains the BIOS Setup program,
POST, the PCI auto-configuration utility, and Plug and Play support.
This board supports system BIOS shadowing, allowing the BIOS to execute from 64-bit onboard
write-protected DRAM.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The
initial production BIOS is identified as BA81010A.86A.
For information about Refer to
The board’s compliance level with Plug and Play Table 2, page 13
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3.2 BIOS Flash Mem ory Organi za tion
The Intel 82802AB Firmware Hub (FWH) includes a 4 Mbit (512 KB) symmetrical flash memory
device. Internally, the device is grouped into eight 64 KB blocks that are individually erasable,
lockable, and unlockable. Figure 13 shows the organization of the flash memory.
The last two 8 KB blocks of the fault tolerance area are the parameter blocks. These blocks contain
data such as BIOS updates, vital product data (VPD), logo, System Management BIOS (SMBIOS)
interface, and extended system configuration data (ESCD) information. The backup block contains
a copy of the fault tolerance block.
64 KB Block 7
64 KB Block 6
64 KB Block 5
64 KB Block 4
64 KB Block 3
64 KB Block 2
64 KB Block 1
64 KB Block 0
Fault Tolerance
Main System BIOS
Backup
Boot Block
080000
07FFFF
070000
06FFFF
060000
05FFFF
050000
04FFFF
040000
03FFFF
030000
02FFFF
020000
01FFFF
010000
00FFFF
000000
OM08376
48 KB - Reserved
8 KB - Parameter Block 2
8 KB - Parameter Block 1
Figure 13. Memory Map of the Flash Memory Device
Overview of BIOS Features
67
3.3 Resource Configuration
3.3.1 PCI Autoconfiguration
The BIOS can automatically configure PCI devices. When a user turns on the system, the BIOS
automatically configures interrupts, the I/O space, and other system resources. Onboard PCI
devices can share an interrupt. Autoconfiguration information is stored in ESCD format.
For information about Refer to
The BIOS’s compliance level with Plug and Play Table 2, page 13
3.3.2 PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the
PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives
up to ATA-66 and recognizes any ATAPI devices, including CD-ROM drives, tape drives, and
Ultra DMA drives. The BIOS determines the capabilities of each drive and configures them to
optimize capacity and performance. To take advantage of the high capacities typically available
today, hard drives are automatically configured for Logical Block Addressing (LBA) and to
PIO Mode 3 or 4, depending on the capability of the drive. You can override the auto-
configuration options by specifying manual configuration in the BIOS Setup program.
To use ATA-66 features the following items are required:
• An ATA-66 peripheral device
• An ATA-66 compatible cable
• ATA-66 operating system device drivers
✏NOTE
ATA-66 compatible cables are backward compatible with drivers using slower IDE transfer
protocols. If an Ultra ATA-66 disk drive and a disk drive using any other IDE transfer protocol are
attached to the same cable, the maximum transfer rate for either drive is 33 MB/sec.
✏NOTE
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For
example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive.
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3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in
a managed network.
The main component of SMBIOS is the Management Information Format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates for
system components. The MIF database defines the data and provides the method for accessing this
information. The BIOS enables applications such as Intel® LANDesk® Client Manager to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as mem or y size, cach e size, and proce sso r speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems, such as Windows NT†, require an additional interface for
obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such
operating systems. Using this support, an SMBIOS service-level application running on a non-
Plug and Play operating system can obtain the SMBIOS information.
For information about Refer to
The board’s compliance level with SMBIOS Table 2, page 13
Overview of BIOS Features
69
3.5 BIOS Updates
A new version of the BIOS can be updated from a diskette using the Intel® Flash Memory Update
Utility that is available from Intel. This utility supports the following BIOS maintenance functions:
• Update the flash BIOS from a file on a diskette
• Change the language section of the BIOS
• Verify that the updated BIOS matches the target system to prevent accidentally installing an
incompatible BIOS
• Update BIOS boot block
• Update Video BIOS
• Insert a user logo
BIOS updates and the Intel Flash Memory Update Utility are available from Intel through the Intel
World Wide Web site.
✏NOTE
Please review the instructions distributed with the update utility before attempting a BIOS update.
For information about Refer to
The Intel World Wide Web site Section 1.2, page 13
3.5.1 Language Support
The BIOS Setup program and help messages are supported in five languages: US English, German,
Italian, French, and Spanish. The default language is US English, which is present unless another
language is selected in the BIOS Setup program.
3.5.2 Custom Splash Screen
During POST, an Intel splash screen is displayed by default. This splash screen can be replaced
with a custom splash screen. A utility is available from Intel to assist with creating a custom splash
screen. The custom splash screen can be programmed into the flash memory using the BIOS
update utility. Information about this capability is available on the Intel Support World Wide Web
site.
For information about Refer to
The Intel World Wide Web site Section 1.2, page 13
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3.6 Recoveri ng BIOS Data
Some types of failure can destroy the BIOS. For example, the data can be lost if a power outage
occurs while the BIOS is being updated in flash memory. The BIOS can be recovered from a
diskette using the BIOS recovery mode. When recovering the BIOS, be aware of the following:
• Because of the small amount of code available in the nonerasable boot block area, there is no
video support. You can only monitor this procedure by listening to the speaker or looking at
the diskette drive LED.
• The recovery proce ss may tak e sever al mi nute s; la rge r BIOS fla sh me mory dev ices req ui re
more time.
• A single beep indicates the beginning of the BIOS recovery process.
• Two beeps and the end of activity in the diskette drive indicate successful BIOS recovery.
• A series of continuous beeps indicates a failed BIOS recovery.
To create a BIOS recovery diskette, a bootable diskette must be created and the BIOS update files
copied to it. BIOS updates and the Intel Flash Memory Update Utility are available from Intel
Customer Support thr ough the Intel Wor ld Wide Web site.
✏NOTE
BIOS Recovery cannot be accomplished using a non-SPD DIMM. SPD data structure is required
for the recovery proces s.
✏NOTE
If the computer is configured to boot from an LS-120 diskette (in the Removable Devices submenu),
the BIOS recovery diskette must be a standard 1.44 MB diskette not a 120 MB diskette.
For information about Refer to
The BIOS recovery mode Section 2.9, page 51
The Boot menu in the BIOS Setup program Section 4.7, page 87
Contacting Intel customer support Section 1.2, page 13
Overview of BIOS Features
71
3.7 Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives, or a
CD-ROM drive. The default setting is for the diskette drive to be the primary boot device and the
hard drive to be the secondary boot device. By default, the fourth device is disabled.
3.7.1 Booti ng fr om CD-ROM
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format
specification.
For information about Refer to
The El Torito specification Table 2, page 13
3.7.2 Booti ng Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the
operating system loader is invoked even if the keyboard and mouse are not present.
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3.8 USB Legacy Support
USB legacy support enables USB keyboards, mice, and hubs to be used even when no operating
system USB drivers are in place. USB legacy support is used in accessing the BIOS Setup program
and installing an operating system that supports USB. USB legacy support is automatically enabled
whenever a USB device is connected to a USB port. This sequence describes how USB legacy
support operates:
1. When you power up the computer, USB legacy support is enabled if a USB device is connected
to a USB port.
2. POST begins.
3. USB legacy support is still enabled by the BIOS. This allows you to use a USB keyboard to
enter the BIOS Setup program or the maintenance mode.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB keyboards and mice
are recognized. After the operating system loads the USB drivers, the USB devices are
recognized by the operating system.
To install an operating system that supports USB, follow the operating system’s installation
instructions. Once the operating system is installed and the USB drivers have been configured,
USB legacy support is no longer used.
Notes on using USB legacy support:
• Do not use USB devices with an operating system that does not support USB. USB legacy is
not intended to support the use of USB devices in a non-USB aware operating system.
• USB legacy support is for keyboards, mice, and hubs only. Other USB devices are not
supported.
Overview of BIOS Features
73
3.9 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can
boot the computer. A supervisor password and a user password can be set for the BIOS Setup
program and for booting the co mput er, with the following restriction s:
• The supervisor password gives unrestricted access to view and change all the Setup options in
the BIOS Setup program. This is supervisor mode.
• The user password gives restricted access to view and change Setup options in the BIOS Setup
program. This is user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the
BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the supervisor password
or the user password to access Setup. Users have access to Setup respective to which password
is entered.
• Setting the user password restricts who can boot the computer. The password prompt will be
displayed before the computer is booted. If only the supervisor password is set, the computer
boots without asking for a password. If both passwords are set, the user can enter either
password to boot the computer.
Table 41 shows the effects of setting the supervisor password and user password. This table is for
reference only and is not displayed on the screen.
Table 41. Supervisor and User Password Functions
Password Set Supervisor
Mode User Mode Setup Options Password to
Enter Setup Password
During Boot
Neither Can change all
options* Can change all
options* None None None
Supervisor
only Can change all
options Can change a
limited number
of options
Supervisor Password Supervisor None
User only N/A Can change all
options Enter Password
Clear User Password User User
Supervisor
and user set Can change all
options Can change a
limited number
of options
Supervisor Password
Enter Password Supervisor or
user Supervisor or
user
* If no password is set, any user can change all Setup options.
For information about Refer to
Setting user and supervisor passwords Table 53, page 85
Intel Desktop Board BA810 Technical Product Specification
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75
4 BIOS Setup Program
What This Chapter Contains
4.1 Introduction................................................................................................................75
4.2 Maintenance Menu.................................................................................................... 76
4.3 Main Menu................................................................................................................. 77
4.4 Advanced Menu......................................................................................................... 78
4.5 Secu r i ty Me nu............................................................................................................ 85
4.6 Power Menu.............................................................................................................. 86
4.7 Boo t Me n u................................................................................................................. 87
4.8 Exit Menu .................................................................................................................. 88
4.1 Introduction
The BIOS Setup program can be used to view and change the BIOS settings for the computer. The
BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST)
memory test begins and before the operating system boot begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
Table 42 lists the BIOS Setup program menu functions.
Table 42. BIOS Setup Program Menu Bar
Maintenance Main Advanced Security Power Boot Exit
Clears
passwords and
enables
extended
configuration
mode
Allocates
reso urces for
hardware
components
Configures
advanced
features
available
through the
chipset
Sets
passwords
and security
features
Configures
power
management
features
Selects boot
options and
power supply
controls
Save s or
discards
changes to
Setup
program
options
✏NOTE
In this chapter, all examples of the BIOS Setup Program menu bar include the maintenance menu;
however, the maintenance menu is displayed only when the board is in configuration mode.
Section 2.9 on page 51 tells how to put the board in configuration mode.
Intel Desktop Board BA810 Technical Product Specification
76
Table 43 lists the function keys available for menu screens.
Table 43. BIOS Setup Program Function Keys
BIOS Setup Program Function Key Description
<←> or <→>Selects a different menu screen
<↑> or <↓>Selects an item
<Tab> Selects a field
<Enter> Executes command or selects a submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
4.2 Maintenance Menu
To access this menu, select Maintenance on the menu bar at the top of the screen.
Maintenance Main Advanced Security Power Boot Exit
The menu shown in Table 44 is for clearing Setup passwords. Setup only displays this menu in
configuration mode. See Section 2.9 on page 51 for configuration mode setting information.
Table 44. Maintenance Menu
Feature Options Description
Clear All Passwords No options Clears the user and supervisor passwords
BIOS Setup Program
77
4.3 Main Menu
To access this menu, select Main on the menu bar at the top of the screen.
Maintenance Main Advanced Security Power Boot Exit
Table 45 describes the Main Menu. This menu reports processor and memory information and is
for configuring the system date and system time.
Table 45. Main Menu
Feature Options Description
BIOS Version No options Displays the version of the BIOS.
Processor Type No options Displays processor type.
Processor Speed No options Displays processor speed.
System Bus Frequency No options Displays system bus frequency.
Cache RAM No options Displays the size of second-level cache.
Total Memory No options Displays the total amount of RAM on the board.
Memory Bank 0 No options Displays type of DIMM installed in each memory bank.
Processor Serial
Number* • Disabled (default)
• Enabled Enables or disables the Intel Pentium III processor serial
number feature.
System Time Hour, minute, and
second Specifies the current time.
System Date Month, day, and year Specifies the current date.
* Thi s feature appears only if a Pentium III proc essor is installed.
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4.4 Advanced Menu
To access this menu, select Advanced on the menu bar at the top of the screen.
Maintenance Main Advanced Security Power Boot Exit
Boot Configuration
Peripheral Configuration
IDE Configuration
Diskette Configuration
Event Log Configuration
Table 46 describes the Advanced Menu. This menu is used for setting advanced features that are
available thro ugh the chipset.
Table 46. Advanced Menu
Feature Options Description
Boot Configuration No options Configures Plug and Play and the Numlock key, and resets
configuration data. When selected, displays the Boot
Settings Configuration submenu.
Peripheral Configuration No options Configures peripheral ports and devices. When selected,
displays the Peripheral Configuration submenu.
IDE Configuration No options Specifies type of connected IDE device.
Diskette Configuration No options When selected, displays the Floppy Options submenu.
Event Log Configuration No options Configures Event Logging. When selected, displays the
Event Log Configuration submenu.
BIOS Setup Program
79
4.4.1 Boot Configuration Submenu
To access this submenu, select Advanced on the menu bar, then Boot Configuration.
Maintenance Main Advanced Security Power Boot Exit
Boot Configuration
Peripheral Configuration
IDE Configuration
Diskette Configuration
Event Log Configuration
The submenu represented by Table 47 is for setting Plug and Play options, resetting configuration
data, and the power-on state of the Numlock key.
Table 47. Boot Configuration Submenu
Feature Options Description
Plug & Play O/S • No (default)
• Yes Specifies if a Plug and Play operating system is being used.
No
lets the BIOS configure all devices.
Yes
lets the operating system configure Plug and Play
devices. Not required with a Plug and Play operating
system.
Reset Confi g Data • No (default)
• Yes Clears the BIOS configuration data on the next boot.
Numlock • Off
• On (default) Specifies the power on state of the Numlock feature on the
numeric keypad of the keyboard.
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4.4.2 Per i pheral Configuration Submenu
To access this submenu, select Advanced on the menu bar, then Peripheral Configuration.
Maintenance Main Advanced Security Power Boot Exit
Boot Configuration
Peripheral Configuration
IDE Configuration
Diskette Configuration
Event Log Configuration
The submenu represented in Table 48 is used for configuring computer peripherals.
Table 48. Peripheral Configuration Submenu
Feature Options Description
Serial port A • Auto (default)
• Disabled
• 3F8/COM1
• 2F8/COM2
• 3E8/COM3
• 2E8/COM4
Configures serial port A.
Auto
assigns the first free COM port, normally COM1 at I/O
address 3F8h.
Audio Device • Disabled
• Enabled
(default)
Enables or disables the onboard audio subsystem.
Modem Device • Disabled
• Enabled
(default)
Enables or disables the onboard modem device.
BIOS Setup Program
81
4.4.3 IDE Configuration
To access this submenu, select Advanced on the menu bar, then IDE Configuration.
Maintenance Main Advanced Security Power Boot Exit
Boot Configuration
Peripheral Configuration
IDE Configuration
Primary IDE Master
Primary IDE Slave
Diskette Configuration
Event Log Configuration
The menu represented in Table 49 is used to configure IDE device options.
Table 49. IDE Device Configuration
Feature Options Description
IDE Controller • Disabled
• Enabled (default) Enables or disables the integrated IDE controller.
Hard Disk Pre-Delay • Disabled (default)
• 3 Seconds
• 6 Seconds
• 9 Seconds
• 12 Seconds
• 15 Seconds
• 21 Seconds
• 30 Seconds
Specifies the hard disk drive pre-delay.
4 Primary IDE Master No options Reports type of connected IDE device. When selected,
displays the Primary IDE Master submenu.
4 Primary IDE Slave No options Reports type of connected IDE device. When selected,
displays the Primary IDE Slave submenu.
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4.4.3.1 Primary IDE Master/Slave Submenus
To access these submenus, select Advanced on the menu bar, then IDE Configuration and then the
master or slave to be configured.
Maintenance Main Advanced Security Power Boot Exit
Boot Configuration
Peripheral Configuration
IDE Configuration
Primary IDE Master
Primary IDE Slave
Diskette Configuration
Event Log Configuration
There are two IDE submenus: primary master and primary slave. Table 50 shows the format of the
IDE submenus. For brevity, only one example is shown.
Table 50. Primary IDE Master/Slave Submenus
Feature Options Description
Type • None
• User
• Auto (default)
• CD-ROM
• ATAPI Removable
• Other ATAPI
• IDE Removable
Specifies the IDE configuration mode for IDE devices.
User
allows the cylinders, heads, and sectors fields to be
changed.
Auto
automatically fills in the values for the cylinders,
heads, and sectors fields.
LBA Mode Control • Disabled
• Enabled (default) Enables or disables the LBA mode control.
Multi-Sector Transfers • Disabled
• 2 Sectors
• 4 Sectors
• 8 Sectors
• 16 Sectors (default)
Specifies number of sectors per block for transfers from
the hard disk drive to memory.
Check the hard disk drive’s specifications for optimum
setting.
PIO Mode • Auto (default)
• 0
• 1
• 2
• 3
• 4
Specifies the method for moving data to/from the drive.
Ultra DMA • Disabled (default)
• Mode 0
• Mode 1
• Mode 2
• Mode 3
• Mode 4
Specifies the Ultra DMA mode for the drive.
BIOS Setup Program
83
4.4.4 Di skette Configur ations Submenu
To access this submenu, select Advanced on the menu bar, then Diskette Configuration.
Maintenance Main Advanced Security Power Boot Exit
Boot Configuration
Peripheral Configuration
IDE Configuration
Diskette Configuration
Event Log Configuration
The submenu represented by Table 51 is used for configuring the diskette drive.
Table 51. Diskette Configurations Submenu
Feature Options Description
Diskette Controller • Disabled
• Enabled (default) Enables or disables the integrated diskette
controller.
Diskette A • Not Installed
• 360 KB 5¼ "
• 1.2 MB 5¼ "
• 720 KB 3½ "
• 1.44/1.25 MB 3½ " (default)
• 2.88 MB 3½ "
Specifies the capacity and physical size of
diskette drive A.
Diskette Write Protect • Disabled (default)
• Enabled Enables or disables write protect for the
diskette drive.
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4.4.5 Event Log Confi guration
To access this submenu, select Advanced on the menu bar, then Event Log Configuration.
Maintenance Main Advanced Security Power Boot Exit
Boot Configuration
Peripheral Configuration
IDE Configuration
Diskette Configuration
Event Log Configuration
The submenu represented by Table 52 is used to configure the event logging features.
Table 52. Event Log Configuration Submenu
Feature Options Description
Event log No options Indicates if there is space available in the event log.
Event log validity No options Indicates if the contents of the event log are valid.
View event log [Enter] Displays the event log.
Clear all event logs • No (default)
• Yes Clears the event log after rebooting.
Event Logging • Disabled
• Enabled (default) Enables logging of events.
Mark events as read [Enter] Marks all events as read.
BIOS Setup Program
85
4.5 Security Menu
To access this menu, select Security from the menu bar at the top of the screen.
Maintenance Main Advanced Security Power Boot Exit
The menu represented by Table 53 is for setting passwords and security features.
Table 53. Security Menu
Feature Options Description
Supervisor Password Is No options Reports if there is a supervisor password set.
User Password Is No options Reports if there is a user password set.
Set Supervisor Password Password can be up to seven
alphanumeric characters. Specifies the supervisor password.
Set User Password Password can be up to seven
alphanumeric characters. Specifies the user password.
Clear User Password* [Enter] Clears the user password.
User Access Level** • Limited
• No Access
• View Only
• Full (default)
Sets BIOS Setup Utility access rights for user
level.
Unattended Start* • Disabled (default)
• Enabled The keyboard remains locked until a
password is entered.
* Thi s feature appears only if a user password has been set.
** This feature appears only if both a user password and a supervisor password have been set.
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4.6 Power Menu
To access this menu, select Power from the menu bar at the top of the screen.
Maintenance Main Advanced Security Power Boot Exit
The menu represented in Table 54 is for setting the power management features.
Table 54. Power Menu
Feature Options Description
Power Management* • Disabled
• Enabled (default) Enables or disables the BIOS power management
feature.
Inactivity Timer* • Off
• 1 minute
• 5 minutes
• 10 minutes
• 20 minutes (default)
• 30 minutes
• 60 minutes
• 120 minutes
Specifies the amount of time before the computer
enters standby mode, when APM power
management is activ e.
Hard Drive* • Disabled
• Enabled (default) Enables or disables power management for hard
disks during standby and suspend modes, when
APM power management is active.
Video Power Down* • Disabled
• StandBy
• Suspend (default)
• Sleep
Specifies power management for video during
standby and suspend modes, when APM power
management is activ e.
ACPI Suspend State • S1 State (default)
• S3 State Specifies the ACPI suspend state.
* Power Management, Inactiv i ty Timer, Hard Drive, and Video Power Down features apply only for AP M operating
systems.
BIOS Setup Program
87
4.7 Boot Menu
To access this menu, select Boot from the menu bar at the top of the screen.
Maintenance Main Advanced Security Power Boot Exit
The menu represented in Table 55 is used to set the boot features and the boot sequence.
Table 55. Boot Menu
Feature Options Description
Quie t Boot • Disabled
• Enabled (default)
Disabled
displays normal POST messages.
Enabled
displays OEM logo instead of POST
messages.
Quick Boot • Disabled
• Enabled (default) Enables the computer to boot without running certain
POST tests.
Scan User Flash
Area • Disabled (default)
• Enabled Enables the BIOS to scan the flash memory for user
binary files that are executed at boot time.
After Power Failure • Stays Off
• Last State (default)
• Power On
Specifies the mode of operation if an AC/Power loss
occurs.
Stay Off
keeps the power off until the power button is
pressed.
Last State
restores the previous power state before
power loss occurred.
Power On
restores power to the computer.
On Modem Ring • Stay Off (default)
• Power On Specifies how the computer responds to an incoming
call on an installed modem when the power is off.
First Boot Device
Second Boot Device
Third Boot Device
Fourth Boot Device
• Floppy
• ARMD-FDD*
• ARMD-HDD**
• IDE-HDD***
• ATAPI CDROM
• Disabled
Specifies the boot sequence from the available devices.
To specify boot sequence:
1. Select the boot device with <↑> or <↓>.
2. Press <Enter> to set the selection as the intended
boot device.
The operating system assigns a drive letter to each
boot device in the order listed. Changing the order of
the devices changes the drive lettering.
Not all of the devices in this list are available as second,
third, and fourth boot devices. The default settings for
the first through fourth boot devices are, respectively:
• Floppy
• IDE-HDD
• ATAPI CDROM
• Disabled
IDE Drive
Configuration • Primary Master IDE
1st IDE (default)
• Primary Slave IDE
2nd IDE
Selects the IDE boot device. If selected, allows the
slave IDE device to be the boot device.
* ARMD-FDD = ATAPI removable device - floppy disk drive
** ARMD-HDD = ATAPI removabl e device - hard disk driv e
*** HDD = Hard Disk Drive
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4.8 Exit Menu
To access this menu, select Exit from the menu bar at the top of the screen.
Maintenance Main Advanced Security Power Boot Exit
The menu represented in Table 56 is for exiting the BIOS Setup program, saving changes, and
loading and saving defaults.
Table 56. Exit Menu
Feature Description
Exit Saving Changes Exits and saves the changes in CMOS SRAM.
Exit Discarding Changes Exits without saving any changes made in the BIOS Setup program.
Load Setup Defaults Loads the factory default values for all the Setup options.
Load Custom Defaults Loads the custom defaults for Se tup options.
Save Custom Defaults Saves the current values as custom defaults. Normally, the BIOS reads the
Setup values from flash memory. If this memory is corrupted, the BIOS reads the
custom defaults. If no custom defaults are set, the BIOS reads the factory
defaults.
Discard Changes Discards changes without exiting Setup. The option values present when the
computer was turned on are used.
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5 Error Messages and Beep Codes
What This Chapter Contains
5.1 BIOS Error Messages................................................................................................ 89
5.2 Bus Initialization Checkpoints.................................................................................... 91
5.3 Speaker.....................................................................................................................92
5.4 BIOS Beep Codes..................................................................................................... 93
5.1 BIOS Error Messages
Table 57 lists the error messages and provides a brief description of each.
Table 57. BIOS Error Messages
Error Message Explanation
GA20 Error An error occurred with Gate-A20 when switching to protected
mode during the memory test.
Pri Master HDD Error
Pri Slave HDD Error Could not read sector from corresponding drive.
Pri Master Drive - ATAPI Incompatible
Pri Slave Drive - ATAPI Incompatible Corresponding drive in not an ATAPI device. Run Setup to make
sure device is selected correctly.
A: Drive Error No response from diskette drive.
Cache Memory Bad An error occurred when testing L2 cache. Cache memory may be
bad.
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Display Type Wrong The display type is different than what has been stored in CMOS.
Check S etup to make sure type is cor rect.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have
been corrupted. Run Setup to reset values.
CMOS Settings Wrong CMOS values are not the same as the last boot. These values
have either been corrupted or the battery has failed.
CMOS Date/Time Not Set The time and/or date values stored in CMOS are invalid. Run
Setup to set correct values.
DMA Error Error during read/write test of DMA controller.
FDC Failure Error occurred trying to access diskette drive controller.
HDC Failure Error occurred trying to access hard disk controller.
continued
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Table 57. BIOS Error Messages (continued)
Error Message Explanation
Checking NVRAM..... NVRAM is being checked to see if it is valid.
Update OK! NVRAM was invalid and has been updated.
Updated Failed NVRAM was invalid but was unable to be updated.
Keyboard Is Locked The system keyboard lock is engaged. The system must be
unlocked to continue to boot.
Keyboard Error Error in the keyboard connection. Make sure keyboard is
connected properly.
KB/Interface Error Keyboard interface test failed.
Memory Size Decreased Memory size has decreased since the last boot. If no memory was
removed then memory may be bad.
Memory Size Increased Memory size has increased since the last boot. If no memory was
added there may be a problem with the system.
Memory Size Changed Memory size has changed since the last boot. If no memory was
added or removed then memory may be bad.
No Boot Device Available System did not find a device to boot.
Off Board Parity Error A parity error occurred on an offboard card. This error is followed
by an address.
On Board Parity Error A parity error occurred in onboard memory. This error is followed
by an address.
Parity Error A parity error occurred in onboard memory at an unknown
address.
<CTRL_N> Pressed CMOS is ignored and NVRAM is cleared. User must enter Setup.
Error Messages and Beep Codes
91
5.2 Bus Initialization Checkpoints
The system BIOS gives control to the different buses at several checkpoints to do various tasks.
Table 58 describes the bus initialization checkpoints.
Table 58. Bus Initialization Checkpoints
Checkpoint Description
2A Different buses init (system, static, and output devices) to start if present.
38 Different buses init (input, IPL, and general devices) to start if present.
39 Display different buses initialization error messages.
95 Init of different buses optional ROMs from C800 to start.
While control is inside the different bus routines, additional checkpoints are output to port 80h as
WORD to identify the routines under execution. In these WORD checkpoints, the low byte of the
checkpoint is the system BIOS checkpoint from which the control is passed to the different bus
routines. The high byte of the checkpoint is the indication of which routine is being executed in the
different buses. Table 59 describes the upper nibble of the high byte and indicates the function that
is being executed.
Table 59. Upper Nibble High Byte Functions
Value Description
0 func#0, disable all devices on the bus concerned
1 func#1, static devices init on the bus concerned
2 func#2, output device init on the bus concerned
3 func#3, input device init on the bus concerned
4 func#4, IPL device init on the bus concerned
5 func#5, general device init on the bus concerned
6 func#6, error reporting for the bus concerned
7 func#7, add-on ROM init for all buses
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Table 60 describes the lower nibble of the high byte and indicates the bus on which the routines are
being executed .
Table 60. Lower Nibble High Byte Functions
Value Description
0 Generic DIM (Device Initialization Manager)
1 Onboard system devices
2 ISA devices
3 EISA devices
4 ISA PnP devices
5 PCI devices
5.3 Speaker
A 47 Ω inductive speaker is mounted on the board. The speaker provides audible error code (beep
code) information during the power-on self-test (POST).
For information about Refer to
The location of the onboard speaker Figure 1, page 11
Error Messages and Beep Codes
93
5.4 BIOS Beep Codes
Whenever a recoverable error occurs during power-on self-test (POST), the BIOS displays an error
message describing the problem (see Table 61). The BIOS also issues a beep code (one long tone
followed by two short tones) during POST if the video configuration fails (a faulty video card or no
card installed) or if an external ROM module does not properly checksum to zero.
There are several POST routines that issue a POST terminal error and shut down the system if they
fail. Before shutting down the system, the terminal-error handler issues a beep code signifying the
test point error, writes the error to I/O port 80h, attempts to initialize the video and writes the error
in the upper left corner of the screen (using both monochrome and color adapters).
If POST completes normally, the BIOS issues one short beep before passing control to the
operating system.
Table 61. Beep Codes
Beep Description
1 Refresh failure
2 Parity cannot be reset
3 First 64 KB memory failure
4 Timer not operational
5 Not used
6 8042 GateA20 cannot be toggled
7 Exception interrupt error
8 Display memory R/W error
9 Not used
10 CMOS Shutdown register test error
11 Invalid BIOS (e.g. POST module not found, etc.)
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