CL03C100GA3GNNH - SAMSUNG

SPECIFICATION

(Reference sheet)

· Supplier : Samsung electro-mechanics · Samsung P/N :

· Product : Multi-layer Ceramic Capacitor · Description : CAP, 10㎊, 25V, ± 2%, C0G, 0201

CL 03 C100 G A 3 G N N H

① ②③ ④ ⑤ ⑥ ⑦ ⑧⑨⑩⑪

①Series Samsung Multi-layer Ceramic Capacitor

②Size 0201 (inch code) L: 0.60 ± 0.03 mm W: 0.30 ± 0.03 mm

③Dielectric C0G ⑧Inner electrode

④Capacitance 10

㎊

Termination

⑤Capacitance Plating (Pb Free)

tolerance ⑨Product Normal

⑥Rated Voltage 25 V ⑩Special Reserved for future use

⑦Thickness 0.30 ± 0.03 mm ⑪Packaging Cardboard Type, 7" reel

B. Structure and dimension

CL03C100GA3GNNH

± 2% Sn 100%

Cu

BW

A. Samsung Part Number

Samsung P/N

Dimension(㎜)

LWT

CL03C100GA3GNNH0.60 ± 0.03 0.30 ± 0.03 0.30 ± 0.03 0.15 ± 0.05

1

C. Samsung Reliability Test and Judgement condition

Capacitance Within specified tolerance

Q600 min

Insulation 10,000Mohm or 500Mohm x ㎌Rated Voltage 60~120 sec.

Resistance Whichever is smaller

Appearance No abnormal exterior appearance Microscop (X10)

Withstanding No dielectric breakdown or of the rated voltage

Voltage mechanical breakdown

Temperature C0G

Characteristics (From -55℃ to 125℃, Capacitance change should be within ±30PPM/℃)

Adhesive Strength No peeling shall be occur on the 200g×F, for 10±1 sec.

of Termination terminal electrode

Bending Strength Capacitance change : Bending to the limit (1mm)

within ±5% or ±0.5㎊ whichever is large

r

with 1.0mm/sec.

Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder

is to be soldered newly 245±5℃, 3±0.3sec.

(preheating : 80~120℃ for 10~30sec.)

Resistance to Capacitance change : Solder pot : 270±5℃, 10±1sec.

Soldering heat within ±2.5% or ±0.25㎊ whichever is larger

Tan δ, IR : initial spec.

Vibration Test Capacitance change : Amplitude : 1.5mm

within ±2.5% or ±0.25㎊ whichever is larger From 10㎐ to 55㎐ (return : 1min.)

Tan δ, IR : initial spec. 2hours ´ 3 direction (x, y, z)

Moisture Capacitance change : With rated voltage

Resistance within ±7.5% or ±0.75㎊ whichever is larger 40±2℃, 90~95%RH, 500+12/-0hrs

Q : 133.33 min

IR : 500Mohm or 25Mohm × ㎌

Whichever is smaller

High Temperature Capacitance change : With of the rated voltage

Resistance within ±3% or ±0.3㎊ whichever is large

r

Max. operating temperature

Q : 300.00 min 1,000+48/-0hrs

IR : 1,000Mohm or 50Mohm × ㎌

Whichever is smaller

Temperature Capacitance change : 1 cycle condition

Cycling within ±2.5% or ±0.25㎊ whichever is larger Min. operating temperature →25℃

Tan δ, IR : initial spec. →Max. operating temperature →25℃

5 cycle test

※ The reliability test condition can be replaced by the corresponding accelerated test condition.

D. Recommended Soldering method :

Reflow ( Reflow Peak Temperature : 260±5℃, 30sec. )

Product specifications included in the specifications are effective as of March 1, 2013.

Please be advised that they are standard product specifications for reference only.

We may change, modify or discontinue the product specifications without notice at any time.

So, you need to approve the product specifications before placing an order.

Should you have any question regarding the product specifications,

please contact our sales personnel or application engineers.

200%

Test condition

300%

1㎒±10% / 0.5~5Vrms

Judgement

2

MLCC Pr

o

E. Recom

m

(Sub

s

☞ Materi

a

☞

☞ Caution

o

duct Ma

m

ended T

E

strate for b

e

Si

z

a

l : Glass ep

: Copper

f

: Abnormal

i

nual

E

ST PCB

Size co

d

02

03

05

10

21

31

32

43

55

e

nding stren

z

e code

02

03

05

10

21

31

32

43

55

oxy substra

t

f

oil (T=0.03

5

i

ty can occu

( Adhesive

d

e Si

z

0.

1.

0

1.

2.

0

3.

4.

5.

gth test)

Size (mm)

0.4 × 0.2

0.6 × 0.3

1.0 × 0.5

1.6 × 0.8

2.0 × 1.25

3.2 × 1.6

3.2 × 2.5

4.5 × 3.2

5.7 × 5.0

t

e ☞

T

5

㎜) ☞

r if lead-ba

s

3

strength of

z

e (mm)

.

4 × 0.2

.

6 × 0.3

0. × 0.5

.

6 × 0.8

0

× 1.25

.

2 × 1.6

.

2 × 2.5

.

5 × 3.2

.

7 × 5.0

a

0.2

0.3

0.4

1.0

1.2

2.2

3.5

4.5

T

hickness :

T

: S

o

s

ed solder (

K

d

b

termination

)

a

b

0.20 0.

1

0.30 0.

3

0.40 0.

5

1.00 1.

0

1.20 1.

4

2.20 1.

4

2.20 1.

4

3.50 1.

7

4.50 1.

7

(S

u

b c

0.6 0.

2

0.9 0.

3

1.5 0.

5

3.0 1.

2

4.0 1.

6

5.0 2.

0

5.0 2.

9

7.0 3.

7

8.0 5.

6

T

=1.6 ㎜ (T=

o

lder resist

K

SD 6704)

w

)

b

c

1

70.26

3

00.30

5

50.50

0

01.20

4

01.65

4

02.00

4

02.90

7

53.70

7

55.60

u

bstrate for

R

d

2

5.0

3

5.0

5

5.0

2

5.0

6

55.0

0

5.0

9

5.0

7

5.0

6

5.0

0.8 ㎜ for

0

w

ith 3% silve

r

Reliability t

e

5.5

0

3/05)

r

is used.

e

st)

e

a

c

3

MLCC Pr

o

1. Packa

g

This sp

e

When

c

1-1. Figur

1-2. Qua

n

Type

MLCC

o

duct Ma

g

ing

e

cification

a

c

ustomers r

e

n

tity

Size Code

Inch(mm)

0402 (01005)

0603 (0201)

1005 (0402)

1608 (0603)

2012 (0805)

3216 (1206)

3225 (1210)

4520 (1808)

4532 (1812)

5750 (2220)

nual

a

pplies to t

a

e

quire, the

s

Chip

Thickness

0.2 mm

0.3 mm

0.5 mm

0.8 mm

T≤0.85 mm

T≥1.0 mm

T≤0.85 mm

T≥1.0 mm

T≤1.6 mm

T≥2.0 mm

T≤1.6 mm

T≥2.0 mm

T≤2.0 mm

T>2.0 mm

T≥2.5 mm

a

ping of M

L

s

pecificatio

n

Tap ing Ty

p

PAPER

EMBOSSE

D

PAPER

EMBOSSE

D

EMBOSSE

D

EMBOSSE

D

EMBOSSE

D

EMBOSSE

D

EMBOSSE

D

EMBOSSE

D

EMBOSSE

D

4

L

CC

n

may be c

h

p

ePitch 7

2mm

4mm

D

4mm

D

4mm

D

4mm

D

4mm

D

8mm

D

8mm

D

8mm

D

8mm

D

8mm

h

anged un

d

Plastic

inches reel

20k

10K

4K

2K

4K

2K

1K

2k

1k

-

d

er the agr

e

Plastic

10 inches reel

-

10K

6K

10K

4K

-

e

ement.

[u

Plas

t

13 inch

e

100

K

50

K

50

K

15K /

1

15K /

1

10

K

10

K

10

K

10

K

4K

8k

4k

4K

2K

nit:pcs]

t

ic

s reel

K

1

0K

1

0K

K

4

MLCC Product Manual

5

1-3. Tape Size

1-3-1. Cardboard(Paper) tape : 4mm pitch

[unit:mm]

Size

Inch(mm) A B W F E P1 P2 P0 D t

0603

(1608)

1.00

±0.10

1.90

±0.10

8.00

±0.30

3.50

±0.05

1.75

±0.10

4.00

±0.10

2.00

±0.05

4.00

±0.10

φ1.50

+0.10/-0

1.1

Below

0805

(2012)

1.55

±0.10

2.30

±0.10

1206

(3216)

2.05

±0.10

3.60

±0.10

※ The A, B in the table above are based on normal dimensions. The data may be changed

with the special size tolerances.

1-3-2. Cardboard(Paper) tape : 2mm pitch

[unit:mm]

Size

Inch(mm) A B W F E P1 P2 P0 D t

01005

(0402)

0.25

±0.02

0.46

±0.02

8.00

±0.30

3.50

±0.05

1.75

±0.10

2.00

±0.05

2.00

±0.05

4.00

±0.10

φ1.50

+0.10

/-0.03

0.25

±0.02

0201

(0603)

0.38

±0.03

0.68

±0.03

0.35

±0.03

0402

(1005)

0.62

±0.05

1.12

±0.05

0.60

±0.05

0204

(0510)

0.62

+0.05

/-0.10

1.12

+0.05

/-0.10

0.37

±0.03

※ The A, B in the table above are based on normal dimensions. The data may be changed

with the special size tolerances.

5

MLCC Product Manual

6

1-3-3. Embossed(Plastic) tape

[unit:mm]

Size

Inch(mm) A B W F E P1 P2 P0 D t1 t0

01005

(0402)

0.23

±0.02

0.45

±0.02

4.00

±0.05

1.80

±0.02

0.90

±0.05

1.00

±0.02

1.00

±0.02

2.00

±0.03

φ0.80

±0.04 0.35

Below

0.50

Below

015008

(05025)

0.32

±0.03

0.58

±0.03

8.00

±0.30

3.50

±0.05

1.75

±0.10

2.00

±0.05

2.00

±0.05

4.00

±0.10

φ1.50

+0.10

/-0.03

0603

(1608)

1.05

±0.15

1.90

±0.15

4.00

±0.10

φ1.50

+0.10

/-0

2.50

Below

0.60

Below

0805

(2012)

1.45

±0.20

2.30

±0.20

1206

(3216)

1.90

±0.20

3.50

±0.20

1210

(3225)

2.80

±0.20

3.60

±0.20

1808

(4520)

2.30

±0.20

4.90

±0.20

12.0

±0.30

5.60

±0.05

8.00

±0.10

3.80

Below

1812

(4532)

3.60

±0.20

4.90

±0.20

2220

(5750)

5.50

±0.20

6.20

±0.20

0204

(0510)

0.62

+0.05

/-0.10

1.12

+0.05

/-0.10 8.00

±0.30

3.50

±0.05

4.00

±0.10

2.50

Below

0306

(0816)

1.10

±0.20

1.90

±0.20

※ The A, B in the table above are based on normal dimensions. The data may be changed

with the special size tolerances.

6

MLCC Pr

o

1-3-4. Reel

Symbol

7”Reel

10”Reel

13”Reel

1-4. Cove

r

1-4-1. Peel

-

10 g

1-4-2. Mea

s

-Ta

p

(IE

* If t

o

duct Ma

Size

Tape Wid

t

4mm

8mm

12mm

8mm

12mm

r

tape pee

-

off force

.f ≤ peel-o

f

s

urement M

p

ing Packag

C 60286-3

P

he static el

e

nual

t

h A

φ178±2.

φ258±2.

φ330±2.

l-off force

f

f force ≤ 7

0

ethod

ing design :

P

ackaging o

f

e

ctricity of S

M

B

0 MINφ50

0 MINφ70

0

g.f

Packaging

f

componen

M

T process

7

C

φ13±0.5

design follo

ts for auto

m

causes any

D

21±0.8

w

s IEC 602

8

m

atic handli

n

problems, p

E

2.0±0.5

8

6-3 standar

d

n

g - parts 3)

lease conta

c

W

5±0.5

10±1.5

13±0.5

10±1.5

13±0.5

d.

c

t us.

[unit:mm]

t

1.2±0.2

0.9±0.2

1.2±0.2

1.8±0.2

2.2±0.2

7

MLCC Pr

o

1-5. BOX

1-5-1. Pac

k

REE

L

Lab

e

1)

2)

3)

4)

5)

6)

1-5-2. Box

1) Dou

2) Avo

i

3) Re

m

※ If sp

1-5-3. 7" B

o

- Inner

- Oute

r

o

duct Ma

package

k

aging Label

L

& Box Typ

e

l includes t

h

Chip size

Temp e ratur

e

Nominal C

a

Model Na

m

LOT Numb

e

Q’ty

Packaging

ble packagi

n

i

d any dam

a

m

ark informa

t

p

ecial packa

g

o

x packagin

g

r

Box (7" x 5

r

Box (7" x

2

nual

e

h

e informati

o

e

Characteri

s

a

pacitance

m

e

r & Reel N

u

n

g with the

a

ges during

t

ion of cont

g

ing is requi

g

REEL )

2

0 REEL)

o

n as below

.

s

tics

u

mber

paper type

o

t

ransportati

o

e

nts on inn

e

red, please

c

8

w

.

of inner bo

x

o

n by car, a

i

e

r box and

o

c

ontact us.

- I

-

x

and outer

b

i

rplane and

s

o

uter box

nner Box (7

"

-

Outer Box

b

ox.

s

hip.

"

x 10 REEL)

(7" x 60 RE

E

[ Unit :

m

E

L)

m

m ]

8

MLCC Product Manual

9

1-5-4. 13” Box packaging

- Inner Box (13" x 4 REEL) - Outer Box (13" x 20 REEL)

1-6. Chip Weight

Size(L/W)

Inch(mm)

Size(T)

(mm) Temp. Weight

(mg/pc)

Size(L/W)

Inch(mm)

Size(T)

(mm) Temp. Weight

(mg/pc)

01005

(0402)

0.20 C0G 0.082 0201

(0603)

0.30 C0G 0.233

0.20 X7R 0.083 0.30 X7R 0.285

0.20 X5R 0.093 0.30 X5R 0.317

0402

(1005)

0.50 C0G 1.182 0603

(1608)

0.80 C0G 4.615

0.50 X7R 1.559 0.80 X7R 5.522

0.50 X5R 1.560 0.80 X5R 5.932

0805

(2012)

0.65 C0G 7.192 1206

(3216)

1.25 C0G 28.086

1.25 X7R 16.523 1.60 X7R 54.050

1.25 X5R 16.408 1.60 X5R 45.600

1210

(3225)

2.50 X7R 116.197 1808

(4520)

1.25 C0G 47.382

2.50 X5R 121.253 1.25 X7R 63.136

1812

(4532) 1.25 X7R 96.697 2220

(5750) 1.60 X7R 260.897

The weight of product is typical value per size, for more details, please contact us.

9

MLCC Product Manual

10

2. Product Characteristic data

2-1. Capacitance

The capacitance is the ratio of the change in an electric charge according to voltage change.

Due to the fact that the capacitance may be subject to change with the measured voltage and

frequency, it is highly recommended to measure the capacitance based on the following

conditions.

2-1-1. Measure capacitance with voltage and frequency specified in this document.

Regarding the voltage/frequency condition for capacitance measurement of each MLCC model,

please make sure to follow a section “C. Reliability test Condition - Capacitance” in this document.

The following table shows the voltage and frequency condition according to the capacitance

range.

[The voltage and frequency condition according to MLCC the capacitance range]

◆ Class I

Capacitance Frequency Voltage

≤ 1,000 pF 1 MHz ± 10%

0.5 ~ 5 Vrms

> 1,000 pF 1 kHz ± 10%

◆ Class II

Capacitance Frequency Voltage

≤ 10 ㎌ 1 kHz ± 10% 1.0 ± 0.2 Vrms

> 10 ㎌ 120 Hz ± 20% 0.5 ± 0.1 Vrms

Exception* 1 kHz ± 10% 0.5 ± 0.1 Vrms

Capacitance shall be measured after the heat treatment of 150+0/-10℃

for 1hr, leaving at room temperature for 24±2hr. (Class II)

2-1-2. It is recommended to use measurement equipment with the ALC (Auto Level Control) option.

The reason is that when capacitance or measurement frequency is high, the output voltage of

measurement equipment can be lower than the setting voltage due to the equipment limitation.

Note that when capacitance or measurement frequency is excessively high, the measurement

equipment may show ALC off warning and provide a lower output voltage than the setting

voltage even with ALC option selected. It is necessary to ensure the output voltage of

measurement equipment is the same as the setting voltage before measuring capacitance.

10

MLCC Product Manual

11

2-1-3. Capacitance value of high dielectric constant (Class II) MLCC changes with applied AC and DC

voltage. Therefore, it is necessary to take into account MLCC’s AC voltage characteristics and DC-

bias voltage characteristics when applying MLCC to the actual circuit.

2-1-4. The capacitance is in compliance with the EIA RS-198-1-F-2002.

2-2. Tan δ (DF)

2-2-1. An ideal MLCC’s energy loss is zero, but real MLCC has dielectric loss and resistance loss of

electrode. DF (Dissipation Factor) is defined as the ratio of loss energy to stored energy and

typically being calculated as percentage.

2-2-2. Quality factor (Q factor) is defined as the ratio of stored energy to loss energy.

The equation can be described as 1/DF. Normally the loss characteristic of Class I MLCC is

presented in Q, since the DF value is so small whereas the loss characteristic of Class II MLCC is

presented in DF.

2-2-3. It is recommended to use Class I MLCC for applications to require good linearity and low loss

such as coupling circuit, filter circuit and time constant circuit.

2-3. Insulation Resistance

Ceramic dielectric has a low leakage current with DC voltage due to the high insulating properties.

Insulation resistance is defined as the ratio of a leakage current to DC voltage.

2-3-1. When applying DC voltage to MLCC, a charging current and a leakage current flow together at

the initial stage of measurement. While the charging current decreases, and insulation resistance

(IR) in MLCC is saturated by time. Therefore, insulation resistance shall be measured 1 minute after

applying the rated voltage.

2-4. Capacitance Aging

The aging characteristic is that the high dielectric (Class II) MLCC decreases capacitance

value over time. It is also necessary to consider the aging characteristic with voltage and

temperature characteristics when Class II MLCC is used in circuitry.

11

MLCC Pr

o

2-4-1. In g

e

follo

w

diffe

2-4-2. Afte

r

sho

u

2-5. Tem

p

Pleas

e

capac

2-5-1. It is

Cha

r

[ Exam

o

duct Ma

e

neral, agin

g

w

ing graph.

rent models

r

heat treat

m

u

ld be consi

d

p

erature C

h

e

consider t

e

itance chan

g

necessary t

o

r

acteristics”

f

ple of Temp

* Sample

nual

g

causes ca

p

Please che

c

.

m

ent (150 °

C

d

ered again

h

aracterist

i

e

mperature

g

es which is

o

check the

v

f

or the tem

p

erature Cha

: 10uF, Rate

d

p

acitance to

c

k with SEM

C

, 1hour), th

e

from the ti

m

[ Example

* Sam

p

i

cs of Cap

a

c

haracteristi

caused by

a

v

alues speci

p

erature and

r

acteristics (

X

d

voltage 6.

3

12

decrease li

n

C

O for mor

e

capacitan

c

m

e of heat t

of Capacita

n

p

le : C0G, X

7

a

citance (

T

cs of capaci

a change in

fied in secti

o

capacitanc

e

X

5R) ]

3V *

n

early with t

h

e

details, sin

c

e decrease

d

reatment.

n

ce Aging ]

7

R, X5R

T

CC)

tance since

ceramic di

e

o

n “C. Relia

b

e

change ra

n

[ E

x

Sample : 10

h

e log of ti

m

c

e the valu

e

d

by aging i

s

the electric

a

e

lectric cons

t

b

ility test C

o

n

ge of MLC

C

x

ample of Bi

a

uF, Rated v

o

m

e as show

n

e

may vary

b

s

recovered,

a

l characteri

s

t

ant by tem

p

o

ndition–Te

m

C

.

a

s TCC ]

o

ltage 6.3V

n

in the

b

etween

so aging

s

tics such a

s

p

erature.

m

perature

s

12

MLCC Pr

o

2-5-2. Whe

tem

p

MLC

C

2-5-3. In a

d

2-6. Self-

h

It is

n

(Equi

2-6-1. Whe

or p

u

insul

2-6-2. The

circu

Ther

e

1) T

h

A

C

2) T

h

o

duct Ma

e

n selecting

p

erature an

d

C

.

d

dition, Bias

h

eating Te

n

ecessary t

o

valent Serie

s

e

n MLCC is

u

lse current

ating prope

reliability of

it, even the

e

fore, make

h

e surface t

e

C

or Pulse v

o

h

e rise in in

c

nual

MLCC, it is

n

d

TCC of ML

C

TCC of ML

C

mperature

o

design the

s

Resistance

)

u

sed in an A

flows throu

g

rties.

MLCC may

AC voltage

su

r

e to che

c

e

mperature

o

ltage is ap

p

c

rease by se

l

*

S

n

ecessary to

C

C, since th

e

C

C should b

e

system, wit

h

)

of MLCC

w

C

voltage o

r

g

h MLCC. S

h

be affected

o

r

the puls

e

c

k the follo

w

o

f MLCC m

u

p

lied.

l

f-heating o

f

[ Examp

S

ample : X5

R

13

consider t

h

e

applied te

m

e

taken into

h

considerin

w

hen AC vol

t

r

pulse volt

a

h

ort-circuit

m

by MLCC b

e

voltage is

w

ing conditi

u

st stay with

f

MLCC mus

t

le of Ripple

R

10uF, Rat

e

h

e heat char

a

m

perature

m

account wh

g self-heati

n

t

age or puls

a

ge circuit, s

e

m

ay be occ

u

e

ing used in

w

ithin the r

a

o

ns.

in the maxi

m

t

not excee

d

current ]

e

d voltage 6

.

a

cteristics o

f

m

ay change

en DC volta

n

g generate

d

e

voltage is

e

lf-heating i

u

rred by the

an AC volt

a

nge of rate

d

m

um operat

i

d

20℃

.

3V

f

a system,

r

the capacit

a

ge is applie

d

by the ES

R

applied to

M

s generated

degradatio

n

a

ge or puls

e

d voltage.

ing temper

a

oom

a

nce of

d

to MLCC.

R

M

LCC.

when AC

n

of M

L

CC’s

e

voltage

a

ture after

13

MLCC Pr

o

2-7. DC

&

It is

r

diele

c

2-7-1. Plea

s

parti

capa

char

a

2-7-2. It is

sinc

e

AC

v

o

duct Ma

&

AC Volta

g

r

equired to

c

tric consta

n

s

e ensure th

cular, when

citance tole

r

a

cteristics a

n

necessary t

o

e

the capaci

t

v

oltage.

nual

g

e Charac

t

c

onsider vol

t

n

t MLCC(Cla

e capacitan

c

high dielec

t

r

ance, a sys

t

n

d aging ch

a

*

o

consider t

h

t

ance value

[

E

*

S

t

eristics

t

age charac

t

ss II) is cha

n

c

e change i

s

ric constant

t

em should

b

a

racteristics

[ Example o

f

Sample : X5

h

e AC volta

g

o

f high diel

e

E

xample of

A

S

ample : X5

R

14

t

eristics in t

h

n

ged by ap

p

s

within the

type MLCC

b

e designe

d

of MLCC.

f DC Bias ch

a

R 10uF, Rate

g

e character

e

ctric const

a

A

C voltage

c

R

10uF, Rat

e

h

e circuit si

n

p

lied DC &

A

allowed op

e

(Class II) is

d

with consi

d

a

racteristics

]

d voltage 6.

3

istics of ML

C

a

nt type ML

C

c

haracteristi

c

e

d voltage 6

.

n

ce the capa

A

C voltage.

e

rating rang

e

used in circ

u

d

ering DC v

o

3

V

C

C and the

A

C

C (Class II)

c

s ]

.

3V

a

citance val

u

e

of a syste

m

u

it with nar

r

o

ltage, tem

p

A

C voltage

o

varies with

e of high

m

. In

r

ow allowed

p

erature

o

f a system,

the applied

14

MLCC Pr

o

2-8. Impe

Elect

r

curre

(Z=V

/

cons

i

Ther

e

MLC

C

2-8-1. MLC

incr

e

The

from

2-8-2. MLC

(Equ

i

freq

u

com

e

2-8-3. SRF

indu

c

2-8-4. The

Whe

imp

e

o

duct Ma

dance Cha

r

ical impeda

e

nt (I) when

a

/

I). Impeda

n

i

sting of the

e

fore, it is r

e

C

based on

t

C operates

a

e

ases ( X_C=

resistance (

E

m

the loss of

C operates

a

ivalent Seri

e

u

ency increa

e

s from the

(Self Reson

a

c

tive reacta

n

impedance

o

n using the

e

dance of lo

w

nual

racteristic

nce (Z) of

M

a

voltage (

V

n

ce extends

t

real part o

f

e

quired to d

e

t

he frequen

c

a

s a capacit

o

1/j2πfC ) w

h

E

SR; Equival

e

its dielectri

c

a

s an induc

t

e

s Inductanc

e

ses ( X_L=j

2

loss of its e

a

nt Frequen

c

n

ce(XL) canc

o

f MLCC ca

n

network an

a

w

capacitan

[

*

M

LCC is the

m

V

) is applied.

t

he concept

f

resistance

(

e

sign circuit

c

y ( Z = R +

o

r in the lo

w

h

ere f is fre

q

e

nt Series R

e

c

material.

t

or in the hi

g

e

). The reac

t

2

πf∙ESL ). Th

e

lectrode m

e

c

y) of MLCC

el each oth

e

n

be measu

r

a

lyzer, pleas

c

e caused b

Example of

I

*

Sample : X

5

15

m

easureme

n

It is define

d

of resistan

c

(

R) and the

i

with consi

d

jX )

w

frequency

q

uency and

C

e

sistance) o

f

g

h frequenc

y

t

ance (XL) o

f

e

resistance

e

tal.

is the freq

u

e

r and the i

m

r

ed by a ne

t

e note that

b

y the AC v

o

I

mpedance

c

5

R 1uF, Rate

d

n

t of the op

p

d

as the rati

o

c

e to AC ci

r

c

i

maginary p

a

d

eration of t

h

and its rea

c

C

is capacit

a

f

MLCC in t

h

y

and the i

n

f

MLCC in t

h

(ESR) of M

L

u

ency where

m

pedance

o

t

work analy

z

the small-si

g

o

ltage chara

c

haracteristic

s

d

voltage 6.3

p

osition tha

t

o

of the vol

t

uits and is

a

rt of reacta

h

e impedan

c

tance (XC)

d

a

nce.

h

e low frequ

e

ductance o

f

h

e high freq

u

L

CC in the h

i

its capaciti

v

f MLCC has

er or an im

p

g

nal input

m

c

teristic of

M

s

]

V

t

MLCC pre

s

t

age to the

c

a

complex n

a

nce (X) as

Z

c

e characte

r

d

ecreases a

s

ency mainl

y

f

MLCC is c

a

uency incre

a

igh frequen

c

v

e reactanc

e

only ESR a

t

p

edance an

a

m

a

y

lead to

M

LCC.

s

ents to a

c

urrent

umber

Z

=R+jX.

r

istics of

s

frequenc

y

comes

a

lled ESL

a

ses as

c

y mainl

y

(XC) and

SRF.

a

lyzer.

t

he

15

MLCC Pr

o

3. Electri

c

3-1. Dera

t

MLC

C

are la

derat

e

test v

o

3-1-1. The

follo

w

3-1-2. The

MLC

C

give

s

defi

n

o

duct Ma

c

al & Me

c

t

ing

C

with the te

beled as “d

e

d as show

n

o

ltage at 15

derated ML

C

w

ing graph.

“Temperatu

r

C including

s

the maxim

n

ed in secti

o

nual

c

hanical

C

st voltage a

t

e

rated MLC

C

n

in the foll

o

0% of the r

a

C

C should

b

r

e of MLCC”

self-heating

um operati

n

o

n “3-2. App

[Exa

m

C

aution

t

100% of t

h

C

.” For this t

y

o

wing graph

a

ted voltag

e

b

e applied w

in the x-ax

i

effect. The

n

g voltage

o

lied Voltag

e

m

ple of dera

t

* Vmax

* Only the

D

16

h

e rated vol

t

y

pe of MLC

C

for the equ

e

in the hig

h

w

ith the dera

i

s of the gr

a

“Voltage D

e

o

f MLCC wit

h

e

.”

ting graph

f

≤ Derated

D

erating ma

t

age in the

h

C

, the volta

g

ivalent life t

h

temperatu

r

ting voltag

e

ph below i

n

e

rating Rati

o

h

reference

t

f

or derated

M

Voltage

rked model

s

h

igh tempe

r

g

e and tem

p

ime of a no

r

e resistanc

e

and tempe

dicates the

o

” in the y-a

x

t

o the maxi

m

M

LCC]

s

r

ature resist

a

p

erature sho

rmal MLCC

w

e

test.

rature as sh

surface tem

x

is of the g

r

m

um voltag

e

a

nce test

uld be

w

ith the

own in the

perature of

r

aph below

e

(Vmax) as

16

MLCC Pr

o

3-2. Appl

i

The

a

3-2-1. Cau

t

· Fo

r

n

o

· Fo

r

sh

o

· Ab

n

M

L

DC V

o

3-2-2. Effe

c

· Ele

c

th

e

· Do

w

diel

e

abo

u

· Ple

a

pr

e

(1) Surg

e

Whe

n

indu

c

elect

r

surg

e

(2) ESD

Sinc

e

com

p

o

duct Ma

i

ed Voltag

e

a

ctual appli

e

t

ions by typ

e

r

DC voltag

e

o

t exceed th

e

r

AC voltage

o

uld not ex

c

n

ormal volt

a

L

CC.

o

ltage

c

t of EOS (El

c

trical Over

s

e

electrical

s

w

n time of

M

e

ctric shock

c

u

t a failure

o

a

se use cau

t

e

paring ML

C

e

n

the overc

u

c

e the overs

r

ical short f

a

e

current int

o

(Electrostati

c

e

the voltag

e

p

ared to the

nual

e

d voltage

o

e

s of voltag

e

or DC+AC

e

rated volt

a

or pulse v

o

c

eed the rat

e

a

ge such as

[Ty

p

AC Volta

ectrical Ove

s

tress such

a

s

hort failure

M

LCC is vari

c

aused by E

o

f MLCC in a

t

ion not to

a

C

C for testin

g

u

rrent cause

d

hooting ph

e

a

ilure in ML

C

o

MLCC.

c

Discharge)

e

of the stat

surge, ESD

o

n MLCC sh

o

e

applied to

voltage, DC

a

ge of MLC

C

o

ltage, the p

e

d voltage

o

surge volta

g

p

es of Volta

g

ge D

C

r

stress)

a

s a surge v

o

caused by t

ed with the

O

S can acc

e

market at

t

a

pply excess

g

or evaluat

i

d

by surge i

s

e

nomenon

o

C

C. Therefor

e

i

c electricity

can cause

d

17

o

uld not ex

c

MLCC

voltage or

t

C

.

ea

k

-to-pea

k

o

f MLCC.

g

e, static el

e

g

e Applied

t

C

+AC Volta

g

o

ltage or E

O

t

he dielectri

c

applied vol

t

e

lerate heati

t

he early sta

ive electrica

i

ng.

s applied to

o

f voltage as

e

, it is nece

s

is very hig

h

d

amage to

M

c

eed the rat

e

t

he maximu

m

k

value of A

C

e

ctricity sho

u

t

o the Capa

c

g

e 1 DC+

A

O

S can caus

e

c

breakdow

n

t

age and th

e

ng on the d

ge.

l overstress

MLCC, the

shown in t

h

s

sary to be

c

h

but the qu

M

LCC with l

o

e

d voltage s

m

value of

D

C

voltage or

u

ld not exce

e

c

itor]

A

C Voltage

2

e

damages t

o

n

in MLCC.

e

room tem

p

ielectric. Th

e

including s

p

influx of cur

h

e graph be

c

areful to pr

e

antity of el

e

o

w capacita

n

s

et in the sp

e

D

C + AC vol

pulse volta

g

ed the rate

d

2

DC+Pul

o

MLCC, res

p

erature an

d

e

refore, it c

a

p

ike voltage

r

rent into M

L

e

low and res

r

event the i

n

e

ctric charge

n

ce as show

n

e

cifications.

tage should

g

e

d

voltage of

se Voltage

ulting in

d

a

n bring

MLCC whe

n

L

CC can

ult in the

flux of

is small

n

in the

n

17

MLCC Pr

o

follo

w

high

[ E

x

3-3. Vibr

a

Plea

s

Man

a

Whe

and

3-4. Shoc

k

Mech

a

Do n

o

When

preve

n

3-5. Piez

o

MLCC

const

a

MLCC

o

duct Ma

w

ing graph,

capacitance

x

ample of S

u

a

tion

s

e check th

e

a

ge MLCC

n

n MLCC is

u

consider sp

e

k

a

nical stress

o

t use a dro

p

n

piling up

o

nt cracks or

o

-electric P

may gener

a

nt MLCC (

C

may cause

nual

whereas su

r

MLCC.

u

rge applied

e

types of vi

b

n

ot to gener

a

u

sed in a vib

e

cial MLCC

s

caused by

a

p

ped MLCC

o

r handling

p

any other

d

henomen

o

a

te a noise

d

C

lass Ⅱ) at

A

a noise if

M

r

ge with lot

s

to MLCC ]

b

ration and

a

te resonan

c

ration envir

o

s

uch as Soft

-

a

drop may

to avoid an

y

p

rinted circu

d

amages to

t

o

n

d

ue to vibra

A

C or Pulse

c

M

LCC is affec

18

s

of electric

c

shock, and

c

e and avoi

d

o

nment, ple

a

-

term, etc.

cause dam

a

y quality an

d

it boards, d

o

t

he MLCC.

tion at spe

c

ircuits.

c

ted by any

c

harge qua

n

[ Example

the status o

d

any kind

o

a

se make s

u

a

ges to a di

e

d

reliability

d

o

not hit M

L

ific frequen

c

m

echanical

v

n

tity can cau

of ESD appl

* Simulati

o

f

resonance.

o

f impact to

u

re to conta

c

e

lectric or a

d

eterioratio

n

L

CC with th

e

c

y when usi

n

v

ibrations o

r

u

se damage

s

ied to MLC

C

o

n for ESD

8

.

terminals.

c

t us for th

e

crack in ML

n

.

e

corners of

n

g the high

r shocks.

s

to even

C

]

8

kV

e

situation

C

a PCB to

dielectric

18

MLCC Pr

o

4. Proce

s

4-1. Mou

n

4-1-1. Mou

It is

r

is a

p

4-1-2. Cau

t

Plea

s

PCB.

loca

t

4-1-3. Cau

t

If M

L

Mou

o

duct Ma

s

s of Mou

n

ting

nting positi

o

recommend

p

plied.

Not r

t

ions during

s

e take the

f

Select the

m

t

ion and a d

t

ions during

L

CC is mou

n

nt MLCC as

nual

nting an

d

o

n

ed to locat

e

ecommend

e

mounting

n

f

ollowing m

e

m

ounting lo

irection of

M

mounting

n

ted near a

s

far from th

e

N

d

Solderin

g

e

the major

a

e

d

n

ear the cut

o

e

asures to e

cation sho

w

M

LCC moun

t

n

ear screw

s

crew hole,

t

e

screw hol

e

N

ot recomm

19

g

a

xis of MLC

C

o

ut

e

ffectively re

d

w

n below, si

n

t

ed near th

e

t

he board d

e

s as possibl

m

ended

C

in parallel

Rec

o

d

uce the str

n

ce the mec

h

e

cutting lin

e

flection m

a

e.

Recom

m

to the direc

t

o

mmended

ess generat

e

h

anical stres

e

.

a

y be occurr

e

ended

tion in whic

e

d from the

s

s is affecte

d

r

ed by scre

w

h the stress

cutting of

d

by a

w

torque.

19

MLCC Product Manual

20

4-2. Caution before Mounting

4-2-1. It is recommended to store and use MLCC in a reel. Do not re-use MLCC that was isolated from

the reel.

4-2-2. Check the capacitance characteristics under actual applied voltage.

4-2-3. Check the mechanical stress when actual process and equipment is in use.

4-2-4. Check the rated capacitance, rated voltage and other electrical characteristics before assembly.

Heat treatment must be done prior to measurement of capacitance.

4-2-5. Check the solderability of MLCC that has passed shelf life before use.

4-2-6. The use of Sn-Zn based solder may deteriorate the reliability of MLCC.

4-3. Cautions during Mounting with Mounting (pick-and-place) Machines

4-3-1. Mounting Head Pressure

Excessive pressure may cause cracks in MLCC.

It is recommended to adjust the nozzle pressure within the maximum value of 300g.f.

Additional conditions must be set for both thin film and special purpose MLCC.

4-3-2. Bending Stress

When using a two-sided substrate, it is required to mount MLCC on one side first before

mounting on the other side due to the bending of the substrate caused by the mounting head.

Support the substrate as shown in the picture below when MLCC is mounted on the other side.

If the substrate is not supported, bending of the substrate may cause cracks in MLCC.

4-3-3. Suction nozzle

Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of

the nozzle. This may cause cracks in MLCC due to the excessive force during mounting.

If the mounting claw is worn out, it may cause cracks in MLCC due to the uneven force during

positioning.

A regular inspection such as maintenance, monitor and replacement for the suction nozzle and

mounting claw should be conducted.

20

MLCC Pr

o

4-4. Reflo

MLCC

poten

There

f

For t

h

4-4-1. Refl

o

Use

c

Pre-

h

on

M

to t

h

As f

o

thre

e

time

s

MLC

C

o

duct Ma

o

w solderi

n

is in a dire

c

n

tial mechan

f

ore, MLCC

m

h

e reason, t

h

Refl

o

w Profile

c

aution not

h

eating is n

e

M

LCC. The t

e

h

e minimum

.

o

r reflow sol

e

times. Ple

a

s

. Care mus

t

C as they c

a

nual

n

g

c

t contact

w

ical stress c

a

m

ay be con

t

h

e mountin

g

M

o

w solderin

g

to exceed t

h

e

cessary for

e

mperature

d

.

dering, it is

a

se check wi

t

be exercis

e

a

n be affect

e

ith the diss

o

a

used by th

e

t

aminated b

process m

u

M

ethod

g

Over

a

Loc

a

[Reflow

S

h

e peak te

m

all constitu

e

d

ifference b

e

recommen

d

t

h us when

e

d especiall

y

e

d by therm

a

21

o

lved solder

e

sudden te

m

b

y the locati

o

u

st be closel

all heating

a

l heating

S

oldering C

o

m

perature (2

6

e

nts includi

n

etween the

d

ed to keep

the number

y

for the ult

r

al stress m

o

during sold

m

perature c

o

n moveme

n

y monitore

d

C

I

n

VP

S

L

o

nditions]

6

0℃) and ti

m

n

g the PCB

t

PCB and th

e

the numbe

r

of reflow s

o

r

a-small size

,

o

re easily.

ering, whic

h

hange.

n

t and flux.

d

.

lassificatio

n

frared rays

Hot plate

S

(Vapor pha

s

Air heater

Laser

L

ight beam

m

e (30sec)

a

o prevent t

h

e

componen

r

of reflow s

o

ldering ne

e

,

thin film a

n

h

may be ex

n

s

e)

a

s shown.

h

e mechani

c

n

t surface m

u

o

ldering to

e

ds to exce

e

n

d high cap

p

osed to

c

al damages

u

st be kept

less than

d three

a

citance

21

MLCC Product Manual

22

4-4-2. Reflow temperature

The following quality problem may occur when MLCC is mounted with a lower temperature than

the reflow temperature recommended by a solder manufacturer. The specified peak temperature

must be maintained after taking into consideration the factors such as the placement of

peripheral constituent and the reflow temperature.

･Drop in solder wettability

･Solder voids

･Potential occurrence of whisker

･Drop in adhesive strength

･Drop in self-alignment properties

･Potential occurrence of tombstones

4-4-3. Cooling

Natural cooling with air is recommended.

4-4-4. Optimum solder flux for reflow soldering

· Overly the thick application of solder pastes results in an excessive solder fillet height.

This makes MLCC more vulnerable to the mechanical and thermal stress from the board, which

may cause cracks in MLCC.

· Too little solder paste results in a lack of the adhesive strength, which may cause MLCC to

isolate from PCB

· Check if solder has been applied uniformly after soldering is completed.

· It is required to design a PCB with consideration of a solder land pattern and its size to apply an

appropriate amount of solder to MLCC. The amount of the solder at the edge may impact

directly on cracks in MLCC.

· The design of a suitable solder land is necessary since the more the solder amount is,

the larger the force MLCC experiences and the higher the chance MLCC cracks.

Too Much Solder

large stress may cause cracks

Not enough solder

Weak holding force may cause bad

connections or detaching of the capacitor

22

MLCC Pr

o

4-5. Flow

4-5-1. Flo

w

T

a

I

n

r

e

P

e

x

4-5-2. Cau

t

· W

h

inter

the

m

surf

a

· If t

may

valu

e

term

o

duct Ma

soldering

w

profile

ake caution

n

case of flo

e

commende

lease conta

c

x

ceptions t

h

t

ion before

F

h

en a sudde

n

nal deform

a

m

echanical

d

a

ce of MLCC

he flow tim

e

be deterior

a

e

may be dr

o

ination.

nual

not to exce

w soldering

,

d to use.

c

t us before

h

at may be

c

F

low solderi

n

heat is ap

a

tion of ML

C

d

amages on

must be k

e

is too lon

g

a

ted by the

o

pped by w

[Flow S

o

ed peak te

m

,

only 1608(

0

use the typ

c

aused.

n

g

p

lied to ML

C

C. Preheati

n

MLCC. The

pt to the m

g

or the flo

w

leaching ph

eak adhesio

23

o

ldering Co

n

m

perature (2

0

603inch), 2

e of high c

a

C

C, the mec

n

g all the co

temperatur

e

inimum.

w

temperatu

r

enomenon

o

n between

t

n

ditions]

60℃) and ti

012(0805in

c

a

pacitance a

n

h

anical rigi

d

nstituents i

n

e

difference

r

e is too hig

o

f the outer

t

he internal

me (5sec) a

s

h), 3216(12

0

n

d thin film

ity of MLCC

n

cluding PC

B

between th

e

h, the adhe

s

terminatio

n

t

ermination

s

shown.

0

6inch) case

MLCC for s

o

is deterior

a

B

is required

e

solder an

d

s

ive strengt

h

n

, or the ca

p

and the ou

t

size are

o

me

a

ted by the

to prevent

d

the

h

with PCB

acitance

t

er

23

MLCC Product Manual

24

4-6. Soldering Iron

Manual soldering can pose a great risk on creating thermal cracks in MLCC. The high temperature

soldering iron tip may come into a direct contact with the ceramic body of MLCC due to the

carelessness of an operator. Therefore, the soldering iron must be handled carefully, and close

attention must be paid to the selection of the soldering iron tip and to temperature control of the

tip.

4-6-1. How to use a soldering Iron

· In order to minimize damages on MLCC, preheating MLCC and PCB is necessary.

A hot plate and a hot air type preheater should be used for preheating

. Do not cool down MLCC and PCB rapidly after soldering.

· Keep the contact time between the outer termination of MLCC and the soldering iron as short as

possible. Long soldering time may cause problems such as adhesion deterioration by the

leaching phenomenon of the outer termination.

Variation of

Temp.

Soldering

Temp.(℃)

Pre-heating

Time(sec)

Soldering

Time(sec)

Cooling

Time(sec)

ΔT ≤ 130 300±10℃ max ≥60 ≤4 -

* Control Δ T in the solder iron and preheating temperature.

Condition of Iron facilities

Wattage Tip diameter Soldering time

20W max 3 ㎜ max 4sec max

* Caution - Iron tip should not contact with ceramic body directly

Lead-free solder: Sn-3.0Ag-0.5CU

4-6-2. How to use a spot heater

Compared to local heating using a solder iron, heat by a spot heater heats the overall MLCC and

the PCB, which is likely to lessen the thermal shocks.

For a high density PCB, a spot heater can prevent the problem to connect between a solder iron

and MLCC directly.

· If the distance from the air nozzle outlet to MLCC is too close, MLCC may be cracked due to the

thermal stress. Follow the conditions set in the table below to prevent this problem.

· The spot heater application angle as shown in the figure is recommended to create a suitable

solder fillet shape.

24

MLCC Product Manual

25

4-6-3. Cautions for re-work

· Too much solder amount will increase the risk of PCB bending or cause other damages.

· Too little solder amount will result in MLCC breaking loose from the PCB due to the

inadequate adhesive strength.

· Check if the solder has been applied properly and ensure the solder fillet has a proper shape.

* Soldering wire below ø0.5mm is required for soldering.

4-7. Cleaning

4-7-1. In general, cleaning is unnecessary if rosin flux is used.

When acidic flux is used strongly, chlorine in the flux may dissolve into some types of cleaning

fluids, thereby affecting the performance of MLCC.

This means that the cleansing solution must be carefully selected and should always be new.

4-7-2. Cautions for cleaning

MLCC or solder joint may be cracked with the vibration of PCB, if ultrasonic vibration is too strong

during cleaning. When high pressure cleaning equipment is used, test should be done for the

cleaning equipment and its process before the cleaning in order to avoid damages on MLCC.

Distance 5㎜ ≤

Hot Air Application angle 45℃

Hot Air Temperature Nozzle Outlet 400℃ ≥

Application Time 10s＞

25

MLCC Product Manual

26

4-8. Cautions for using electrical measuring probes

· Confirm the position of the support pin or jig when checking the electrical performance of MLCC

after mounting on the PCB.

· Watch for PCB bending caused by the pressure of a test-probe or other equipment.

· If the PCB is bent by the force from the test probe, MLCC may be cracked or the solder joint may

be damaged.

· Avoid PCB flexing by using the support pin on the back side of the PCB.

· Place equipment with the support pin as close to the test-probe as possible.

· Prevent shock vibrations of the board when the test-probe contacts a PCB.

Not recommended Recommended

4-9. Printed Circuit Board Cropping

· Do not apply any stress to MLCC such as bending or twisting the board after mounting MLCC

on the PCB.

· The stress as shown may cause cracks in MLCC when cutting the board.

· Cracked MLCC may cause degradation to the insulation resistance, thereby causing short circuit.

· Avoid these types of stresses applied to MLCC.

[Bending] [Twisting]

4-9-1. Cautions for cutting PCB

Check a cutting method of PCB in advance.

The high density board is separated into many individual boards after the completion of soldering.

If the board is bent or deformed during separation, MLCC may be cracked.

Carefully select a separation method that minimizes the deformation of the PCB.

26

MLCC Product Manual

27

4-10. Assembly Handling

4-10-1. Cautions for PCB handling

Hold the edges of the board mounted with MLCC with both hands since holding with one hand

may bend the board.

Do not use dropped boards, which may degrade the quality of MLCC.

4-10-2. Mounting other components

Pay attention to the following conditions when mounting other components on the back side of

The board after MLCC has been mounted on the front side.

When the suction nozzle is placed too close to the board, board deflection stress may be

applied to MLCC on the back side, resulting in cracks in MLCC.

Check if proper value is set on each chip mounter for a suction location, a mounting gap and a

suction gap by the thickness of components.

4-10-3. Board mounting components with leads

If the board is bent when inserting components (transformer, IC, etc.) into it, MLCC or solder

joint may be cracked.

Pay attention to the following:

· Reduce the stress on the board during insertion by increasing the size of the lead insertion

hole.

· Insert components with leads into the board after fixing the board with support pins or a

dedicated jig.

· Support the bottom side of the board to avoid bending the board.

· Check the status of the height of each support pin regularly when the support pins are used.

Not recommended Recommended

27

MLCC Product Manual

28

4-10-4. Socket and / or connector attach / detach

Since the insertion or removal from sockets and connectors may cause the board to bent, make

sure that MLCC mounted on the board should not be damaged in this process.

4-10-5. Fastening screw

When attaching a shield on a board, the board may be bent during a screw tightening work

Pay attention to the following conditions before performing the work.

· Plan the work to prevent the board from bending

· Use a torque driver to prevent over-tightening of the screw.

· Since the board may be bent by soldering, use caution in tightening the screw.

4-11. Adhesive selection

Pay attention to the following if an adhesive is used to position MLCC on the board before

soldering.

4-11-1. Requirements for Adhesives

· They must have enough adhesive strength to prevent MLCC from slipping or moving during

the handling the board.

· They must maintain their adhesive strength when exposed to soldering temperatures.

· They should not spread when applied to the PCB.

· They should have a long pot life.

· They should hardened quickly.

· They should not corrode the board or MLCC materials.

· They should be an insulator type that does not affect the characteristic of MLCC.

· They should be non-toxic, not harmful, and particularly safe when workers touch the adhesives.

4-11-2. Caution before Applying Adhesive

Check the correct application conditions before attaching MLCC to the board with an adhesive.

If the dimension of land, the type of adhesives, the amount of coating, the contact surface areas,

the curing temperature, or other conditions are not appropriate, it may degrade the MLCC

performance.

28

MLCC Product Manual

29

4-11-3. Cautions for selecting Adhesive

Depending on the type of the chosen adhesive, MLCC insulation resistance may be degraded.

In addition, MLCC may be cracked by the difference in contractile stress caused by the different

contraction rate between MLCC and the adhesive.

4-11-4. Cautions for the amount of applied adhesive and curing temperature

· The inappropriate amount of the adhesive cause the weak adhesive strength, resulting in the a

mounting defect in MLCC

· Excessive use of the adhesive may cause a soldering defect, loss of electrical connection,

incorrect curing, or slippage of a mounting position, thereby an inflow of the adhesive onto a

land section should be avoided.

· If the curing temperature is too high or the curing time is too long, the adhesive strength will

be degraded. In addition, oxidation both on the outer termination (Sn) of MLCC and the

surface of the board may deteriorate the solderability.

4-12. Flux

4-12-1. The excessive amount of flux generates excessive flux gases which may deteriorate solderability.

Therefore, apply the flux thin and evenly as a whole.

4-12-2. Flux with a high ratio of halogen may oxidize the outer termination of MLCC, if cleaning is not

done properly. Therefore, use flux with a halogen content of 0.1% max.

4-12-3. Strong acidic flux can degrade the MLCC performance

4-12-4. Check the solder quality of MLCC and the amount of remaining flux surrounding MLCC after the

mounting process.

4-13. Coating

4-13-1. Crack caused by Coating

A crack may be caused in the MLCC due to amount of the resin and stress of thermal

contraction of the resin during coating process.

During the coating process, the amount of resin and the stress of thermal contraction of the

resin may cause cracks in MLCC

The difference of thermal expansion coefficient between the coating, or a molding resin may

cause destruction, deterioration of insulation resistance or dielectric breakdown of MLCC such

as cracks or detachment, etc.

29

MLCC Product Manual

30

4-13-2. Recommended Coating material

· A thermal expansion coefficient should be as close to that of MLCC as possible.

· A silicone resin can be used as an under-coating to buffer the stress.

· The resin should have a minimum curing contraction rate.

· The resin should have a minimum sensitivity (ex. Epoxy resin).

· The insulation resistance of MLCC can be deteriorated if a high hygroscopic property resin is

used in a high humidity condition.

· Do not use strong acid substances due to the fact that coating materials inducing a family of

halogen substances and organic acid may corrode MLCC.

30

MLCC Product Manual

31

5. Design

5-1. Circuit design

When the board is dropped or bent, MLCC mounted on the board may be short-circuited by the

drop in insulation resistance. Therefore, it is required to install safety equipment such as a fuse to

prevent additional accidents when MLCC is short-circuited, otherwise, electric short and fire may

occur. This product is not a safety guaranteed product..

5-2. PCB Design

5-2-1. Unlike lead type components, SMD type components that are designed to be mounted directly

on the board are fragile to the stress. In addition, they are more sensitive to mechanical and

thermal stress than lead type components.

5-2-2. MLCC crack by PCB material type

A great difference of the thermal expansion coefficient between PCB and MLCC causes thermal

expansion and contraction, resulting in cracks in MLCC. Even though MLCC is mounted on a

board with a fluorine resin or on a single-layered glass epoxy, cracks in MLCC may occur.

5-3. Design system evaluation

5-3-1. Evaluate the actual design with MLCC to make sure there is no functional issue or violation of

specifications of the finished goods.

5-3-2. Please note that the capacitance may differ based on the operating condition of the actual system

since Class 2 MLCC capacitance varies with applied voltage and temperature.

5-3-3. Surge resistance must be evaluated since the excessive surge caused by the inductance of the

actual system may apply to MLCC.

5-3-4. Note the actual MLCC size and the termination shape.

31

MLCC Pr

o

5-4 Land

d

The re

c

R

F

o

duct Ma

d

imension

c

ommende

d

R

eflow Fo

o

Chi

p

Size

[mm]

0402

0603

1005

1608

2012

3216

3225

4532

5750

F

low Foot

p

Chip Size

[mm]

1608

2012

3216

nual

d

land dime

n

o

tprint

Chi

p

Tol.

[mm]

± 0.02

± 0.03

± 0.05

± 0.07

± 0.09

± 0.05

± 0.07

± 0.10

± 0.15

± 0.20

± 0.30

± 0.40

± 0.10

± 0.15

± 0.20

± 0.25

± 0.30

±0.10

±0.15

±0.20

±0.25

±0.30

±0.20

±0.30

-

p

rint

Chip Tol.

[mm]

-

n

sion is det

e

a

[mm]

0.14~0.20

0.16~0.20

0.18~0.26

0.20~0.28

0.22~0.30

0.35~0.40

0.37~0.42

0.40~0.45

0.45~0.50

0.50~0.55

0.55~0.60

0.60~0.65

0.65~0.70

0.70~0.75

0.75~0.80

0.80~0.85

0.85~0.90

0.90~0.95

1.70~1.90

1.80~2.00

2.00~2.40

2.80~3.20

4.00~4.60

a

[mm]

0.60~1.00

1.00~1.20

2.00~2.40

32

e

rmined by

e

b

[mm]

0.14~0.22

0.24~0.32

0.25~0.35

0.37~0.47

0.40~0.50

0.42~0.52

0.45~0.55

0.60~0.65

0.62~0.67

0.65~0.70

0.70~0.75

0.75~0.80

0.80~0.85

0.85~0.90

0.95~1.00

1.05~1.10

0.85~1.00

0.95~1.10

1.00~1.40

1.40~1.80

1.70~2.30

b

[mm]

0.60~0.80

0.80~1.20

1.00~1.20

e

valuating t

h

c

[mm]

0.20~0.26

0.30~0.35

0.32~0.37

0.35~0.39

0.50~0.55

0.52~0.58

0.55~0.60

0.60~0.65

0.65~0.70

0.70~0.75

0.75~0.80

0.80~0.85

0.85~0.90

0.90~0.95

0.95~1.00

1.00~1.05

1.25~1.30

1.30~1.35

1.35~1.40

1.40~1.45

1.45~1.50

1.60~1.80

1.70~1.90

1.80~2.20

2.40~3.00

4.10~4.90

c

[mm]

0.60~0.80

0.80~1.20

1.00~1.40

h

e actual SE

T

(

a+2b

)

min

0.42

0.64

0.66

0.7

0.72

1.09

1.11

1.14

1.2

1.25

1.29

1.4

1.7

1.79

1.9

2.05

2.2

2.35

2.5

2.75

3

3.4

3.7

4

5.6

7.4

(a+2b)

min

1.8

2.6

4.0

T

and a bo

a

(a+2b)

max

0.64

0.84

0.9

0.98

1

1.34

1.36

1.39

1.45

1.5

1.54

1.65

1.85

1.94

2.05

2.2

2.35

2.5

2.65

2.9

3.15

3.9

4.2

5.2

6.8

9.2

(a+2b)

max

2.6

3.6

4.8

rd.

32

MLCC Product Manual

33

6. Others

6-1. Storage environment

6-1-1. Recommendation for temperature/humidity

Even taping and packaging materials are designed to endure a long-term storage, they should

be stored with a temperature of 0~40°C and an RH of 0~70% otherwise, too high temperatures

or humidity may deteriorate the quality of the product rapidly.

As oxidization is accelerated when relative humidity is above 70%RH, the lower the humidity is,

the better the solderability is.

As the temperature difference may cause dew condensation during the storage of the product,

it is a must to maintain a temperature control environment

6-1-2. Shelf Life

An allowable storage period should be within 6 months from the outgoing date of delivery in

consideration of solderability. As for products in storage over 6 months, please check solderability

before use.

6-2. Caution for corrosive environment

As corrosive gases may deteriorate the solderability of MLCC outer termination, it is a must to

store MLCC in an environment without gases. MLCC that is exposed to corrosive gases may cause

its quality issues due to the corrosion of plating layers and the penetration of moisture.

6-3. Equipment in operation

6-3-1. Do not touch MLCC directly with bare hands to prevent an electric shock or damage.

6-3-2. The termination of MLCC shall not be contacted with a conductive object (short –circuit).

Do not expose MLCC to conductive liquid containing acidic or alkaline material.

6-3-3. Do not use the equipment in the following conditions.

(1) Exposure to water or oil

(2) Exposure to direct sunlight

33

MLCC Product Manual

34

(3) Exposure to Ozone or ultra-violet radiation.

(4) Exposure to corrosive gas (e.g. hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas)

(5) Exposure to vibration or mechanical shock exceeding specified limit

(6) Exposure to high humidity

6-3-4. If the equipment starts generating any smoke, fire or smell, immediately switch it off or unplug

from the power source.

If the equipment is not switched off or unplugged, serious damage may occur due to the

continuous power supply. Please be careful with the high temperature in this condition.

6-4. Waste treatment

In case of scrapping MLCC, it is incinerated or buried by a licensed industrial waste company.

When scrapping MLCC, it is recommended to incinerate or bury the scrappage by a licensed

industrial waste company.

6-5. Operating temperature

The operating temperature limit is determined by the specification of each models.

6-5-1. Do not use MLCC over the maximum operating temperature.

Pay attention to equipment’s temperature distribution and the seasonal fluctuation of ambient

temperature.

6-5-2. The surface temperature of MLCC cannot exceed the maximum operating temperature including

self-heating effects.

6-6. Transportation

The performance of MLCC may be affected by transportation conditions.

6-6-1. MLCC shall be protected from excessive temperature, humidity and a mechanical force during

transportation.

34

MLCC Product Manual

35

During transportation, the cartons shall not be deformed and the inner packaging shall be

protected from excessive external forces.

6-6-2. Do not apply excessive vibrations, shocks or excessive forces to MLCC.

· If excessive mechanical shock or stress are applied, MLCC’s ceramic body may crack.

· When the surface of MLCC is hit with the sharp edge of an air driver, a soldering iron, or a

tweezer, etc, MLCC may crack or become short-circuited.

6-6-3. MLCC may crack and become non-functional due to the excessive shocks or dropping during

transportation

.

6-7. Notice

Some special products are excluded from this document.

Please be advised that this is a standard product specification for a reference only.

We may change, modify or discontinue the product specifications without notice at any time.

So, you need to approve the product specifications before placing an order.

Should you have any question regarding the product specifications,

please contact our sales personnel or application engineers.

35

MLCC Product Manual

36

Caution of Application

Disclaimer

The products listed as follows are NOT designed and manufactured for any use and applications set

forth below.

Please note that any misuse of the products deviating from products specifications or information

provided in this Spec sheet may cause serious property damages or personal injury.

① Aerospace/Aviation equipment

② Automotive of Transportation equipment (vehicles，trains，ships，etc)

③ Military equipment

④ Atomic energy-related equipment

⑤ Undersea equipment

⑥ Any other applications with the same as or similar complexity or reliability to the applications

Limitation

Please contact us with usage environment information such as voltage, current, temperature, or other

special conditions before using our products for the applications listed below. The below application

conditions require especially high reliability products to prevent defects that may directly cause damages

or loss to third party's life, body or property.

If you have any questions regarding this 'Limitation'，you should first contact our sales

personnel or application engineers.

① Medical equipment

② Disaster prevention/crime prevention equipment

③ Power plant control equipment

④ Traffic signal equipment

⑤ Data-processing equipment

⑥ Electric heating apparatus，burning equipment

⑦ Safety equipment

⑧ Any other applications with the same as or similar complexity or reliability to the applications

36