NCP4626
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APPLICATION INFORMATION
A typical application circuit for NCP4626 series is shown
in Figure 84.
VIN VOUT
CE
GND
C1 C2
2m2
VIN VOUT
NCP4626x
AE
4m7
Figure 84. Typical Application Schematic
Input Decoupling Capacitor (C1)
A 2.2 mF (or larger) ceramic input decoupling capacitor
should be connected as close as possible to the input and
ground pin of the NCP4626. Higher capacitor values and
lower ESR improves line transient response.
Output Decoupling Capacitor (C2)
A 4.7 mF (or larger) ceramic output decoupling capacitor
is sufficient to achieve stable operation of the IC. It is
necessary to use a capacitor with good frequency
characteristics and low ESR. The capacitor should be
connected as close as possible to the output and ground pins.
Larger capacitor values and lower ESR improves dynamic
parameters.
Enable Operation
The enable pin CE may be used to turn the regulator on and
off. The IC is switched on when a high level voltage is
applied to the CE pin. The enable pin has an internal pull
down resistor. If the enable function is not needed, connect
the CE pin to VIN.
Output Discharger
The D version of the NCP4626 includes a transistor
between VOUT and GND that is used for faster discharging
of the output capacitor. This function is activated when the
IC goes into disable mode.
Current Limit
This regulator includes fold-back type current limit
circuit. This type of protection doesn’t limit current up to
current capability in normal operation, but when over
current occurs, output voltage and current decrease until
over current condition ends. Typical characteristics of this
protection type can be observed in the Output Voltage versus
Output Current graphs shown in the typical characteristics
chapter of this datasheet.
ECO Function
The IC can be switched between two modes by ECO pin.
One mode is low power mode, where IC’s self current
consumption is low, but IC has slower dynamic behavior or
in to fast mode, where current consumption is higher, but the
IC has better dynamic response and lower dropout voltage.
Do not leave the ECO pin unconnected or between VCEH
and VCEL voltage levels as this may cause indefinite and
unexpected currents flows internally.
Thermal Considerations
As power across the IC increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
effect the rate of temperature rise for the part. That is to say,
when the device has good thermal conductivity through the
PCB, the junction temperature will be relatively low with
high power dissipation applications.
The IC includes internal thermal shutdown circuit that
stops the regulator operating if the junction temperature is
higher than 150°C. After shutdown, when the junction
temperature decreases below 130°C, the voltage regulator
would restarts. As long as the high power dissipation
condition exists, the regulator will start and stop repeatedly
to protect itself against overheating. Care should be taken in
the PCB layout to try to avoid this temperature cycling
condition.
PCB Layout
Make the VIN and GND lines as large as possible. If their
impedance is high, noise pickup or unstable operation may
result. Connect capacitors C1 and C2 as close as possible to
the IC, and make wiring as short as possible. The tab under
the XDFN package is internally connected to GND: it is best
practice to connect it to GND on the PCB, but leaving it
unconnected is also acceptable.