XC4VLX15-12SFG363C - Xilinx

DS112 (v3.1) August 30, 2010 www.xilinx.com

Product Specification 1

other countries. The PowerPC name and logo are registered trademarks of IBM Corp. and used under license. All other trademarks are the property of their respective owners.

General Description

Combining Advanced Silicon Modular Block (ASMBL™) architecture with a wide variety of flexible features, the Virtex®-4

family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC

technology. Virtex-4 FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices and

combinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes the

PowerPC® processors (with a new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers,

dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. The basic Virtex-4

FPGA building blocks are enhancements of those found in the popular Virtex, Virtex-E, Virtex-II, Virtex-II Pro, and

Virtex-II Pro X product families, so previous-generation designs are upward compatible. Virtex-4 devices are produced on a

state-of-the-art 90 nm copper process using 300 mm (12-inch) wafer technology.

Summary of Virtex-4 Family Features

• Three Families — LX/SX/FX

- Virtex-4 LX: High-performance logic applications solution

- Virtex-4 SX: High-performance solution for digital signal

processing (DSP) applications

- Virtex-4 FX: High-performance, full-featured solution for

embedded platform applications

• Xesium™ Clock Technology

- Digital clock manager (DCM) blocks

- Additional phase-matched clock dividers (PMCD)

- Differential global clocks

• XtremeDSP™ Slice

- 18 x 18, two’s complement, signed Multiplier

- Optional pipeline stages

-Built-in Accumulator (48-bit) and Adder/Subtracter

• Smart RAM Memory Hierarchy

- Distributed RAM

- Dual-port 18-Kbit RAM blocks

· Optional pipeline stages

· Optional programmable FIFO logic automatically

remaps RAM signals as FIFO signals

- High-speed memory interface supports DDR and DDR-2

SDRAM, QDR-II, and RLDRAM-II.

• SelectIO™ Technology

- 1.5V to 3.3V I/O operation

- Built-in ChipSync™ source-synchronous technology

- Digitally controlled impedance (DCI) active termination

- Fine grained I/O banking (configuration in one bank)

• Flexible Logic Resources

• Secure Chip AES Bitstream Encryption

• 90 nm Copper CMOS Process

• 1.2V Core Voltage

• Flip-Chip Packaging including Pb-Free Package

Choices

• RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit

Transceiver (MGT) [FX only]

• IBM PowerPC RISC Processor Core [FX only]

- PowerPC 405 (PPC405) Core

- Auxiliary Processor Unit Interface (User Coprocessor)

• Multiple Tri-Mode Ethernet MACs [FX only]

Virtex-4 Family Overview

DS112 (v3.1) August 30, 2010 00Product Specification

Table 1: Virtex-4 FPGA Family Members

Device

Configurable Logic Blocks (CLBs)(1)

XtremeDSP

Slices(2)

Block RAM

DCMs PMCDs

PowerPC

Processor

Blocks

Ethernet

MACs

RocketIO

Transceiver

Blocks

Total

I/O

Banks

Max

User

I/O

Array(3)

Row x Col

Logic

Cells Slices

Max

Distributed

RAM (Kb)

18 Kb

Blocks

Max

Block

RAM (Kb)

XC4VLX15 64 x 24 13,824 6,144 96 32 48 864 4 0 N/A N/A N/A 9 320

XC4VLX25 96 x 28 24,192 10,752 168 48 72 1,296 8 4 N/A N/A N/A 11 448

XC4VLX40 128 x 36 41,472 18,432 288 64 96 1,728 8 4 N/A N/A N/A 13 640

XC4VLX60 128 x 52 59,904 26,624 416 64 160 2,880 8 4 N/A N/A N/A 13 640

XC4VLX80 160 x 56 80,640 35,840 560 80 200 3,600 12 8 N/A N/A N/A 15 768

XC4VLX100 192 x 64 110,592 49,152 768 96 240 4,320 12 8 N/A N/A N/A 17 960

XC4VLX160 192 x 88 152,064 67,584 1056 96 288 5,184 12 8 N/A N/A N/A 17 960

XC4VLX200 192 x 116 200,448 89,088 1392 96 336 6,048 12 8 N/A N/A N/A 17 960

Virtex-4 Family Overview

DS112 (v3.1) August 30, 2010 www.xilinx.com

Product Specification 2

System Blocks Common to All Virtex-4 Families

Xesium Clock Technology

• Up to twenty Digital Clock Manager (DCM) modules

- Precision clock deskew and phase shift

- Flexible frequency synthesis

- Dual operating modes to ease performance trade-off

decisions

- Improved maximum input/output frequency

- Improved phase shifting resolution

- Reduced output jitter

- Low-power operation

- Enhanced phase detectors

- Wide phase shift range

• Companion Phase-Matched Clock Divider (PMCD)

blocks

• Differential clocking structure for optimized low-jitter

clocking and precise duty cycle

• 32 Global Clock networks

• Regional I/O and Local clocks

Flexible Logic Resources

• Up to 40% speed improvement over previous

generation devices

• Up to 200,000 logic cells including:

- Up to 178,176 internal registers with clock enable

(XC4VLX200)

- Up to 178,176 look-up tables (LUTs)

- Logic expanding multiplexers and I/O registers

• Cascadable variable shift registers or distributed

memory capability

500 MHz XtremeDSP Slices

• Dedicated 18-bit x 18-bit multiplier,

multiply-accumulator, or multiply-adder blocks

• Optional pipeline stages for enhanced performance

• Optional 48-bit accumulator for multiply accumulate

(MACC) operation

• Integrated adder for complex-multiply or multiply-add

operation

• Cascadeable Multiply or MACC

• Up to 100% speed improvement over previous

generation devices.

500 MHz Integrated Block Memory

• Up to 10 Mb of integrated block memory

• Optional pipeline stages for higher performance

• Multi-rate FIFO support logic

- Full and Empty Flag support

- Fully programmable AF and AE Flags

- Synchronous/ Asynchronous Operation

• Dual-port architecture

• Independent read and write port width selection (RAM

only)

• 18 Kbit blocks (memory and parity/sideband memory

support)

• Configurations from 16K x 1 to 512 x 36

(4K x 4 to 512 x 36 for FIFO operation)

• Byte-write capability (connection to PPC405, etc.)

• Dedicated cascade routing to form 32K x 1 memory

without using FPGA routing

• Up to 100% speed improvement over previous

generation devices.

XC4VSX25 64 x 40 23,040 10,240 160 128 128 2,304 4 0 N/A N/A N/A 9 320

XC4VSX35 96 x 40 34,560 15,360 240 192 192 3,456 8 4 N/A N/A N/A 11 448

XC4VSX55 128 x 48 55,296 24,576 384 512 320 5,760 8 4 N/A N/A N/A 13 640

XC4VFX12 64 x 24 12,312 5,472 86 32 36 648 4 0 1 2 N/A 9 320

XC4VFX20 64 x 36 19,224 8,544 134 32 68 1,224 4 0 1 2 8 9 320

XC4VFX40 96 x 52 41,904 18,624 291 48 144 2,592 8 4 2 4 12 11 448

XC4VFX60 128 x 52 56,880 25,280 395 128 232 4,176 12 8 2 4 16 13 576

XC4VFX100 160 x 68 94,896 42,176 659 160 376 6,768 12 8 2 4 20 15 768

XC4VFX140 192 x 84 142,128 63,168 987 192 552 9,936 20 8 2 4 24 17 896

Notes:

1. One CLB = Four Slices = Maximum of 64 bits.

2. Each XtremeDSP slice contains one 18 x 18 multiplier, an adder, and an accumulator

3. Some of the row/column array is used by the processors in the FX devices.

Table 1: Virtex-4 FPGA Family Members (Continued)

Device

Configurable Logic Blocks (CLBs)(1)

XtremeDSP

Slices(2)

Block RAM

DCMs PMCDs

PowerPC

Processor

Blocks

Ethernet

MACs

RocketIO

Transceiver

Blocks

Total

I/O

Banks

Max

User

I/O

Array(3)

Row x Col

Logic

Cells Slices

Max

Distributed

RAM (Kb)

18 Kb

Blocks

Max

Block

RAM (Kb)

Virtex-4 Family Overview

DS112 (v3.1) August 30, 2010 www.xilinx.com

Product Specification 3

SelectIO Technology

• Up to 960 user I/Os

• Wide selections of I/O standards from 1.5V to 3.3V

• Extremely high-performance

- 600 Mb/s HSTL & SSTL (on all single-ended I/O)

- 1 Gb/s LVDS (on all differential I/O pairs)

• True differential termination

• Selected low-capacitance I/Os for improved signal

integrity

• Same edge capture at input and output I/Os

• Memory interface support for DDR and DDR-2

SDRAM, QDR-II, and RLDRAM-II.

ChipSync Technology

• Integrated with SelectIO technology to simplify

source-synchronous interfaces

• Per-bit deskew capability built in all I/O blocks (variable

input delay line)

• Dedicated I/O and regional clocking resources (pin and

trees)

• Built in data serializer/deserializer logic in all I/O and

clock dividers

• Memory/Networking/Telecommunication interfaces up

to 1 Gb/s+ DDR

Digitally Controlled Impedance (DCI)

Active I/O Termination

• Optional series or parallel termination

• Temperature compensation

Configuration

• 256-bit AES bitstream decryption provides intellectual

property (IP) security

• Improved bitstream error detection/correction capability

• Fast SelectMAP configuration

• JTAG support

• Readback capability

90 nm Copper CMOS Process

1.2V Core Voltage

Flip-Chip Packaging

• Pb-Free packages available with production devices.

System Blocks Specific to the Virtex-4 FX Family

RocketIO Multi-Gigabit Transceiver (MGT)

• Full-duplex serial transceiver (MGT) capable of

622 Mb/s to 6.5 Gb/s baud rates

• 8B/10B, 64B/66B, user-defined FPGA logic, or no data

encoding/decoding

• Channel bonding support

• CRC generation and checking

• Programmable TX pre-emphasis or pre-equalization

• Programmable RX continuous time equalization

• Programmable RX decision feedback equalization

• On-chip RX AC coupling

• RX signal detect and loss of signal indicator

• TX driver electrical idle mode

• User dynamic reconfiguration using secondary

configuration bus

PowerPC 405 Processor RISC Core

• Embedded PowerPC 405 processor (PPC405) core

- Up to 450 MHz operation

- Five-stage data path pipeline

- 16 KB instruction cache

- 16 KB data cache

- Enhanced instruction and data on-chip memory

(OCM) controllers

- Additional frequency ratio options between

PPC405 and Processor Local Bus

• Auxiliary Processor Unit (APU) Interface for direct

connection from PPC405 to coprocessors in fabric

- APU can run at different clock rates

- Supports autonomous instructions: no pipeline stalls

- 32-bit instruction and 64-bit data

- 4-cycle cache line transfer

Tri-Mode Ethernet Media Access Controller

• IEEE 802.3 compliant

• Operates at 10, 100, and 1,000 Mb/s

• Supports tri-mode auto-detect

• Receive address filter

• Fully monolithic 1000Base-X solution with RocketIO

MGT

• Implements SGMII through RocketIO MGT to external

PHY device

• Supports multiple PHY (MII, GMII, etc.) interfaces

through an I/O resource

• Receive and transmit statistics available through

separate interfaces

• Separate host and client interfaces

• Support for jumbo frames

• Flexible, user-configurable host interface

Virtex-4 Family Overview

DS112 (v3.1) August 30, 2010 www.xilinx.com

Product Specification 4

Architectural Description: Virtex-4 FPGA Array Overview

Virtex-4 devices are user-programmable gate arrays with

various configurable elements and embedded cores opti-

mized for high-density and high-performance system

designs. Virtex-4 devices implement the following function-

ality:

• I/O blocks provide the interface between package pins

and the internal configurable logic. Most popular and

leading-edge I/O standards are supported by

programmable I/O blocks (IOBs). The IOBs are

enhanced for source-synchronous applications.

Source-synchronous optimizations include per-bit

deskew, data serializer/deserializer, clock dividers, and

dedicated local clocking resources.

• Configurable Logic Blocks (CLBs), the basic logic

elements for Xilinx FPGAs, provide combinatorial and

synchronous logic as well as distributed memory and

SRL16 shift register capability.

• Block RAM modules provide flexible 18Kbit true

dual-port RAM, that are cascadable to form larger

memory blocks. In addition, Virtex-4 FPGA block RAMs

contain optional programmable FIFO logic for

increased device utilization.

• Cascadable embedded XtremeDSP slices with 18-bit x

18-bit dedicated multipliers, integrated Adder, and

48-bit accumulator.

• Digital Clock Manager (DCM) blocks provide

self-calibrating, fully digital solutions for clock

distribution delay compensation, clock

multiplication/division, and coarse-/fine-grained clock

phase shifting.

Additionally, FX devices support the following embedded

system functionality:

• Integrated high-speed serial transceivers enable data

rates up to 6.5 Gb/s per channel.

• Embedded IBM PowerPC 405 Processor RISC CPU

(up to 450 MHz) with the auxiliary processor unit

interface

• 10/100/1000 Ethernet media-access control (EMAC)

cores.

The general routing matrix (GRM) provides an array of rout-

ing switches between each component. Each programma-

ble element is tied to a switch matrix, allowing multiple

connections to the general routing matrix. The overall pro-

grammable interconnection is hierarchical and designed to

support high-speed designs.

All programmable elements, including the routing

resources, are controlled by values stored in static memory

cells. These values are loaded in the memory cells during

configuration and can be reloaded to change the functions

of the programmable elements.

Virtex-4 FPGA Features

This section briefly describes the features of the Virtex-4 family of FPGAs.

Input/Output (SelectIO) Blocks

IOBs are programmable and can be categorized as follows:

• Programmable single-ended or differential (LVDS)

operation

• Input block with an optional single data rate (SDR) or

double data rate (DDR) register

• Output block with an optional SDR or DDR register

• Bidirectional block

• Per-bit deskew circuitry

• Dedicated I/O and regional clocking resources

• Built in data serializer/deserializer

The IOB registers are either edge-triggered D-type flip-flops

or level-sensitive latches.

IOBs support the following single-ended standards:

• LVTTL

• LVCMOS (3.3V, 2.5V, 1.8V, and 1.5V)

• PCI (33 and 66 MHz)

•PCI-X

• GTL and GTLP

• HSTL 1.5V and 1.8V (Class I, II, III, and IV)

• SSTL 1.8V and 2.5V (Class I and II)

The DCI I/O feature can be configured to provide on-chip

termination for each single-ended I/O standard and some

differential I/O standards.

The IOB elements also support the following differential sig-

naling I/O standards:

• LVDS and Extended LVDS (2.5V only)

• B LVD S (Bus LVDS)

•ULVDS

• Hypertransport™

• Differential HSTL 1.5V and 1.8V (Class II)

• Differential SSTL 1.8V and 2.5V (Class II)

Two adjacent pads are used for each differential pair. Two or

four IOB blocks connect to one switch matrix to access the

routing resources.

Per-bit deskew circuitry allows for programmable signal

delay internal to the FPGA. Per-bit deskew flexibly provides

fine-grained increments of delay to carefully produce a

Virtex-4 Family Overview

DS112 (v3.1) August 30, 2010 www.xilinx.com

Product Specification 5

range of signal delays. This is especially useful for synchro-

nizing signal edges in source synchronous interfaces.

General purpose I/O in select locations (four per bank) are

designed to be “regional clock capable” I/O by adding spe-

cial hardware connections for I/O in the same locality. These

regional clock inputs are distributed within a limited region

to minimize clock skew between IOBs. Regional I/O clock-

ing supplements the global clocking resources.

Data serializer/deserializer capability is added to every I/O

to support source synchronous interfaces. A serial-to-paral-

lel converter with associated clock divider is included in the

input path, and a parallel-to-serial converter in the output

path.

An in-depth guide to the Virtex-4 FPGA IOB is discussed in

the Virtex-4 FPGA User Guide.

Configurable Logic Blocks (CLBs)

A CLB resource is made up of four slices. Each slice is

equivalent and contains:

• Two function generators (F & G)

• Two storage elements

• Arithmetic logic gates

• Large multiplexers

• Fast carry look-ahead chain

The function generators F & G are configurable as 4-input

look-up tables (LUTs). Two slices in a CLB can have their

LUTs configured as 16-bit shift registers, or as 16-bit distrib-

uted RAM. In addition, the two storage elements are either

edge-triggered D-type flip-flops or level sensitive latches.

Each CLB has internal fast interconnect and connects to a

switch matrix to access general routing resources.

The Virtex-4 FPGA CLBs are further discussed in the

Virtex-4 FPGA User Guide.

Block RAM

The block RAM resources are 18 Kb true dual-port RAM

blocks, programmable from 16K x 1 to 512 x 36, in various

depth and width configurations. Each port is totally synchro-

nous and independent, offering three “read-during-write”

modes. Block RAM is cascadable to implement large

embedded storage blocks. Additionally, back-end pipeline

registers, clock control circuitry, built-in FIFO support, and

byte write enable are new features supported in the Virtex-4

FPGA.

The block RAM feature in Virtex-4 devices is further dis-

cussed in the Virtex-4 FPGA User Guide.

XtremeDSP Slices

The XtremeDSP slices contain a dedicated 18 x 18-bit 2’s

complement signed multiplier, adder logic, and a 48-bit

accumulator. Each multiplier or accumulator can be used

independently. These blocks are designed to implement

extremely efficient and high-speed DSP applications.

The block DSP feature in Virtex-4 devices are further dis-

cussed in XtremeDSP Design Considerations.

Global Clocking

The DCM and global-clock multiplexer buffers provide a

complete solution for designing high-speed clock networks.

Up to twenty DCM blocks are available. To generate

deskewed internal or external clocks, each DCM can be

used to eliminate clock distribution delay. The DCM also

provides 90°, 180°, and 270° phase-shifted versions of the

output clocks. Fine-grained phase shifting offers higher res-

olution phase adjustment with fraction of the clock period

increments. Flexible frequency synthesis provides a clock

output frequency equal to a fractional or integer multiple of

the input clock frequency.

Virtex-4 devices have 32 global-clock MUX buffers. The

clock tree is designed to be differential. Differential clocking

helps reduce jitter and duty cycle distortion.

Routing Resources

All components in Virtex-4 devices use the same intercon-

nect scheme and the same access to the global routing

matrix. Timing models are shared, greatly improving the

predictability of the performance for high-speed designs.

Boundary-Scan

Boundary-Scan instructions and associated data registers

support a standard methodology for accessing and config-

uring Virtex-4 devices, complying with IEEE standards

1149.1 and 1532.

Configuration

Virtex-4 devices are configured by loading the bitstream into

internal configuration memory using one of the following

modes:

• Slave-serial mode

• Master-serial mode

• Slave SelectMAP mode

• Master SelectMAP mode

• Boundary-Scan mode (IEEE-1532)

Optional 256-bit AES decryption is supported on-chip (with

software bitstream encryption) providing Intellectual Prop-

erty security.

Virtex-4 Family Overview

DS112 (v3.1) August 30, 2010 www.xilinx.com

Product Specification 6

Virtex-4 FX Family

This section briefly describes blocks available only in FX devices.

RocketIO Multi-Gigabit Transceiver

8 – 24 Channels RocketIO Multi-Gigabit Serial Transceivers

(MGTs) capable of running 622 Mb/s – 6.5 Gb/s

• Full Clock and Data Recovery

• 32-bit or 40-bit datapath support

• Optional 8B/10B, 64B/66B, or FPGA-based

encode/decode

• Integrated FIFO/Elastic Buffer

• Support for Channel Bonding

• Embedded 32-bit CRC generation/checking

• Integrated Comma-detect or programmable A1/A2,

A1A1/A2A2 detection

• Programmable pre-emphasis (AKA transmitter

equalization)

• Programmable receiver equalization

• Embedded support for:

- Out of Band (OOB) Signalling: Serial ATA

- Beaconing and Electrical Idle: PCI-Express™

• On-chip bypassable AC coupling for receiver

One or Two PowerPC 405 Processor Cores

• 32-bit Harvard Architecture

• 5-Stage Execution Pipeline

• Integrated 16KB Level 1 Instruction Cache and 16KB

Level 1 Data Cache

• Integrated Level 1 Cache Parity Generation and

Checking

• CoreConnect™ Bus Architecture

• Efficient, high-performance on-chip memory (OCM)

interface to block RAM

• PLB Synchronization Logic (Enables Non-Integer

CPU-to-PLB Clock Ratios)

• Auxiliary Processor Unit (APU) Interface and Integrated

APU Controller

- Optimized FPGA-based Coprocessor connection

- Automatic decode of PowerPC floating-point instructions

— allows custom instructions (decode for up to eight

instructions)

- Extremely efficient microcontroller-style interfacing

Two or Four Tri-Mode (10/100/1000 Mb/s) Ethernet Media Access Control (MAC) Cores

• IEEE 802.3-2000 Compliant

• MII/GMII Interface or SGMII (when used with RocketIO

Transceivers)

• Can Operate Independent of PowerPC processor

• Half- or Full-Duplex

• Supports Jumbo Frames

• 1000Base-X PCS/PMA: When used with RocketIO

MGT can provide complete 1000Base-X

implementation on-chip

Intellectual Property Cores

Xilinx offers IP cores for commonly used complex functions

including DSP, bus interfaces, processors, and processor

peripherals. Using Xilinx LogiCORE™ products and cores

from third party AllianceCORE participants, customers can

shorten development time, reduce design risk, and obtain

superior performance for their designs. Additionally, our

CORE Generator™ system allows customers to implement

IP cores into Virtex-4 FPGAs with predictable and repeat-

able performance. It offers a simple user interface to gener-

ate parameter-based cores optimized for our FPGAs.

The System Generator for DSP tool allows system archi-

tects to quickly model and implement DSP functions using

handcrafted IP, and features an interface to third-party sys-

tem level DSP design tools. System Generator for DSP

implements many of the high-performance DSP cores sup-

porting Virtex-4 FPGAs including the Xilinx Forward Error

Correction Solution with Interleaver/De-interleaver,

Reed-Solomon encoder/decoders, and Viterbi decoders.

These are ideal for creating highly-flexible, concatenated

codecs to support the communications market.

Industry leading connectivity and networking IP cores

include the electronics industry's first Advanced Switching

product, leading-edge PCI Express, Serial RapidIO, Fibre

Channel, and 10Gb Ethernet cores that include Virtex-4

FPGA RocketIO multi-gigabit serial interfaces. The Xilinx

SPI-4.2 IP core utilizes the Virtex-4 FPGA embedded

ChipSync technology to implement dynamic phase align-

ment for high-performance source-synchronous operation.

MicroBlaze™ processor 32-bit core provides the industry's

fastest soft processing solution for building complex sys-

tems for the networking, telecommunication, data communi-

cation, embedded and consumer markets. The MicroBlaze

processor features a RISC architecture with Harvard-style

separate 32-bit instruction and data busses running at full

speed to execute programs and access data from both

on-chip and external memory. A standard set of peripherals

are also CoreConnect™ enabled to offer MicroBlaze pro-

cessor designers compatibility and reuse.

All IP cores for Virtex-4 FPGAs are found on the Xilinx IP

Center Internet portal presenting the latest intellectual prop-

erty cores and reference designs via Smart Search for

faster access.

Virtex-4 Family Overview

DS112 (v3.1) August 30, 2010 www.xilinx.com

Product Specification 7

Application Notes and Reference Designs

Application notes and reference designs written specifically for the Virtex-4 family are available on the Xilinx web site at

http://www.xilinx.com/support/documentation/virtex-4.htm.

Virtex-4 Device and Package Combinations and Maximum I/Os

Virtex-4 FPGA Ordering Information

Virtex-4 FPGA ordering information shown in Figure 1 applies to all packages including Pb-Free.

Table 2: Virtex-4 Device and Package Combinations and Maximum Available I/Os

Package(1,2) SF363

SFG363

FF668

FFG668

FF672

FFG672

FF676

FFG676

FF1148

FFG1148

FF1152

FFG1152

FF1513

FFG1513

FF1517

FFG1517

Size 17x17 27x27 27x27 27x27 35x35 35x35 40x40 40x40

Device MGTs I/O MGTs I/O MGTs I/O MGTs I/O MGTs I/O MGTs I/O MGTs I/O MGTs I/O

XC4VLX15 N/A 240 N/A 320 N/A 320

XC4VLX25 N/A 240 N/A 448

XC4VLX40 N/A 448 N/A 640

XC4VLX60 N/A 448 N/A 640

XC4VLX80 N/A 768

XC4VLX100 N/A 768 N/A 960

XC4VLX160 N/A 768 N/A 960

XC4VLX200 N/A 960

XC4VSX25 N/A 320

XC4VSX35 N/A 448

XC4VSX55 N/A 640

XC4VFX12 N/A 240 N/A 320

XC4VFX20 8320

XC4VFX40 12 352 12 448

XC4VFX60 12 352 16 576

XC4VFX100 20 576 20 768

XC4VFX140 24 768

Notes:

1. All packages are also available in Pb-Free versions (SFG/FFG).

2. Pinouts on all packages (except SF363/SFG363 and FF668/FFG668) are configured using the new, improved SparseChevron pin

layout for superior signal integrity.

Figure 1: Virtex-4 FPGA Ordering Information

Example: XC4VLX25-10FFG668CS2

Device Type

Temperature Range:

C = Commercial (TJ = 0°C to +85°C)

I = Industrial(2) (TJ = –40°C to +100°C)

Number of Pins

Step Identification Version(1)

Package Type

Speed Grade

(-10, -11, -12(2))

Pb-Free

DS112_01_112806

Notes:

1) The step identification version is optional and is not specified unless

a particular device stepping is required. Refer to the Virtex-4 Data

Sheet (DS302) for additional information on step ordering codes.

2) -12 devices not available in Industrial grade.

Virtex-4 Family Overview

DS112 (v3.1) August 30, 2010 www.xilinx.com

Product Specification 8

Virtex-4 Documentation

Complete and up-to-date documentation of the Virtex-4

family of FPGAs is available on the Xilinx web site. In addi-

tion to the most recent Virtex-4 Family Overview, the follow-

ing files are also available for download:

Virtex-4 FPGA Data Sheet: DC and Switching

Characteristics

This data sheet contains the DC and Switching Characteris-

tic specifications for the Virtex-4 family.

Virtex-4 FPGA User Guide

This guide includes chapters on:

• Clocking Resources

• Digital Clock Manager (DCM)

• Phase-Matched Clock Dividers (PMCD)

• Block RAM and FIFO memory

• Configurable Logic Blocks (CLBs)

• SelectIO Resources

• SelectIO Logic Resources

• Advanced SelectIO Logic Resources

XtremeDSP for Virtex-4 FPGAs User Guide

This guide describes the DSP48 slice and includes refer-

ence designs for using DSP48 math functions and various

FIR filters.

Virtex-4 FPGA Configuration Guide

This all-encompassing configuration guide includes chap-

ters on configuration interfaces (serial and SelectMAP), bit-

stream encryption, Boundary-Scan and JTAG configuration,

and reconfiguration techniques.

Virtex-4 FPGA Packaging and Pinout Specification

This specification includes the tables for device/package

combinations and maximum I/Os, pin definitions, pinout

tables, pinout diagrams, mechanical drawings, and thermal

specifications.

Virtex-4 FPGA PCB Designer’s Guide

This guide describes PCB guidelines for the Virtex-4 family.

It covers SelectIO signaling, RocketIO signaling, power dis-

tribution systems, PCB breakout, and parts placement.

Virtex-4 RocketIO Multi-Gigabit Transceiver User Guide

This guide describes the RocketIO Multi-Gigabit Transceiv-

ers available in the Virtex-4 FX family.

Virtex-4 FPGA Embedded Tri-Mode Ethernet MAC User

Guide

This guide describes the Embedded Tri-Mode Ethernet

Media Access Controller available in the Virtex-4 FX family.

PowerPC 405 Processor Block Reference Guide

This guide is updated to include the PowerPC 405 proces-

sor block available in the Virtex-4 FX family.

Revision History

The following table shows the revision history for this document.

Date Version Revision

08/02/04 1.0 Initial Xilinx release. Printed Handbook version.

09/10/04 1.1 Typographical edits.

12/08/04 1.2 • Removed System Monitor and ADC references.

• Edited Ethernet MAC section.

03/26/05 1.3 • Removed legacy CLB reference and typographical edits.

• Edited serial transceiver sections.

•In Ta bl e 2 added FFG Pb-Free packages.

06/17/05 1.4 Added note to Ta b l e 2 for SparseChevron pinouts.

02/10/06 1.5 • Removed FCRAM-II support.

• Added note 3 to Ta b l e 1 .

• Revised the CLB numbers for XC4VFX40 devices in Table 1.

• Added stepping to order information example in Figure 1.

10/10/06 1.6 • Changed maximum transceiver rate to 6.5 Gb/s.

• Removed FF1760 package from Ta b l e 2 .

01/23/07 2.0 Revision number jumped to 2.0 to correlate to data sheet (DS302) major revision.

•Table 1: Corrected typo: XC4VFX40 number of slices = 18,624.

•Table 2: Added column for FF676 package. Rewrote table footnotes.

Virtex-4 Family Overview

DS112 (v3.1) August 30, 2010 www.xilinx.com

Product Specification 9

03/12/07 2.1 Table 2: Corrected to remove FF676 package offerings in XC4VLX40, XC4VLX60,

XC4VSX25, XC4VSX35, and XC4VFX12 devices.

09/28/07 3.0 All Virtex-4 devices released to Production status. See DS302, Virtex-4 Data Sheet, for full

particulars. No changes in this document from previous revision.

08/30/10 3.1 See XCN09028, Product Discontinuation Notice Virtex-4 LX25 FPGA FF(G)676 Devices for

detailed product revisions. In Table 2, removed XC4VLX25 devices in the FF676/FFG676

package column.

Date Version Revision