Philips Semiconductors Power Bipolar Transistors Mounting and Soldering GENERAL DATA AND INSTRUCTIONS FOR TO126/SOT82 When the driven nut or screw is in direct contact with a toothed lock washer, the torques are as follows: General rules Minimum torque for good heat transfer is 0.55 Nm. 1. Fasten the device to the heatsink before soldering the leads. Maximum torque to avoid damaging the device is 0.8 Nm. 2. Avoid stress to the leads. BODY MOUNTING (SOT82 ONLY) 3. Keep mounting tool (e.g. screwdriver) clear of the plastic body. A SOT82 envelope can be adhesive mounted or soldered into a hybrid circuit. Mounting methods For soldering, a copper plate or an anodised aluminium plate with copper layer is recommended. CLIP MOUNTING With adhesive mounting, a ceramic substrate may be used. Mounting by means of spring clip offers: 1. A good thermal contact under the crystal area. RIVET MOUNTING 2. Safe insulation for mains and high voltage operation. It is not permitted to rivet mount the TO126 outline. Minimum force for good heat transfer is 10 N. Maximum force to avoid damaging the device is 80 N. Heatsink requirements M2.5 AND M3 SCREW MOUNTING (TO126 ONLY) Flatness in the mounting area: 0.02 mm maximum per 10 mm. Mounting holes must be deburred, for further information see clip and screw mounting instructions. The spacing washer should be inserted between screw head and body. Heatsink compound Minimum torque for good heat transfer is 0.4 Nm. Maximum torque to avoid damaging the device is 0.6 Nm. 1998 Dec 07 The thermal resistance from mounting base to heatsink (Rth mb-h) can be reduced by applying a metallic oxide compound between the contact surfaces. Values given are of thermal resistance using this type of compound. Dow Corning 340 Heat sink compound is recommended. For insulated mounting, the compound should be applied to the bottom of both device and insulator. 768 Philips Semiconductors Power Bipolar Transistors Mounting and Soldering Thermal data for heatsink mounting methods Rth mb-h Thermal resistance from mounting base to heatsink Envelope Mounting method K/W Clip TO126 SOT82 Screw Direct Insulated Direct Insulated with heatsink compound 1.0 3.0 0.5 3.0 without heatsink compound 3.0 6.0 1.0 6.0 with heatsink compound 0.4 2.0 - - without heatsink compound 2.0 5.0 - - Soldering Lead bending LEAD SOLDERING Maximum permissible tensile force on the body for 5 seconds is 20 N. For devices with a maximum junction temperature <150 C. DIP OR WAVE SOLDERING Maximum permissible solder temperature is 260 C at a distance from the body of >5 mm and for a total contact time with soldering bath or waves of <7 s. HAND SOLDERING Maximum permissible temperature is 275 C at a distance from the body of >3 mm and for a total contact time with the soldering iron of <5 s. Maximum permissible temperature is 250 C at a distance from the body of >3 mm and for a total contact time with the soldering iron of <10 s. The body of the device must not touch anything with a temperature >200 C. The leads can be bent, twisted or straightened. To keep forces within the above mentioned limits the leads should always be clamped rigidly near the body during bending. This is also to prevent damage to the seal of the leads within the plastic body. Leads can be bent as near to the body as required, but adequate length should always be allowed for clamping. This is a minimum of 1.75 mm from the body to the start of a bend radius. The internal radius of bend should never be less than the thickness of the lead. A minimum radius of at least 1.5 x lead thickness is preferred. See Fig.1. Surface cracks in the dip tin coating on the lead are common when a radius less than 1.5 x lead thickness is used. Although exposing the copper material, these cracks do not affect the mechanical strength of the lead. Avoid any force on body and leads during or after soldering; do not correct the position of the device or of its leads after soldering. clamp area 1.75 min MOUNTING BASE SOLDERING plastic body Recommended metal-alloy of solder paste (85% metal weight) 62% Sn / 36% Pb / 2% Ag or 60% Sn / 40% Pb. L Maximum soldering temperature <200 C (mounting base temperature). Soldering cycle duration including pre-heating <30 sec. MGA772 Dimensions in mm. For good soldering and avoiding damage to the encapsulation pre-heating is recommended to a temperature <165 C at a duration of <10 s. 1998 Dec 07 RL Fig.1 Minimum lead bend radius. 769 Philips Semiconductors Power Bipolar Transistors Mounting and Soldering Additional guide-lines It is recommended that where a device is rigidly secured to a heatsink which is in turn rigidly secured to a PCB, that a bend is put in the leads to act as an expansion loop. This will prevent differential expansion of the mounting parts transferring stress to the soldering joint, as shown in Fig.2. This is only necessary where the device is mounted so rigidly that expansion forces are transmitted through the assembly. secure not rigid rigid rigid solder joint rigid PCB secure not rigid solder joint rigid PCB solder joint PCB MGA768 (a) Incorrect (b) Correct Fig.2 Printed circuit board and heatsink mounting. 1998 Dec 07 770 (c) Correct Philips Semiconductors Power Bipolar Transistors Mounting and Soldering INSTRUCTIONS FOR SCREW MOUNTING Direct mounting with screw and spacing washer THROUGH HEATSINK WITH NUT INTO TAPPED HEATSINK M3 screw M3 screw rectangular washer (not required for F-pack) rectangular washer (not required for F-pack) heatsink heatsink plain washer lock washer M3 nut MGA761 MGA762 Fig.3 Assembly. Fig.5 Assembly. 3.5 max 3.5 max 4 min 1.5 min 3.3 3.1 MGA751 M3 Dimensions in mm. Dimensions in mm. Fig.4 Heatsink requirements. 1998 Dec 07 MGA752 Fig.6 Heatsink requirements. 771 Philips Semiconductors Power Bipolar Transistors Mounting and Soldering GENERAL DATA AND INSTRUCTIONS FOR TO220AB (SOT78)/SOT186/A When a nut or screw is driven directly against the tab, the torques are as follows: General rules Minimum torque for good heat transfer is 0.40 Nm. 1. Fasten the device to the heatsink before soldering the leads. Maximum torque to avoid damaging the device is 0.60 Nm. 2. Avoid stress to the leads. RIVET MOUNTING NON-INSULATED 3. Keep mounting tool (e.g. screwdriver) clear of the plastic body. The device should not be pop-riveted to the heatsink. It is permissible to press-rivet the metal tab providing that eyelet rivets of soft material are used, and the press forces are slowly and carefully controlled. 4. The rectangular washer may only touch the plastic part of the body; it should not exert any force on that part (screw mounting). This method is not permitted for full-pack envelopes because it will damage the plastic encapsulation. Mounting methods CLIP MOUNTING Heatsink requirements Mounting by means of spring clip offers: 1. A good thermal contact under the crystal area, and slightly lower thermal resistance than screw mounting. Flatness in the mounting area: 0.02 mm maximum per 10 mm. Mounting holes must be deburred, for further information see clip and screw mounting instructions. 2. Safe insulation for mains operation. Minimum force for good heat transfer is 10 N. Maximum force to avoid damaging the device is 80 N. M3 SCREW MOUNTING It is recommended that the rectangular spacing washer is inserted between screw head and mounting tab. Do not use self-tapping screws. Heatsink compound The thermal resistance from mounting base to heatsink (Rth mb-h) can be reduces by applying a metallic oxide compound between the contact surfaces. Values given are of thermal resistance using this type of compound. Dow Corning 340 Heat sink compound is recommended. For insulated mounting, the compound should be applied to the bottom of both device and insulator. Mounting torque for screw mounting: For thread-forming screws these are final values. Minimum torque for good heat transfer is 0.55 Nm. Maximum torque to avoid damaging the device is 0.80 Nm. 1998 Dec 07 772 Philips Semiconductors Power Bipolar Transistors Mounting and Soldering Thermal data for heatsink mounting methods (TO220 only) Typical figures, for exact figures see data for each device type. Rth mb-h Thermal resistance from mounting base to heatsink Mounting method K/W Clip Screw direct with heatsink compound 0.3 0.5 direct without heatsink compound 1.4 1.4 with heatsink compound and 0.1 mm maximum mica insulator 2.2 - with heatsink compound and 0.25 mm maximum alumina insulator 0.8 - with heatsink compound and 0.05 mm mica insulator insulated up to 500 V - 1.4 insulated up to 800 V/1000 V - 1.6 without heatsink compound and 0.05 mm mica insulator insulated up to 500 V - 3.0 insulated up to 800 V/1000 V - 4.5 Additional insulators are generally not required when mounting the full-pack outlines. Soldering Recommendation for devices with a maximum junction temperature rating <175 C: DIP OR WAVE SOLDERING Maximum permissible solder temperature is 260 C at a distance from the body of >5 mm and for a total contact time with soldering bath or waves of <7 s. HAND SOLDERING Maximum permissible temperature is 275 C at a distance from the body of >3 mm and for a total contact time with the soldering iron of <5 s. The body of the device must not touch anything with a temperature >200 C. This is also to prevent damage to the seal of the leads within the plastic body. Leads can be bent as near to the body as required, but adequate length should always be allowed for clamping. This is a minimum of 1.75 mm from the body to the start of a bend radius. The internal radius of bend should never be less than the thickness of the lead. A minimum radius of at least 1.5 x lead thickness is preferred. See Fig.7. Surface cracks in the dip tin coating on the lead are common when a radius less than 1.5 x lead thickness is used. Although exposing the copper material, these cracks do not affect the mechanical strength of the lead. Lead forming by Philips is available as an option on all products supplied in these outlines. It is not permitted to solder the metal tab of the device to a heatsink, otherwise the junction temperature rating will be exceeded. clamp area 1.75 min Avoid any force on body and leads during or after soldering; do not correct the position of the device or of its leads after soldering. plastic body RL Lead bending L Maximum permissible tensile force on the body for 5 seconds is 20 N. MGA772 Dimensions in mm. The leads can be bent, twisted or straightened. To keep forces within the above mentioned limits the leads should always be clamped rigidly near the body during bending. 1998 Dec 07 Fig.7 Minimum lead bend radius. 773 Philips Semiconductors Power Bipolar Transistors Mounting and Soldering Additional guide-lines It is recommended that where a device is rigidly secured to a heatsink which is in turn rigidly secured to a PCB, that a bend is put in the leads to act as an expansion loop. This will prevent differential expansion of the mounting parts transferring stress to the soldering joint, as shown in Fig.8. This is only necessary where the device is mounted so rigidly that expansion forces are transmitted through the assembly. secure not rigid rigid rigid solder joint rigid PCB secure not rigid solder joint rigid PCB solder joint PCB MGA768 (a) Incorrect (b) Correct Fig.8 Printed circuit board and heatsink mounting. 1998 Dec 07 774 (c) Correct Philips Semiconductors Power Bipolar Transistors Mounting and Soldering INSTRUCTIONS FOR SCREW MOUNTING Direct mounting with screw and spacing washer THROUGH HEATSINK WITH NUT INTO TAPPED HEATSINK M3 screw M3 screw rectangular washer (not required for F-pack) rectangular washer (not required for F-pack) heatsink heatsink plain washer lock washer M3 nut MGA761 MGA762 Fig.9 Assembly. Fig.11 Assembly. 3.5 max 3.5 max 4 min 1.5 min 3.3 3.1 MGA751 M3 Dimensions in mm. Dimensions in mm. Fig.10 Heatsink requirements. 1998 Dec 07 MGA752 Fig.12 Heatsink requirements. 775 Philips Semiconductors Power Bipolar Transistors Mounting and Soldering GENERAL DATA AND INSTRUCTIONS FOR SOT199/SOT429 (TO247)/TOP3D (SOT399) For M4 screw (direct mounting only): General rules Maximum torque to avoid damaging the device is 1.0 Nm. 1. Fasten the device to the heatsink before soldering the leads. The M4 screw head should not touch the plastic part of the envelope. Minimum torque for good heat transfer is 0.4 Nm. 2. Avoid stress to the leads. RIVET MOUNTING NON-INSULATED 3. Keep mounting tool (e.g. screwdriver) clear of the plastic body. The device should not be pop-riveted to the heatsink because it will damage the plastic encapsulation. 4. The washer may only touch the plastic part of the body; it should not exert any force on that part (screw mounting). Heatsink requirements Flatness in the mounting area: 0.02 mm maximum per 10 mm. Mounting holes must be deburred, for further information see clip and screw mounting instructions. Mounting methods CLIP MOUNTING Mounting by means of spring clip offers: Heatsink compound 1. A good thermal contact under the crystal area. The thermal resistance from mounting base to heatsink (Rth mb-h) can be reduced by applying a metallic oxide compound between the contact surfaces. Values given are of thermal resistance using this type of compound. Dow Corning 340 Heat sink compound is recommended. For insulated mounting, the compound should be applied to the bottom of both device and insulator. 2. Safe insulation for mains operation. Minimum force for good heat transfer is 10 N. Maximum force to avoid damaging the device is 80 N. MOUNTING TORQUES For M3 screw (insulated mounting): Minimum torque for good heat transfer is 0.4 Nm. Maximum torque to avoid damaging the device is 0.6 Nm. 1998 Dec 07 776 Philips Semiconductors Power Bipolar Transistors Soldering Recommendation for devices with a maximum junction temperature rating <175 C: DIP OR WAVE SOLDERING Maximum permissible solder temperature is 260 C at a distance from the body of >5 mm and for a total contact time with soldering bath or waves of <7 s. HAND SOLDERING Maximum permissible temperature is 275 C at a distance from the body of >3 mm and for a total contact time with the soldering iron of <5 s. The body of the device must not touch anything with a temperature >200 C. Mounting and Soldering This is also to prevent damage to the seal of the leads within the plastic body. Leads can be bent as near to the body as required, but adequate length should always be allowed for clamping. This is a minimum of 1.75 mm from the body to the start of a bend radius. The internal radius of bend should never be less than the thickness of the lead. A minimum radius of at least 1.5 x lead thickness is preferred. See Fig.13. Surface cracks in the dip tin coating on the lead are common when a radius less than 1.5 x lead thickness is used. Although exposing the copper material, these cracks do not affect the mechanical strength of the lead. Lead forming by Philips is available as an option on all products supplied in these outlines. It is not permitted to solder the metal tab of the device to a heatsink, otherwise the junction temperature rating will be exceeded. clamp area 1.75 min Avoid any force on body and leads during or after soldering; do not correct the position of the device or of its leads after soldering. plastic body RL Lead bending L Maximum permissible tensile force on the body for 5 seconds is 20 N. MGA772 Dimensions in mm. The leads can be bent, twisted or straightened. To keep forces within the above mentioned limits the leads should always be clamped rigidly near the body during bending. 1998 Dec 07 Fig.13 Minimum lead bend radius. 777 Philips Semiconductors Power Bipolar Transistors Mounting and Soldering Additional guide-lines It is recommended that where a device is rigidly secured to a heatsink which is in turn rigidly secured to a PCB, that a bend is put in the leads to act as an expansion loop. This will prevent differential expansion of the mounting parts transferring stress to the soldering joint, as shown in Fig.14. This is only necessary where the device is mounted so rigidly that expansion forces are transmitted through the assembly. secure not rigid rigid rigid solder joint rigid PCB secure not rigid solder joint rigid PCB solder joint PCB MGA768 (a) Incorrect (b) Correct Fig.14 Printed circuit board and heatsink mounting. 1998 Dec 07 778 (c) Correct Philips Semiconductors Power Bipolar Transistors Mounting and Soldering INSTRUCTIONS FOR SCREW MOUNTING Direct mounting through heatsink with nut M4 screw rectangular washer (not required for F-pack) 4.5 max heatsink plain washer 2 min lock washer M4 nut MBK910 4.3 4.1 MBK911 Dimensions in mm. Fig.15 Assembly. Fig.16 Heatsink requirements. Where vibrations are to be expected the use of a lock washer or of a curved spring washer is recommended with a plain washer between aluminium heatsink and spring washer. 1998 Dec 07 779 Philips Semiconductors Power Bipolar Transistors Mounting and Soldering Insulated screw mounting with insert nut; up to 500 V 1 5 2 3 1.0 min device 4 2.5 min heatsink insert nut MBK912 (1) (2) (3) (4) (5) M3 screw. Plain washer. Insulating bush. Mica insulator. Lock washer. Fig.17 Assembly and heatsink requirements for 500 V insulation. See also Figs 15 and 16. 1998 Dec 07 780