1N4148WS/1N4448WS/1N914BWS
200mW High Speed SMD Switching Diode
Small Signal Diode
Fast switching device(Trr<4.0nS)
Surface device type mounting
Moisture sensitivity level 1
Matte Tin(Sn) lead finish with Nickel(Ni) underplate
Pb free version and RoHS compliant
Case : Flat lead SOD-323F small outline plastic package Min Max Min Max
1.15 1.35 0.045 0.053
2.30 2.70 0.091 0.106
0.25 0.40 0.010 0.016
1.60 1.80 0.063 0.071
0.80 1.00 0.031 0.039
0.05 0.20 0.002 0.008
Package Part No. Packing
SOD-323F 1N4148WS RR 3K / 7" Reel
SOD-323F 1N4448WS RR 3K / 7" Reel
SOD-323F 1N914BWS RR 3K / 7" Reel
SOD-323F 1N4148WS RRG 3K / 7" Reel
SOD-323F 1N4448WS RRG 3K / 7" Reel
SOD-323F 1N914BWS RRG 3K / 7" Reel
Maximum Ratings
Notes: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary despending on application.
SOD-323F
Maximum Ratings and Electrical Characteristics
Features
Mechanical Data
Terminal: Matte tin plated, solderable
per MIL-STD-202, Method 208 guaranteed
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
High temperature soldering guaranteed: 260°C/10s
mA
°C/W
100
mW
V
°C
E
Value
150
500
mA300
200
100
V
Junction and Storage Temperature Range TJ, TSTG -65 to + 150
Mean Forward Current
Thermal Resistance (Junction to Ambient)
IO
RθJA
VRRM
IFRM
VR
Power Dissipation
Reverse Voltage
Non-Repetitive Peak Forward Current
Repetitive Peak Reverse Voltage
PD
Type Number
Polarity : Indicated by cathode band
Weight : 4.85±0.5 mg
Rating at 25°C ambient temperature unless otherwise specified.
Ordering Information
UnitsSymbol
S3
S1
S2
S3
Marking
Suggested PAD Layou
t
S1
S2
Unit (inch)
Pin Configuration
Marking Code : S1, S2, S3
Dimensions
F
Unit (mm)
A
B
C
D
D
A
B
C
E
F
Version : E10
1N4148WS/1N4448WS/1N914BWS
200mW High Speed SMD Switching Diode
Small Signal Diode
Electrical Characteristics
IR=
IR=
1N4448WS, 1N914BWS IF=
1N4148WS IF=
1N4448WS, 1N914BWS IF=
VR=
VR=
Junction Capacitance
Tape & Reel specification
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Embossment center
Overall tape thickness
Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10° within the determined cavity.
Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
W 8.30 Max.
Reel width W1 14.4 Max
P0 4.00 ±0.10
P1 2.00 ±0.10
Tape width
T 0.6 Max.
13.0 ± 0.5
K
D2
D1
D
E 1.75 ±0.10
50 Min.
F 3.50 ±0.05
Item Symbol Dimension(mm)
A 178 ± 1
2.40 Max.
Min
1.5 ± 0.1
75 -
UnitsMax
ns4.0
Symbol
5.0
-
-
100 -
25
-Reverse Recovery Time IF=10mA, IR=60mA, RL=100Ω, IRR=1mA Trr
pF4.0
V
100.0mA
0.72
1.0
1.0-
10.0mA
VR=0, f=1.0MHz
V
CJ
0.62
-
μA-
VF
IR
V(BR)
nA
User Direction of Feed
Reverse Breakdown Voltage
Reverse Leakage Current
Type Number
100uA
5uA
Forward Voltage
20V
75V
5.0mA
T
op
Co
v
e
r T
ape
Carieer Tape
A
n
y
Additional Label
(
If Required
)
TSC label
W1
D1D2
A
Version : E10
1N4148WS/1N4448WS/1N914BWS
200mW High Speed SMD Switching Diode
Small Signal Diode
Rating and Characteristic Curves
FIG 1 Forward Voltage vs Forward Current
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
0.01 0.1 1 10 100 1000
Forward Current (mA)
Forward Voltage (V)
FIG 3 Admissible Power Dissipation Curve
0
50
100
150
200
250
0 25 50 75 100 125 150 175
Power Dissipation (mW)
FIG 4 Typical Junction Capacitance
0.7
0.7
0.8
0.8
0.9
0.9
1.0
1.0
1.1
1.1
1.2
012345678910
Junction Capacitance (pF)
Ambient Temperature (°C) Reverse Voltage (V)
25°C
FIG 2 Reverse Current vs Reverse Voltage
0.01
0.1
1
10
100
0 20 40 60 80 100 120
Reverse Current (uA)
Reverse Voltage (V)
Ta=25°C
VR=0V
Tj=25°C
f=1MHz
125°
Version : E10
