Parameter Min. Typ. Max. Unit
RthJC Thermal resistance Junction-Case 2.1
RthJA Thermal resistance Junction-ambient 80 K/W
RthCS Thermal resistance Junction-ambient 1.0
2N7086
Prelim. 1/99
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Parameter Test Conditions Min. Typ. Max. Unit
VGS = 0 ID= 250µA
VDS = VGS ID= 250µA
VDS = 0 VGS = ±20V
VDS = 160V
VGS = 0 TJ= 125°C
VDS = 10V VGS = 10V
VGS = 10V
ID= 8.5A TJ= 125°C
VDS = 15V IDS = 8.5A
VGS = 0
VDS = 25V
f = 1MHz
VDS = 0.5 x V(BR)DSS
VGS = 10V ID= 14A
VDD = 100V ID= 14A
VGEN =10V
RL= 7.1Ω
RG= 4.7Ω
IF= ISVGS = 0
IF= IS
dIF/dt = 100A/µs
ELECTRICAL CHARACTERISTICS (TJ= 25°C unless otherwise stated)
THERMAL RESISTANCECHARACTERISTICS
Drain–Source Breakdown Voltage
Gate Threshold Voltage
Gate – Body Leakage
Zero Gate Voltage Drain Current
On–State Drain Current1
Static Drain – Source On–State
Resistance 1
Forward Transconductance1
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge2
Gate Source Charge2
Gate Drain Charge2
Turn–On Delay Time2
Rise Time2
Turn–Off Delay Time2
Fall Time2
Continuous Current
Pulse Current 3
Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
200
24
±100
25
250
14 0.14 0.16
0.25 0.30
5.0
1550
500
220
30 44 77
4.6 10 15
13 26 35
10 30
60 100
30 80
40 95
114
56
2.0
150 650
0.5
V
V
nA
µA
A
Ω
S
pF
nC
ns
A
V
ns
µC
BV(BR)DSS
VGS(th)
IGSS
IDSS
ID(on)
RDS(on)
gfs
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
IS
ISM
VSD
trr
Qrr
STATIC ELECTRICAL RATINGS
DYNAMIC CHARACTERISTICS
SOURCE – DRAIN DIODE CHARACTERISTICS
1Pulse test : Pulse Width < 300µs ,Duty Cycle < 2%
2Independent of Operating Temperature
3Pulse width Limited by maximum Junction Temperature