2
TechnischeInformation/TechnicalInformation
FS200R12PT4
IGBT-Module
IGBT-modules
preparedby:MK
approvedby:MK
dateofpublication:2013-11-11
revision:2.2
VorläufigeDaten
PreliminaryData
IGBT,Wechselrichter/IGBT,Inverter
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage Tvj = 25°C VCES 1200 V
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent TC = 95°C, Tvj max = 175°C
TC = 25°C, Tvj max = 175°C
IC nom
IC200
280 A
A
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 400 A
Gesamt-Verlustleistung
Totalpowerdissipation TC = 25°C, Tvj max = 175°C Ptot 1000 W
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage VGES +/-20 V
CharakteristischeWerte/CharacteristicValues min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage IC = 200 A, VGE = 15 V
IC = 200 A, VGE = 15 V
IC = 200 A, VGE = 15 V
VCE sat
1,75
2,05
2,10
2,15
V
V
V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Gate-Schwellenspannung
Gatethresholdvoltage IC = 7,60 mA, VCE = VGE, Tvj = 25°C VGEth 5,2 5,8 6,4 V
Gateladung
Gatecharge VGE = -15 V ... +15 V QG1,65 µC
InternerGatewiderstand
Internalgateresistor Tvj = 25°C RGint 3,5 Ω
Eingangskapazität
Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 14,0 nF
Rückwirkungskapazität
Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 0,50 nF
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent VCE = 1200 V, VGE = 0 V, Tvj = 25°C ICES 1,0 mA
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload IC = 200 A, VCE = 600 V
VGE = ±15 V
RGon = 1,1 Ω
td on
0,14
0,15
0,15
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Anstiegszeit,induktiveLast
Risetime,inductiveload IC = 200 A, VCE = 600 V
VGE = ±15 V
RGon = 1,1 Ω
tr
0,03
0,035
0,04
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload IC = 200 A, VCE = 600 V
VGE = ±15 V
RGoff = 1,1 Ω
td off
0,32
0,40
0,42
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Fallzeit,induktiveLast
Falltime,inductiveload IC = 200 A, VCE = 600 V
VGE = ±15 V
RGoff = 1,1 Ω
tf
0,09
0,16
0,18
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse IC = 200 A, VCE = 600 V, LS = 30 nH
VGE = ±15 V, di/dt = 5400 A/µs (Tvj = 150°C)
RGon = 1,1 ΩEon 10,5
18,5
20,5
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse IC = 200 A, VCE = 600 V, LS = 30 nH
VGE = ±15 V, du/dt = 5000 V/µs (Tvj = 150°C)
RGoff = 1,1 ΩEoff 11,0
16,5
18,5
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Kurzschlußverhalten
SCdata VGE ≤ 15 V, VCC = 800 V
VCEmax = VCES -LsCE ·di/dt ISC
800
A
Tvj = 150°C
tP ≤ 10 µs,
Wärmewiderstand,ChipbisGehäuse
Thermalresistance,junctiontocase proIGBT/perIGBT RthJC 0,15 K/W
Wärmewiderstand,GehäusebisKühlkörper
Thermalresistance,casetoheatsink proIGBT/perIGBT
λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH 0,083 K/W
TemperaturimSchaltbetrieb
Temperatureunderswitchingconditions Tvj op -40 150 °C