The documentation and process comply with this revision sha completed by 30 September 1 conversion measures necessary to Ll be 994 MILITARY SPECIFICATION INCH-POUND MIL-S-19500/550A 30 June 1994 SUPERSEDING MIL-S-19500/550(USAF) 21 December 1981 SEMICONDUCTOR DEVICE, DIODE, SILICON, FAST-RECOVERY, HIGH CURRENT TYPES 1N4304, 1N6305, 1N6306, AND R TYPES JAN, JANTX, JANTXV, JANHC, AND JANKC This specification is approved for use by all Depart- ments amd Agencies of 1. SCOPE 1.1 Scope. switching power rectifier diodes the Department of Defense. This specification covers the detail requirements for silicon, high efficiency fast recovery . Three levels of product assurance are provided for each encapsulated device type as specified in MIL-S-19500, and two levels of product assurance for each unencapsulated device type die. 1.2 Physical dimensions. See figure 1 (DO-203AB) and figure 2 for JANHC and JANKC (die) dimensions. 1.3 Maximum ratings. Tp = +25C, untess otherwise specified. Types Vv, Vv I I t V I R, R RUM Ir = Sroocc | TE -ssec | TT | fy = 70.4 CpkD at eve to = 8.3 ms Huty cycle rated Vp V/ 2/ S 2 percent tp = 300 us max Vide | Vde |* Ace A_de ns V_(pk) BA_de SC/W 1N6304, R 50 50 70 800 50 0.975 25 0.8 1N6305, R 100 100 70 800 50 0.975 25 0.8 1N6306, R 150 150 70 800 50 0.975 25 0.8 4/ Derate linearly, 875 mA/C from T. = +100C to +150C, and 1,050 mA/C above T, > +150C. 2/ Higher Ip, up to 1.2 times Ig is allowable provided that appropriate heat sinking or forced air cooling maintains the maximum junction temperature at or below +175C as proven by the junction temperature rise time. Storage temperature: Te = -65C to +175C. Operating temperature: Tp = -65C to +175C. Beneficial comments (recommendations, additions, detetions) and any pertinent data which may be of use in improving this document should be addressed to: Center, DESC-ELDT, 1507 Wilmington Pike, Dayton, OH 65444-5765, by using the Standardization Document {mprovement Proposal (DD form 1426) appearing at the end of this document or by letter. Commander, Defence Electronic Supply AMSC/NA QISTRIBUTION STATEMENT A. M@ 0000125 0035341 941 Approved for public release; distribution is unlimited. FSC 5961MIL-S-19500/550A 2. APPLICABLE DOCUMENTS 2.1 Government_documents. 2.1.1 Specifications, standards, and handbocks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 - Semiconductor Devices, General Specification for. STANDARDS FEDERAL FED-STD-H28 - Screw-Thread Standards for Federal Services. MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Defense Printing Service Detachment Office, Suilding 40 (Customer Service), 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated detail specification. The individual item requirements shal! be in accordance with MIL-S-19500 and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-S-19500 and as specified herein. JANH 2 1 6 we ew ew we te we tt High reliability product assurance level for unencapsulated devices. JANK 2. 2 ee a Space reliability product assurance level for unencapsulated devices. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-S-19500, and on figure 1 (DO-203AB) and figures 2 and 3 for JANC die herein. 3.3.1 Lead material and finish. Lead material shall be copper (terminal number 1) with a steel cap on a copper stud (terminal number 2). Lead finish shall be solderable as defined in MIL-S-19500, MIL-STO-750, and herein. Where a choice of lead finish is desired, it shail be specified in the acquisition document (see 6.2). 3.4 Marking. Marking shall be in accordance with MIL-S-19500. 3.4.1 Marking of JANHC and JANKC die. For JANHC and JANKC die, the following marking shall be used (example): JANHCAM 1N6306 Tttt JE RHA level (see MIL-S-19500). Source of manufacturer (see figure 2). Unencapsulated. Product assurance level IJ/. t/ Two levels of product assurance levels are provided for unencapsulated devices, H and K (see MIL-S-19500. ms 0000125 0035342 415 @MIL-S-19500/550A 7 |.002 | (0.05) a PITCH LINE[A] (0.15) SEE NOTE 6 pt pM1 \ pM Sh | Pp iy | Ey = TERM 2 Ni \ (SEE NOTE 9} TERM 1 N 6; - SEATING PLANE FIGURE 1. Physical dimensions (00-203A8). m oo001e5 9035343 7S) a EnMIL-S-19500/550A Dimensions Inches Millimeters Ltr Notes Min Max Min Max c 375 9.53 7 Cy -080 2.03 gD -667 16.94 E -669 -688 | 16.99 | 17.48 Ey 115 200 2.92 5.08 G -450 11.43 Gy .750 | 1.000 | 19.05 | 25.40 oM 5 OM, .220 249 5.59 6.32 N 422 -453 | 10.72 | 11.51 Ny -090 2.29 4 oT +140 2175 3.56 4.45 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for information only. 3. Units must not be damaged by torque of 30 inch-pound applied to .25-28 UNF-2B nut assembled on thread. 4. Length of incomplete or undercut threads of @M,. 5. Maximum pitch diameter of plated threads shall be basic pitch diameter .2268 inch (5.761 mm). 6. A chamfer or undercut on one or both ends of the hex portion is optional; minimum base diameter at seating plane .60 inch (15.2 mm). 7. The anguiar orientation and peripheral configuration of terminal 1 is undefined. 8. Standard types shall have cathode connected to stud. Reverse types shail have anode connected to stud. 9. Term 2 threads in accordance with FED-STD-H28. FIGURE 1. Physical dimensions (D0-203A8) - Cont inued. me 00001e5 0035344 LIDNOTES: a eP ul Pn - eesee MIL-S-19500/550A 8 Tis Pd/A 7 CATHODE? Pe g Ze N +4 lL 5 Ne 7 Ti/Pd/Ag ANODE cll see OETAIL A PASSIVATION - DETAIL A Dimensions Inches Millimeters Ltr Notes Min Max Min Max A 0.199 sa | 0.201 sa | 5.054 sa | 5.105 Sa B 0.009 0.011 0.229 0.279 A version Dimensions are in inches. Metric equivalents are given for information only. Back metal: Ti - Pd - Ag. Top metal: Ti - Pd - Ag. Metalization: Ti = 700 A; Pd = 700 A; Ag = 31400 A. FIGURE 2. Physical dimensions JANHCA and JANKCA. a gg0dbes 0035345 Sc? @MIL-S-19500/550A 1 Dimensions Inches Millimeters Ltr Notes Min Max Min Max A 0.191 sq | 0.201 sq | 4.851 sq | 5.105 sq 8 0.173 sq | 0.183 sq | 4.394 sq | 4.648 sq c 0.009 0.010 0.229 0.254 8 version NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for information only. 3. Back metal: Cr - Ni - Ag 4. Top metal: Cr - Ni - Ag 5. Metalization: Cr = 800 A minimm, Ni = 1.5 A minimum, Ag = 3000 A minimm. FIGURE 3. Physical dimensions JANHCB and JANKC8. 3.5 Polarity. The polarity shall be indicated by a graphic symbol with the arrow pointing toward the cathode terminal. The reversed units shall also be marked with an following the last digit in the type number . 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500 and as specified herein. 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19500. Tests in either polarity shall be sufficient to obtain qualification approval of both polarities. 6.2.1 JANHC and JANKC devices. Qualification shall be in accordance with appendix H of MIL-S-19500. Me 00001eS 0035346 443 @MIL-S-19500/550A 4.3 Screening (JANTX and JANTXV Levels only). Screening shall be in accordance with table II of MIL-S-19500 and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the Limits of table I herein shali not be acceptable. Measurement Screen (see table II of MIL-S-19500 JANTX and JANTXV levels 3b 2/ Surge (see 4.3.2) 3c Thermal response (see 4.3.4) 4 Not applicable 9 Not applicable 10 Not applicable 11 Veq and [py Vy 12 Burn-in (see 4.3.2) 13 3/ Subgroup 2 of table | herein. Veq and Ipqi AVEy 0.1 V (pk); al $ +5 pA de or 100 percent R1 a from the initial value, whichever is greater. 1f Ip4 measurement shall not be indicative of an open condition. 2/ May be performed at any time after screen 3a. Surge shall precede thermal response. 3/ Thermal response need not be repeated if previously screened. 4.3.1 Screening (JANHC and JANKC). Screening of die shall be in accordance with MIL-S-19500, (appendix H), as a minimum die shall be 100 percent probed in accordance with group A, subgroup 2, except test current shall not exceed 20 A. 4.3.2 Burn-in conditions. Burn-in conditions for ali levels are as follows: MIL-STD-750, method 1038, test condition A; TF +125C, Vp = 0.8 to 0.85 rated de (see 1.3), t = 48 hours. 4.3.2.1 Alternate burn-in conditions. T, = +150C, Vp = rated Vp (see 1.3), Ig 0, f = 50 to 60 Hz, t = 48 hours. . 4.3.3 Surge current. Surge current, see MIL-STD-750, method 4066. I = 0; Veww = 0; Tpgy 2 800 A; six surges; Ty = +25C; tp = 8.3 ms. 4.3.4 Thermal response (AVp measurements). The 4Vp measurements shall be performed in accordance with MIL-STD-750, method 3101. The AVE conditions and maximum aV, Limit shall be derived by each vendor. The chosen Ve measurement and conditions for each device in the qualification lot shall be submitted in the qualification report and a thermal response curve shall be plotted. The chosen AV, value shall be considered final after the manufacturer has had the opportunity to test five consecutive lots. ty = 100 to 250 ms; heating current Iy = SO A. Measurement current: 50 mA < ty $ 250 mA; typ = 100 ws to 300 us. 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-19500 and as specified herein. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500 and table I herein. 4.4.2 Group 6 inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in table [Vb (JANTX and JANTXV) of MIL-S-19500 and as follows. Electrical measurements (end-points) shall be in accordance with the applicable steps of table I, group A, subgroup 2 WVewy and Ip4 only) herein. 4.4.2.1 Group 8 inspection, table [Vb (JANTX and JANTXV) of MIL-$-19500. Subgroup Method Condition 82 4066 Te = +55C; V, = rated Vp (see 1.3); six .083 s surges; 1 surge/minute; Ip (surge) = Roo Adc, Ig = Q. 63 1037 25 percent rated Ig 3 Ig applied s rated Ip, 2,000 cycles. 4.4.3 Group inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500, and as follows. Electrical measurements (end-points) shall be in accordance with the applicable steps of table [, group A, subgroup 2 (Vey, and Ip, only) herein. 7 me 0000125 0035347? 3TTMIL-S-19500/550A 4.4.3.1 Group C inspection, table V of MIL-$-19500. Subgroup Method Condition c2 2036 Tension, test condition A, weight = 10 lbs, t = 15s. 2036 Bending stress, test condition F, method B; weight = 15 pounds, t = 15 s. 2036 Seal torque, test condition 01, torque = 3 inch-pound, t = 15 s. 2036 Stud torque, test condition D2, torque = 30 inch-pound, t = 15 s. C6 1037 25 percent rated [y < Iy applied < rated lg, 6,000 cycles. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. 4.5.1 Pulse measurements. Conditions for pulse measurements shail be as specified in section 4 of MIL-STD-750. 4.5.2 DC intermittent operation life. A cycle shall consist of an "on" period, when power is applied suddenly, not gradually, to the device for the time necessary to achieve a delta case temperature of +85C +15C -5C, followed by an "off" period, when the power is suddenly removed, for cooling. Auxiliary (forced) cooling is permitted during the off period only. 30s < theating * 180 s. Within the time interval of 5 cycles before to 500 cycles after the termination of the test, the sample units SRall be removed from the specified test conditions and allowed to reach room ambient conditions. Specified end-point measurements for qualification and quality conformance inspection shalt be complete within 96 hours after removal of sample units from the specified conditions. Additional readings may be taken at the discretion of the manufacturer. 4.5.3 Reverse recovery time. The reverse recovery time shall be measured as shown in the circuit A of figure 4 or equivalent. Care should be exercised to minimize stray inductances in the test circuit and to ensure that the total resistance of the reverse current loop can be adjusted sufficiently low that more than two amperes will flow if not blocked by the diode being tested. Switch SW shall be activated and the regulated voltage source adjusted to achieve the following characteristics of the waveform: a. The d;/d, shalt be the specified value between the forward 0.5 ampere point and the reverse 0.2 ampere point. b. The i_Crec) shall be the maximum value obtainable, except that if it exceeds 2 amperes, the reverse-recovery time shall then be determined from the current waveform as shown in circuit B on figure 3. 4.5.4 Thermal resistance. Thermal resistance measurements shall be performed in accordance with MIL-STD-750, method 4081 or method 3101. The case reference temperature shall be held to equilibrium within the range of 20C to 80C during the power application, and shall be measured at the hex flat. The maximum limit of Reic shall be 0.8C/W. The following parameter measurements shall be used: ly tip 2 10 A. ty 50 to 400 ms (t, 2 50 s for method 4081). 10 mA < Ty 100 mA. tup < 250 us. ms 0000125 0035348 23h @MIL-$-19500/550A TABLE 1. Group A inspection. MIL-STD-750 Limits Inspection 1/ Method Conditions Symbol Min Max Unit Subgroup 1 Visual and mechanical 2071 inspection Subgroup 2 Forward voltage 4011 = 70 A (pk); duty cycle Vem4 -975 IV de(pk) Me 2 percent (pulsed see 4.5.1) = 300 us maximum Forward voltage 4011 i = 150 A (pk); duty cycle Vewo 1.18 jV deCpk) < 2 percent (pulsed see 4.5.1) tp = 300 ws maximum Reverse current 4016 DC method; Vp = rated Vp (see 1.3) Tp4 25 nA de Subgroup 3 High temperature Te = +150C operation: Reverse current 4016 OC method; VR = rated V_ (see 1.3) Ipo 30 mA de Forward voltage 4011 Tey = 70 A (pk); duty cycle Vew3 -84 1V de(pk> < 2 percent (pulsed see 4.5.1) tp = 300 gs maximum Low temperature Te = -55C operation: Breakdown voltage 4021 Ip = 1m Vesey 1N6304 50 Vv de 1N6305 100 V de 1N6306 150 Vv de Subgroup 4 Reverse recovery time | 4031 Condition B, tert 50 ns pe Oe oon Rs & = 0.25 Adc, dj/d, = 85 A/us (RES naimy, (see 4.5.3 and figure 4) Reverse recovery time | 4031 Condition C, ter2 60 ns = 70 Ade, dj/d = 130 A/us (see 4.5.3 and figure 4) Junction capacitance 4001 Vp = = 10v, f = 1 MHz C, 600 pF Vsig = 50 mV (p-p) maximum See footnote at end of table. me 0000125 0035349 1?c @MIL~S-19500/550A TABLE {. Group A inspection - Continued. MIL-STD-750 Limits Inspection 1/ Method Conditions Symbol Min Max Unit Subgroups 5 and 6 Not applicable Subgroup 7 Forward recovery 4026 Ipy = 1A, to 2 20 ns, t, = 8 ns VecDyn) 2.2 V(pk) voltage Forward recovery 4026 ley = TA tee 15 ns time 41/ for sampling plan, see MIL-S-19500. me 0000125 0035350 595MIL-S$-19500/S550A Circuit A SYNC PULSE TO INTERRUPT r TT Tp DURING "REVERSE PULSE =CSNNSSS i | 002 AF \{ J 1 I l LY |- oLe ge CONSTANT CURRENT PULSE GENERATOR SUPPLY FOR SEE NOTE 2 Ip? FOR Ip! HIGH Zou4 LOW Zo FAST tp - + CVR SEE NOTE 3 -oscILLOScoPE SEE NOTE 1 ~ nm SET TIME BASE FOR 10 as/ce NOTES: 1.0scilloscope: Rise time <1 ns; input impedance = 50 ohms maximum. 2.Pulse generator: Rise time < 10 ns; source impedance 50 ohms maximum. 3.Current viewing resistor: Noninductive coaxial type with resistance matched to pulse generator impedance. An appropriate current probe may be used in place of the C.V.R. A 50 ohm, 60 ns, charge line may be used for the 2,,,- FIGURE 4. Reverse recovery time circuit and waveform. Circuit 8 ! go00125 0035351 420MIL-S-19500/550A OUT 120 V ac 60 Hz AAS R2 < 0.259 (L<0.01 aH) RO1 0 OSCILLOSCOPE Traireci NOTE: Select L, C, and input voltage to achieve Ipy and d;/d, specified. FIGURE 4. Reverse recovery time circuit and waveform - Continued. 12 me 0000125 0035352 7b?MIL-S-19500/550A 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shail be in accordance with MIL-S-19500. 6. NOTES (this section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Issue of DODISS to be cited in the solicitation. b. Lead finish as specified (see 3.3.1). . Type designation, product assurance tevel and for die acquisition, the manufacturer's letter identification should be specified. 6.3 Suppliers of JANC die. The qualified die suppliers will be identified on the QPL (example JANHCA1N6304). JANC ordering information Military PIN Manufacturer 12969 12969 59377 59377 1N6304 JANHCAIN6304 JANKCA1N6304 JANHCS1N6304 JANKCB1N6304 1N6305 JANHCA1N6305 JANKCA1N6305 JANHCB1N6305 JANKCB1N6305 1N6306 JANHCA1N6306 JANKCA1N6306 JANHCB1N6306 JANKCB1N6306 6.4 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Custodians: Preparing activity: Army - ER DLA - ES Navy - EC Air Force - 17 (Project 5961-1564) NASA - NA Review activities: Army - AR, MI, SM Navy - AS, CG, MC Air Force - 13, 15, 19, 80, 85, 99 DLA - ES 13 mm 0000125 0035353 4LT3 =