Infineon® LITIX™ Power
TLD5045EJ
Table of Contents
Data Sheet 2 Revision 1.0 2015-05-28
Not for Customers
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 Power Supply Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6 Enable, Dimming Function and Thermal Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.2 Electrical Characteristics Enable, Bias, Dimming Function and Thermal Protection . . . . . . . . . . . . . 14
6.2.1 PWM Dimming with µC connected to TLD5045EJ PWMI pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2.2 Internal PWM dimming Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.3 Overtemperature Protection of the Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7 Open Load Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.2 Electrical Characteristics: Open Load Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3 Open Load Diagnosis in different Application Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.3.1 Light module application without µC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.4 Application with µC connected to TLD5045EJ IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.1 Output Peak current Adjustment via RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.2 Switching Frequency Determination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.3 TLD5045EJ in different LED Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
8.3.1 TLD5045EJ in a Body Control Module (BCM) with µC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
8.3.2 Decentralized Light Module Application - DLM (Input configuration 1) . . . . . . . . . . . . . . . . . . . . . . . 25
8.3.3 Decentralized Light Module Application - DLM (Input configuration 2) . . . . . . . . . . . . . . . . . . . . . . . 26
8.3.4 Decentralized Light Module Application - DLM (Input configuration 3) . . . . . . . . . . . . . . . . . . . . . . . 27
9 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table of Contents
PG-DSO-8 EP
Type Package Marking
Device1 PG-DSO-8 EP PG-DSO-8 EP
Data Sheet 3 Revision 1.0, 2015-05-28
TLD5045EJ Infineon® LITIX™ Power
1 Overview
• Constant Current Generation
• Wide Input Voltage Range from 5V to 40V
• Peak Current Regulation
• Very low current consumption (<2uA) in Sleep Mode
• Integrated power transistor with low saturation voltage
• Integrated fast freewheeling diode
• Integrated load current sense resistor
• Integrated status pull down transistor
• Overtemperature Protection
• Switching frequency (typ. 200kHz) adjustable via external RC network
• External PWM Dimming Input
• Integrated PWM Dimming Engine
• Analog Dimming (output current adjustable via external low power resistor and possibility to connect PTC
resistor for LED protection during overtemperature conditions)
• Stable switching frequency due to fix OFF-time concept with VREC (supply voltage) feedforward
• Under- and Overvoltage shutdown with hysteresis
• Small thermally enhanced exposed heatslug SMD package
• Automotive AEC Qualified
• Green Product (RoHS) Compliant
Description
The TLD5045EJ is a highly integrated smart LED buck controller with built in protection functions. The main
function of this device is to drive single or multiple series connected LEDs efficiently from a voltage source
higher than the LED forward voltage by regulating a constant LED current. The constant current regulation is
especially beneficial for LED color accuracy and long LED lifetime. The built in freewheeling diode and
switching transistor with current sense requires less external components and saves system costs. High
flexibility is achieved by placing low power resistors to adjust output currents up to 700mA and the regulator
switching frequency (typ. 200kHz). An integrated PWM dimming engine provides a LED dimming function by
placing a simple RC network to GND. This feature is dedicated for decentralized light modules without micro
controller involvement. In addition to that an integrated status pull down transistor can be used to simulate
a minimum current flow for decentralized modules to avoid a wrong open load detection by a highside switch
located in the body control module (BCM).
Application
• Automotive LED driven Exterior Lighting: Brake, Tail, CHMSL, Daytime Running Light, Position Light
• Automotive LED driven Interior Lighting: Reading Light, Dome Light, Display Backlighting
Data Sheet 4 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Block Diagram
2 Block Diagram
The TLD5045 regulates the LED current by monitoring the load current (Peak Current Measurement) through the
internal switch cycle by cycle. When the curr ent through the switch reaches the threshold Ipeak the switch is shut-
OFF and it is kept OFF for a time equal to tOFF. Both I peak and tOFF can be fixed through few external components.
The peak current Ipeak is fixed by a resistor connected to the SET pin while the tOFF is fixed by RC network. As t OFF
is fixed and the duty cycle depend s on VREC, the frequency d epends on VREC as well. Refer to Chapter 8.2 for the
evaluation of the switching frequency.
Figure 2-1 Block Diagram TLD5045EJ
1
5
3
2
8
7
6
GND
VREC
Logic
Power
Switch
FREQ
SW
Internal
Supply
EN
Thermal
Protection
UV+OV
Lockout
SET
PWMI
ST
Power-
Switch Driver
Open Load
Detection
Peak Current
Measurement
ON/OFF
Logic
Peak Current
Adjustment
4
OFF-Time
Control
internal
PWM
Generation
Data Sheet 5 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Pin Configuration
3 Pin Configuration
3.1 Pin Assignment
Figure 3-1 Pin Configuration TLD5045EJ
3.2 Pin Definitions and Functions
Table 3-1 sec_bias_prereg pin definition and function
# Name Direction Type Function
1VREC Voltage Recirculation Output and Internal Supply
Input;
This pin is the supply pin of the IC (see block diagram).
Furthermore the cathode of the integrated fast free-
wheeling diode is connected to this pin as well.
2ST Status Output;
Open collector diagnostic output to indicate an open
load failure.
Refer to Chapter 7 for more details.
3EN Enable;
Apply logic HIGH signal to enable the device
4SET SET Input;
Connect a low power resistor to adjust the output
current.
ST GND
EN FREQ
SW
5
6
4
3
2 7
1 8
SET
TLD5045
VREC
PWMI
EP
Data Sheet 6 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Pin Configuration
5PWMI PWM Input;
PWM signal for dimming LEDs. Connect external R and C
combination to achieve an auto PWM-dimming function
with defined frequency and duty cycle.
1) internal PWM dimming function (external RC
connected to GND)
2) external PWM dimming function (µC is controlling this
pin)
Refer to Chapter 6 for more details.
6FREQ FREQuency Select Input;
Connect external Resistor and Capacitor to GND to set the
OFF-time of the switching frequency.
7GND Ground;
Connect to system ground.
SW Integrated Power-Switch Output;
Collector of the integrated NPN-power transistor.
EP Exposed Pad;
Connect to external heatspreading copper area with
electrically GND (e.g. inner GND layer of the PCB via
thermal vias)
Table 3-1 sec_bias_prereg pin definition and function (continued)
# Name Direction Type Function
Data Sheet 7 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
General Product Characteristics
4 General Product Characteristics
4.1 Absolute Maximum Ratings
Tj = -40°C to +150°C; all voltages with respect to ground (unless otherwise specified)
Table 4-1 Absolute Maximum Ratings1)
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Voltages
VREC (Pin 1)
Recirculation and
Supply Input
VREC -0.3 45 V P_4.1.1
VREC (Pin 1)
Maximum current
flowing continuously
through the
freewheeling diode
and the power switch
VFW,SW 1.2 A – Maximum
ambient
temperature must
be calculated with
given Rthja of the
application
P_4.1.2
ST (Pin 2)
Diagnostic Status
Output Voltage
VST -0.3 45 V P_4.1.3
ST (Pin 2)
Diagnostic Status
Current
IST 150 mA –no short circuit
protection and no
current limitation
implemented
P_4.1.4
EN (Pin 3)
Enable Input Voltage
VEN -0.3 45 V P_4.1.5
SET (Pin 4)
Peak Current Adjust
Input Voltage
VSET -0.3 6 V P_4.1.6
PWMI (Pin 5)
PWM Input Voltage
VPWMI -0.3 6 V P_4.1.7
FREQ (Pin 6)
OFF-time Adjustment
Input
VFREQ -0.3 6 V P_4.1.8
SW (Pin 8)
Switch Output
VSW -0.3 45 V P_4.1.9
Temperatures
Junction
Temperature
Tj-40 150 °C P_4.1.10
Storage Temperature TSW -55 150 °C P_4.1.11
Data Sheet 8 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
General Product Characteristics
Note:
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
4.2 Functional Range
Note: Within the functional range the IC operates as described in the circuit desc rip tio n. The el ec tric al
characteristics are specified within the conditions given in the related electrical characteristics table.
ESD Susceptibility
ESD Resistivity all
Pins to GND
VESD, HBM -2 2 kV HBM2) ESD Results
available?
P_4.1.12
ESD Resistivity to
GND
VESD -500 500 V CDM3) P_4.1.13
ESD Resistivity corner
pins to GND
VESD -750 750 V CDM P_4.1.14
1) Not subject to production test, specified by desi gn.
2) ESD susceptibility HBM according to EIA/JESD 22-A 114B
3) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101 or ESDA STM5.3.1
Table 4-2 Functional Range
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Voltages
Extended Supply
Voltage
VREC 540
1)
1) Not subject to production test, specified by design
V Parameter
deviations possible
P_4.2.1
Nominal Supply
Voltage Range
VFW,SWREC 836V P_4.2.2
External Inductor LSW 220 560 µH max.560µH to
avoid OL
P_4.2.3
Output current range IOUT 100 700 mA P_4.2.4
Switching Frequency fSW 50 300 kHz Tj = 25°C to 150°C P_4.2.5
Junction
Temperature
Tj-40 150 °C P_4.2.6
Table 4-1 Absolute Maximum Ratings1)
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Data Sheet 9 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
General Product Characteristics
4.3 Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards.
For more information, go to www.jedec.org.
Table 4-3 Thermal Resistance
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Voltages
Junction to Case RthJ-case 10 K/W 1)2)
1) Not subject to production test, specified by desi gn.
2) Specified RthJ-case value is simulated at natural convection on a cold plate setup (all pins and the exposed Pad are fixed to
ambient temperature). Ta=25°C, Power Switch and freewheeling diode are dissipating 1W.
P_4.3.1
Junction to Ambient
(2s2p)
RthJA 40 K/W 1)3)
3) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
According to JESD51-5 a thermal via array under the exposed pad contacted the first inner copper layer. Ta=25°C, Power
Switch and freewheeling diode are dissipating 1W.
P_4.3.2
Data Sheet 10 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Electrical Characteristics
5 Electrical Characteristics
Tj = -40°C to +150°C, all voltages with respect to ground (unless otherwise specified)
5.1 General Parameters
Table 5-1 Electrical Characteristics
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Voltage Drop over
Power Transistor
VDrop,100 – 0.8 – V Ipeak=100mA P_5.1.1
Voltage Drop over
Power Transistor
VDrop,700 – 1.4 – V Ipeak=700mA P_5.1.2
Freewheeling diode
forward voltage
Vfw,100 – 0.8 – V Ipeak=100mA P_5.1.3
Freewheeling diode
forward voltage
Vfw,700 – 1.4 – V Ipeak=700mA P_5.1.4
Peak over current
limit
Ipeak_lim –1.4–A P_5.1.5
Peak current
accuracy
Ipeak_acc 450 500 550 mA VREC = 12V
VEN = 5V
VLED = 7.2V
RSET = 14kΩ
LSW = 220µH
fSW = 200kHz
P_5.1.6
Input under voltage
shutdown threshold
VREC,UVOFF – – 5 V VEN = 5V
VREC decreasing;
see Figure 5-1
P_5.1.7
Input voltage startup
threshold
VREC,UVON – – 6 V VEN = 5V
VREC increasing;
see Figure 5-1
P_5.1.8
Input under voltage
shutdown hysteresis
VREC,UVhyst –1–V P_5.1.9
Input over voltage
shutdown threshold
VREC,OVOFF 40.5 – – V VEN = 5V
VREC increasing;
see Figure 5-1
P_5.1.10
Input over voltage
startup threshold
VREC,OV 40 – – V VEN = 5V
VREC decreasing;
see Figure 5-1
P_5.1.11
Input over voltage
shutdown hysteresis
VREC,OVhyst –0.5–V P_5.1.12
Switch ON delay tdON – 400 600 ns 1)–P_5.1.13
Switch OFF delay tdOFF – 500 850 ns 1)–P_5.1.14
Data Sheet 11 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Electrical Characteristics
5.2 Power Supply Monitoring
Over- and Undervoltage Shutdown
If the supply voltage VREC drops below the input under voltagae threshold voltage VREC,UVOFF, the power stage
is switched OFF and the device is in normal consumption mode (Iq,ON).
If VREC rises again and reaches the input undervoltage startup threshold VREC,UVON the power stage is restarted
and the device is back to normal operation mode.
Same behaviour applies to overvoltage.
The internal status transistor switches off during an overvoltage or undervoltage event on VREC.
A detailed description of the under and overvoltage behaviour is displayed in Figure 5-1 below.
Reference Voltage at
SET pin
VSET 1.16 1.225 1.29 V P_5.1.15
Pull up current for
FREQ pin
IFREQ 5 – – mA VFREQ=0V P_5.1.16
Oscillator switch off
threshold
VFREQ,HIGH –3.2–V P_5.1.17
Oscillator switch on
threshold
VFREQ,LOW –1.2–V P_5.1.18
1) The minimum switching ON time tON must be greater than tdON + tdOFF
Table 5-1 Electrical Characteristics
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Data Sheet 12 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Electrical Characteristics
Figure 5-1 Over- and Undervoltage Protection
V
SW
V
REC,UVoff
V
REC,UVon
V
REC,UVhyst
t
t
I
LED
t
V
REC
V
REC,OVhyst
V
REC,OVon
V
REC,OVoff
I
set
ST
t
ST pull-
down ON ST pul l-down transistor OFFST pull-down transistor OFF ST pull-
down ON ST pull-
down ON
Data Sheet 13 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Enable, Dimming Function and Thermal Protection
6Enable, Dimming Function and Thermal Protection
6.1 Description
Enable Function
A logic high signal on the EN pin turns the device on. A logic low signal on e nable pin EN brings the device in sleep
mode. The current consumption is typ. 0.1 µA in this case. The EN pin has an internal pull down resistor which
ensures that the IC is in sleep mode and the power stage is switched off in case the pin EN is externally not
connected.
Dimming Function
The PWMI pin combines two functions:
1. PWM dimmming via a µC (3.3V and 5V µC)
2. Integrated PWM dimming engine for standalone solutions in decentralized light module (frequency and
duty cycle adjustable via external R,C network)
A detailed description of the PWMI pin is displayed in below.
Figure 6-1 PWMI Pin Description
PWMI ON ÆDC=100%
V
PWMI
PWMI OFF ÆDC=0%
t
SW-
ON SW - OFF SW-
ON SW - OFF SW-
ON SW - OFF SW-
ON SW - OFF
Internal PWM
V
PWMI,OFF
V
PWMI,ON
Data Sheet 14 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Enable, Dimming Function and Thermal Protection
6.2 Electrical Characteristics Enable, Bias, Dimming Function and Thermal
Protection
VREC = 4.5 V to 18 V, Tj = -40°C to +150°C, all voltages with respect to ground (unless otherwise specified)
Table 6-1 Electrical Characteristics: Enable, Bias, Dimming Function and Thermal Protection
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Current
Consumption,
sleep mode
Iq,OFF –0.12µAVEN = 0V;
VREC = 16V
P_6.2.1
Current
Consumption,
active mode (Open
Load)
Iq,ON ––5mAVEN = 5.0V;
Ipeak = 0mA (open
load);
VREC = 16V
P_6.2.2
Current
Consumption,
active mode
Iq,ON ––10mAVEN = 5.0V;
Ipeak = 700mA
VREC = 16V
P_6.2.3
EN
Turn On Threshold
VEN,ON 2.8 – – V – P_6.2.4
EN
Turn Off Threshold
VEN,OFF ––0.8V P_6.2.5
EN
high input current
IEN,hi – 100 – µA VEN = 5V P_6.2.6
EN
low input current
IEN,lo 0–20µAVEN = 0.5V P_6.2.7
PWMI
Turn On Threshold
VPWMI,ON –1–Vsee Figure 6-1 P_6.2.8
PWMI
Turn Off Threshold
VPWMI,OFF –2–Vsee Figure 6-1 P_6.2.9
PWMI
source current
IPWMI – 250 – µA Rset = 10kΩ
VPWMI = 0.5V; P_6.2.10
Over temperature
shutdown
Tj,sd 150 175 – °C 1)
1) Specified by design. Not subject to production test.
P_6.2.11
Over temperature
shutdown hysteresis
Tj,sd_hyst –15–K
1) P_6.2.12
Data Sheet 15 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Enable, Dimming Function and Thermal Protection
6.2.1 PWM Dimming with µC connected to TLD5045EJ PWMI pin
The PWMI pin c an be us ed for PWM dim ming. It is a commo nly prac ticed dim ming me thod to pr event co lor shift
in LED light applications.
Figure 6-2 Timing Diagram for LED Dimming with µC
VPWMI
V
PWMI,OFF
Ipeak
V
PWMI,ON
t
t
T
PWMI
t
OFF
SW - ONSW - OFF SW - OFF SW - ON SW - OFF
Data Sheet 16 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Enable, Dimming Function and Thermal Protection
6.2.2 Internal PWM dimming Function
The TLD5045EJ has an integrated PWM dimming engine. Via an external RPWM and CPWM network it is possible
to achieve a PWM LED current waveform. The duty cycle and dimming frequ ency is depe nding on the size of the
external components (see formula in Figure 6-4). This feature is specially designed to achieve a stand alone
PWM dimming function without the usage of micro controllers or external logic. This allows a flexible and cost
effective usage of the device in a decentralized light module application (refer to application drawing ).
The advantage of a PWM dimming (to reduce the LED load current) is the change of light intensity only, at constant
light color.
With an external RC network a PWM programming between 100Hz and 1200Hz and Duty Cycles between 4%
and max. 20%. is possible. Figure 6-3 displays the external components corresponding to the desired PWM
frequency and duty cycle.
The following setup applies for the table displayed in Figure 6-3: VREC=12V, VLED=7.2V, LSW=220µH, RSET=14kΩ.
Figure 6-3 RPWMI and CPWMI versus fPWMI and DC
R
PWMI
C
PWMI
f
PWMI
DC
216kΩ64nF 100Hz 4%
216kΩ32nF 200Hz 4%
216kΩ21nF 300Hz 4%
216kΩ16nF 400Hz 4%
87kΩ150nF 100Hz 10%
87kΩ75nF 200Hz 10%
87kΩ50nF 300Hz 10%
87kΩ37nF 400Hz 10%
44kΩ265nF 100Hz 20%
44kΩ132nF 200Hz 20%
44kΩ88nF 300Hz 20%
44kΩ
66nF 400Hz 20%
Data Sheet 17 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Enable, Dimming Function and Thermal Protection
6.3 Overtemperature Protection of the Device
A temperature sensor at the power stage causes the overheated device to switch OFF to prevent destruction.
During over temperature condition the internal ST transistor is switched OFF. Due to the autorestart function of
the device the status signal will toggle accordingly. The timing of this pattern is dependant on the thermal capability
of the application and can be used to distinguish between open load error and overtemperature condition. More
details on the overtemperature behavior is displayed in Figure 6-4 below.
Figure 6-4 RPWMI and CPWMI versus fPWMI and DC
VSW
t
ILED
t
ΔΤ
VEN
t
H
L
Tj
t
Ta
TjSD
TjSO
Ipeak
ST
t
ST pull-down transistor ON
ST pull-
down OFF ST
OFF ST
ON ST
OFF ST
ON ST
OFF ST
ON ST
OFF
Data Sheet 18 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Open Load Diagnosis
7Open Load Diagnosis
7.1 Description
The TLD5045EJ has an integrated open load during ON diagnosis. During normal operation the ST pin (open
collector output) is pulled to GND (internal transistor is ON). The open load d etection is realized by monitor ing the
switching behavior at the SW pin. During an open load event the integrated power stage at the SW pin will be
statically turned ON. If the output stage is turned ON for more than the open load diagnosis delay time (tOL) an
open load condition is detected. An open load event will switch OFF the internal transistor. If a µC is connected to
the ST pin an external pull up resistor should be placed to achieve a logic HIGH level for the proper open load
error signalling reporting. For a timing diagram on the functionality of the open load diagnosis please refer to
Figure 7-1 and Figure 7-2.
7.2 Electrical Characteristics: Open Load Diagnosis
VREC = 4.5 V to 18 V, Tj = -40°C to +150°C, all voltages with respect to ground (unless otherwise specified)
Table 7-1 Functional Range
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Voltages
Open Load diagnosis
DelayTime
tOL 20 – – µs P_7.2.1
Open Load diagnosis
current
IOL –50–mA P_7.2.2
Voltage Drop over
internal ST transistor
VDrop,ST –0.3–VIST=150mA P_7.2.3
Data Sheet 19 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Open Load Diagnosis
7.3 Open Load Diagnosis in different Application Conditions
7.3.1 Light module application without µC
Most of the time, the open load diagnosis of the whole light module is done via the current sense of the driver IC
(e.g. PROFET) located in the light control module (or BC M module). See Figure 8-6 for a simplified application
schematic. The light module needs to sink a specified minimum current (e.g. 100mA) to indicate normal operation.
To guarantee this minimum current also under light load conditions (e.g. high efficiency LED bin at high supply
voltages = min. load curre nt requ ired) system d esigners often ha ve to place resistors in parallel to the application
circuit (see Resistors connected to supply lines in Figure 8-6). When using such resistors co nnected be tween V S
and GND, an open LED diagnosis is not possible anymore. To overcome this issue an internal transistor (open
collector) is connected to the ST pin of the TLD5045EJ. During normal operation the ST pin is LOW and a minimum
module current can be guaranteed.
As soon as an open load occurs the internal ST transistor switches off. Due to this, the current on the VREC pin
decreases below the open load detection threshold of the driver IC located in the light control module.
Note: Open Load is only detected during the ON cycle of the switching transistor. During the OFF state the ST
signal displays what was detected in the previous ON state.
Figure 7-1 Open Load Diagnosis using Internal PWM Mode
t
OL
V
PWMI
Open Load
Event
ST
t
t
t
t
Open Load
V
SW
ST pull-down transistor OFF
ST pull-down transistor ON
V
PWMI,OFF
V
PWMI,O N
Hig h - z
Data Sheet 20 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Open Load Diagnosis
7.4 Application with µC connected to TLD5045EJ IC
The ST pin can be connected directly to a µC input. During an open load condition the ST transistor is OFF. An
external pull up resistor connected to VDD is required to signal a logic high signal on the ST pin during an open
load error. Please consider that this diagnosis functionality is only active if the device is in active mode (HIGH
potential at the EN pin).
Refer to application drawing Figure 8-5.
Figure 7-2 Open Load diagnosis via µC connected to ST pin
Open Load
Event
V
SW
ST t
OL
Open Load
t
t
t
t
T
PWMI
V
EN
t
High
Low
SW - ON
SW - OFF SW - OFF
SW - ON
SW - OFF
V
PWMI,OFF
V
PWMI,ON
ST pull-down transistor ON
ST pull - down tr ansist or O FF
V
PWMI
High - z
Data Sheet 21 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Application Information
8Application Information
Note: The followin g information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
8.1 Output Peak current Adjustment via RSET
The external resistor RSET is used to adjust the peak current of the regulator. Maximum achievable peak current
is 700mA and minimum achievable peak current is 100mA. The SET pin provides an internally fixed voltage leve l
at typ.: 1.225V. Out of this considerations the equatio n is:
(8.1)
The factor 5710 is derived from following considerations:
• Ipeak, max = 700mA (RSET = 10kΩ)
• Ipeak,min = 100mA (RSET = 70kΩ)
Internal comparator voltage at SET pin = 1.225V.
The circuitry behind the SET pin is adjusting higher peak currents with lower RSET values.
The RSET value should be in the range from 10kΩ to 70kΩ to achieve the requested peak current range.
The following setup applies for the table displayed in Figure 8-1: VREC=12V, VLED=7.2V, LSW=220µH.
Figure 8-1 RSET Resistor Selection
5710
225.1 ⋅
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛
=
SET
RV
Ipeak
I
PEAK
[mA] R
SET
[kΩ]
100
200
300
400
500
600
700
70
35
23
18
14
12
10
Data Sheet 22 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Application Information
8.2 Switching Frequency Determination
With the external RFREQ, CFREQ and RCOMP network, it is possible to adjust the switching frequency of the regulator.
To ensure a stable frequency over a broad range of input voltage VREC an external resistor RCOMP can be used.
The following setup applies for the table displayed in Figure 8-3: VREC=12V, VLED=7.2V, LSW=220µH, RSET=14kΩ.
Figure 8-2 Setting tOFF Time of Regulator with External RFREQ, CFREQ Network
Figure 8-3 RFREQ, CFREQ versus fSW Table
7
GND
6
FREQ
TLD5045
R
FREQ
C
FREQ
1
VREC R
COMP
R
comp
R
freq
C
freq
f
sw
t
off
255.8kΩ17.1kΩ220pF 50kHz 6.47μs
115.8kΩ7.7kΩ220pF 100kHz 3.19μs
69.7kΩ4.6kΩ220pF 150kHz 2.12μs
46.8kΩ3.1kΩ220pF 200kHz 1.59μs
72.8kΩ4.9kΩ100pF 250kHz 1.27μs
52.7kΩ3.5kΩ
100pF 300kHz
1.06μs
Data Sheet 23 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Application Information
Figure 8-4 Theoretical Operating Waveforms
V
EN
t
down
t
t
t
t
High
Low
V
FREQ
I
LED
V
SW
V
FREQ,high
V
FREQ,low
I
set
=I
peak
V
REC
+V
fw
V
drop
Transistor Diode TDiode TDiode TDiode TDiode
t
up
t
on
t
off
I
min
I
ripple
Data Sheet 24 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Application Information
8.3 TLD5045EJ in different LED Applications
8.3.1 TLD5045EJ in a Body Control Module (BCM) with µC Interface
Figure 8-5 provides a simplified application with two high brightness LEDs in series. A µC is controlling the EN
pin to put the device into sleep/active mode. Also the PWMI pin can be directly controlled via a µC port if PWM
dimming of the LED current is required. The open load ST pin monitors the load condition of the application
and gives feedback to the µC. An external pull up resistor is recommended to achieve a logic HIGH signal
during an open load error (internal status transistor is switched OFF and the ST pin is high ohmic an external
pull up resistor ensures a logic HIGH signal).
The external low powe r resistor RSET is used to set the required peak current for the LED load (refer to Figure 8-1
for more details).
To set the desired switching frequency of the buck regulator the external RFREQ and CFREQ network must be
connected to GND (reference values are given in Figure 8-3).
Figure 8-5 Simplified Application Diagram TLD5045EJ
Note: This is a very simpli fied example of an application circuit. The function must be verified in the real
application
SW
GND
FREQ
PWMI
ST
EN
VREC
5
6
7
81
4
3
2
TLD5045
LSW
CFREQ
RFREQ
RSET
CREC
Vs = 5V t o 40V
PWM dimm ing via µC
open load stat us
connect ed t o µ C
ILED
SET
c onn ect t o µC pi n
VDD
RCOMP
VREC
REMC
RST
Data Sheet 25 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Application Information
8.3.2 Decentralized Light Module Application - DLM (Input configuration 1)
The connection between the Body Co ntrol Module (BCM) and the Decentralized Light Module is realized via one
supply line and one GND connection.
The supply line could change between two different operation modes:
1. Light Function 1 - Daytime Running Light (DRL) mode: If the supply line is permanently ON, the DRL
application which requires higher LED current (e.g. 400mA) is active. The proper RSET resistor should be
placed to achieve the desired load current (e.g 18kΩ).
2. Light Function 2 - Position Light (PL) mode: During a PWM signal (e.g. 200Hz) on the supply line the mean
LED current is reduced to a lower level (e.g. 50mA) and the application is entering into PL mode. The enable
pin of the TLD5045EJ is a high voltage pin (max. 45V) and can be directly connected via a resistor REN
before the reverse polarity protection diode of the module to achieve a fast capture of the PWM signal. The
PWMI pin is connected to GND (inverse logic = ON).
To simulate a module current during light load conditions, the ST pin can be connected via a resistor to the
supply voltage line. (refer to Chapter 7 for a detailed description of the ST behavior)
For a decentralized solution without micro controller involvement the possibility to connect a PTC resistor at
the SET pin is a cost effective solution to protect the LED load from thermal destruction.
Figure 8-6 Application Diagram of Decentralized Light Module without µC (input config 1)
Note: This is a very simpli fied example of an application circuit. The function must be verified in the real
application
SW
GND
FREQ
SET
ST
PWMI
VREC
4
6
7
81
3
5
2
TLD5045
C
FREQ
R
FREQ
R
SET
I
ST,PD
Vbat
BCM - module
Wire Harness
Inductance
Light F unc ti on 1
(e.g. DRL)
GND
I
Open_load
I
LED
Decentralized Light Module
EN
C
REC
R
PTC
R
COMP
V
REC
L
SW
R
EN
Data Sheet 26 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Application Information
8.3.3 Decentralized Light Module Application - DLM (Input configuration 2)
In this particular input configuration two supply lines are tied together on the DLM. The following input states
must be considered to distinguish between Light Function 1 (DRL mode) and Light Function 2 (PL mode).
1. 1) Condition: DRL = ON, PL = OFF. Desired function: DRL mode (e.g. 400mA LED load current)
2. 2) Condition: DRL = OFF, PL = ON. Desired function: PL mode (e.g. 50mA LED load current)
3. 3) Condition: DRL = ON, PL =ON. Desired function: PL mode (e.g. 50mA LED load current)
To achieve a lower mean LED load current during the PL mode the integrated PWM engine is a useful feature.
The external RPWM and CPWM circuit predefines a dedicated PWM frequency and duty cycle. (for details refer
to Figure 8-2)
To simulate a module current during light load conditions the ST pin can be connected via resistors to both
supply voltage lines. (refer to Chapter 7 for a detailed description of the ST behavior)
For a decentralized solution without micro controller involvement the possibility to connect a PTC resistor at
the SET pin is a cost effective solution to protect the LED load from thermal destruction.
Figure 8-7 Application Diagram of Decentralized Light Module without µC (input config 2)
Note: This is a very simpli fied example of an application circuit. The function must be verified in the real
application
SW
GND
FREQ
SET
ST
PWMI
VREC
4
6
7
81
3
5
2
TLD5045
CFREQ
RFREQ
RSET
IST,PD
Vbat
Vbat
BCM - module
Wire Harness
Inductance
Light Function 1
(e .g . DRL)
Light Function 2
(e.g. P L)
GND
RPWM
CPWM
IOpen_load
ILED
Decentralized Light Module
EN
CREC
RPTC
RCOMP
VREC
LSW
REN
TDIM1
TDIM2
R
DIM1
Data Sheet 27 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Application Information
8.3.4 Decentralized Light Module Application - DLM (Input configuration 3)
A permanent supply chooses the Light Function 1 (DRL mode) and a second dedicated PWM supply between
100Hz and 200Hz switches to Light Function 2 (PL mode). For this input configuration it is possible to connect
the PWM dimming output of the BCM directly to the PWMI input of the TLD5045EJ. To simulate a module
current during light load conditions the ST pin can be connected via a resistor to the permanent supply
voltage line. (refer to Chapter 7 for a detailed description of the ST behavior)
For a decentralized solution without micro controller involvement the possibility to connect a PTC resistor at
the SET pin is a cost effective solution to protect the LED load from thermal destruction. (for details refer to
Figure 8-6)
Figure 8-8 Application Diagram of Decentralized Light Module without µC (input config 3)
Note: This is a very simpli fied example of an application circuit. The function must be verified in the real
application
SW
GND
FREQ
SET
ST
PWMI
VREC
4
6
7
81
3
5
2
TLD5045
L
SW
C
FREQ
R
FREQ
R
SET
I
ST,PD
Vbat
BCM - module
Wire Harness
Inductance
GND
I
Open_load
I
LED
Decentralized Light Module
EN
C
REC
R
PTC
Vbat
Light Fun ct ion 1
( e .g . D RL)
Light Fu nction 2
(e .g . P L )
R
COMP
V
REC
R
EMC
R
EN
R
LIM
D
LIM
Data Sheet 28 Revision 1.0
2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Package Outlines
9 Package Outlines
Figure 9-1 Outline PG-DSO-8 EP
Green Product (RoHS Compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
PG-DSO-8-27-PO V01
14
85
8
14
5
8x
0.41±0.09 2)
M
0.2 DC A-B
1.27 C
Stand Off
+0
-0.1
0.1
(1.45)
1.7 MAX.
0.08
Seating Plane
C
A
B
4.9±0.11) A-BC0.1 2x
3) JEDEC reference MS-012 variation BA
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width
Bottom View
±0.2
3
±0.2
2.65
0.2
±0.2
D6MD 8x
0.64
±0.25
3.9±0.11)
0.1
0.35 x 45˚
CD2x
+0.06
0.19
8
˚
MAX.
Index Marking
Data Sheet 29 Revision 1.0 2015-05-28
Infineon® LITIX™ Power
TLD5045EJ
Revision History
Revision 1.0, 2015-05-28
Page or Item Subjects (major changes since previous revision) Responsible Date
Rev1.0 Initial Data Sheet for TLD5045EJ 2011-05-27
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBLADE™, EasyPIM™,
EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, Infineon™, ISOFACE™, IsoPACK™, i-
Wafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™,
PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited,
UK. ANSI™ of American National Standards Institute. AUTOSAR™ of AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT
Forum. CIPURSE™ of OSPT Alliance. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. HYPERTERMINAL™ of Hilgraeve Incorporated. MCS™ of Intel Corp. IEC™ of Commission Electrotechnique Internationale.
IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of
Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc.,
USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies,
Inc. Openwave™ of Openwave Systems Inc. RED HAT™ of Red Hat, Inc. RFMD™ of RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of
Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA,
Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design
Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Trademarks Update 2014-11-12
Edition 2015-05-28
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG.
All Rights Reserved.
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conditions or characteristics. With respect to any
examples or hints given herein, any typical
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regarding the application of the device, Infineon
Technologies hereby disclaims any and all
warranties and liabilities of any kind, including
without limitation, warranties of non-
infringement of intellectual property rights of
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