IN to GND .............................................................. -0.3V to +45V
CS+, CS-, V5 to GND .............................................-0.3V to +6V
DIM, EN to GND .........................................-0.3V to (VIN + 0.3V)
OUT Short Circuited to GND Duration
(at VIN = +16V) ...................................................... 60 minutes
Maximum Current into Any Pin (except IN and OUT) ...... ±20mA
Continuous Power Dissipation (TA = +70°C)
6-Pin, 3mm x 3mm TDFN
derate 18.2mW/°C above +70°C) ........................... 1454.5mW
8-Pin SO (derate 23.3mW/°C above +70°C) .......... 1860.5mW
Operating Temperature Range ......................... -40°C to +125°C
Junction Temperature ...................................................... +150°C
Junction-to-Case Thermal Resistance (θJC) (Note 1)
6-Pin, 3mm x 3mm TDFN ..............................................9°C/W
8-Pin SO ........................................................................7°C/W
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)
6-Pin, 3mm x 3mm TDFN ............................................42°C/W
8-Pin SO ......................................................................43°C/W
Storage Temperature Range ............................ -60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
(VIN = 12V, VEN = 12V (SO only), CV5 = 0.1µF to GND, IV5 = 0, VDIM = 4V, VCS- = 0V (SO only), connect RSENSE = 2Ω (MAX16815)
and RSENSE = 1Ω (MAX16828) between CS+ and GND. TA = -40°C to +125°C, unless otherwise noted. Typical values are at
TA = +25°C.) (Note 2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range VIN (Note 3) 6.5 40.0 V
Ground Current IG
ILOAD = 100mA 0.82 2 mA
ILOAD = 200mA 1 2
Shutdown Supply Current ISHDN VEN ≤ 0.6V (SO only) 35 70 µA
Guaranteed Output Current IOUT
RSENSE = 2_ (MAX16815) 100 mA
RSENSE = 1_ (MAX16828) 200
Output Current Accuracy 35mA < IOUT < 100mA (MAX16815) ±3.5 %
35mA < IOUT < 200mA (MAX16828) ±3.5
Dropout Voltage DVDO
IOUT = 100mA (current pulsed),
12V < VIN < 40V (MAX16815) (Note 4) 0.1 0.4
V
IOUT = 100mA (current pulsed),
6.5V < VIN < 12V (MAX16815) (Note 4) 0.1 0.6
IOUT = 200mA (current pulsed),
12V < VIN < 40V (MAX16828) (Note 5) 0.27 0.55
IOUT = 200mA (current pulsed),
6.5V < VIN < 12V (MAX16828) (Note 5) 0.27 0.7
Output Current Slew Rate Current rising 9.7 mA/µs
Current falling 9.7
Short-Circuit Current VOUT = 0V, VIN = 12V, MAX16815 130 200 270 mA
VOUT = 0V, VIN = 12V, MAX16828 250 300 350
EN INPUT (SO ONLY)
EN Input Current IEN -2.5 -1 -0.2 µA
EN Input Voltage High VIH 2.8 V
EN Input Voltage Low VIL 0.6 V
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MAX16815/MAX16828 High-Voltage, 100mA/200mA Adjustable Linear
High-Brightness LED Drivers with PWM Dimming
Electrical Characteristics
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Absolute Maximum Ratings