Publication Release Date: September 2003
- 1 - Revision 1
ISD4002 SERIES
SINGLE-CHIP, MULTIPLE-MESSAGES
VOICE RECORD/PLAYBACK DEVICES
120-, 150-, 180-, AND 240-SECOND DURATION
ISD4002 SERIES
- 2 -
1. GENERAL DESCRIPTION
The ISD4002 ChipCorder® series provides high-quality, 3-volt, single-chip record/playback solutions
for 2- to 4-minute messaging applications ideally for cellular phones and other portable products. The
CMOS-based devices include an on-chip oscillator, anti-aliasing filter, smoothing filter, AutoMute®
feature, audio amplifier, and high density multilevel Flash memory array. The ISD4002 series is
designed to be used in a microprocessor- or microcontroller-based system. Address and control are
accomplished through a Serial Peripheral Interface (SPI) or Microwire Serial Interface to minimize pin
count.
Recordings are stored into the on-chip Flash memory cells, providing zero-power message storage.
This unique single-chip solution utilizes Winbond’s patented multilevel storage technology. Voice and
audio signals are directly stored onto memory array in their natural form, providing high-quality voice
reproduction.
ISD4002 SERIES
Publication Release Date: September 2003
- 3 - Revision 1
2. FEATURES
• Single-chip voice record/playback solution
• Single 3 volt supply
• Low-power consumption
Operating current:
- ICC_Play = 15 mA (typical)
- ICC_Rec = 25 mA (typical)
Standby current:
- ICC_Standby = 1 µA (typical)
• Single-chip durations of 120, 150, 180, and 240 seconds
• High-quality, natural voice/audio reproduction
• AutoMute feature provides background noise attenuation
• No algorithm development required
• Micorcontroller SPI or Microwire™ Serial Interface
• Fully addressable to handle multiple messages
• Non-volatile message storage
• 100K record cycles (typical)
• 100-year message retention (typical)
• On-chip clock source
• Power consumption controlled by SPI or Microwire control register
• Available in die form, PDIP, SOIC, and TSOP
• Temperature:
- Commercial (die): 0°C to +50°C
- Commercial (packaged units): 0°C to +70°C
- Extended: -20°C to +70°C
- Industrial: -40°C to +85°C
ISD4002 SERIES
- 4 -
3. BLOCK DIAGRAM
Internal Clock Timing
Sampling Clock
960K Cell
Nonvolatile
Multilevel Storage
Array
Analog Transceivers
Decoders
Power Conditioning
5-Pole Active
Antialiasing Filter
5-Pole Active
Smoothing Filter
Amp AUDOUT
VCCA VSSA VSSA VSSA
XCLK
Amp
ANA IN-
ANA IN+
AUX IN
Device Control
SCLK SS MOSI MISO INT RAC
AutoMuteTM
Feature
VSSD VCCD
ISD4002 SERIES
Publication Release Date: September 2003
- 5 - Revision 1
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 3
3. BLOCK DIAGRAM .............................................................................................................................. 4
4. TABLE OF CONTENTS ...................................................................................................................... 5
5. PIN CONFIGURATION ....................................................................................................................... 6
6. PIN DESCRIPTION............................................................................................................................. 7
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 12
7.1. Detailed Description.................................................................................................................... 12
7.2. Serial Peripheral Interface (SPI) Description..............................................................................13
7.2.1. OPCODES ........................................................................................................................... 14
7.2.2. SPI Diagrams ....................................................................................................................... 15
7.2.3. SPI Control and Output Registers........................................................................................ 16
8. TIMING DIAGRAMS.......................................................................................................................... 18
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20
9.1. Operating Conditions .................................................................................................................. 21
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 22
10.1. Parameters For Packaged Parts ........................................................................................ 22
10.2. Parameters For Die .............................................................................................................. 25
10.3. SPI AC Parameters .............................................................................................................. 26
11. TYPICAL APPLICATION CIRCUIT.................................................................................................27
12. PACKAGING AND DIE INFORMATION ......................................................................................... 30
12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 30
12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................... 31
12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1................................ 32
12.4. Die Information ......................................................................................................................... 33
13. ORDERING INFORMATION........................................................................................................... 35
14. VERSION HISTORY ....................................................................................................................... 36
ISD4002 SERIES
- 6 -
5. PIN CONFIGURATION
ISD4002
NC
NC
VCCA
ANA IN+
ANA IN-
NC
AM CAP
NC
AUD OUT
VSSA
VSSA
NC
NC
NC
VSSA
RAC
NC
NC
INT
XCLK
VCCD
SCLK
SS
MOSI
MISO
VSSD
NC
NC
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TSOP
SOIC / PDIP
SS
MOSI
MISO
VSSD
NC
NC
NC
NC
NC
NC
VSSA
VSSA
AUD OUT
AM CAP
VCCD
XCLK
INT
RAC
VSSA
NC
NC
NC
NC
VCCA
ANA IN+
ANA IN-
NC
SCLK
ISD4002
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
ISD4002 SERIES
Publication Release Date: September 2003
- 7 - Revision 1
6. PIN DESCRIPTION
PIN NO. PIN NAME
SOIC /
PDIP
TSOP
FUNCTION
SS 1 9
Slave Select: This input, when LOW, will select the
ISD4002 device.
MOSI 2 10
Master Out Slave IN: This is the serial input to the
ISD4002 device when it is configured as slave. The master
microcontroller places data on the MOSI line one half-cycle
before the rising edge of SCLK for clocking into the device.
MISO 3 11
Master In Slave Out: This is the serial output (open drain)
of the ISD4002 device. This output goes into a high-
impedance state if the device is not selected.
VSSA / VSSD 11, 12,
23 / 4
1, 17, 18 /
12
Ground: The ISD4002 series utilizes separate analog and
digital ground busses. The analog ground (VSSA) pins
should be tied together as close as possible and connected
through a low-impedance path to power supply ground.
The digital ground (VSSD) pin should be connected through
a separate low-impedance path to power supply ground.
These ground paths should be large enough to ensure that
the impedance between the VSSA pins and the VSSD pin is
less than 3 Ω. The backside of the die is connected to VSS
through the substrate. For chip-on-board design, the die
attach area must be connected to VSS or left floating.
NC 5-10, 15,
19-22
3, 4, 13-
16, 19, 21,
23, 27, 28
Not connected
AUD OUT [1] 13 20 Audio Output: This pin provides an audio output of the
stored data and is recommended be AC coupled. It is
capable of driving a 5 KΩ impedance REXT.
[1] The AUD OUT pin is always at 1.2 volts when the device is powered up. When in playback, the output buffer
connected to this pin can drive a load as small as 5 KΩ. When in record, a resistor connects AUD OUT to the
internal 1.2-volt analog ground supply. This resistor is approximately 850 KΩ, but will vary somewhat according to
the sample rate of the device. This relatively high impedance allows this pin to be connected to an audio bus
without loading it down.
ISD4002 SERIES
- 8 -
PIN NO. PIN NAME
SOIC /
PDIP
TSOP
FUNCTION
AM CAP 14 22 AutoMute™ Feature: The AutoMute feature only applies
for playback operation and helps to minimize noise (with 6
dB of attenuation) when there is no signal (i.e. during
periods of silence). A 1 µF capacitor to ground is
recommended to connect to the AM CAP pin.
This capacitor becomes a part of an internal peak detector
which senses the signal amplitude. This peak level is
compared to an internally set threshold to determine the
AutoMute trip point. For large signals, the AutoMute
attenuation is set to 0 dB automatically but 6 dB of
attenuation occurs for silence. The 1 µF capacitor also
affects the rate at which the AutoMute feature changes with
the signal amplitude (or the attack time).
The AutoMute feature can be disabled by connecting the
AM CAP pin directly to VCCA..
ANA IN- 16 24 Inverting Analog Input: This pin transfers the signal into
the device during recording via differential-input mode.
In this differential-input mode, a 16 mVp-p maximum input
signal should be capacitively coupled to ANA IN- for
optimal signal quality, as shown in Figure 1: ANA IN
Modes. This capacitor value should be equal to that used
on ANA IN+ pin. The input impedance at ANA IN- is
normally 56 KΩ.
In the single-ended mode, ANA IN- should be capacitively
coupled to VSSA through a capacitor equal to that used on
the ANA IN+ pin.
ANA IN+ 17 25 Non-Inverting Analog Input: This pin is the non-inverting
analog input that transfers the signal to the device for
recording. The analog input amplifier can be driven single
ended or differentially.
In the single-ended input mode, a 32 mVp-p (peak-to-peak)
maximum signal should be capacitively connected to this
pin for optimal signal quality. The external capacitor
associated with ANA IN+ together with the 3 KΩ input
impedance are selected to give cutoff a the low frequency
end of the voice passband.
In the differential-input mode, the maximum input signal at
ANA IN+ should be 16 mVp-p capacitively coupled for
optimal signal quality. The circuit connections for the two
modes are shown in Figure 1.
ISD4002 SERIES
Publication Release Date: September 2003
- 9 - Revision 1
PIN NO. PIN NAME
SOIC /
PDIP
TSOP
FUNCTION
VCCA / VCCD 18 / 27 26 / 7 Supply Voltage: To minimize noises, the analog and digital
circuits in the ISD4002 devices use separate power
busses. These +3V busses are brought out to separate
pins and should be tied together as close to the supply as
possible. In addition, these supplies should be decoupled
as close to the package as possible.
RAC 24 2
Row Address Clock: This is an open drain output that
provides the signal of a ROW with a 200 ms period for 8
KHz sampling frequency. (This represents a single row of
memory) This signal stays HIGH for 175 ms and stays
LOW for 25 ms when it reaches the end of a row.
The RAC pin stays HIGH for 109.37 µsec and stays LOW
for 15.63 µsec in Message Cueing mode (see Message
Cueing section for detailed description). Refer to the AC
Parameters table for RAC timing information at other
sample rates.
When a record command is first initiated, the RAC pin
remains HIGH for an extra TRACL period. This is due to the
need of loading the internal sample and hold circuits in the
device. This pin can be used for message management
techniques.
A pull-up resistor is required to connect to other device.
INT 25 5
Interrupt: This is an open drain output pin. This pin goes
LOW and stays LOW when an Overflow (OVF) or End of
Message (EOM) marker is detected. Each operation that
ends with an EOM or OVF will generate an interrupt. The
interrupt will be cleared the next time an SPI cycle is
initiated. The interrupt status can also be read by an RINT
instruction.
A pull-up resistor is required to connect to other device.
Overflow Flag (OVF) – The Overflow flag indicates that the
end of memory has been reached during a record or
playback operation.
End of Message (EOM) – The End of Message flag is set
only during playback operation when an EOM is found.
There are eight EOM flag position options per row.
ISD4002 SERIES
- 10 -
PIN NO. PIN NAME
SOIC /
PDIP
TSOP
FUNCTION
XCLK 26 6
External Clock Input: The pin has an internal pull-down
device. The ISD4002 series is configured at the factory with
an internal sampling clock frequency centered to ±1
percent of specification. The frequency is then maintained
to a variation of ±2.25 percent over the entire commercial
temperature and operating voltage ranges. The internal
clock has a –6/+4 percent tolerance over the extended
temperature, industrial temperature and voltage ranges. A
regulated power supply is recommended for industrial
temperature range parts. If greater precision is required,
the device can be clocked through the XCLK pin as follows:
Part Number Sample Rate Required Clock
ISD4002-120 8.0 kHz 1024 kHz
ISD4002-150 6.4 kHz 819.2 kHz
ISD4002-180 5.3 kHz 682.7 kHz
ISD4002-240 4.0 kHz 512 kHz
These recommended clock rates should not be varied
because the anti-aliasing and smoothing filters are fixed.
Otherwise, aliasing problems can occur if the sample rate
differs from the one recommended. The duty cycle on the
input clock is not critical, as the clock is immediately
divided by two. If the XCLK is not used, this input must
be connected to ground.
SCLK 28 8
Serial Clock: This is the input clock to the ISD4002 device.
It is generated by the master device (typically
microcontoller) and is used to synchronize the data transfer
in and out of the device through the MOSI and MISO lines,
respectively. Data is latched into the ISD4002 on the rising
edge of SCLK and shifted out of the device on the falling
edge of SCLK.
ISD4002 SERIES
Publication Release Date: September 2003
- 11 - Revision 1
32m Vp-pSignal
0.1 F
µ
0.1 F
µ
ANA IN+
ANA IN-
3K
Ω
3K
Ω
53K
Ω
53K
Ω
1.2V
To Filter
Internal to the device
-
+
Single-Ended Input Mode
16m Vp-pInput Signal
0.1 F
µ
0.1 F
µ
ANA IN+
ANA IN-
3K
Ω
3K
Ω
53K
Ω
53K
Ω
1.2V
To Filter
Internal to the device
-
+
Differential Input Mode
16m Vp-p
180°
Input Signal
FIGURE 1: ISD4002 SERIES ANA IN MODES
RAC
TRAC
(200 ms)
25 ms
TRACL
FIGURE 2: RAC TIMING WAVEFORM DURING NORMAL OPERATION
(example of 8KHz sampling rate)
ISD4002 SERIES
- 12 -
7. FUNCTIONAL DESCRIPTION
7.1. DETAILED DESCRIPTION
Audio Quality
The Winbond’s ISD4002 ChipCorder® series is offered at 8.0, 6.4, 5.3 and 4.0 kHz sampling
frequencies, allowing the user a choice of speech quality options. Increasing the sampling frequency
will produce better sound quality, but affects duration. Please refer to Table 1: Product Summary for
details.
Analog speech samples are stored directly into on-chip non-volatile memory without the digitization
and compression associated with other solutions. Direct analog storage provides higher quality
reproduction of voice, music, tones, and sound effects than other solid-state solutions.
Duration
The ISD4002 Series is a single-chip solution with 120, 150, 180, and 240 seconds duration.
TABLE 1: PRODUCT SUMMARY OF ISD4002 SERIES
Part Number Duration
(Seconds)
Sample Rate
(kHz)
Typical Filter Pass
Band (kHz) *
ISD4002-120 120 8.0 3.4
ISD4002-150 150 6.4 2.7
ISD4002-180 180 5.3 2.3
ISD4002-240 240 4.0 1.7
* This is the –3dB point. This parameter is not checked during production testing and may vary due to process
variations and other factors. Therefore, the customer should not rely upon this value for testing purposes.
Flash Storage
The ISD4002 series utilizes on-chip Flash memory, providing zero-power message storage. The
message is retained for up to 100 years typically without power. In addition, the device can be re-
recorded typically over 100,000 times.
Memory Architecture
The ISD4002 series contains a total of 960K Flash memory cells, which is organized as 600 rows of
1,600 cells each.
ISD4002 SERIES
Publication Release Date: September 2003
- 13 - Revision 1
Microcontroller Interface
A four-wire (SCLK, MOSI, MISO & SS ) SPI interface is provided for controlling and addressing
functions. The ISD4002 is configured to operate as a peripheral slave device, with a microcontroller-
based SPI bus interface. Read and write operations are controlled through this SPI interface. An
interrupt signal (INT ) and internal read only Status Register are provided for handshake purposes.
Programming
The ISD4002 series is also ideal for playback-only applications, where single- or multiple-messages
playback is controlled through the SPI port. Once the desired message configuration is created,
duplicates can easily be generated via a programmer.
7.2. SERIAL PERIPHERAL INTERFACE (SPI) DESCRIPTION
The ISD4002 series operates via SPI serial interface with the following protocol.
First, the data transfer protocol assumes that the microcontroller’s SPI shift registers are clocked on
the falling edge of the SCLK. However, for the ISD4002, the protocols are as follows:
1. All serial data transfers begin with the falling edge of SS pin.
2. SS is held LOW during all serial communications and held HIGH between instructions.
3. Data is clocked in on the rising edge of the SCLK signal and clocked out on the falling edge of
the SCLK signal, with LSB first.
4. Playback and record operations are initiated when the device is enabled by asserting the SS
pin LOW, shifting in an opcode and an address data to the ISD4002 device (refer to the
Opcode Summary in the following page).
5. The opcodes contain <11 address bits> and <5 control bits>.
6. Each operation that ends with an EOM or Overflow will generate an interrupt. The Interrupt
will be cleared the next time a SPI cycle is initiated.
7. As Interrupt data is shifted out of the MISO pin, control and address data are simultaneously
shifted into the MOSI pin. Care should be taken such that the data shifted in is compatible
with current system operation. Because it is possible to read an interrupt data and start a new
operation within the same SPI cycle.
8. An operation begins with the RUN bit set and ends with the RUN bit reset.
9. All operations begin after the rising edge of SS .
ISD4002 SERIES
- 14 -
7.2.1. OPCODES
The available Opcodes are summarized as follows:
TABLE 2: OPCODE SUMMARY
OpCodes
Instructions Address (11 bits)
<A0 – A9, 0>
Control bits (5 bits)
C0 C1 C2 C3 C4
Descriptions
POWERUP <XXXXXXXXXXX> 0 0 1 0 0 Power-Up: Device will be ready for an operation after
TPUD.
SETPLAY <A0 – A9, 0> 0 0 1 1 1 Initiates playback from address <A0-A9>.
PLAY 0 1 1 1 1 Playback from the current address (until EOM or OVF).
SETREC <A0 – A9, 0> 0 0 1 0 1 Initiates a record operation from address <A0-A9>.
REC 0 1 1 0 1 Records from current address until OVF is reached or
Stop command is sent.
SETMC <A0 – A9, 0> 1 0 1 1 1 Initiates Message Cueing (MC) from address <A0-A9>.
MC [2] 1 1 1 1 1 Performs a Message Cueing from current location.
Proceeds to the end of message (EOM) or enters OVF
condition if no more messages are present.
STOP <XXXXXXXXXXX> 0 1 1 X 0 Stops the current operation.
STOPPWRDN <XXXXXXXXXXX> X 1 0 X 0 Stops the current operation and enters into standby
(power-down) mode.
RINT [3] <XXXXXXXXXXX> 0 1 1 X 0 Read Interrupt status bits: Overflow and EOM.
Notes:
C0 = Message cueing
C1 = Ignore address bit
C2 = Master power control
C3 = Record or playback operation
C4 = Enable or disable an operation
[2] Message Cueing can be selected only at the beginning of a playback operation.
[3] As the Interrupt data is shifted out of the ISD4002, control and address data are being shifted in. Care should
be taken such that the data shifted in is compatible with current system operation. It is possible to read interrupt
data and start a new operation at the same time. See Figures 5 - 8 for references.
ISD4002 SERIES
Publication Release Date: September 2003
- 15 - Revision 1
7.2.2. SPI Diagrams
Row Counter
Output Shift Register
Input Shift Register
Select Logic
MOSI
MISO
A0-A9
P0-P9
(Loaded to Row Counter
only if IAB = 0)
OVF EOM
FIGURE 3: SPI INTERFACE SIMPLIFIED BLOCK DIAGRAM
The following diagram describes the SPI port and the control bits associated with it.
OVF EOM P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 X 0 0 0
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 0C0 C1 C2 C3 C4
MISO
MOSI
Message Cueing (MC)
Ignore Address Bit (IAB)
Power Up (PU)
Play/Record (P/R)
RUN
LSB MSB
FIGURE 4: SPI PORT
ISD4002 SERIES
- 16 -
7.2.3. SPI Control and Output Registers
The SPI control register provides control of individual device functions such as play, record, message
cueing, power-up and power-down, start and stop operations, and ignore address pointers.
TABLE 3: SPI CONTROL REGISTERS
Control Bit Control Register Bit Device Function
C0 MC
=
=
1
0
Message Cueing function
Enable Message Cueing
Disable Message Cueing
C1 IAB
[4]
=
=
1
0
Ignore Address bit
Ignore input address register (A0-A9)
Use the input address register (A0-A9)
C2 PU
=
=
1
0
Power Up bit
Power-Up
Power-Down
C3 P/ R
=
=
1
0
Playback or Record bit
Play
Record
C4 RUN
=
=
1
0
Enable or Disable an operation
Start
Stop
Address Bits A0-A9 Input address register
TABLE 4: SPI OUTPUT REGISTERS
Output Bits Description
OVF Overflow
EOM End-of-Message
P0-P9 Output of the row pointer register
[4] When IAB (Ignore Address Bit) is set to 0, a playback or record operation starts from address (A0-A9). For
consecutive playback or record, IAB should be changed to a 1 before the end of that row (see RAC timing).
Otherwise the ISD4002 will repeat the operation from the same row address. For memory management, the Row
Address Clock (RAC) signal and IAB can be used to move around the memory segments.
ISD4002 SERIES
Publication Release Date: September 2003
- 17 - Revision 1
Message Cueing
Message cueing (MC) allows the user to skip through messages, without knowing the actual physical
location of the messages. It will stop when an EOM marker is reached. Then, the internal address
counter will point to the next message. Also, it will enter into OVF condition when it reaches the end of
memory. In this mode, the messages are skipped 1,600 times faster than the normal playback
mode.
Power-Up Sequence
The ISD4002 will be ready for an operation after power-up command is sent and followed by the TPUD
timing (25 ms for 8 KHz sampling rate). Refer to the AC timing table for other TPUD values with respect
to different sampling rates.
The following sequences are recommended for optimized Record and Playback operations.
Record Mode
1. Send POWERUP command.
2. Wait TPUD (power-up delay).
3. Send POWERUP command.
4. Wait 2 x TPUD (power-up delay).
5. a). Send SETREC command with address xx, or
b). Send REC command (recording from current location).
6. Send STOP command to stop recording.
7. Wait TSTOP/PAUSE.
For 5.a), the device will start recording at address xx and will generate an interrupt when an overflow
(end of memory array) is reached, if no STOP command is sent before that. Then, it will automatic
stop recording operation.
Playback Mode
1. Send POWERUP command
2. Wait TPUD (power-up delay)
3. a). Send SETPLAY command with address xx, or
b). Send PLAY command (playback from current location).
4. a). Send STOP command to halt the playback operation, or
b). Wait for playback operation to stop automatically, when an EOM or OVF is reached.
5. Wait TSTOP/PAUSE.
For 3.a), the device will start playback at address xx and it will generate an interrupt when an EOM or
OVF is reached. It will then stop playback operation.
ISD4002 SERIES
- 18 -
8. TIMING DIAGRAMS
TSSH
TSSmin
TSCKhi
TSSS
TDIS
TDIH TSCKlow
TPD TPD TDF
(TRISTATE)
LSB
SS
SCLK
MOSI
MISO
FIGURE 5: TIMING DIAGRAM
SS
SCLK
MOSI
MISO
A8 A9 X C0 C1 C2 C3 C4
OVF EOM P0 P1 P2 P3 P4 P5
LSB
LSB
FIGURE 6: 8-BIT COMMAND FORMAT
ISD4002 SERIES
Publication Release Date: September 2003
- 19 - Revision 1
SS
SCLK
MOSI
MISO
LSB
LSB
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 X C0 C1 C2 C3 C4
XXXXP9P8P7P6P5P4P3P2P1P0EOMOVF
FIGURE 7: 16-BIT COMMAND FORMAT
SS
SCLK
MOSI
MISO
ANA IN
ANA OUT
Data
Play/Record Stop
Data
(Rec)
(Play)
TSTOP/PAUSE
TSTOP/PAUSE
FIGURE 8: PLAYBACK/RECORD AND STOP CYCLE
≈ ≈ ≈ ≈ ≈ ≈ ≈ ≈
≈ ≈ ≈ ≈ ≈
≈
≈ ≈ ≈
≈
≈
ISD4002 SERIES
- 20 -
9. ABSOLUTE MAXIMUM RATINGS
TABLE 5: ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)
CONDITIONS VALUES
Junction temperature 150ºC
Storage temperature range -65ºC to +150ºC
Voltage applied to any pin (VSS –0.3V) to (VCC +0.3V)
Voltage applied to any pin (Input current limited to ±20mA) (VSS –1.0V) to (VCC +1.0V)
Voltage applied to MOSI, SCLK, and SS pins
(Input current limited to ±20mA)
(VSS –1.0V) to 5.5V
Lead temperature (soldering – 10 seconds) 300ºC
VCC – VSS -0.3V to +7.0V
TABLE 6: ABSOLUTE MAXIMUM RATINGS (DIE)
CONDITIONS VALUES
Junction temperature 150ºC
Storage temperature range -65ºC to +150ºC
Voltage applied to any pad (VSS –0.3V) to (VCC +0.3V)
Voltage applied to any pad (Input current limited to ±20 mA) (VSS –1.0V) to (VCC +1.0V)
Voltage applied to MOSI, SCLK, and SS pins
(Input current limited to ±20mA)
(VSS –1.0V) to 5.5V
VCC – VSS -0.3V to +7.0V
Note: Stresses above those listed may cause permanent damage to the device. Exposure to the absolute
maximum ratings may affect device reliability and performance. Functional operation is not implied at these
conditions.
ISD4002 SERIES
Publication Release Date: September 2003
- 21 - Revision 1
9.1. OPERATING CONDITIONS
TABLE 7: OPERATING CONDITIONS (PACKAGED PARTS)
CONDITION VALUE
Commercial operating temperature range (Case temperature) 0ºC to +70ºC
Extended operating temperature (Case temperature) -20ºC to +70ºC
Industrial operating temperature (Case temperature) -40ºC to +85ºC
Supply voltage (VCC) [1] +2.7V to +3.3V
Ground voltage (VSS) [2] 0V
TABLE 8: OPERATING CONDITIONS (DIE)
CONDITION VALUE
Commercial operating temperature range 0ºC to +50ºC
Supply voltage (VCC) [1] +2.7V to +3.3V
Ground voltage (VSS) [2] 0V
[1] VCC = VCCA = VCCD
[2] VSS = VSSA = VSSD
ISD4002 SERIES
- 22 -
10. ELECTRICAL CHARACTERISTICS
10.1. PARAMETERS FOR PACKAGED PARTS
TABLE 9: DC PARAMETERS
PARAMETER SYMBOL MIN[2] TYP[1] MAX[2] UNITS CONDITIONS
Input Low Voltage VIL V
CC x 0.2 V
Input High Voltage VIH V
CC x 0.8 V
Output Low Voltage VOL 0.4 V IOL = 10 µA
RAC, INT Output Low Voltage VOL1 0.4 V IOL = 1 mA
Output High Voltage VOH V
CC x 0.4 V IOH = -10 µA
VCC Current (Operating)
- Playback
- Record
ICC
15
25
30
40
mA
mA
REXT = ∞ [3]
REXT = ∞ [3]
VCC Current (Standby) ISB 1 10 µA
[3] [4]
Input Leakage Current IIL
±1 µA
MISO Tristate Current IHZ 1 10 µA
Output Load Impedance REXT 5 KΩ
ANA IN+ Input Resistance RANA IN+ 2.2 3.0 3.8 KΩ
ANA IN- Input Resistance RANA IN- 40 56 71 KΩ
ANA IN+ or ANA IN- to AUD
OUT Gain
AARP 20 23 26 dB 1 KHz
sinewave input
[5]
Notes:
[1] Typical values @ TA = 25°C and VCC = 3.0V.
[2] All Min/Max limits are guaranteed by Winbond via electronical testing or characterization. Not all
specifications are 100 percent tested.
[3] V
CCA and VCCD connected together.
[4] SS = VCCA = VCCD, XCLK = MOSI = VSSA = VSSA and all other pins floating.
[5] Measured with AutoMute feature disabled.
ISD4002 SERIES
Publication Release Date: September 2003
- 23 - Revision 1
TABLE 10: AC PARAMETERS (Packaged Parts)
CHARACTERISTIC SYMBOL MIN[2] TYP[1] MAX[2] UNITS CONDITIONS
Sampling Frequency
ISD4002-120
ISD4002-150
ISD4002-180
ISD4002-240
FS
8.0
6.4
5.3
4.0
KHz
KHz
KHz
KHz
[5]
[5]
[5]
[5]
Filter Pass Band
ISD4002-120
ISD4002-150
ISD4002-180
ISD4002-240
FCF
3.4
2.7
2.3
1.7
KHz
KHz
KHz
KHz
3 dB Roll-Off Point[3][7]
3 dB Roll-Off Point[3][7]
3 dB Roll-Off Point[3][7]
3 dB Roll-Off Point[3][7]
Record Duration
ISD4002-120
ISD4002-150
ISD4002-180
ISD4002-240
TREC
120
150
180
240
sec
sec
sec
sec
[6]
[6]
[6]
[6]
Playback Duration
ISD4002-120
ISD4002-150
ISD4002-180
ISD4002-240
TPLAY
120
150
180
240
sec
sec
sec
sec
[6]
[6]
[6]
[6]
Power-Up Delay
ISD4002-120
ISD4002-150
ISD4002-180
ISD4002-240
TPUD
25
31.25
37.5
50
msec
msec
msec
msec
Stop or Pause in Record or Play
ISD4002-120
ISD4002-150
ISD4002-180
ISD4002-240
TSTOP or TPAUSE
50
62.5
75
100
msec
msec
msec
msec
RAC Clock Period
ISD4002-120
ISD4002-150
ISD4002-180
ISD4002-240
TRAC
200
250
300
400
msec
msec
msec
msec
[10]
[10]
[10]
[10]
RAC Clock Low Time
ISD4002-120
ISD4002-150
ISD4002-180
ISD4002-240
TRACL
25
31.25
37.5
50
msec
msec
msec
msec
RAC Clock Period in Message
Cueing Mode
ISD4002-120
ISD4002-150
ISD4002-180
ISD4002-240
TRACM
125
156.3
187.5
250
µsec
µsec
µsec
µsec
RAC Clock Low Time in
Message Cueing Mode
ISD4002-120
ISD4002-150
ISD4002-180
ISD4002-240
TRACML
15.63
19.53
23.44
31.25
µsec
µsec
µsec
µsec
Total Harmonic Distortion THD 1 2 % @ 1 KHz sinewave
ANA IN Input Voltage VIN 32 mV Peak-to-Peak
[4] [8] [9]
ISD4002 SERIES
- 24 -
Notes:
[1] Typical values @ TA = 25°C, VCC = 3.0V and timing measurement at 50%.
[2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all
specifications are 100 percent tested.
[3] Low-frequency cutoff depends upon the value of external capacitors (see Pin Descriptions)
[4] Single-ended input mode. In the differential input mode, VIN maximum for ANA IN+ and ANA IN- is 16
mVp-p.
[5] Sampling Frequency can vary as much as ±2.25 percent over the commercial temperature and voltage
ranges, and –6/+4 percent over the extended temperature, industrial temperature and voltage ranges.
For greater stability, an external clock can be utilized (see Pin Descriptions)
[6] Playback and Record Duration can vary as much as ±2.25 percent over the commercial temperature and
voltage ranges, and –6/+4 percent over the extended temperature, industrial temperature and voltage
ranges. For greater stability, an external clock can be utilized (see Pin Descriptions)
[7] Filter specification applies to the antialiasing filter and the smoothing filter. Therefore, from input to
output, expect a 6 dB drop by nature of passing through both filters.
[8] The typical output voltage will be approximately 450 mVp-p with VIN at 32 mVp-p.
[9] For optimal signal quality, this maximum limit is recommended.
[10] When a record command is sent, TRAC = TRAC + TRACL on the first row address.
ISD4002 SERIES
Publication Release Date: September 2003
- 25 - Revision 1
10.2. PARAMETERS FOR DIE
TABLE 11: DC PARAMETERS
PARAMETERS [6] SYMBOL MIN[2] TYP[1] MAX[2] UNITS CONDITIONS
VCC Current (Operating)
-Playback
-Record
ICC
15
25
30
40
mA
mA
REXT = ∞ [3]
REXT = ∞ [3]
VCC Current (Standby) ISB 1 10 µA
[3] [4]
Total Harmonic Distortion THD 1 2 % @ 1 KHz sinewave
ANA IN+ or ANA IN- to AUD
OUT Gain
AARP 20 23 26 dB
[5]
Notes:
[1] Typical values @ TA = 25°C and VCC = 3.0V.
[2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all
specifications are 100 percent tested.
[3] V
CCA and VCCD connected together.
[4] SS = VCCA = VCCD, XCLK = MOSI = VSSA = VSSA and all other pins floating.
[5] Measured with AutoMute feature disabled.
[6] The test coverage for die is limited to room temperature testing. The test conditions may differ from that
of packaged parts.
ISD4002 SERIES
- 26 -
10.3. SPI AC PARAMETERS
TABLE 13: AC PARAMETERS[1]
PARAMETER SYMBOL MIN TYP MAX UNITS CONDITIONS
SS Setup Time TSSS 500 nsec
SS Hold Time TSSH 500 nsec
Data in Setup Time TDIS 200 nsec
Data in Hold Time TDIH 200 nsec
Output Delay TPD 500 nsec
Output Delay to HighZ [2] T
DF 500 nsec
SS HIGH TSSmin 1 µsec
SCLK High Time TSCKhi 400 nsec
SCLK Low Time TSCKlow 400 nsec
CLK Frequency F0 1,000 KHz
Notes:
[1] Typical values @ TA = 25°C, VCC = 3.0V and timing measurement at 50%.
[2] Tri-state test condition.
MISO
VCC
6.32K
10.91K
50pF (Includes scope and fixture capacitance)
Ω
Ω
ISD4002 SERIES
Publication Release Date: September 2003
- 27 - Revision 1
11. TYPICAL APPLICATION CIRCUIT
These application examples are for illustration purposes only. Winbond makes no representation or
warranty that such application will be suitable for production.
Make sure all bypass capacitors are as close as possible to the package.
68HC705C8P
ISD4002
15-30 pF
C9
15-25 pF
C8
10 K
R7
Ω
47 K
R6
Ω
47 K
R5
Ω
39
38
1
2
37
35
11
10
9
8
7
6
5
4
19
18
17
16
15
14
13
12
21
22
23
24
25
26
27
28
34
33
32
31
30
29 3
2
28
1
16
17
24
25
26
14
13
11
12
23
18
4
27
13
14
5
6
7
3
2
16
9
8
4
1
12
15
10
11
C11
0.1 F
µ
C12
0.1 F
µ
C5
1 F
µ
C4
1 F
µ
C3 0.22 F
µ
C2 0.22 F
µ
C1
47 F
µ
VCC
R1
10K
R2
1M
R3 100
R4
100K POT
LINE OUT
EXT
SPEAKER
C6
1 F
µ
C7
.1 F
µ
J4
3
2
4
5
1
3
2
1
3
4
5
1
J1
U3
U1
U2
LM4860M
OCS1
OCS2
RESET
IRQ
TCAP
TCMP
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PD7
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PD0/RDI
PD1/TD0
PD2/MISO
PD3/MOSI
PD4/SCK
PD5/SS
MISO
MOSI
SCLK
SS
ANA IN-
ANA IN+
RAC
INT
XCLK
AM CAP
VCCD
VSSD
VCCA
VSSA
VSSA
VSSA
AUD OUT
-IN
+IN
BYPASS
HP-IN1
HP-IN2
HPSENSE
SHUTDOWN
GAIN-OUT
V01
V02
VDD
GND
GND
GND
GND
GND
PDIP / SOIC
FIGURE 9: APPLICATION EXAMPLE USING SPI
ISD4002 SERIES
- 28 -
PIC16C62A ISD4002
R7
8
19
1
20
9
11
21
7
14
16
15
3
2
28
1
16
17
24
25
26
14
13
11
12
23
18
4
27
13
14
5
6
7
3
2
16
9
8
4
1
12
15
10
11
C9
0.1 F
µ
C8
0.1 F
µ
C5
1 F
µ
C4
1 F
µ
C3 0.22 F
µ
C2 0.22 F
µ
C1
47 F
µ
VCC
R1
10K
R2
1M
R3 100
R4
100K POT
LINE OUT
EXT
SPEAKER
C6
1 F
µ
C7
.1 F
µ
J4
3
2
4
5
1
3
2
1
3
4
5
1
J1
U3
U1
U2
LM4860M
VSS
VSS
MCLR
VDD
OSC1
RC0
RB0
RC4
RC5
RC3
RA5
MISO
MOSI
SCLK
SS
ANA IN-
ANA IN+
RAC
INT
XCLK
AM CAP
VCCD
VSSD
VCCA
VSSA
VSSA
VSSA
AUD OUT
-IN
+IN
BYPASS
HP-IN1
HP-IN2
HPSENSE
SHUTDOWN
GAIN-OUT
V01
V02
VDD
GND
GND
GND
GND
GND
PDIP / SOIC
C10
4.7 K
R6
Ω
4.7 K
R5
Ω
FIGURE 10: APPLICATION EXAMPLE USING MICROWIRE
ISD4002 SERIES
Publication Release Date: September 2003
- 29 - Revision 1
COP 820C ISD4002
R7
23
24
6
5
25
19
20
21
22 3
2
28
1
16
17
24
25
26
14
13
11
12
23
18
4
27
13
14
5
6
7
3
2
16
9
8
4
1
12
15
10
11
C9
0.1 F
µ
C8
0.1 F
µ
C5
1 F
µ
C4
1 F
µ
C3 0.22 F
µ
C2 0.22 F
µ
C1
47 F
µ
VCC
R1
10K
R2
1M
R3 100
R4
100K POT
LINE OUT
EXT
SPEAKER
C6
1 F
µ
C7
.1 F
µ
J4
3
2
4
5
1
3
2
1
3
4
5
1
J1
U3
U1
U2
LM4860M
GND
RESET
VCC
CLI
D3
D2
D1
D0
MISO
MOSI
SCLK
SS
ANA IN-
ANA IN+
RAC
INT
XCLK
AM CAP
VCCD
VSSD
VCCA
VSSA
VSSA
VSSA
AUD OUT
-IN
+IN
BYPAS
S
HP-IN1
HP-IN2
HPSENSE
SHUTDOWN
GAIN-OUT
V01
V02
VDD
GND
GND
GND
GND
GND
PDIP / SOIC
C10
4.7 K
R6
Ω
4.7 K
R5
Ω
10
11
12
13
3.3 KΩ
82 pF
7
8
9
10
G3
G2
G1
INT
SI
SK
G7
SO
L7
L6
L5
L4
L3
L2
L1
L0 11
12
13
14
15
16
17
18
1
4
2
3
26
27
28
FIGURE 11: APPLICATION EXAMPLE USING SPI PORT ON MICROCONTROLLER
ISD4002 SERIES
- 30 -
12. PACKAGING AND DIE INFORMATION
12.1. 28-LEAD 300-MIL PLASTIC SMALL OUTLINE IC (SOIC)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
12345 67891011 12 13 14
A
D
E
F
B
G
C
H
INCHES MILLIMETERS
Min Nom Max Min Nom Max
A 0.701 0.706 0.711 17.81 17.93 18.06
B 0.097 0.101 0.104 2.46 2.56 2.64
C 0.292 0.296 0.299 7.42 7.52 7.59
D 0.005 0.009 0.0115 0.127 0.22 0.29
E 0.014 0.016 0.019 0.35 0.41 0.48
F 0.050 1.27
G 0.400 0.406 0.410 10.16 10.31 10.41
H 0.024 0.032 0.040 0.61 0.81 1.02
Note: Lead coplanarity to be within 0.004 inches.
ISD4002 SERIES
Publication Release Date: September 2003
- 31 - Revision 1
12.2. 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP)
INCHES MILLIMETERS
Min Nom Max Min Nom Max
A 1.445 1.450 1.455 36.70 36.83 36.96
B1 0.150 3.81
B2 0.065 0.070 0.075 1.65 1.78 1.91
C1 0.600 0.625 15.24 15.88
C2 0.530 0.540 0.550 13.46 13.72 13.97
D 0.19 4.83
D1 0.015 0.38
E 0.125 0.135 3.18 3.43
F 0.015 0.018 0.022 0.38 0.46 0.56
G 0.055 0.060 0.065 1.40 1.52 1.62
H 0.100 2.54
J 0.008 0.010 0.012 0.20 0.25 0.30
S 0.070 0.075 0.080 1.78 1.91 2.03
q 0° 15° 0° 15°
ISD4002 SERIES
- 32 -
12.3. 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1
INCHES MILLIMETERS
Min Nom Max Min Nom Max
A 0.520 0.528 0.535 13.20 13.40 13.60
B 0.461 0.465 0.469 11.70 11.80 11.90
C 0.311 0.315 0.319 7.90 8.00 8.10
D 0.002 0.006 0.05 0.15
E 0.007 0.009 0.011 0.17 0.22 0.27
F 0.0217 0.55
G 0.037 0.039 0.041 0.95 1.00 1.05
H 0° 3° 6° 0° 3° 6°
I 0.020 0.022 0.028 0.50 0.55 0.70
J 0.004 0.008 0.10 0.21
Note: Lead coplanarity to be within 0.004 inches.
5
6
7
8
9
10
11
12
13
14
2
3
4
15
16
17
18
19
20
21
22
23
24
25
26
27
28
A
BG
F
C
D
E
HJ
I
A
B
G
C
F
E
H
J
4
8
10
1
2
3
5
6
7
9
11
12
13
14
18
20
24
17
16
15
19
21
22
23
25
26
27
28
ISD4002 SERIES
Publication Release Date: September 2003
- 33 - Revision 1
12.4. DIE INFORMATION
ISD4002 Series
o Die Dimensions [1]
X: 166.6 ± 1 mils
Y: 222.5 ± 1 mils
o Die Thickness [2]
11.5 ± 0.5 mils
o Pad Opening
Single pad opening: 90 x 90 µm
Double pad opening: 180 x 90 µm
Notes:
[1] The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or
damage may occur.
[2] Die thickness is subject to change, please contact Winbond as this thickness may change in the future.
[3] Double bond is recommended if treated as one single pad.
≈ISD4002 ≈
MISO
MOSI
SS VCCD
SCLK INT RAC
VSSA
VSSD
VSSD
VCCD
XCLK
VCCA
[3]
ANA IN+
AM CAP
AUD OUT
VSSA
[3]
VSSA
ANA IN-
VSSA
[3]
VCCA
[3]
ISD4002 SERIES
- 34 -
ISD4002 SERIES PAD COORDINATIONS
(with respect to die center)
Pad Pad Description X Axis (µm) Y Axis (µm)
VSSA Analog Ground 1885.7 2606.7
RAC Row Address Clock 1483.8 2606.7
INT Interrupt 794.8 2606.7
XCLK External Clock Input 564.8 2606.7
VCCD Digital Power Supply 384.9 2606.7
VCCD Digital Power Supply 169.5 2606.7
SCLK Slave Clock -14.7 2606.7
SS Slave Select -198.1 2606.7
MOSI Master Out Slave In -1063.7 2606.7
MISO Master In Slave Out -1325.6 2606.7
VSSD Digital Ground -1665.3 2606.7
VSSD Digital Ground -1836.9 2606.7
VSSA
[1] Analog Ground -1943.1 -2607.4
VSSA
[1] Analog Ground -1853.1 -2607.4
VSSA Analog Ground -1599.9 -2607.4
AUD OUT Audio Output 281.9 -2607.4
AM CAP AutoMute 577.3 -2607.4
ANA IN- Inverting Analog Input 1449.3 -2607.4
ANA IN+ Noninverting Analog Input 1603.5 -2607.4
VCCA
[1] Analog Power Supply 1853.5 -2607.4
VCCA
[1] Analog Power Supply 1943.8 -2607.4
Note:
[1] Double bond recommended if treated as one pad.
ISD4002 SERIES
Publication Release Date: September 2003
- 35 - Revision 1
13. ORDERING INFORMATION
When ordering ISD4002 Series devices, please refer to the following valid part numbers.
Die / Package Part Number
Die ISD4002-120X ISD4002-150X ISD4002-180X ISD4002-240X
PDIP ISD4002-120P ISD4002-150P ISD4002-180P ISD4002-240P
ISD4002-120S ISD4002-150S ISD4002-180S ISD4002-240S
SOIC
ISD4002-120SI ISD4002-150SI ISD4002-180SI ISD4002-240SI
ISD4002-120E ISD4002-150E ISD4002-180E ISD4002-240E
ISD4002-120ED ISD4002-150ED ISD4002-180ED ISD4002-240ED
TSOP
ISD4002-120EI ISD4002-150EI ISD4002-180EI ISD4002-240EI
For the latest product information, access Winbond worldwide website at http://www.winbond-usa.com
ISD4002-
Product Family :
Product Series :
ISD4000 Family
02 = Second Series (2-4 min)
Duration :
Special Temperature Field :
Packaged Units / Die :
120 = 120 seconds
150 = 150 seconds
180 = 180 seconds
240 = 240 seconds
Blank = Commercial Package (0°C to + 70°C)
or Commercial Die (0°C to + 50°C)
D = Extended (-20°C to + 70°C)
I = Industrial (-40°C to + 85°C)
X = Die
P = 28-Lead 600-mil Plastic Dual Inline Package
(PDIP)
S = 28-Lead 300-mil Plastic Small Outline Package
(SOIC)
E = 28-Lead 8x13.4mm Plastic Thin Small Outline
Package (TSOP) Type 1
ISD4002 SERIES
- 36 -
14. VERSION HISTORY
VERSION DATE DESCRIPTION
0 June 2000 Initial version
1 Sep. 2003 Reformat the document.
Add note for typical filter pass band.
Add memory architecture description.
Remove all CSP info.
Revise RAC timing parameter for MC.
Revise AutoMute: playback only.
Revise SPI, opcodes sections, record & playback steps.
Rename TRACLO to TRACL.
Revise AARP parameter.
Revise DC & AC parameters tables for die.
Revise die information: pad opening and (x,y) coordinates.
Figures 9-11: revise VCCA and VCCD pin #.
ISD4002 SERIES
Publication Release Date: September 2003
- 37 - Revision 1
Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.
No. 4, Creation Rd. III 2727 North First Street, San Jose, 27F, 299 Yan An W. Rd. Shanghai,
Science-Based Industrial Park, CA 95134, U.S.A. 200336 China
Hsinchu, Taiwan TEL: 1-408-9436666 TEL: 86-21-62365999
TEL: 886-3-5770066 FAX: 1-408-5441797 FAX: 86-21-62356998
FAX: 886-3-5665577 http://www.winbond-usa.com/
http://www.winbond.com.tw/
Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd.
9F, No. 480, Pueiguang Rd. 7F Daini-ueno BLDG. 3-7-18 Unit 9-15, 22F, Millennium City,
Neihu District Shinyokohama Kohokuku, No. 378 Kwun Tong Rd.,
Taipei, 114 Taiwan Yokohama, 222-0033 Kowloon, Hong Kong
TEL: 886-2-81777168 TEL: 81-45-4781881 TEL: 852-27513100
FAX: 886-2-87153579 FAX: 81-45-4781800 FAX: 852-27552064
Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.
The contents of this document are provided only as a guide for the applications of Winbond products. Winbond
makes no representation or warranties with respect to the accuracy or completeness of the contents of this
publication and reserves the right to discontinue or make changes to specifications and product descriptions at
any time without notice. No license, whether express or implied, to any intellectual property or other right o
f
Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and
Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty o
f
merchantability, fitness for a particular purpose or infringement of any Intellectual property.
Winbond products are not designed, intended, authorized or warranted for use as components in systems o
r
equipments intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for othe
r
applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications
wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe
property or environmental injury could occur.
A
pplication examples and alternative uses of any integrated circuit contained in this publication are for illustration
only and Winbond makes no representation or warranty that such applications shall be suitable for the use
specified.
ISD® and ChipCorder® are trademarks of Winbond Electronics Corporation.
The 100-year retention and 10K record cycle projections are based upon accelerated reliability tests, as published
in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product
incorporates SuperFlash® technology licensed from SST.
Information contained in this ISD® ChipCorder® data sheet supersedes all data for the ISD ChipCorder products
published by ISD® prior to August, 1998.
This data sheet and any future addendum to this data sheet is(are) the complete and controlling ISD® ChipCorder
®
product specifications. In the event any inconsistencies exist between the information in this and other product
documentation, or in the event that other product documentation contains information in addition to the information
in this, the information contained herein supersedes and governs such other information in its entirety.
Copyright© 2003, Winbond Electronics Corporation. All rights reserved. ChipCorder® ISD® are registered
trademark of Winbond. All other trademarks are properties of their respective owners.
