Parameter Min. Typ. Max. Unit
RthJC Thermal resistance Junction-Case 1.8
RthJA Thermal resistance Junction-ambient 80 °C/W
RthCS Thermal resistance Case to Sink 1.0
2N7091
Document Number 2653
Issue 2
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Parameter Test Conditions Min. Typ. Max. Unit
VGS = 0 ID= -250µA
VDS = VGS ID= -250µA
VDS = 0 VGS = ±20V
VDS = -80V
VGS = 0 TJ= 125°C
VDS = -10V VGS = -10V
VGS = -10V
ID= - 8.7A TJ= 125°C
VDS = -15V IDS = -8.7A
VGS = 0
VDS = - 25V
f = 1MHz
VDS = -50
VGS = -10V ID= -14A
VDD = -50V ID= -14A
VGEN =-10V
RL= 3.5Ω
RG= 4.7Ω
IF= -14A VGS = 0
IF= -14A
di/dt = 100A/µs
ELECTRICAL CHARACTERISTICS (TJ= 25°C unless otherwise stated)
THERMAL RESISTANCECHARACTERISTICS
Drain–Source Breakdown Voltage
Gate Threshold Voltage
Gate – Body Leakage
Zero Gate Voltage Drain Current
On–State Drain Current1
Drain – Source On–State
Resistance 1
Forward Transconductance1
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge2
Gate Source Charge2
Gate Drain Charge2
Turn–On Delay Time2
Rise Time2
Turn–Off Delay Time2
Fall Time2
Continuous Current
Pulsed Current
Diode Forward Voltage1
Reverse Recovery Time
Reverse Recovery Charge
-100
-2 -4
±100
-25
-250
-14 0.15 0.20
2.3 0.32
5.0
1300
750
310
50 62
10 15
27 35
10 30
50 80
40 80
40 60
-14
-56
-3.5
150 300
0.3
V
V
nA
µA
A
Ω
S
pF
nC
ns
A
V
ns
µC
V(BR)DSS
VGS(th)
IGSS
IDSS
ID(on)
rDS(on)
gfs
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
IS
ISM
VSD
trr
Qrr
STATIC ELECTRICAL RATINGS
DYNAMIC CHARACTERISTICS
SOURCE – DRAIN DIODE CHARACTERISTICS
1 Pulse test : Pulse Width < 300µs ,Duty Cycle < 2%
2 Independent of Operating Temperature