RECEPTACLES
TMT SMT
Height (mm) 4.50 2.30
Insertion
Depth (max.) 4.30 2.20
Insertion
Depth (min.) 3.03 1.43
Minitek™ Unshrouded Stacking Headers
2,00 mm
43
Dimensions in mm
Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics
Part Number
1= Through Mount (TMT)
2= Surface Mount (SMT) 02 to 25 (TMT)
02 to 25 (SMT)
XX.X = mm
Specify mm
[i.e., 037 = 03.7 mm]
in 0.1 mm increments
1= 2.50
3= 3.00
0= SMT
5 9 2
Lead Solder
Side
Option Plating Pin Style Positions
Per Row Stack Height
Pin OAL (TMT) Height (SMT)
Style mm mm
22 8.20 6.53
24 9.55 7.87
26 10.19 8.51
28 11.79 10.11
30 13.54 11.86
32 14.10 12.42
34 15.60 13.92
36 17.09 15.42
38 19.08 17.40
40 21.08 19.41
Recommended PCB Layout
Step-by-Step Design
1. Determine desired board spacing
2. Select receptacle and calculate stack height
Stack Height = Board Spacing– Receptacle Height
3. Find the insertion depth from the chart below.
Calculate max./min. OAL
OAL = Stack Height + Tail + Insertion Depth
4. Select the Pin Style with OAL between max.
and min. values
Example:
1. Application requires a board spacing of 14.1
2. Select the appropriate receptacle, in this case
3.0 height (SMT)
The Header Stack Height is 14.1– 3.0 = 11.1
3. For1,6 mm board application (TMT),
the 2.5 Solder side is selected
OAL (max.)= 14.1 + 2.5 + 3.4 = 20.0
OAL (min.) = 14.1 + 2.5 + 1.28 = 17.88
4. Select Pin Style 38 with OAL = 19.07
5. Part Number is 59112-G38-10-141
PACKING:
= Bags (TMT)
A = Tape-and-reel (SMT)
G= 0,76 µm Gold on mating area,
2-6 µmTin-Lead on solder side
F= Gold flash