Minitek™ Unshrouded Stacking Headers
2,00 mm
Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics
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■CUSTOMISABLE:
Wide variety of stack heights in
0.13 mm increments
■Custom sizes to meet your specific
design requirements
■High temperature plastic
Technical Data
Physical
Housing: High-temperature,
black thermoplastic
Flammability rating: UL 94 V-0
Pin: Phosphor-bronze
Plating: Gold over 1.27 µm nickel
Electrical Performance
Current rating: 2 A continuous
Insulation resistance: 1000 MΩmin.
Contact resistance: 25 mΩmax.
Dielectric withstanding voltage: 650 V
Voltage rating: 200 V
Mechanical Performance
Mating cycles (durability): 100
Operating Temperature
-55°C to +125°C
Packaging
Standard: TMT in bags
SMT in Tape-and-reel
Optional: Tubes (see drawing)
Reference Information
File no. E66906
File no. LR46923
Product drawing: 59112, 59132, or 59202
Product specification: DPS-12-011
Specifications subject to change without notice.
Mating Data
■Minitek™ ctw contacts and housings
■Minitek™Vertical receptacles
■Minitek™Shunts
Processing Information
Compatible with wave, vapor-phase, and
IR reflow soldering processes
Typical Applications
OAL
Mating side
OAL OAL
Receptacle
OAL
Solder side
Stack
Height
Board
Space
Stack
Height Stack
Height
Mating side
Solder side
Mating side
Solder side
RECEPTACLES
TMT SMT
Height (mm) 4.50 2.30
Insertion
Depth (max.) 4.30 2.20
Insertion
Depth (min.) 3.03 1.43
Minitek™ Unshrouded Stacking Headers
2,00 mm
43
Dimensions in mm
Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics
Part Number
1= Through Mount (TMT)
2= Surface Mount (SMT) 02 to 25 (TMT)
02 to 25 (SMT)
XX.X = mm
Specify mm
[i.e., 037 = 03.7 mm]
in 0.1 mm increments
1= 2.50
3= 3.00
0= SMT
5 9 2
Lead Solder
Side
Option Plating Pin Style Positions
Per Row Stack Height
Pin OAL (TMT) Height (SMT)
Style mm mm
22 8.20 6.53
24 9.55 7.87
26 10.19 8.51
28 11.79 10.11
30 13.54 11.86
32 14.10 12.42
34 15.60 13.92
36 17.09 15.42
38 19.08 17.40
40 21.08 19.41
Recommended PCB Layout
Step-by-Step Design
1. Determine desired board spacing
2. Select receptacle and calculate stack height
Stack Height = Board Spacing– Receptacle Height
3. Find the insertion depth from the chart below.
Calculate max./min. OAL
OAL = Stack Height + Tail + Insertion Depth
4. Select the Pin Style with OAL between max.
and min. values
Example:
1. Application requires a board spacing of 14.1
2. Select the appropriate receptacle, in this case
3.0 height (SMT)
The Header Stack Height is 14.1– 3.0 = 11.1
3. For1,6 mm board application (TMT),
the 2.5 Solder side is selected
OAL (max.)= 14.1 + 2.5 + 3.4 = 20.0
OAL (min.) = 14.1 + 2.5 + 1.28 = 17.88
4. Select Pin Style 38 with OAL = 19.07
5. Part Number is 59112-G38-10-141
PACKING:
= Bags (TMT)
A = Tape-and-reel (SMT)
G= 0,76 µm Gold on mating area,
2-6 µmTin-Lead on solder side
F= Gold flash
