1. Product profile
1.1 General description
The IP4234CZ6 is designed to protect Input/Output (I/O) USB 2.0 ports, that are sensitive
to capacitive loads, from being damaged by ElectroStatic Discharge (ESD). The π-filter
structure is implemented with a small series resistor to provide the necessary protection
to signal and supply components from ESD voltages greater than ±8 kV contact discharge
according IEC 61000-4-2, level 4.
The ESD protection is independent of the supply voltage due to the rail-to-rail diode
architecture being connected to a Zener diode.
The IP4234CZ6 is fabricated using monolithic silicon technology and integrates two
ultra-low capacitance π-filter ESD protection diodes plus a Zener diode in a miniature
6-lead SOT457 package.
1.2 Features
nPb-free and RoHS compliant
nSimple, direct signal routing provides for high speed signal integrity
nESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge
nSignificant reduction in peak clamping and peak residual current
nFour low input capacitance (2.0 pF typical) rail-to-rail ESD protection diodes
nLow voltage clamping due to an integrated Zener diode
nSmall 6-lead SO6 (SOT457) package
nIEC 61000-4-5 15 A Lightning (8/20 µs) compliant
1.3 Applications
nGeneral-purpose downstream ESD protection high frequency analog signals and
high-speed serial data transmission for ports inside:
uCellular and PCS mobile handsets
uPC/Notebook USB2.0/IEEE1394 ports
uDVI interfaces
uHDMI interfaces
uCordless telephones
uWireless data (WAN/LAN) systems
uPDAs
IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
Rev. 01 — 16 April 2009 Product data sheet
IP4234CZ6_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 16 April 2009 2 of 9
NXP Semiconductors IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
2. Pinning information
3. Ordering information
4. Limiting values
5. Recommended operating conditions
Table 1. Pinning
Pin Description Simplified outline Graphic symbol
1 ESD protection I/O channel 1
2 ground
3 ESD protection I/O channel 1
4 ESD protection I/O channel 2
5 supply voltage
6 ESD protection I/O channel 2
132
4
56 3
RR
65
2
001aaj950
1 4
Table 2. Ordering information
Type number Package
Name Description Version
IP4234CZ6 TSOP6 plastic surface-mounted package (TSOP6); 6 leads SOT457
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VIinput voltage GND −0.5 +5.5 V
Vesd electrostatic
discharge voltage all pins; IEC 61000-4-2
level 4; contact discharge −15 +15 kV
PPP peak pulse power tp = 8/20 µs; IEC 61000-4-5
15 A lightning - 100 W
Tstg storage temperature −55 +125 °C
Table 4. Operating conditions
Symbol Parameter Conditions Min Max Unit
Tamb ambient temperature −40 +85 °C
IP4234CZ6_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 16 April 2009 3 of 9
NXP Semiconductors IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
6. Characteristics
[1] Guaranteed by design.
7. Application information
7.1 Universal serial bus 2.0 protection
The IP4234CZ6 is optimized to protect a USB 2.0 port from ESD. The device is capable of
protecting both USB data lines and the VBUS supply. A typical application is shown in
Figure 1.
To avoid a short circuit on the data lines when VBUS is shut down, a back drive protection
diode can be attached to the IP4234CZ6.
Table 5. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
C(I/O-GND) input/output to ground
capacitance pins 1, 3, 4, 6; VI = 0 V;
f = 1 MHz; VCC = 3.0 V [1] - 2.5 - pF
C(zd-GND) Zener diode to ground
capacitance pin 5 to pin 2; VI= 0 V; f = 1 MHz;
VCC = 3.0 V [1] -40-pF
ILR reverse leakage
current pins 1, 3, 4, 6 to ground;
VI= 3.0 V - - 100 nA
VBRzd Zener diode
breakdown voltage pin 5 to pin 2; I = 1 mA 6 - 9 V
VFforward voltage [1] - 0.7 - V
Rsseries resistance Tcase =25°C[1] - 0.5 - Ω
Fig 1. Typical application of IP4234CZ6
R
654
123
R
001aaj951
VBUS
D−
D+
GND
USB 2.0/
IEEE1394
TRANSCEIVER
IP4234CZ6_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 16 April 2009 4 of 9
NXP Semiconductors IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
8. Package outline
Fig 2. Package outline SOT457 (TSOP6)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT457 SC-74
wBM
bp
D
e
pin 1
index A
A1
Lp
Q
detail X
HE
E
vMA
AB
y
scale
c
X
132
4
56
0 1 2 mm
Plastic surface-mounted package (TSOP6); 6 leads SOT457
UNIT A1bpcDEHELpQywv
mm 0.1
0.013 0.40
0.25 3.1
2.7
0.26
0.10 1.7
1.3
e
0.95 3.0
2.5 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.6
0.2 0.33
0.23
A
1.1
0.9
05-11-07
06-03-16
IP4234CZ6_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 16 April 2009 5 of 9
NXP Semiconductors IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
9. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
9.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
9.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
•Through-hole components
•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•Board specifications, including the board finish, solder masks and vias
•Package footprints, including solder thieves and orientation
•The moisture sensitivity level of the packages
•Package placement
•Inspection and repair
•Lead-free soldering versus SnPb soldering
9.3 Wave soldering
Key characteristics in wave soldering are:
•Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
•Solder bath specifications, including temperature and impurities
IP4234CZ6_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 16 April 2009 6 of 9
NXP Semiconductors IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
9.4 Reflow soldering
Key characteristics in reflow soldering are:
•Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 3) than a SnPb process, thus
reducing the process window
•Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
•Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 6 and 7
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 3.
Table 6. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350 ≥ 350
< 2.5 235 220
≥ 2.5 220 220
Table 7. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
IP4234CZ6_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 16 April 2009 7 of 9
NXP Semiconductors IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”
.
10. Abbreviations
11. Revision history
MSL: Moisture Sensitivity Level
Fig 3. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 8. Abbreviations
Acronym Description
DVI Digital Video Interface
ESD ElectroStatic Discharge
HDMI High Definition Multimedia interface
LAN Local Area Network
PCS Personal Computing System
PDA Personal Digital Assistant
RoHS Restriction of Hazardous Substances
USB Universal Serial Bus
WAN Wide Area Network
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
IP4234CZ6_1 20090416 Product data sheet - -
IP4234CZ6_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 16 April 2009 8 of 9
NXP Semiconductors IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors IP4234CZ6
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 April 2009
Document identifier: IP4234CZ6_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Recommended operating conditions. . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Application information. . . . . . . . . . . . . . . . . . . 3
7.1 Universal serial bus 2.0 protection . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
9 Soldering of SMD packages . . . . . . . . . . . . . . . 5
9.1 Introduction to soldering . . . . . . . . . . . . . . . . . . 5
9.2 Wave and reflow soldering . . . . . . . . . . . . . . . . 5
9.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . . 5
9.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . . 6
10 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 7
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
