SFH 4258
SFH 4259
IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (850 nm)
Lead (Pb) Free Product - RoHS Compliant
gemäß OS-PCN-2009-021-A2
acc. to OS-PCN-2009-021-A2
2012-05-21 1
Wesentliche Merkmale
• Infrarot LED mit hoher Ausgangsleistung
• Halbwinkel SFH 4258: ± 15°
• Halbwinkel SFH 4259: ± 25°
• Hohe Bestromung bei hohen Temperaturen
möglich
• Kurze Schaltzeiten
Anwendungen
• Infrarotbeleuchtung für Kameras
• IR-Datenübertragung
• Sensorik
Sicherheitshinweise
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare Infrarot-
Strahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheits-
richtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4258 Q65110A2975 ≥ 40 (typ. 110)
SFH 4259 Q65110A2464 ≥ 25 (typ. 55)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
Features
• High Power Infrared LED
• Half angle SFH 4258: ± 15°
• Half angle SFH 4259: ± 25°
• High forward current allowed at high
temperature
• Short switching times
Applications
• Infrared Illumination for cameras
• IR Data Transmission
• Optical sensors
Safety Advices
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
2012-05-21 2
SFH 4258, SFH 4259
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top , Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage
VR5 V
Vorwärtsgleichstrom
Forward current
IF100 mA
Stoßstrom, tp = 100 μs, D = 0
Surge current
IFSM 1 A
Verlustleistung
Power dissipation
Ptot 180 mW
Wärmewiderstand Sperrschicht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
RthJA
RthJS
300
140
K/W
K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA
λpeak 860 nm
Schwerpunkt-Wellenlänge der Strahlung
Centroid wavelength
IF = 100 mA
λcentroid 850 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA
Δλ 30 nm
Abstrahlwinkel
Half angle
SFH 4258
SFH 4259
ϕ
ϕ
± 15
± 25
Grad
deg.
SFH 4258, SFH 4259
2012-05-21 3
Aktive Chipfläche
Active chip area
A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
0.3 × 0.3 mm²
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr, tf12 ns
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
VF
VF
1.5 (< 1.8)
2.4 (< 3.0)
V
V
Sperrstrom
Reverse current
IRnot designed for
reverse
operation
μA
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe typ 70 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe, IF = 100 mA
TCI– 0.5 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV– 0.7 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
TCλ+ 0.3 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
2012-05-21 4
SFH 4258, SFH 4259
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol Werte
Values
Einheit
Unit
SFH 4258
-U
SFH 4258
-V
SFH 4258
-AW
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie max
40
80
63
125
100
200
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1A, tp = 25 µs
Ie typ. 480 750 1200 mW/sr
SFH 4259
-T
SFH 4259
-U
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie max
25
50
40
80
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1A, tp = 25 µs
Ie typ. 300 480 mW/sr
1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /
Only one bin in one packing unit (variation lower 2:1)
SFH 4258, SFH 4259
2012-05-21 5
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚ OHL00021
50˚
60˚
70˚
80˚
90˚
100˚
0 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
SFH 4258
SFH 4259
OHL00999
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
SFH 4258, SFH 4259
2012-05-21 6
Relative Spectral Emission
Irel = f (λ)
Forward Current IF = f (VF)
Single pulse, tp = 100 μs
700
0nm
%
OHF04132
20
40
60
80
100
950750 800 850
I
rel
λ
OHL01713
F
I
10
-4
0.5 1 1.5 2 2.5 V3
10
0
A
0
F
V
-1
10
5
5
10
-2
-3
5
10
Radiant Intensity
Single pulse, tp = 25 μs
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °,
duty cycle D = parameter
Ie
Ie 100 mA = f (IF)
OHL01715
10
-3
mA
10
1
0
10
5
5
10
-1
-2
5
10
e
e (100 mA)
I
I
I
F
0
10
1
10
2
10
3
1055
Max. Permissible Forward Current
IF = f (TA), RthJA = 300 K/W
0
0˚C
T
I
F
mA
OHL01716
A
20
40
60
80
100
120
20 40 60 80 120
SFH 4258, SFH 4259
2012-05-21 7
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
Gehäuse / Package Power TOPLED® mit Linse, klarer Verguss / Power TOPLED® with lens, clear
resin
Anschlussbelegung
pin configuration
1 = Kathode / cathode
2/3/4 = Anode / anode
3.8 (0.150) max.
ø2.55 (0.100)
0.13 (0.005)
0.18 (0.007)
0.1 (0.004) typ
1.1 (0.043)
0.5 (0.020)
2.6 (0.102)
3.4 (0.134)
3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
3.0 (0.118)
3.7 (0.146)
3.3 (0.130)
4˚±1
GPLY6127
0.4 (0.016)
0.6 (0.024)
0.9 (0.035)
0.7 (0.028)
1.7 (0.067)
2.1 (0.083)
0.6 (0.024)
0.8 (0.031)
34
12
ø2.60 (0.102)
Package marking
(2.4) (0.095)
SFH 4258
3.5 (0.138) max.
ø2.55 (0.100)
0.13 (0.005)
0.18 (0.007)
0.1 (0.004) typ
1.1 (0.043)
0.5 (0.020)
2.6 (0.102)
3.4 (0.134)
3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
3.0 (0.118)
3.7 (0.146)
3.3 (0.130)
4˚±1
GPLY6128
0.4 (0.016)
0.6 (0.024)
0.9 (0.035)
0.7 (0.028)
1.7 (0.067)
2.1 (0.083)
34
12
ø2.60 (0.102)
Package marking
(2.4) (0.095)
SFH 4259
2012-05-21 8
SFH 4258, SFH 4259
Empfohlenes Lötpaddesign Reflow Löten
Recommended Solder Pad Design Reflow Soldering
Empfohlenes Lötpaddesign Wellenlöten TTW
Recommended Solder Pad Design TTW Soldering
OHFP3021
Padgeometrie für
verbesserte Wärmeableitung
improved heat dissipation
Paddesign for
Lötstoplack
Solder resist
0.8 (0.031)
3.7 (0.146)
1.1 (0.043)
2.3 (0.091)
3.3 (0.130)
1.5 (0.059)
11.1 (0.437)
Cu Fläche / 16 mm per pad
2
Cu-area
_
<
3.3 (0.130)
0.7 (0.028)
OHPY3040
6.1 (0.240)
2.8 (0.110)
2 (0.079)
3 (0.118)
6 (0.236)
2 (0.079)
1 (0.039)
2.8 (0.110) 0.5 (0.020)
Solder resist
Lötstoplack
PCB-direction
Bewegungsrichtung
der Platine
2 (0.079)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
2
Cu Fläche / > 16 mm per pad
Cu-area
SFH 4258, SFH 4259
2012-05-21 9
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020D.01)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020D.01)
Profileigenschaften
Profile Feature
Bleifreier Aufbau / Pb-Free Assembly (SnAgCu)
Empfehlung / Recommendation Grenzwerte / Max. Ratings
Aufheizrate zum Vorwärmen*) /
Ramp-up rate to preheat*) 25 °C to 150 °C
2 K / s 3 K / s
Zeit ts von TSmin bis TSmax /
Time ts from TSmin to TSmax 150 °C to 200 °C
100 s min. 60 s max. 120 s
Aufheizrate zur Spitzentemperatur*) /
Ramp-up rate to peak*) 180 °C to TP
2 K / s 3 K / s
Liquidustemperatur TL /
Liquidus temperature TL
217 °C
Zeit tL über TL / Time tL above TL80 s max. 100 s
Spitzentemperatur TP / Peak temperature TP245 °C max. 250 °C
Verweilzeit tP innerhalb des spezifizierten
Spitzentemperaturbereichs TP - 5 K / Time tP within the
specified peak temperature range TP - 5 K
20 s min. 10 s max. 30 s
Abkühlrate*) / Ramp-down rate*) TP to 100 °C 3 K / s 4 K / s maximum
Zeitspanne von 25 °C bis zur Spitzentemperatur /
Time from 25 °C to peak temperature
max. 8 min.
Alle Temperaturen beziehen sich auf die Bauteilmitte, jeweils auf der Bauteiloberseite gemessen / All temperatures refer to the center of
the package, measured on the top of the package
* Steigungsberechnung ΔT/Δt: Δt max. 5 s; erfüllt über den gesamten Temperaturbereich / slope calculation ΔT/Δt: Δt max. 5 s; fulfillment
for the whole T-range
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
2012-05-21 10
SFH 4258, SFH 4259
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLY0598
0
0
50 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves