General Description
The MAX17000A pulse-width modulation (PWM) con-
troller provides a complete power solution for notebook
DDR, DDR2, and DDR3 memory. It comprises a step-
down controller, a source-sink LDO regulator, and a ref-
erence buffer to generate the required VDDQ, VTT, and
VTTR rails.
The VDDQ rail is supplied by a step-down converter
using Maxim’s proprietary Quick-PWM™ controller. The
high-efficiency, constant-on-time PWM controller han-
dles wide input/output voltage ratios (low duty-cycle
applications) with ease and provides 100ns response
to load transients while maintaining a relatively constant
switching frequency. The Quick-PWM architecture cir-
cumvents the poor load-transient timing problems of
fixed-frequency current-mode PWMs while also avoid-
ing the problems caused by widely varying switching
frequencies in conventional constant-on-time and con-
stant-off-time PWM schemes. The controller senses the
current to achieve an accurate valley current-limit pro-
tection. It is also built in with overvoltage, undervoltage,
and thermal protections. The MAX17000A can be set to
run in three different modes: power-efficient SKIP
mode, low-noise forced-PWM mode, and standby
mode to support memory in notebook computer stand-
by operation. The switching frequency is programma-
ble from 200kHz to 600kHz to allow small components
and high efficiency. The VDDQ output voltage can be
set to a preset 1.8V or 1.5V, or be adjusted from 1.0V to
2.5V by an external resistor-divider. This output has 1%
accuracy over line-and-load operating range.
The MAX17000A includes a ±2A source-sink LDO reg-
ulator for the memory termination VTT rail. This VTT reg-
ulator has a ±5mV deadband that either sources or
sinks, ideal for the fast-changing load burst present in
memory termination applications. This feature also
reduces output capacitance requirements.
The VTTR reference buffer sources and sinks ±3mA,
providing the reference voltage needed by the memory
controller and devices on the memory bus.
The MAX17000A is available in a 24-pin, 4mm x 4mm,
thin QFN package.
Applications
Notebook Computers
DDR, DDR2, and DDR3 Memory Supplies
SSTL Memory Supplies
Features
oSMPS Regulator (VDDQ)
Quick-PWM with 100ns Load-Step Response
Output Voltages—Preset 1.8V, 1.5V, or
Adjustable 1.0V to 2.5V
1% VOUT Accuracy Over Line and Load
26V Maximum Input Voltage Rating
Accurate Valley Current-Limit Protection
200kHz to 600kHz Switching Frequency
oSource/Sink Linear Regulator (VTT)
±2A Peak Source/Sink
Low-Output Capacitance Requirement
Output Voltages-Preset VDDQ/2 or REFIN
Adjustable from 0.5V to 1.5V
oSoft-Start/Soft-Shutdown
oSMPS Power-Good Window Comparator
oVTT Power-Good Window Comparator
oSelectable Overvoltage Protection
oUndervoltage/Thermal Protections
o±3mA Reference Buffer (VTTR)
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
________________________________________________________________
Maxim Integrated Products
1
23
24
22
21
8
7
9
PGOOD1
VTTS
VTTR
10
OVP
BST
DH
TON
DL
CSH
1 2
SKIP
456
*EP
*EXPOSED PAD
1718 16 14 13
VCC
SHDN
REFIN
VTTI
VTT
PGND2
MAX17000A
PGOOD2 LX
3
15
AGND
20 11 FB
PGND1
19 12 CSL
VDD
THIN QFN
4mm x 4mm
TOP VIEW
STDBY
Pin Configuration
Ordering Information
19-4307; Rev 2; 11/10
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
*
EP = Exposed pad.
PART TEMP RANGE PIN-PACKAGE
MAX17000AETG+ -40°C to +85°C 24 Thin QFN-EP*
Quick-PWM is a trademark of Maxim Integrated Products, Inc.
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = 12V, VCC = VDD = VSHDN = VREFIN = 5V, VCSL = 1.8V, STDBY = SKIP = AGND, TA= 0°C to +85°C, unless otherwise noted.
Typical values are at TA= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
TON to PGND1 .......................................................-0.3V to +28V
VDD to PGND1..........................................................-0.3V to +6V
VCC to VDD ............................................................-0.3V to +0.3V
OVP to AGND ...........................................................-0.3V to +6V
SHDN, STDBY, SKIP to AGND .................................-0.3V to +6V
REFIN, FB, PGOOD1,
PGOOD2 to AGND ................................-0.3V to (VCC + 0.3V)
CSH, CSL to AGND....................................-0.3V to (VCC + 0.3V)
DL to PGND1..............................................-0.3V to (VDD + 0.3V)
BST to PGND1...........................................................-1V to +34V
BST to LX..................................................................-0.3V to +6V
DH to LX....................................................-0.3V to (VBST + 0.3V)
BST to VDD .............................................................-0.3V to +26V
VTTI to PGND2 .........................................................-0.3V to +6V
VTT to PGND2 ............................................-0.3V to (VTTI + 0.3V)
VTTS to AGND............................................-0.3V to (VCC + 0.3V)
VTTR to AGND ..........................................-0.3V to (VCSL + 0.3V)
PGND1, PGND2 to AGND.....................................-0.3V to +0.3V
Continuous Power Dissipation (TA= +70°C)
24-Pin, 4mm x 4mm Thin QFN
(derated 27.8mW/°C above +70°C) ..........................2222mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
PWM CONTROLLER
VIN 3 26
Input Voltage Range VCC, VDD 4.5 5.5 V
FB = AGND 1.485 1.500 1.515
FB = VCC 1.782 1.800 1.818
Output-Voltage Accuracy VCSL VIN = 4.5V to 26V,
SKIP = VCC FB = Adj 0.99 1.000 1.01
V
Output-Voltage Range VCSL 1 2.7 V
Load Regulation Error VCSH - VCSL = 0 to 18mV, SKIP = VCC 0.1 %
Line Regulation Error VDD = 4.5V to 5.5V, VIN = 4.5V to 26V 0.25 %
Soft-Start Ramp Time tSSTART Rising edge of SHDN 1.4 2.1 ms
Soft-Stop Ramp Time tSSTOP Falling edge of SHDN 2.8 ms
Soft-Stop Threshold 25 mV
RTON = 96.75k (600kHz),
167ns nominal -15 +15
RTON = 200k (300kHz),
333ns nominal -10 +10
On-Time Accuracy (Note 2) tON VIN = 12V,
VCSL = 1.2V
RTON = 303.25k
(200kHz), 500ns nominal -15 +15
%
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
_______________________________________________________________________________________ 3
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Minimum Off-Time tOFF(MIN) (Note 2) 250 350 ns
Quiescent Supply Current (VDD) IDD FB forced above 1.0V, STDBY = AGND or
VCC, TA = +25°C 0.01 1.00 µA
FB forced above 1.0V (PWM, VTT, and
VTTR blocks); STDBY = VCC 2 4 mA
Quiescent Supply Current (VCC) ICC FB forced above 1.0V (PWM and VTTR
blocks); STDBY = AGND 900 1500 µA
Shutdown Supply Current
(VDD + VCC)ICC + IDD SHDN = AGND, TA = +25°C 0.01 5 µA
TON Shutdown Current ITON
SHDN = AGND, VIN = 26V, VDD = 0 or 5V,
TA = +25°C 0.01 1.00 µA
LINEAR REGULATOR (VTT)
VTTI Input Voltage Range VTTI 1.0 2.8 V
VTTI Supply Current IVTTI VTTI = 2.8V, REFIN = 1.4V, no load 10 50 µA
VTTI Shutdown Current SHDN = AGND, TA = +25°C 10 µA
REFIN Input Bias Current VTTI = 2.8V, REFIN = 1.4V, TA = +25°C -50 +50 nA
REFIN Range VREFIN 0.5 1.5 V
REFIN Disable Threshold VCC -
0.3 V
High-side on-resistance
(source, IVTT = 0.1A) 0.12 0.25
VTT Internal MOSFET
Low-side on-resistance (sink, IVTT = 0.1A) 0.18 0.36
VREFIN = 1V,
IVTT = +50µA -5 +5
VTT Output-Accuracy
Source Load
(VREFIN - 5mV) or
(VCSL/2 - 5mV) to
VTTS, VTT = VTTS VREFIN = 0.5V to 1.5V,
IVTT = +300mA -5
mV
VREFIN = 1V,
IVTT = -50µA -5 +5
VTT Output-Accuracy
Sink Load
(VREFIN + 5mV) or
(VCSL/2 + 5mV) to
VTTS, VTT = VTTS VREFIN = 0.5V to 1.5V,
IVTT = -300mA +5
mV
VTT Load Regulation -50µA to -1A IVTT +50µA to +1A 13 17 mV/A
VTT Line Regulation 1.0V VTTI 2.8V, IVTT = ±100mA 1 mV
Source 2 4
VTT Current Limit Sink -4 -2
A
VTT Current-Limit Soft-Start Time With respect to internal VTT_EN signal 160 µs
VTT Discharge MOSFET OVP = VCC 16
VTTS Input Current TA = +25°C 0.1 1.0 µA
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 12V, VCC = VDD = VSHDN = VREFIN = 5V, VCSL = 1.8V, STDBY = SKIP = AGND, TA= 0°C to +85°C, unless otherwise noted.
Typical values are at TA= +25°C.) (Note 1)
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 12V, VCC = VDD = VSHDN = VREFIN = 5V, VCSL = 1.8V, STDBY = SKIP = AGND, TA= 0°C to +85°C, unless otherwise noted.
Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
REFERENCE BUFFER (VTTR)
IVTT = ±1mA -10 +10
VTTR Output Accuracy (Adj) REFIN to VTTR IVTT = ±3mA -20 +20
IVTT = ±1mA -10 +10
VTTR Output Accuracy (Preset) VCSL/2 to VTTR IVTT = ±3mA -20 +20
mV
VTTR Maximum
Recommended Current Source/sink 5 mA
FAULT DETECTION (SMPS)
SMPS OVP and PGOOD1
Upper Trip Threshold 12 15 18 %
SMPS OVP and PGOOD1
Upper Trip Threshold
Fault-Propagation Delay
tOVP FB forced 25mV above trip threshold 10 µs
SMPS Output Undervoltage
Fault-Propagation Delay tUVP 200 µs
SMPS PGOOD1 Lower Trip
Threshold Measured at FB, hysteresis = 25mV -12 -15 -18 %
PGOOD1 Lower Trip Threshold
Propagation Delay tPGOOD1 FB forced 50mV below PGOOD1 trip
threshold 10 µs
PGOOD1 Output Low Voltage ISINK = 3mA 0.4 V
PGOOD1 Leakage Current IPGOOD1 FB = 1V (PGOOD1 high impedance),
PGOOD1 forced to 5V, TA = +25°C 1 µA
TON POR Threshold VPOR(IN) Rising edge, PWM disabled below this level;
hysteresis = 200mV 3.0 V
FAULT DETECTION (VTT)
PGOOD2 Upper Trip Threshold Hysteresis = 25mV 8 10 13 %
PGOOD2 Lower Trip Threshold Hysteresis = 25mV -13 -10 -8 %
PGOOD2 Propagation Delay tPGOOD2 VTTS forced 50mV beyond PGOOD2
trip threshold 10 µs
PGOOD2 Fault Latch Delay VTTS forced 50mV beyond PGOOD2
trip threshold 5 ms
PGOOD2 Output Low Voltage ISINK = 3mA 0.4 V
PGOOD2 Leakage Current IPGOOD2 VTTS = VREFIN (PGOOD2 high impedance),
PGOOD2 forced to 5V, TA = +25°C 1 µA
FAULT DETECTION
Thermal-Shutdown Threshold TSHDN Hysteresis = 15°C 160 °C
VCC Undervoltage Lockout
Threshold VUVLO(VCC) Rising edge, IC disabled below this level
hysteresis = 200mV 3.8 4.1 4.4 V
CSL Discharge MOSFET OVP = VCC 16
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 12V, VCC = VDD = VSHDN = VREFIN = 5V, VCSL = 1.8V, STDBY = SKIP = AGND, TA= 0°C to +85°C, unless otherwise noted.
Typical values are at TA= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CURRENT LIMIT
Valley Current-Limit Threshold VLIMIT VCSH - VCSL 17 20 25 mV
Current-Limit Threshold
(Negative) VNEG VCSH - VCSL,SKIP = VCC -23 mV
Current-Limit Threshold
(Zero Crossing) VZX VPGND1 - VLX 1 mV
SMPS GATE DRIVERS
DH Gate-Driver On-Resistance RDH BST - LX forced to 5V 1.5 5.0
DL high 1.5 5.0
DL Gate-Driver On-Resistance RDL DL low 0.6 3.0
DH Gate-Driver Source/
Sink Current IDH DH forced to 2.5V, BST - LX forced to 5V 1 A
IDL(SRC) DL forced to 2.5V 1
DL Gate-Driver Source/
Sink Current IDL(SNK) DL forced to 2.5V 3 A
DL rising, TA = +25°C 10 25
Dead Time tDEAD DL falling, TA = +25°C 15 35 ns
Internal BST Switch
On-Resistance RBST IBST = 10mA,
VDD = 5V internal design target 4.5
LX, BST Leakage Current VBST = VLX = 26V, SHDN = AGND,
TA = +25°C 0.001 20 µA
INPUTS AND OUTPUTS
Logic-Input Threshold SHDN,STDBY,SKIP, OVP, rising edge
hysteresis = 300mV/600mV (min/max) 1.30 1.65 2.00 V
Logic-Input Current SHDN,STDBY,SKIP = 0 or VCC,
TA = +25°C -1 +1 µA
Input Leakage Current CSH = 0 or VCC, TA = +25°C -1 +1 µA
Input Bias Current CSL = 0 or VCC 55 100 µA
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
6 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS
(VIN = 12V, VCC = VDD = VSHDN = VREFIN = 5V, VCSL = 1.8V, STDBY = SKIP = AGND, TA= -40°C to +85°C, unless otherwise noted.)
(Note 1)
PARAMETER SYMBOL CONDITIONS MIN MAX UNITS
PWM CONTROLLER
VIN 3 26
Input Voltage Range VCC, VDD 4.5 5.5
V
FB = AGND 1.485 1.520
FB = VCC 1.782 1.820
Output-Voltage Accuracy VCSL VIN = 4.5V to 26V,
SKIP = VCC FB = Adj 0.990 1.020
V
RTON = 96.75k
(600kHz), 167ns
nominal
-15 +15
RTON = 200k
(300kHz), 333ns
nominal
-10 +10
On-Time Accuracy (Note 2) tON VIN = 12V,
VCSL = 1.2V
RTON = 303.25k
(200kHz), 500ns
nominal
-15 +15
%
Minimum Off-Time tOFF(MIN) (Note 2) 350 ns
FB forced above 1.0V (PWM, VTT, and
VTTR blocks); STDBY = VCC 4 mA
Quiescent Supply Current (VCC) ICC FB forced above 1.0V (PWM and VTTR
blocks); STDBY = AGND 1500 µA
LINEAR REGULATOR (VTT)
VTTI Input Voltage Range VVTTI 1.0 2.8 V
VTTI Supply Current IVTTI VTTI = 2.8V, REFIN = 1.4V, no load 50 µA
REFIN Range VREFIN 0.5 1.5 V
REFIN Disable Threshold VCC -
0.3 V
High-side on-resistance (source, IVTT = 0.1A) 0.25
VTT Internal MOSFET Low-side on-resistance (sink, IVTT = 0.1A) 0.36
VTT Load Regulation -50µA to -1A IVTT +50µA to +1A 17 mV/A
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
_______________________________________________________________________________________ 7
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 12V, VCC = VDD = VSHDN = VREFIN = 5V, VCSL = 1.8V, STDBY = SKIP = AGND, TA= -40°C to +85°C, unless otherwise noted.)
(Note 1)
PARAMETER SYMBOL CONDITIONS MIN MAX UNITS
REFERENCE BUFFER (VTTR)
IVTT = ±1mA -10 +10
VTTR Output Accuracy (Adj) REFIN to VTTR IVTT = ±3mA -20 +20 mV
IVTT = ±1mA -10 +10
VTTR Output Accuracy (Preset) VCSL/2 to VTTR IVTT = ±3mA -20 +20 mV
FAULT DETECTION (SMPS)
PGOOD1 Output Low Voltage ISINK = 3mA 0.4 V
FAULT DETECTION (VTT)
PGOOD2 Output Low Voltage ISINK = 3mA 0.4 V
FAULT DETECTION
VCC Undervoltage-Lockout
Threshold VUVLO(VCC) Rising edge, IC disabled below this level;
hysteresis = 200mV 4.0 4.4 V
CURRENT LIMIT
Valley Current-Limit Threshold VLIMIT VCSH - VCSL 15 25 mV
SMPS GATE DRIVERS
DH Gate-Driver On-Resistance RDH BST - LX forced to 5V 5
DL high 5
DL Gate-Driver On-Resistance RDL DL low 3
DL rising 10
Dead Time tDEAD DL falling 15 ns
INPUTS AND OUTPUTS
Logic-Input Threshold SHDN,STDBY,SKIP OVP, rising edge
hysteresis = 300mV/600mV (min/max) 1.3 2 V
Note 1: Limits are 100% production tested at TA= +25°C. Maximum and minimum limits over temperature are guaranteed by design
and characterization.
Note 2: On-time and off-time specifications are measured from 50% point at the DH pin with LX = GND, VBST = 5V, and a 250pF
capacitor connected from DH to LX. Actual in-circuit times might differ due to MOSFET switching speeds.
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
8 _______________________________________________________________________________________
Typical Operating Characteristics
(MAX17000A Circuit of Figure 1, VIN = 12V, VDD = VCC = 5V, SKIP = GND, TA = +25°C, unless otherwise noted.)
SMPS 1.5V EFFICIENCY
vs. LOAD CURRENT
MAX17000A toc01
LOAD CURRENT (A)
EFFICIENCY (%)
10.1
20
30
40
50
60
70
80
90
100
10
0.01 10
VIN = 7V
SKIP MODE
STDBY = LOW
SKIP MODE
STDBY = HIGH PWM MODE
STDBY = HIGH OR LOW
SMPS 1.5V EFFICIENCY
vs. LOAD CURRENT
MAX17000A toc02
LOAD CURRENT (A)
EFFICIENCY (%)
10.1
20
30
40
50
60
70
80
90
100
10
0.01 10
VIN = 12V
SKIP MODE
STDBY = LOW
SKIP MODE
STDBY = HIGH PWM MODE
STDBY = HIGH OR LOW
SMPS 1.5V EFFICIENCY
vs. LOAD CURRENT
MAX17000A toc03
LOAD CURRENT (A)
EFFICIENCY (%)
10.1
20
30
40
50
60
70
80
90
100
10
0.01 10
VIN = 20V
SKIP MODE
STDBY = LOW
SKIP MODE
STDBY = HIGH
PWM MODE
STDBY = HIGH OR LOW
SMPS 1.5V OUTPUT VOLTAGE
vs. LOAD CURRENT
MAX17000A toc04
LOAD CURRENT (A)
OUTPUT VOLTAGE (V)
0.1 10.01
1.50
1.51
1.49
0.001 10
PWM MODE
VIN = 12V
SKIP MODE
SMPS SWITCHING FREQUENCY
vs. LOAD CURRENT
MAX17000A toc05
LOAD CURRENT (A)
SWITCHING FREQUENCY (kHz)
4682
100
50
200
150
300
250
350
0
010
VIN = 12V
VOUT = 1.5V
PWM MODE
SKIP MODE
SMPS VALLEY-CURRENT LIMIT
vs. INPUT VOLTAGE
MAX17000A toc06
INPUT VOLTAGE (V)
CURRENT LIMIT (A)
12 16 20 248
9.75
10.00
10.25
10.50
9.50
428
RSENSE = 2mΩ
NO-LOAD SUPPLY CURRENT
vs. INPUT VOLTAGE
MAX17000A toc07
INPUT VOLTAGE (V)
SUPPLY CURRENT (mA)
12 16 20 248
0.1
1
10
100
0.01
428
PWM MODE, ICC + IDD
STDBY = HIGH, SKIP MODE, ICC + IDD
STDBY = LOW, SKIP MODE, ICC + IDD
SKIP MODE, IIN
PWM MODE, IIN
NO LOAD
PRESET 1.5V OUTPUT
VOLTAGE DISTRIBUTION
MAX17000A toc08
OUTPUT VOLTAGE (V)
SAMPLE PERCENTAGE (%)
1.500 1.5051.495
10
20
30
40
50
0
1.490 1.510
SAMPLE SIZE = 150 TA = +85°C
TA = +25°C
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
_______________________________________________________________________________________ 9
STARTUP WAVEFORM
(HEAVY LOAD)
MAX17000A toc09
200µs/div
PGOOD1
SHDN: 5V/div
VDDQ: 500mV/div
VTT: 500mV/div
VTTR: 500mV/div
PGOOD1: 2V/div
ILX: 5A/div
DL: 5V/div
RLOAD = 0.25Ω
SKIP = GND
VTTR
VTT
VDDQ
DL
ILX
SHDN
SHUTDOWN WAVEFORM
(DISCHARGE MODE ENABLED)
MAX17000A toc10
400µs/div
DL
PGOOD2: 5V/div
PGOOD1: 5V/div
SHDN: 10V/div
ILX: 2A/div
DL: 5V/div
VDDQ: 2V/div
VTT: 1V/div
VTTR: 1V/div
VTTR
VTT
VDDQ
PGOOD1
PGOOD2
ILX
SHDN
STANDBY TRANSITION WAVEFORM
MAX17000A toc11
100µs/div
DL
TON
TON: 1V/div
DL: 5V/div
LX: 10V/div
ILX: 2A/div
STDBY: 5V/div
VDDQ: 1V/div
VTT: 1V/div
VTT
VDDQ
ILX
LX
STDBY IVTT = 50mA
STANDBY TRANSITION WAVEFORM
MAX17000A toc12
10µs/div
DL
TON
DL: 5V/div
LX: 10V/div
ILX: 2A/div
STDBY: 5V/div
VDDQ: 1V/div
VTT: 1V/div
TON: 1V/div
VTT
VDDQ
ILX
LX
STDBY
SMPS LOAD-TRANSIENT RESPONSE
(PWM MODE)
MAX17000A toc13
20µs/div
ILOAD: 5A/div
ILX: 5A/div
VDDQ: 50mV/div
LX: 10V/div
VDDQ
ILX
ILOAD
LX
SMPS LOAD-TRANSIENT RESPONSE
(SKIP MODE)
MAX17000A toc14
20µs/div
ILOAD: 5A/div
ILX: 5A/div
VDDQ: 50mV/div
LX: 10V/div
VDDQ
ILX
ILOAD
LX
Typical Operating Characteristics (continued)
(MAX17000A Circuit of Figure 1, VIN = 12V, VDD = VCC = 5V, SKIP = GND, TA = +25°C, unless otherwise noted.)
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
10 ______________________________________________________________________________________
Typical Operating Characteristics (continued)
(MAX17000A Circuit of Figure 1, VIN = 12V, VDD = VCC = 5V, SKIP = GND, TA = +25°C, unless otherwise noted.)
OUTPUT OVERLOAD WAVEFORM
MAX17000A toc15
400µs/div
PGOOD2: 2V/div
PGOOD1: 2V/div
ILX: 10A/div
DL: 5V/div
VDDQ: 1V/div
VTT: 1V/div
VTTR: 1V/div
VDDQ
VTT
VTTR
DL
ILX
PGOOD2
PGOOD1
VTT VOLTAGE
vs. SOURCE/SINK LOAD CURRENT
MAX17000A toc16
LOAD CURRENT (A)
VTT VOLTAGE (V)
-0.5 0 0.5 1.51.0-1.5 -1.0
0.74
0.73
0.76
0.75
0.78
0.77
0.79
0.72
-2.0 2.0
VTTI = 1.5V
VTT OFFSET VOLTAGE DISTRIBUTION
AT 300mA LOAD
MAX17000A toc17
OFFSET VOLTAGE (mV)
SAMPLE PERCENTAGE (%)
-10.0 -7.5-12.5
10
20
30
40
50
0
-15.0 -5.0
SAMPLE SIZE = 150 TA = +85°C
TA = +25°C
VTT OVERLOAD FAULT WAVEFORMS
(5ms TIMER)
MAX17000A toc20
1ms/div
VTTR: 1V/div
PGOOD1: 2V/div
PGOOD2: 2V/div
DL: 5V/div
ILX: 2A/div
VDDQ: 2V/div
VTT: 1V/div
VDDQ
VTT
VTTR
DL
ILX
PGOOD1
PGOOD2
VTT SOURCE CURRENT LIMIT
MAX17000A toc18
CURRENT LIMIT (A)
SAMPLE PERCENTAGE (%)
3.0 3.52.5
10
20
30
40
50
0
2.0 4.0
SAMPLE SIZE = 150 TA = +85°C
TA = +25°C
VTT SINK CURRENT LIMIT
MAX17000A toc19
CURRENT LIMIT (A)
SAMPLE PERCENTAGE (%)
-3.0 -2.5-3.5
10
20
30
40
50
0
-4.0 -2.0
SAMPLE SIZE = 150 TA = +85°C
TA = +25°C
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 11
VTT LOAD-TRANSIENT RESPONSE (SOURCE)
IVTT BETWEEN 10mA AND 1.5A
MAX17000A toc21
20µs/div
IVTT: 1A/div
VTT: 20mV/div
VTT_ac
IVTT
VDDQ = 1.5V
VTT LOAD-TRANSIENT RESPONSE
(SINK)
MAX17000A toc22
20µs/div
IVTT: 1A/div
VTT: 20mV/div
VTT_ac
IVTT
VDDQ = 1.5V
VTT LOAD-TRANSIENT RESPONSE
(SOURCE-SINK)
MAX17000A toc23
20µs/div
IVTT: 1A/div
VTT: 50mV/div
VTT_ac
IVTT
VDDQ = 1.5V
VTTR OUTPUT VOLTAGE
vs. LOAD CURRENT
MAX17000A toc24
LOAD CURRENT (mA)
OUTPUT VOLTAGE (V)
-2 0 2 4-4
0.73
0.75
0.74
0.71
0.72
0.77
0.78
0.76
0.79
0.70
-6 6
Typical Operating Characteristics (continued)
(MAX17000A Circuit of Figure 1, VIN = 12V, VDD = VCC = 5V, SKIP = GND, TA = +25°C, unless otherwise noted.)
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
12 ______________________________________________________________________________________
Pin Description
PIN NAME FUNCTION
1 OVP
OVP Mode Control. This input selectively enables/disables the SMPS OV protection feature and
output discharge mode. When enabled, the SMPS OV protection feature is enabled. Connect OVP to
the following voltage levels for the desired function:
High (> 2.4V) = Enable SMPS OV protection, and SMPS and VTT discharge FETs.
Low (GND) = Disable SMPS OV protection, and SMPS and VTT discharge FETs.
2 PGOOD1
Open-Drain Power-Good Output. PGOOD1 is low when the SMPS output voltage is more than 15%
(typ) beyond the normal regulation point, in standby, in shutdown, and during soft-start.
After the soft-start circuit has terminated, PGOOD1 becomes high impedance if the SMPS output is
in regulation.
3 PGOOD2
Open-Drain Power-Good Output. PGOOD2 is low when the VTT output voltage is more than 10% (typ)
beyond the normal regulation point, in standby, in shutdown, and during soft-start.
After the SMPS soft-start circuit has terminated, PGOOD2 becomes high impedance if the VTT output
is in regulation.
4STDBY Standby Control Input. When SHDN is high and STDBY is low, the MAX17000A turns off the VTT output
(high-Z). When STDBY is high, normal SMPS operation resumes and the VTT output is enabled.
5 VTTS
Sense Pin for Termination Supply Output. Normally connected to the VTT pin to allow accurate
regulation to VCSL/2 or the REFIN voltage.
6 VTTR
Termination Reference Buffer Output. VTTR tracks VCSL/2 when REFIN is connected to VCC. VTTR
tracks VREFIN when a voltage between 0.5V to 1.5V is set at REFIN. Decouple VTTR to AGND with a
0.33µF ceramic capacitor.
7 PGND2 Power Ground for VTT. Connect PGND2 externally to the underside of the exposed pad.
8 VTT
Termination Power-Supply Output. Connect VTT to VTTS to regulate the VTT voltage to the VTTS
regulation setting.
9 VTTI
Termination Power-Supply Input. VTTI is the input power supply to the VTT linear regulator. Normally
connected to the output of the SMPS regulator for DDR applications.
10 REFIN
External Reference Input. REFIN sets the feedback regulation voltage (VTTR = VTTS = VREFIN) of the
MAX17000A.
Connect REFIN to VCC to use the internal VCSL/2 divider.
Connect a 0.5V to 1.5V voltage input to set the adjustable output for VTT, VTTS, and VTTR.
11 FB
Feedback Input for SMPS Output. Connect to VCC for a fixed +1.8V output or to AGND for a fixed
+1.5V output. For an adjustable output (1.0V to 2.7V), connect FB to a resistive divider from the
output voltage. FB regulates to +1.0V.
12 CSL
Negative Input of the PWM Output Current-Sense and Supply Input for VTTR. Connect CSL to the
negative side of the output current-sensing resistor or the filtering capacitor if the DC resistance of
the output inductor is utilized for current sensing.
CSL is also the path for the internal 16 discharge MOSFET when VCC UVLO occurs with OVP enabled.
13 CSH
Positive Input of the PWM Output Current Sense. Connect CSH to the positive side of the output
current-sensing resistor or the filtering capacitor if the DC resistance of the output inductor is
utilized for current sensing.
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 13
Pin Description (continued)
PIN NAME FUNCTION
14 TON
Switching Frequency Setting Input. An external resistor between the input power source and this
pin sets the switching frequency per phase according to the following equation:
TSW = CTON x (RTON + 6.5k)
where CTON = 16.26pF.
TON is high impedance in shutdown.
15 DH High-Side Gate-Driver Output. Swings from LX to BST. DH is low when in shutdown or UVLO.
16 LX Inductor Connection. Connect LX to the switched side of the inductor as shown in Figure 1.
17 BST
Boost Flying Capacitor Connection. Connect to an external 0.1µF, 6V capacitor as shown in Figure
1. The MAX17000A contains an internal boost switch.
18 DL Synchronous-Rectifier Gate-Driver Output. DL swings from VDD to PGND1.
19 VDD
Supply Voltage Input for the DL Gate Driver and 3.3V Reference/Analog Supply. Connect to the
system supply voltage (+4.5V to +5.5V). Bypass VDD to power ground with a 1µF or greater
ceramic capacitor.
20 PGND1 Power Ground. Ground connection for the low-side MOSFET gate driver.
21 AGND Analog Ground. Connect backside exposed pad to AGND.
22 SKIP
Pulse-Skipping Control Input. This input determines the mode of operation under normal steady-
state conditions and dynamic output-voltage transitions:
High (> 2.4V) = Forced-PWM operation
Low (AGND) = Pulse-skipping mode
23 VCC Controller Supply Voltage. Connect to a 4.5V to 5.5V source. Bypass VCC to AGND with a 1µF or
greater ceramic capacitor.
24 SHDN
Shutdown Control Input. Connect to VCC for normal operation. When SHDN is pulled low, the
MAX17000A slowly ramps down the output voltage to ground. When the internal target voltage
reaches 25mV, the controller forces DL low, and enters the low current (1µA) shutdown state.
When discharge mode is enabled by OVP (OVP = high), the CSL and VTT internal 16 discharge
MOSFETs are enabled in shutdown. When discharge mode is disabled by OVP (OVP = low), LX,
VTT, and VTTR are high impedance in shutdown.
A rising edge on SHDN clears the fault OV protection latch.
— EP Exposed Pad. Connect backside exposed pad to AGND.
MAX17000A
Standard Application Circuits
The MAX17000A standard application circuit (Figure 1)
generates the VDDQ, VTT, and VTTR rails for DDR,
DDR2, or DDR3 in a notebook computer. See Table 1 for
component selections. Table 2 lists the component man-
ufacturers. Table 3 is the operating mode truth table.
Complete DDR2 and DDR3 Memory
Power-Management Solution
14 ______________________________________________________________________________________
VOUT = 1.5V TO 1.8V AT 10A VOUT = 1.5V TO 1.8V AT 6A
COMPONENT VIN = 7V TO 20V (300kHz) VIN = 7V TO 16V (500kHz)
Input Capacitor (2x) 10µF, 25V
Taiyo Yuden TMK432BJ106KM
10µF, 25V
Taiyo Yuden TMK432BJ106KM
Output Capacitor (2x) 330µF, 2.5V ,12mΩ (C2 case)
SANYO 2R5TPE330MCC2
(2x) 220µF, 2.5V, 21mΩ (B2 case)
SANYO 2R5TPE220MLB
Inductor 1.4µH, 12A, 3.4mΩ (typ)
Sumida CDEP105(L)NP-1R4
1.4µH, 12A, 3.4mΩ (typ)
Sumida CDEP105(L)NP-1R4
Current-Sensing Resistor 2mΩ, 0.5W (2010)
Vishay WSL20102L000FEA
3mΩ, 0.5W (2010)
Vishay WSL20103L000FEA
MOSFETs
30V, 20A n-channel MOSFET (high side)
Fairchild FDMS8690;
30V, 40A n-channel MOSFET (low side)
Fairchild FDMS8660S
30V 20A n-channel MOSFET (high side)
Fairchild FDMS8690;
30V 40A n-channel MOSFET (low side)
Fairchild FDMS8660S
Table 1. Component Selection for Standard Applications
SUPPLIER PHONE WEBSITE
INDUCTORS
Dale (Vishay) 402-563-6866 (USA) www.vishay,com
NEC/TOKIN America, Inc. 510-324-4110 (USA) www.nec-tokinamerica.com
Panasonic Corp. 65-231-3226 (Singapore), 408-749-9714 (USA) www.panasonic.com
Sumida Corp. 408-982-9660 (USA) www.sumida.com
TOKO America, Inc. 858-675-8013 (USA) www.tokoam.com
CAPACITORS
AVX Corp. 843-448-9411 (USA) www.avxcorp.com
KEMET Corp. 408-986-0424 (USA) www.kemet.com
Panasonic Corp. 65-231-3226 (Singapore), 408-749-9714 (USA) www.panasonic.com
SANYO Electric Co., Ltd. 81-72-870-6310 (Japan), 619-661-6835 (USA) www.sanyodevice.com
Taiyo Yuden 03-3667-3408 (Japan), 408-573-4150 (USA) www.t-yuden.com
TDK Corp. 847-803-6100 (USA), 81-3-5201-7241 (Japan) www.component.tdk.com
SENSING RESISTORS
Vishay 402-563-6866 (USA) www.vishay,com
MOSFET
Fairchild Semiconductor 800-341-0392 (USA) www.fairchildsemi.com
DIODES
Central Semiconductor Corp. 631-435-1110 www.centralsemi.com
Nihon Inter Electronics Corp. 81-3-3343-84-3411 (Japan) www.niec.co.jp
Table 2. Component Suppliers
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 15
SHDN STDBY SKIP OPERATION
1 L H L H X
SMPS output ramps up in skip mode with a 1.4ms (typ) ramp time. PGOOD1 is held low until the
SMPS output is in regulation.
VTT and VTTR ramp up to the final voltage based on VCSL/2 or VREFIN. PGOOD2 is he ld low unti l
VTT is in regulation.
2 L H L X
SMPS output ramps up in skip mode with a 1.4ms ramp time. PGOOD1 is held low until the SMPS
output is in regulation.
VTT remains off throughout since STDBY is low. PGOOD2 stays low throughout.
VTTR ramps up to the final voltage based on VCSL/2 or VREFIN.
3 H L H X
Standby mode is exited and the full current capability of the MAX17000A is available.
VTT ramps up after the internal SMPS block is ready. VTT ramps to the final voltage based on
VCSL/2 or VREFIN.
PGOOD2 goes high when VTT is in regulation.
4 H H H
SMPS is in forced-PWM mode.
VTT and VTTR are enabled.
PGOOD1 is high when the SMPS output is in regulation.
PGOOD2 is high when VTT is in regulation.
5 H H L
SMPS is in skip mode.
VTT and VTTR are enabled.
PGOOD1 is high when the SMPS output is in regulation.
PGOOD2 is high when VTT is in regulation.
6 H L H
SMPS is in forced-PWM mode.
VTT is off and is in high impedance.
PGOOD2 is forced low.
VTTR is active and regulates to VCSL/2 or VREFIN.
7 H L L
SMPS is in skip mode.
VTT is off and is high impedance.
PGOOD2 is forced low.
VTTR is active and regulates to VCSL/2 or VREFIN.
8 H L H X Skip mode is exited as the MAX17000A ramps the output down to zero.
VTTR tracks VCSL/2 or VREFIN during shutdown. After the SMPS output reaches 25mV, DL goes low.
9 H L L X
Skip mode is exited as the MAX17000A ramps the output down to zero.
VTTR tracks VCSL/2 or VREFIN during shutdown. After the SMPS output reaches 25mV, DL goes
low. VTT is not enabled throughout soft-shutdown.
10 L X X
DL low. Internal16 discharge MOSFETs on CSL and VTT enabled if OVP is high, but disabled if
OVP is low.
Table 3. Operating Mode Truth Table
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
16 ______________________________________________________________________________________
Detailed Description
The MAX17000A complete DDR solution comprises a
step-down controller, a source-sink LDO regulator, and a
reference buffer. Maxim’s proprietary Quick-PWM pulse-
width modulator in the MAX17000A is specifically
designed for handling fast load steps while maintaining a
relatively constant operating frequency and inductor
operating point over a wide range of input voltages. The
Quick-PWM architecture circumvents the poor load-tran-
sient timing problems of fixed-frequency current-mode
PWMs, while also avoiding the problems caused by
widely varying switching frequencies in conventional con-
stant-on-time and constant-off-time PWM schemes.
Figure 1 is the MAX17000A standard application circuit
and Figure 2 is the MAX17000A functional diagram.
The MAX17000A includes a ±2A source-sink LDO reg-
ulator for the memory termination rail. The source-sink
regulator features a dead band that either sources or
sinks, ideal for the fast-changing short-period loads
presenting in memory termination applications. This
feature also reduces the VTT output capacitance
requirement down to 1µF, though load-transient
response can still require higher capacitance values
between 10µF and 20µF.
The reference buffer sources and sinks ±3mA, generating
a reference rail for use in the memory controller and
memory devices.
DH
VDD
VCC
TON
ON/OFF
FB
BST
VIN
7V TO 20V
VDDQ
+1.8V OR 1.5V
PGND1
DL
LX
CSL
CIN
NH
NL
RFBA
RFBB
CVTTI
CVTT
CVTTR
0.33µF
L1
REQ
CEQ
RC
D1
PGND2
VTTI
VTTR
VTTS
+5V
SLP_S3#
VTT
+1V TO + 2.5V
VTT = VDDQ/2
STDBY
SHDN
SKIP
REFIN
PGOOD2
+5V
PGOOD1
AGND FB OPTIONS:
1. CONNECT FB TO 5V FOR FIXED +1.8V.
2. CONNECT FB TO GND FOR FIXED +1.5V.
3. USE FB RESISTOR-DIVIDER FOR ADJUSTABLE
OUTPUT VOLTAGES.
RTON
CSH
5V VCC
VCC
OVP
1
12
16
18
4
24
7
6
20
14
15
17
13
23
22
21
19
10
9
2
3
EP
11
5
8
CBST
0.1µF
R3
100kΩ
R2
100kΩ
R1
10Ω
CVDD
1µF
CVCC
1µF
AGND
PGND
COUT
MAX17000A
VTTR = VDDQ/2
RCS = RC RDCR
REQ + RC
RDCR = L1 x ( 1 + 1 )
CEQ REQ RC
Figure 1. MAX17000A Standard Application Circuit
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 17
VTT POS
CURRENT LIMIT
VTT SS
CURRENT LIMIT
VTT NEG
CURRENT LIMIT
BST
LX
VDD
ONE-SHOT
TRIGQ
tOFF(MIN)
CSL
TON
ZERO CROSSING
EA
SHDN
VALLEY CURRENT LIMIT
PGND1
S
RQ
S
R
QDH
1mV
20mV
SOFT-START/
SOFT-STOP
DL
CSL
CSH
1V REF
AGND
VCC
INT_REF
FB
FB
DECODE
INT_FB
VTTI
VTT
PGND2
VTTR
POWER-GOOD1
PGOOD1
1.15V
OVF
POWER-GOOD2
PGOOD2
SMPS FAULT
DETECTION
1.2V
OVP SMPS
FAULT
LATCH
SMPS
FAULT
0.7V
INT_FB
OVF
UVF
VTTS
VDD
VDD
CSL
VTT WINDOW
COMPARATOR
VTTR WINDOW
COMPARATOR
VTT FAULT
SMPS
FAULT
5ms
TIMER
VTT
FAULT
VTTR
VTT
FAULT
VTTI
VTT
PGND2
SKIP
ONE-SHOT
TRIG Q
TON
ERROR
AMP
ON-TIME
COMPUTE
SMPS RUN
10ms
TIMER
RUN
1.4ms
5mV
VTT
PGND2
STDBY
PGND1
PGND2
VTT
CSL
16Ω
16Ω
REFIN
CSL
R
R
5mV
VTT_EN
VTT_EN
RUN
OVP
VCC
UVLO
MAX17000A
VDD - 0.3V
Figure 2. MAX17000A Functional Diagram
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
18 ______________________________________________________________________________________
+5V Bias Supply (VDD, VCC)
The MAX17000A requires an external 5V bias supply in
addition to the battery. Typically, this 5V bias supply is
the notebook’s 95% efficient 5V system supply.
Keeping the bias supply external to the IC improves
efficiency and eliminates the cost associated with the
5V linear regulator that would otherwise be needed to
supply the PWM circuit and gate drivers. If stand-alone
capability is needed, the 5V supply can be generated
with an external linear regulator such as the MAX1615.
The 5V bias supply powers both the PWM controller
and internal gate-drive power, so the maximum current
drawn is:
IBIAS = IQ+ fSWQG(MOSFETs) = 2mA to 20mA (typ)
where IQis the current for the PWM control circuit, fSW
is the switching frequency, and QG(MOSFETs) is the
total gate-charge specification limits at VGS = 5V for the
internal MOSFETs.
Free-Running Constant-On-Time PWM
Controller with Input Feed-Forward
The Quick-PWM control architecture is a pseudo-fixed-
frequency, constant on-time, current-mode regulator
with voltage feed-forward. This architecture utilizes the
output filter capacitor’s ESR to act as a current-sense
resistor, so the output ripple voltage can provide the
PWM ramp signal. In addition to the general Quick-
PWM, the MAX17000A also senses the inductor current
through DCR method or with a sensing resistor.
Therefore, it is less dependent on the output capacitor
ESR for stability. The control algorithm is simple: the
high-side switch on-time is determined solely by a one-
shot whose pulse width is inversely proportional to input
voltage and directly proportional to output voltage.
Another one-shot sets a minimum off-time (250ns typ).
The on-time one-shot is triggered if the error compara-
tor is low, the low-side switch current is below the valley
current-limit threshold, and the minimum off-time one-
shot has timed out.
On-Time One-Shot
The heart of the PWM core is the one-shot that sets the
high-side switch on-time. This fast, low-jitter, adjustable
one-shot includes circuitry that varies the on-time in
response to battery and output voltages. The high-side
switch on-time is inversely proportional to the battery
voltage as measured by the VIN input, and proportional
to the output voltage.
An external resistor between the input power source
and TON pin sets the switching frequency per phase
according to the following equation:
where CTON = 16.26pF, and 0.075V is an approxima-
tion to accommodate for the expected drop across the
low-side MOSFET switch. This algorithm results in a
nearly constant switching frequency despite the lack of
a fixed-frequency clock generator.
For loads above the critical conduction point, where the
dead-time effect is no longer a factor, the actual switch-
ing frequency is:
where VDIS is the sum of the parasitic voltage drops in
the inductor discharge path, including synchronous
rectifier, inductor, and PCB resistances; VCHG is the
sum of the parasitic voltage drops in the charging path,
including the high-side switch, inductor, and PCB resis-
tances; and tON is the on-time calculated by the
MAX17000A.
Automatic Pulse-Skipping Mode
(
SKIP
= AGND)
In skip mode (SKIP = AGND), an inherent automatic
switchover to PFM takes place at light loads. This
switchover is affected by a comparator that truncates
the low-side switch on-time at the inductor current’s
zero crossing.
DC output-accuracy specifications refer to the thresh-
old of the error comparator. When the inductor is in
continuous conduction, the MAX17000A regulates the
valley of the output ripple, so the actual DC output volt-
age is higher than the trip level by 50% of the output
ripple voltage. In discontinuous conduction (SKIP =
AGND and IOUT < ILOAD(SKIP)), the output voltage has
a DC regulation level higher than the error-comparator
threshold by approximately 1.5% due to slope compen-
sation. However, the internal integrator corrects for
most of it, resulting in very little load regulation.
The MAX17000A always uses skip mode during start-
up, regardless of the SKIP and STDBY setting. The
SKIP and STDBY controls take effect after soft-start is
done. See Figure 3.
fVV
tVV V
SW OUT DIS
ON IN CHG DIS
=+
×− +()
fCR k
SW TON TON
=×+
1
65(.)Ω
tCR kV V
V
ON TON TON CSL
IN
=×+×+(.)(.)65 0075Ω
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 19
Forced-PWM Mode (
SKIP
= VCC)
The low-noise forced-PWM mode (SKIP = VCC) disables
the zero-crossing comparator, which controls the low-
side switch on-time. This forces the low-side gate-drive
waveform to constantly be the complement of the high-
side gate-drive waveform, so the inductor current
reverses at light loads while DH maintains a duty factor
of VOUT/VIN. The benefit of forced-PWM mode is to keep
a fairly constant switching frequency. However, forced-
PWM operation comes at a cost: the no-load 5V bias
current remains between 2mA to 20mA, depending on
the switching frequency.
STDBY = AGND overrides the SKIP pin setting, forcing
the MAX17000A into standby.
The MAX17000A switches to forced-PWM mode during
shutdown, regardless of the state of SKIP and STDBY
levels.
Standby Mode (
STDBY
)
It should be noted that standby mode in the
MAX17000A corresponds to computer system standby
operation, and is not referring to the MAX17000A shut-
down status.
When standby mode is enabled (STDBY = AGND),
VTT is disabled (high impedance) but VTTR remains
active.
When standby mode is disabled (STDBY = VCC), the
VTT block is enabled and the VTT output capacitor is
charged. The VTT soft-start current limit increases lin-
early from zero to its maximum current limit in 160µs
(typ), keeping the input VTTI inrush low. See Figure 4.
INDUCTOR CURRENT
ILOAD = IPEAK/2
ON-TIME0 TIME
IPEAK
L
VIN - VOUT
∆I
∆t=
Figure 3. Pulse-Skipping/Discontinuous Crossover Point
STDBY
VTTR OUTPUT
SMPS OUTPUT
PGOOD1
STANDBY TIMING
VTT OUTPUT
VTT CURRENT LIMIT
PGOOD2
160µs
VTT HIGH-IMPEDANCE
Figure 4. MAX17000A Standby Mode Timing
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
20 ______________________________________________________________________________________
Valley Current-Limit Protection
The MAX17000A uses the same valley current-limit pro-
tection employed on all Maxim Quick-PWM controllers. If
the current exceeds the valley current-limit threshold,
the PWM controller is not allowed to initiate a new cycle.
The actual peak current is greater than the valley cur-
rent-limit threshold by an amount equal to the inductor
ripple current. Therefore, the exact current-limit charac-
teristic and maximum load capability are a function of
the inductor value and battery voltage. When combined
with the undervoltage-protection circuit, this current-limit
method is effective in almost every circumstance.
In forced-PWM mode, the MAX17000A also implements
a negative current limit to prevent excessive reverse
inductor currents when VOUT is sinking current. The
negative current-limit threshold is set to approximately
115% of the positive current limit. See Figure 5.
Power-Good Outputs
(PGOOD1 and PGOOD2)
The MAX17000A features two power-good outputs.
PGOOD1 is the open-drain output for a window com-
parator that continuously monitors the SMPS output.
PGOOD1 is actively held low in shutdown and during
soft-start and soft-shutdown. After the soft-start termi-
nates, PGOOD1 becomes high impedance as long as
the SMPS output voltage is between 115% (typ) and
85% (typ) of the regulation voltage. When the SMPS
output voltage exceeds the 115%/85% regulation win-
dow, the MAX17000A pulls PGOOD1 low. Any fault
condition on the SMPS output forces PGOOD1 and
PGOOD2 low and latches off until the fault latch is
cleared by toggling SHDN or cycling VCC power below
1V. Detection of an OVP event immediately pulls
PGOOD1 low, regardless of the OVP state (OVP
enabled or disabled).
PGOOD2 is the open-drain output for a window com-
parator that continuously monitors the VTT output.
PGOOD2 is actively held low in standby, shutdown,
and during soft-start. PGOOD2 becomes high imped-
ance as long as the VTT output voltage is within ±10%
of the regulation voltage. When the VTT output exceeds
the ±10% threshold, the MAX17000A pulls PGOOD2
low. If PGOOD2 remains low for 5ms (typ), the
MAX17000A latches off with the soft-shutdown
sequence.
For logic-level output voltages, connect an external 100kΩ
pullup resistor from PGOOD1 and PGOOD2 to VDD.
POR, UVLO
Power-on reset (POR) occurs when VCC rises above
approximately 2V, resetting the fault latch and soft-start
circuit and preparing the controller for power-up. When
OVP protection is enabled, a rising edge on POR turns
on the 16Ωdischarge MOSFET on CSL and VTT. When
OVP is disabled, the internal 16Ωdischarge MOSFETs
on CSL and VTT also remain off.
VCC undervoltage lockout (UVLO) circuitry inhibits
switching until VCC reaches 4.1V (typ). When VCC rises
above 4.1V, the controller activates the PWM controller
and initializes soft-start. When VCC drops below the
UVLO threshold (falling edge), the controller stops, DL
is pulled low, and the internal 16Ωdischarge
MOSFETs on the CSL and VTT outputs are enabled, if
OVP is enabled.
Soft-Start and Soft-Shutdown
Soft-start and soft-shutdown for the MAX17000A PWM
block is voltage based. Soft-start begins when SHDN is
driven high. During soft-start, the PWM output is
ramped up from 0V to the final set voltage in 1.4ms.
This reduces inrush current and provides a predictable
ramp-up time for power sequencing. The MAX17000A
always uses skip mode during startup, regardless of
the SKIP and STDBY setting. The SKIP and STDBY con-
trols take effect after soft-start is done.
The MAX17000A VTT LDO regulator uses a current-limit-
ed soft-start function. When the VTT block is enabled, the
internal source and sink current limits are linearly
increased from zero to the full-scale limit in 160µs. Full-
scale current limit is available when the VTT output is in
regulation, or after 160µs, whichever is earlier. The VTTR
reference buffer does not have any soft-start control.
INDUCTOR CURRENT
ILIMIT
ILOAD
0 TIME
IPEAK
ILIM(VAL) = ILOAD(MAX) 1- LIR
2
()
Figure 5. Valley Current-Limit Threshold Point
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 21
Soft-shutdown begins after SHDN goes low, an output
undervoltage fault occurs, or a thermal fault occurs. A
fault on the SMPS (UV fault for more than 200µs (typ)),
or fault on the VTT output that persists for more than
5ms (typ), triggers shutdown of the whole IC. During
soft-shutdown, the output is ramped down to 0V in
2.8ms, reducing negative inductor currents that can
cause negative voltages on the output. At the end of
soft-shutdown, DL is driven low.
When OVP is enabled (OVP = VCC), the internal 16Ω
discharging MOSFETs on CSL and VTT are enabled
until startup is triggered again by a rising edge of
SHDN. When OVP is disabled (OVP = AGND), the CSL
and VTT internal 16Ωdischarging MOSFETs are not
enabled in shutdown.
Output Fault Protection
The MAX17000A provides overvoltage/undervoltage
fault protections for the PWM output. Drive OVP to
enable and disable fault protection as shown in Table 4.
STDBY
INT_REF
SMPS OUTPUT
REFOK
SMPS_RUNOK
PGOOD1 160µs
SHDN
VTT OUTPUT
VTTR OUTPUT
DL
VTT CURRENT LIMIT
PGOOD2
1.4ms 2.8ms
VTT 16Ω FET
SKIP FPWM
CSL 16Ω FET
25mV
Figure 6. MAX17000A Startup/Shutdown Timing with OVP Enabled
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
22 ______________________________________________________________________________________
OVP MODE REACTION/DRIVER STATE COMMENT
Shutdown
(SHDN = low)
DL immediately pulled low.
VTTR tracks the SMPS output during soft-shutdown. CSL and VTT
are high impedance at the end of soft-shutdown (16discharge
MOSFETs disabled).
Outputs high-
impedance in
shutdown.
SMPS UVP
DL immediately pulled low.
VTTR tracks the SMPS output during soft-shutdown. CSL and VTT
are high impedance at the end of soft-shutdown (16 discharge
MOSFETs disabled).
SMPS latched fault
condition.
SMPS OVP
(disabled)
Controller remains active (normal operation).
Note: An OVP detection still pulls PGOOD1 low.
Only PGOOD1 pulled
low; fault not latched.
VTT < -90% or
VTT > +110%
PGOOD2 immediately pulled low.
Soft-shutdown initiated if fault persists for more than 5ms (typ). DH
not used in soft-shutdown. DL low after soft-shutdown completed.
VTTR tracks the SMPS output soft-shutdown.
VTT latched fault
condition if fault
persists for more
than 5ms (typ).
OVP Disabled
Discharge Disabled
(OVP = Low)
VCC UVLO
falling edge
DL and DH immediately pulled low.
PGOOD1 and PGOOD2 immediately forced low. VTT and VTTR
blocks immediately disabled (high impedance, no 16discharge
on outputs).
—
Shutdown
(SHDN = low)
Soft-shutdown initiated.
DL high after soft-shutdown completed.
VTTR tracks the SMPS output during soft-shutdown. Internal 16
discharge MOSFETs on CSL and VTT enabled after soft-shutdown.
16 discharge
MOSFETs on CSL
and VTT enabled in
shutdown.
SMPS UVP
Soft-shutdown initiated. DH not used in soft-shutdown. DL low
after soft-shutdown completed.
VTTR tracks the SMPS output during soft-shutdown. Internal 16
discharge MOSFETs on CSL and VTT enabled after soft-shutdown.
SMPS latched fault
condition.
SMPS OVP
(enabled)
DL immediately latched high, DH forced low.
PGOOD1 and PGOOD2 immediately forced low.
VTT and VTTR blocks immediately shut down. Internal 16
discharge MOSFETs on CSL and VTT enabled.
SMPS latched fault
condition.
OVP Enabled
Discharge Enabled
(OVP = High)
VTT < 90% or
VTT > 110%
PGOOD2 immediately pulled low.
Soft-shutdown initiated if fault persists for more than 5ms (typ). DH
not used in soft-shutdown. DL low after soft-shutdown completed.
VTTR tracks the SMPS output during soft-shutdown. Internal 16
discharge MOSFETs on CSL and VTT enabled after soft-shutdown.
VTT latched fault
condition if fault
persists for more
than 5ms (typ).
OVP Enabled
Discharge Enabled
(OVP = High)
VCC UVLO
falling edge
DL and DH immediately pulled low.
PGOOD1 and PGOOD2 immediately forced low.
VTT and VTTR blocks immediately disabled.
Internal 16 discharge MOSFETs on CSL and VTT enabled
immediately.
—
Table 4. Fault Protection and Shutdown Setting Truth Table
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 23
SMPS Overvoltage Protection (OVP)
If the output voltage of the SMPS rises 115% above its
nominal regulation voltage while OVP is enabled (OVP =
VCC), the controller sets its overvoltage fault latch, pulls
PGOOD1 and PGOOD2 low, and forces DL high. The
VTT and VTTR block shut down immediately, and the
internal 16Ωdischarge MOSFETs on CSL and VTT are
turned on. If the condition that caused the overvoltage
persists (such as a shorted high-side MOSFET), the bat-
tery fuse blows. Cycle VCC below 1V or toggle SHDN to
clear the overvoltage fault latch and restart the controller.
OVP is disabled when OVP is connected to AGND
(Table 4). PGOOD1 upper threshold remains active at
115% of nominal regulation voltage even when OVP is
disabled and the 16Ωdischarge MOSFETs on CSL
and VTT are not enabled in shutdown.
SMPS Undervoltage Protection (UVP)
If the output voltage of the SMPS falls below 85% of its
regulation voltage for more than 200µs (typ), the controller
sets its undervoltage fault latch, pulls PGOOD1 and
PGOOD2 low, and begins soft-shutdown pulsing DL. DH
remains off during the soft-shutdown sequence initiated
by an undervoltage fault. After soft-shutdown has com-
pleted, the MAX17000A forces DL and DH low, and
enables the internal 16Ωdischarge MOSFETs on CSL
and VTT. Cycle VCC below 1V or toggle SHDN to clear
the undervoltage fault latch and restart the controller.
VTT Overvoltage and Undervoltage Protection
If the output voltage of the VTT regulator exceeds
±10% of its regulation voltage for more than 5ms (typ),
the controller sets its fault latch, pulls PGOOD1 and
PGOOD2 low, and begins soft-shutdown pulsing DL.
DH remains off during the soft-shutdown sequence initi-
ated by an undervoltage fault. After soft-shutdown has
completed, the MAX17000A forces DL and DH low, and
enables the internal 16Ωdischarge MOSFETs on CSL
and VTT. Cycle VCC below 1V or toggle SHDN to clear
the undervoltage fault latch and restart the controller.
Thermal-Fault Protection
The MAX17000A features a thermal-fault protection cir-
cuit. When the junction temperature rises above
+160°C, a thermal sensor activates the fault latch, pulls
PGOOD1 and PGOOD2 low, and shuts down using the
shutdown sequence. Toggle SHDN or cycle VCC power
below VCC POR to reactivate the controller after the
junction temperature cools by 15°C.
Design Procedure
Firmly establish the input voltage range and maximum
load current before choosing a switching frequency and
inductor operating point (ripple-current ratio). The pri-
mary design trade-off lies in choosing a good switching
frequency and inductor operating point, and the follow-
ing four factors dictate the rest of the design:
• Input Voltage Range: The maximum value
(VIN(MAX)) must accommodate the worst-case input
supply voltage allowed by the notebook’s AC
adapter voltage. The minimum value (VIN(MIN))
must account for the lowest input voltage after
drops due to connectors, fuses, and battery selec-
tor switches. If there is a choice at all, lower input
voltages result in better efficiency.
• Maximum Load Current: There are two values to
consider. The peak load current (ILOAD(MAX)) deter-
mines the instantaneous component stresses and
filtering requirements, and thus drives output
capacitor selection, inductor saturation rating, and
the design of the current-limit circuit. The continu-
ous load current (ILOAD) determines the thermal
OVP MODE REACTION/DRIVER STATE COMMENT
Thermal fault
DL and DH immediately pulled low.
PGOOD1 and PGOOD2 immediately forced low.
VTT and VTTR blocks immediately disabled (high impedance, no
16 discharge on outputs).
Active-fault condition.
VCC UVLO
rising edge
Activate INT_REF once VCC rises above UVLO, and SHDN = high.
Once REFOK is valid (high), initiate the soft-start sequence.
DL remains low until switching/soft-start begins.
—
VCC POR
rising edge DL forced low. —
General Shutdown
and Fault
Conditions
VCC POR
falling edge
DL = Don’t care. VCC less than 2VT is not sufficient to turn on the
MOSFETs. —
Table 4. Fault Protection and Shutdown Setting Truth Table (continued)
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
24 ______________________________________________________________________________________
stresses and thus drives the selection of input
capacitors, MOSFETs, and other critical heat-con-
tributing components. Most notebook loads gener-
ally exhibit ILOAD = ILOAD(MAX) x 80%.
• Switching Frequency: This choice determines the
basic trade-off between size and efficiency. The
optimal frequency is largely a function of maximum
input voltage, due to MOSFET switching losses that
are proportional to frequency and VIN2. The opti-
mum frequency is also a moving target, due to
rapid improvements in MOSFET technology that are
making higher frequencies more practical.
• Inductor Operating Point: This choice provides
trade-offs between size vs. efficiency and transient
response vs. output noise. Low inductor values pro-
vide better transient response and smaller physical
size, but also result in lower efficiency and higher
output noise due to increased ripple current. The
minimum practical inductor value is one that causes
the circuit to operate at the edge of critical conduc-
tion (where the inductor current just touches zero
with every cycle at maximum load). Inductor values
lower than this grant no further size-reduction bene-
fit. The optimum operating point is usually found
between 20% and 50% ripple current.
Inductor Selection
The switching frequency and operating point (% ripple
current or LIR) determine the inductor value as follows:
Find a low-loss inductor having the lowest possible DC
resistance that fits in the allotted dimensions. Ferrite
cores are often the best choice, although powdered
iron is inexpensive and can work well at 200kHz. The
core must be large enough not to saturate at the peak
inductor current (IPEAK):
Setting the Valley Current Limit
The minimum current-limit threshold must be high
enough to support the maximum load current when the
current limit is at the minimum tolerance value. The val-
ley of the inductor current occurs at ILOAD(MAX) minus
half the ripple current; therefore:
where ILIMIT(LOW) equals the minimum current-limit
threshold voltage divided by the output sense element
(inductor DCR or sense resistor).
The valley current limit is fixed at 17mV (min) across the
CSH to CSL differential input.
Special attention must be made to the tolerance and
thermal variation of the on-resistance in the case of DCR
sensing. Use the worst-case maximum value for RDCR
from the inductor data sheet, and add some margin for
the rise in RDCR with temperature. A good general rule
is to allow 0.5% additional resistance for each degree
Celsius of temperature rise, which must be included in
the design margin unless the design includes an NTC
thermistor in the DCR network to thermally compensate
the current-limit threshold.
The current-sense method (Figure 7) and magnitude
determine the achievable current-limit accuracy and
power loss. The sense resistor can be determined by:
RSENSE = VLIMIT/ILIMIT
II
LIMIT LOW LOAD MAX() ()
>×
⎛
⎝
⎜⎞
⎠
⎟
1- LIR
2
II LIR
PEAK LOAD MAX
=×+
⎛
⎝
⎜⎞
⎠
⎟
()
12
LVV
fI LIR
V
V
IN OUT
SW LOAD MAX
OUT
IN
=××
⎛
⎝
⎜⎞
⎠
⎟×⎛
-
() ⎝⎝
⎜⎞
⎠
⎟
SENSE RESISTOR
L
COUT
INPUT (VIN)
CIN
CSL
CSH
PGND1
DL
DH
LX
CEQ
REQ
NH
NLDL
LESL RSENSE
CEQREQ = LESL
RSENSE
A) OUTPUT SERIES RESISTOR SENSING
MAX17000A
Figure 7a. Current-Sense Configurations (Sheet 1 of 2)
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 25
For the best current-sense accuracy and overcurrent
protection, use a 1% tolerance current-sense resistor
between the inductor and output as shown in Figure 7a.
This configuration constantly monitors the inductor cur-
rent, allowing accurate current-limit protection.
However, the parasitic inductance of the current-sense
resistor can cause current-limit inaccuracies, especially
when using low-value inductors and current-sense
resistors. This parasitic inductance (LESL) can be can-
celled by adding an RC circuit across the sense resis-
tor with an equivalent time constant:
Alternatively, low-cost applications that do not require
highly accurate current-limit protection could reduce
the overall power dissipation by connecting a series RC
circuit across the inductor (Figure 7b) with an equiva-
lent time constant:
and:
where RCS is the required current-sense resistance,
and RDCR is the inductor’s series DC resistance. Use
the worst-case inductance and RDCR values provided
by the inductor manufacturer, adding some margin for
the inductance drop over temperature and load.
MOSFET Gate Drivers (DH, DL)
The DH and DL drivers are optimized for driving moder-
ate-sized high-side, and larger low-side power MOSFETs.
This is consistent with the low duty factor seen in note-
book applications, where a large VIN - VOUT differential
exists. The high-side gate driver (DH) sources and sinks
1.2A, and the low-side gate driver (DL) sources 1.0A and
sinks 2.4A. This ensures robust gate drive for high-cur-
rent applications. The DH floating high-side MOSFET dri-
ver is powered by an internal boost switch charge pump
at BST, while the DL synchronous-rectifier driver is pow-
ered directly by the 5V bias supply (VDD).
PWM Output Capacitor Selection
The output filter capacitor must have low enough effec-
tive series resistance (ESR) to meet output ripple and
load-transient requirements, yet have high enough ESR
to satisfy stability requirements.
In core and chipset converters and other applications
where the output is subject to large-load transients, the
output capacitor’s size typically depends on how much
ESR is needed to prevent the output from dipping too
low under a load transient. Ignoring the sag due to finite
capacitance:
In low-power applications, the output capacitor’s size
often depends on how much ESR is needed to maintain
an acceptable level of output ripple voltage. The output
ripple voltage of a step-down controller equals the total
inductor ripple current multiplied by the output capaci-
tor’s ESR.
RR V
I
ESR PCB STEP
LOAD MAX
+
()
≤∆()
RL
CRR
DCR EQ
=×+
⎡
⎣
⎢⎤
⎦
⎥
1
1
1
2
RR
RR R
CS DCR
=+×
2
12
CR L
R
EQ EQ ESL
SENSE
×=
COUT
INPUT (VIN)
CIN
B) LOSSLESS INDUCTOR SENSING
FOR THERMAL COMPENSATION:
R2 SHOULD CONSIST OF AN NTC RESISTOR IN
SERIES WITH A STANDARD THIN-FILM RESISTOR.
CSL
CSH
PGND1
DL
DH
LX
CEQ
R1R2
NH
NLDL
L
INDUCTOR
RDCR
RCS = R2 RDCR
R1 + R2
RDCR = L [ 1 + 1 ]
CEQ R1 R2
MAX17000A
Figure 7b. Current-Sense Configurations (Sheet 2 of 2)
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
26 ______________________________________________________________________________________
The maximum ESR to meet ripple requirements is:
where fSW is the switching frequency.
With most chemistries (polymer, tantalum, aluminum,
electrolytic), the actual capacitance value required
relates to the physical size needed to achieve low ESR
and the chemistry limits of the selected capacitor tech-
nology. Ceramic capacitors provide low ESR, but the
capacitance and voltage rating (after derating) are
determined by the capacity needed to prevent VSAG
and VSOAR from causing problems during load tran-
sients. Generally, once enough capacitance is added
to meet the overshoot requirement, undershoot at the
rising load edge is no longer a problem. Thus, the out-
put capacitor selection requires carefully balancing
capacitor chemistry limitations (capacitance vs. ESR
vs. voltage rating) and cost.
PWM Output Capacitor
Stability Considerations
For Quick-PWM controllers, stability is determined by the
in-phase feedback ripple relative to the switching frequen-
cy, which is typically dominated by the output ESR. The
boundary of instability is given by the following equation:
where COUT is the total output capacitance, RESR is the
total equivalent series resistance of the output capaci-
tors, RSENSE is the effective current-sense resistance
(see Figure 7), and ACS is the current-sense gain of 2.
For a standard 300kHz application, the effective zero
frequency must be well below 95kHz, preferably below
50kHz. With these frequency requirements, standard
tantalum and polymer capacitors already commonly
used have typical ESR zero frequencies below 50kHz,
allowing the stability requirements to be achieved with-
out any additional current-sense compensation. In the
standard application circuit (Figure 1), the ESR needed
to support a 15mVP-P ripple is 15mV/(10A x 0.3) =
5mΩ. Two 330µF, 9mΩpolymer capacitors in parallel
provide 4.5mΩ(max) ESR and 1/(2πx 330µF x 9mΩ) =
53kHz ESR zero frequency.
Ceramic capacitors have a high-ESR zero frequency,
but applications with sufficient current-sense compen-
sation can still take advantage of the small size, low
ESR, and high reliability of the ceramic chemistry. By
the inductor current DCR sensing, applications with
ceramic output capacitors can be compensated using
either a DC-compensation or AC-compensation
method. The DC-coupling requires fewer external com-
pensation capacitors, but this also creates an output
load line that depends on the inductor’s DCR (parasitic
resistance). Alternatively, the current-sense information
can be AC-coupled, allowing stability to be dependent
only on the inductance value and compensation com-
ponents and eliminating the DC load line.
When only using ceramic output capacitors, output
overshoot (VSOAR) typically determines the minimum
output capacitance requirement. Their relatively low
capacitance value can allow significant output over-
shoot when stepping from full-load to no-load condi-
tions, unless a small inductor value and high switching
frequency are used to minimize the energy transferred
from inductor to capacitor during load-step recovery.
Unstable operation manifests itself in two related, but
distinctly different ways: double pulsing and feedback
loop instability. Double pulsing occurs due to noise on
the output or because the ESR is so low that there is not
enough voltage ramp in the output voltage signal. This
“fools” the error comparator into triggering a new cycle
immediately after the minimum off-time period has
expired. Double pulsing is more annoying than harmful,
resulting in nothing worse than increased output ripple.
However, it can indicate the possible presence of loop
instability due to insufficient ESR. Loop instability can
result in oscillations at the output after line or load
steps. Such perturbations are usually damped, but can
cause the output voltage to rise above or fall below the
tolerance limits.
The easiest method for checking stability is to apply a
very fast zero-to-max load transient and carefully
observe the output voltage ripple envelope for over-
shoot and ringing. It can help to simultaneously monitor
the inductor current with an AC current probe. Do not
allow more than one cycle of ringing after the initial
step-response undervoltage/overshoot.
Input Capacitor Selection
The input capacitor must meet the ripple current
requirement (IRMS) imposed by the switching currents.
The IRMS requirements can be determined by the fol-
lowing equation:
The worst-case RMS current requirement occurs when
operating with VIN = 2VOUT. At this point, the above
equation simplifies to:
IRMS = 0.5 x ILOAD
II
VVVV
RMS LOAD
IN OUT IN OUT
=⎛
⎝
⎜⎞
⎠
⎟×−
()
RRAR
EFF ESR CS SENSE
=+×
f
RC
SW
EFF OUT
ππ
≥××
1
2
RVf L
VV V V
ESR IN SW
IN OUT OUT RIPP
≤××
()
×
⎡
⎣
⎢
⎢
⎤
⎦
⎥
⎥×
-LLE
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 27
For most applications, nontantalum chemistries (ceramic,
aluminum, or OS-CON) are preferred due to their resis-
tance to inrush surge currents typical of systems with a
mechanical switch or connector in series with the input.
If the Quick-PWM controller is operated as the second
stage of a two-stage power-conversion system, tanta-
lum input capacitors are acceptable. In either configu-
ration, choose an input capacitor that exhibits less than
+10°C temperature rise at the RMS input current for
optimal circuit longevity.
MOSFET Selection
Most of the following MOSFET guidelines focus on the
challenge of obtaining high load-current capability
when using high-voltage (> 20V) AC adapters. Low-
current applications usually require less attention.
The high-side MOSFET (NH) must be able to dissipate
the resistive losses plus the switching losses at both
VIN(MIN) and VIN(MAX). Calculate both these sums.
Ideally, the losses at VIN(MIN) should be roughly equal to
losses at VIN(MAX), with lower losses in between. If the
losses at VIN(MIN) are significantly higher than the losses
at VIN(MAX), consider increasing the size of NH(reducing
RDS(ON) but with higher CGATE). Conversely, if the loss-
es at VIN(MAX) are significantly higher than the losses at
VIN(MIN), consider reducing the size of NH(increasing
RDS(ON) to lower CGATE). If VIN does not vary over a
wide range, the minimum power dissipation occurs
where the resistive losses equal the switching losses.
Choose a low-side MOSFET that has the lowest possi-
ble on-resistance (RDS(ON)), comes in a moderate-sized
package (i.e., one or two 8-pin SOs, DPAK, or D2PAK),
and is reasonably priced. Make sure that the DL gate
driver can supply sufficient current to support the gate
charge and the current injected into the parasitic gate-
to-drain capacitor caused by the high-side MOSFET
turning on; otherwise, cross-conduction problems can
occur (see the
MOSFET Gate Drivers (DH, DL)
section).
MOSFET Power Dissipation
Worst-case conduction losses occur at the duty factor
extremes. For the high-side MOSFET (NH), the worst-
case power dissipation due to resistance occurs at the
minimum input voltage:
Generally, a small high-side MOSFET is desired to
reduce switching losses at high input voltages.
However, the RDS(ON) required to stay within package
power dissipation often limits how small the MOSFET
can be. Again, the optimum occurs when the switching
losses equal the conduction (RDS(ON)) losses. High-
side switching losses do not usually become an issue
until the input is greater than approximately 15V.
Calculating the power dissipation in high-side MOSFET
(NH) due to switching losses is difficult since it must
allow for difficult quantifying factors that influence the
turn-on and turn-off times. These factors include the
internal gate resistance, gate charge, threshold voltage,
source inductance, and PCB layout characteristics. The
following switching-loss calculation provides only a very
rough estimate and is no substitute for breadboard
evaluation, preferably including verification using a
thermocouple mounted on NH:
where COSS is the NHMOSFET’s output capacitance,
QG(SW) is the charge needed to turn on the NHMOSFET,
and IGATE is the peak gate-drive source/sink current
(2.2A typ).
Switching losses in the high-side MOSFET can become
an insidious heat problem when maximum AC adapter
voltages are applied, due to the squared term in the
C x VIN2x fSW switching-loss equation. If the high-side
MOSFET chosen for adequate RDS(ON) at low battery
voltages becomes extraordinarily hot when biased from
VIN(MAX), consider choosing another MOSFET with
lower parasitic capacitance.
For the low-side MOSFET (NL), the worst-case power
dissipation always occurs at maximum input voltage:
The worst case for MOSFET power dissipation occurs
under heavy overloads that are greater than
ILOAD(MAX), but are not quite high enough to exceed
the current limit and cause the fault latch to trip. To pro-
tect against this possibility, the circuit can be “over
designed” to tolerate:
II I
LOAD VALLEY MAX INDUCTOR
=+
⎛
⎝
⎜⎞
⎠
⎟
()
∆
2
() ()
=+
×
⎛
⎝
⎜⎞
⎠
⎟
IILIR
VALLEY MAX LOAD MAX
2
PD (NL Resistive) = 1−⎛
⎝
⎜⎞
⎠
⎟
⎡
⎣
⎢
⎢
V
V
OUT
IN MAX()
⎤⎤
⎦
⎥
⎥×
()
×IR
LOAD DS ON
2()
PD (NH Switching) = V I f Q
IN MAX LOAD SW GSW
() (
×× ))
I
C
GATE
O
⎛
⎝
⎜⎞
⎠
⎟
+SSS IN SW
Vf××
2
2
PD (NH Resistive) = V
VI
OUT
IN LOAD
⎛
⎝
⎜⎞
⎠
⎟×
()
×
2RRDS ON()
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
28 ______________________________________________________________________________________
where IVALLEY(MAX) is the maximum valley current
allowed by the current-limit circuit, including threshold
tolerance and on-resistance variation. The MOSFETs
must have a good size heatsink to handle the overload
power dissipation.
Choose a Schottky diode (DL) with a forward voltage
low enough to prevent the low-side MOSFET body
diode from turning on during the dead time. Select a
diode that can handle the load current during the dead
times. This diode is optional and can be removed if effi-
ciency is not critical.
Setting the PWM Output Voltage
Preset Output Voltages
The MAX17000A’s Dual Mode™ operation allows the
selection of common voltages without requiring external
components. Connect FB to AGND for a fixed 1.5V out-
put, to VCC for a fixed 1.8V output, or connect FB
directly to OUT for a fixed 1.0V output.
Adjustable Output Voltage
The output voltage can be adjusted from 1.0V to 2.7V
using a resistive voltage-divider (Figure 8). The
MAX17000A regulates FB to a fixed reference voltage
(1.0V). The adjusted output voltage is:
where VFB is 1.0V.
VTTI Input Capacitor
Stability Considerations
The value of the VTTI bypass capacitor is chosen to
limit the amount of ripple/noise at VTTI, and the amount
of voltage dip during a load transient. Typically, VTTI is
connected to the output of the buck regulator, which
already has a large bulk capacitor. Nevertheless, a
ceramic capacitor of equivalent value to the VTT output
capacitor must be used and must be added and
placed as close as possible to the VTTI pin. This value
must be increased with larger load current, or if the
trace from the VTTI pin to the power source is long and
has significant impedance.
Setting VTT Output Voltage
The VTT output stage is powered from the VTTI input.
The output voltage is set by the REFIN input. REFIN sets
the feedback regulation voltage (VTTR = VTTS =
VREFIN) of the MAX17000A. Connect a 0.1V to 2.0V volt-
age input to set the adjustable output for VTT, VTTS, and
VTTR. If REFIN is tied to VCC, the internal CSL/2 divider
is used to set VTT voltage; hence, VTT tracks the VCSL
voltage and is set to VCSL/2. This feature makes the
MAX17000A ideal for memory applications in which the
termination supply must track the supply voltage.
VTT Output Capacitor Selection
A minimum value of 9µF is needed to stabilize a 300mA
VTT output. This value of capacitance limits the regula-
tor’s unity-gain bandwidth frequency to approximately
1.2MHz (typ) to allow adequate phase margin for stabil-
ity. To keep the capacitor acting as a capacitor within
the regulator’s bandwidth, it is important that ceramic
capacitors with low ESR and ESL be used.
VV R
R
OUT FB FBA
FBB
=×+
⎛
⎝
⎜⎞
⎠
⎟
1
FB
VOUT
PGND1
DL
LX
CSL
COUT
L1
NL
D1
RFBA
RFBB
CSH
MAX17000A
Figure 8. Setting VOUT with a Resistive Voltage-Divider
Dual Mode is a trademark of Maxim Integrated Products, Inc.
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 29
Since the gain bandwidth is also determined by the
transconductance of the output FETs, which increases
with load current, the output capacitor might need to be
greater than 20µF if the load current exceeds 1.5A, but
can be smaller than 20µF if the maximum load current
is less than 1.5A. As a guideline, choose the minimum
capacitance and maximum ESR for the output capaci-
tor using the following:
COUT_MIN needs to be increased by a factor of 2 for
low-dropout operation:
RESR_MAX value is measured at the unity-gain-band-
width frequency given by approximately:
Once these conditions for stability are met, additional
capacitors, including those of electrolytic and tantalum
types, can be connected in parallel to the ceramic
capacitor (if desired) to further suppress noise or volt-
age ripple at the output.
VTTR Output Capacitor Selection
The VTTR buffer is a scaled-down version of the VTT
regulator, with much smaller output transconductance.
Its compensation capacitor can, therefore, be smaller
and its ESR larger than what is required for its larger
counterpart. For typical applications requiring load cur-
rent up to ±4mA, a ceramic capacitor with a minimum
value of 0.33µF is recommended (RESR < 0.3Ω).
Connect this capacitor between VTTR and the analog
ground plane.
Power Dissipation
Power loss in the MAX17000A is the sum of the losses
of the PWM block, the VTT LDO block, and the VTTR
reference buffer:
The 2W total power dissipation is within the 24-pin
TQFN multilayer board power dissipation specification
of 2.22W. The typical application does not source or
sink continuous high currents. VTT current is typically
100mA to 200mA in the steady state. VTTR is down in
the microamp range, though the Intel specification
requires 3mA for DDR1 and 1mA for DDR2. True worst-
case power dissipation occurs on an output short-circuit
condition with worst-case current limit. The MAX17000A
does not employ any foldback current limiting, and
relies on the internal thermal shutdown for protection.
Both the VTT and VTTR output stages are powered from
the same VTTI input. Their output voltages are refer-
enced to the same REFIN input. The value of the VTTI
bypass capacitor is chosen to limit the amount of rip-
ple/noise at VTTI, or the amount of voltage dip during a
load transient. Typically, VTTI is connected to the output
of the buck regulator, which already has a large bulk
capacitor.
Boost Capacitors
The boost capacitors (CBST) must be selected large
enough to handle the gate-charging requirements of
the high-side MOSFETs. Typically, 0.1µF ceramic
capacitors work well for low-power applications driving
medium-sized MOSFETs. However, high-current appli-
cations driving large, high-side MOSFETs require boost
capacitors larger than 0.1µF. For these applications,
select the boost capacitors to avoid discharging the
capacitor more than 200mV while charging the high-
side MOSFETs’ gates:
where QGATE is the total gate charge specified in the
high-side MOSFET’s data sheet. For example, assume
the FDS6612A n-channel MOSFET is used on the high
side. According to the manufacturer’s data sheet, a sin-
gle FDS6612A has a maximum gate charge of 13nC
(VGS = 5V). Using the above equation, the required
boost capacitance would be:
Selecting the closest standard value, this example
requires a 0.1µF ceramic capacitor.
CnC
mV µF
BST ==
13
200 0 065.
CQ
mV
BST GATE
=200
PD Total W()=2
PD VTTR mA V mW() . .=×=30927
PD VTT A V W() . .=× =20918
PD PWM I V mA V W
BIAS
() .=×= ×=540 502
fC
I
A
GBW OUT
LOAD
=×
36
15.
Rm
A
I
ESR MAX LOAD
_
.
=×515
Ω
CF
I
A
OUT MIN LOAD
_.
=×20 15
µ
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
30 ______________________________________________________________________________________
Applications Information
PCB Layout Guidelines
Careful PCB layout is critical to achieve low switching
losses and clean, stable operation. The switching
power stage requires particular attention. If possible,
mount all the power components on the topside of the
board, with their ground terminals flush against one
another. Follow these guidelines for good PCB layout:
• Keep the high-current paths short, especially at the
ground terminals. This practice is essential for sta-
ble, jitter-free operation.
• Keep the power traces and load connections short.
This practice is essential for high efficiency. Using
thick copper PCBs (2oz vs. 1oz) can enhance full-
load efficiency by 1% or more. Correctly routing
PCB traces is a difficult task that must be
approached in terms of fractions of centimeters,
where a single milliohm of excess trace resistance
causes a measurable efficiency penalty.
• Minimize current-sensing errors by connecting CSH
and CSL directly across the current-sense resistor
(RSENSE).
• When trade-offs in trace lengths must be made, it is
preferable to allow the inductor-charging path to be
made longer than the discharge path. For example,
it is better to allow some extra distance between the
input capacitors and the high-side MOSFET than to
allow distance between the inductor and the low-
side MOSFET or between the inductor and the out-
put filter capacitor.
• Route high-speed switching nodes (BST, LX, DH,
and DL) away from sensitive analog areas (REFIN,
FB, CSH, and CSL).
Layout Procedure
1) Place the power components first, with ground ter-
minals adjacent (low-side MOSFET source, CIN,
COUT, and anode of the low-side Schottky). If possi-
ble, make all these connections on the top layer
with wide, copper-filled areas.
2) Mount the controller IC adjacent to the low-side
MOSFET, preferably on the backside opposite the
MOSFETs to keep LX, GND, DH, and the DL gate-
drive lines short and wide. The DL and DH gate
traces must be short and wide (50 mils to 100 mils
wide if the MOSFET is 1in from the controller IC) to
keep the driver impedance low and for proper
adaptive dead-time sensing.
3) Group the gate-drive components (BST diode and
capacitor, VDD bypass capacitor) together near the
controller IC.
4) Make the DC-DC controller ground connections as
shown in Figures 1 and 9. This diagram can be
viewed as having two separate ground planes:
power ground, where all the high-power compo-
nents go; and an analog ground plane for sensitive
analog components. The analog ground plane and
power ground plane must meet only at a single
point directly at the IC.
5) Connect the output power planes directly to the out-
put filter capacitor positive and negative terminals
with multiple vias. Place the entire DC-to-DC con-
verter circuit as close as is practical to the load.
Table 5 lists the design differences between the
MAX17000 and MAX17000A.
MAX17000 MAX17000A
STDBY = Low turns off VTT and overrides the SKIP setting, forcing
the SMPS to enter a low-quiescent current ultra-skip mode.
STDBY = Low only turns off VTT rail, and does not affect SMPS
operation.
Table 5. MAX17000 vs. MAX17000A Design Differences
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
______________________________________________________________________________________ 31
KELVIN SENSE VIAS
UNDER THE INDUCTOR
(SEE EVALUATION KIT)
VIA TO POWER GROUND
CONNECT AGND AND PGND1 TO
THE CONTROLLER AT THE
EXPOSED PAD
CONNECT THE
EXPOSED PAD TO
ANALOG GROUND
X-RAY VIEW.
IC MOUNTED
ON BOTTOM
SIDE OF PCB.
POWER STAGE LAYOUT (TOP SIDE OF PCB)
IC LAYOUT
VDD BYPASS
CAPACITOR
VCC BYPASS
CAPACITOR
VTTI BYPASS
CAPACITOR
VTT BYPASS
CAPACITOR
INDUCTOR
L1
OUTPUT
SMPS
COUT
INPUT
POWER
GROUND
CEQ
CSL
CSH R2
R1
RNTC
KELVIN-SENSE VIAS TO
INDUCTOR PAD
INDUCTOR DCR SENSING
COUT
CIN1
Figure 9. PCB Layout Example
Chip Information
TRANSISTOR COUNT: 7856
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in
the package code indicates RoHS status only. Package draw-
ings may show a different suffix character, but the drawing per-
tains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
24 TQFN T2444-4 21-0139 90-0022
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
32
____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 10/08 Initial release —
1 12/08 Modified STDBY pin function
5, 11, 12, 13, 17, 23, 26
2 11/10 Changed RESR_MAX equation 29
