PMEG4030EP,115 - NEXPERIA

PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

22 November 2017 Product data sheet

1. General description

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an

integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-

Mounted Device (SMD) plastic package.

2. Features and benefits

•Average forward current: IF(AV) ≤ 3 A

•Reverse voltage: VR ≤ 40 V

•Low forward voltage

•High power capability due to clip-bond technology

•AEC-Q101 qualified

•Small and flat lead SMD plastic package

•Capable for reflow and wave soldering

3. Applications

•Low voltage rectification

•High efficiency DC-to-DC conversion

•Switch Mode Power Supply (SMPS)

•Reverse polarity protection

•Low power consumption applications

4. Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

δ = 0.5 ; f = 20 kHz; Tamb ≤ 65 °C;

square wave

[1] - - 3 AIF(AV) average forward

current

δ = 0.5 ; f = 20 kHz; Tsp ≤ 140 °C;

square wave

- - 3 A

VRreverse voltage Tj = 25 °C - - 40 V

VFforward voltage IF = 3 A; Tj = 25 °C - 430 490 mV

IRreverse current VR = 40 V; Tj = 25 °C - 35 200 µA

[1] Device mounted on a ceramic PCB, Al2O3, standard footprint.

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 2 / 13

5. Pinning information

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1 K cathode[1]

2 A anode

1 2

CFP5 (SOD128)

sym001

1 2

[1] The marking bar indicates the cathode.

6. Ordering information

Table 3. Ordering information

PackageType number

Name Description Version

PMEG4030EP CFP5 plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8

mm x 2.6 mm x 1 mm body

SOD128

7. Marking

Table 4. Marking codes

Type number Marking code

PMEG4030EP AE

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 3 / 13

8. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRreverse voltage Tj = 25 °C - 40 V

δ = 0.5 ; f = 20 kHz; Tamb ≤ 65 °C; square

wave

[1] - 3 AIF(AV) average forward current

δ = 0.5 ; f = 20 kHz; Tsp ≤ 140 °C; square

wave

- 3 A

IFSM non-repetitive peak

forward current

tp = 8 ms; Tj(init) = 25 °C; square wave - 50 A

[2] - 625 mW

[3] - 1.05 W

Ptot total power dissipation Tamb ≤ 25 °C

[1] - 2.1 W

Tjjunction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

[1] Device mounted on a ceramic PCB, Al2O3, standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

[1] [2] - - 200 K/W

[1] [3] - - 120 K/W

Rth(j-a) thermal resistance

from junction to

ambient

in free air

[1] [4] - - 60 K/W

Rth(j-sp) thermal resistance

from junction to solder

point

[5] - - 12 K/W

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a

significant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.

[5] Soldering point of cathode tab.

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 4 / 13

006aab666

102

103

Zth(j-a)

(K/W)

10- 1

tp(s)

10- 3 102103

10110- 2 10- 1

duty cycle =

10.75

0.5 0.33

0.2

0.25

0.1

0.05

0.02 0.01

FR4 PCB, standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

006aab667

102

103

Zth(j-a)

(K/W)

10- 1

tp(s)

10- 3 102103

10110- 2 10- 1

duty cycle =

10.75

0.5 0.33

0.2

0.25

0.1

0.05

0.02 0.01

FR4 PCB, mounting pad for cathode 1 cm2

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 5 / 13

006aab668

tp(s)

10- 3 102103

10110- 2 10- 1

102

Zth(j-a)

(K/W)

10- 1

duty cycle =

10.75

0.5

0.33

0.2

0.25

0.1

0.05

0.02 0.01

Ceramic PCB, Al2O3, standard footprint

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

10. Characteristics

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

IF = 0.1 A; Tj = 25 °C - 285 320 mV

IF = 1 A; Tj = 25 °C - 360 420 mV

VFforward voltage

IF = 3 A; Tj = 25 °C - 430 490 mV

VR = 10 V; Tj = 25 °C - 7 - µAIRreverse current

VR = 40 V; Tj = 25 °C - 35 200 µA

VR = 1 V; f = 1 MHz; Tj = 25 °C - 350 - pFCddiode capacitance

VR = 10 V; f = 1 MHz; Tj = 25 °C - 140 - pF

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 6 / 13

006aab669

VF(V)

0 0.60.40.2

10- 2

10- 3

10- 1

(A)

10- 4

(1)

(2)

(3) (4) (5)

(1) Tj = 150 °C

(2) Tj = 125 °C

(3) Tj = 85 °C

(4) Tj = 25 °C

(5) Tj = -40 °C

Fig. 4. Forward current as a function of forward

voltage; typical values

006aab670

10- 1

10- 2

10- 3

10- 4

10- 5

10- 6

10- 7

(A)

10- 8

VR(V)

0 403010 20

(1)

(2)

(3)

(4)

(1) Tj = 125 °C

(2) Tj = 85 °C

(3) Tj = 25 °C

(4) Tj = -40 °C

Fig. 5. Reverse current as a function of reverse

voltage; typical values

VR(V)

0 403010 20

006aab671

400

200

600

800

(pF)

f = 1 MHz; Tamb = 25 °C

Fig. 6. Diode capacitance as a function of reverse

voltage; typical values

IF(AV) (A)

0.0 5.04.02.0 3.01.0

006aab672

0.8

0.4

1.2

1.6

PF(AV)

(W)

0.0

(1)

(2)

(3)

(4)

Tj = 150 °C

(1) δ = 0.1

(2) δ = 0.2

(3) δ = 0.5

(4) δ = 1

Fig. 7. Average forward power dissipation as a

function of average forward current; typical

values

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 7 / 13

VR(V)

0 403010 20

006aab673

0.5

0.25

0.75

1.0

PR(AV)

(W)

0.0

(1)

(2)

(3)

(4)

Tj = 125 °C

(1) δ = 1

(2) δ = 0.9

(3) δ = 0.8

(4) δ = 0.5

Fig. 8. Average reverse power dissipation as a

function of reverse voltage; typical values

Tamb (°C)

0 50 100 150 1751257525

006aab674

1.5

3.0

4.5

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

FR4 PCB, standard footprint

Tj = 150 °C

(1) δ = 1; DC

(2) δ = 0.5; f = 20 kHz

(3) δ = 0.2; f = 20 kHz

(4) δ = 0.1; f = 20 kHz

Fig. 9. Average forward current as a function of

ambient temperature; typical values

Tamb (°C)

0 50 100 150 1751257525

006aab675

1.5

3.0

4.5

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

FR4 PCB, mounting pad for cathode 1 cm2

Tj = 150 °C

(1) δ = 1; DC

(2) δ = 0.5; f = 20 kHz

(3) δ = 0.2; f = 20 kHz

(4) δ = 0.1; f = 20 kHz

Fig. 10. Average forward current as a function of

ambient temperature; typical values

Tamb (°C)

0 50 100 150 1751257525

006aab676

1.5

3.0

4.5

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

Ceramic PCB, Al2O3, standard footprint

Tj = 150 °C

(1) δ = 1; DC

(2) δ = 0.5; f = 20 kHz

(3) δ = 0.2; f = 20 kHz

(4) δ = 0.1; f = 20 kHz

Fig. 11. Average forward current as a function of

ambient temperature; typical values

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 8 / 13

Tsp (°C)

0 50 100 150 1751257525

006aab677

1.5

3.0

4.5

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

Tj = 150 °C

(1) δ = 1; DC

(2) δ = 0.5; f = 20 kHz

(3) δ = 0.2; f = 20 kHz

(4) δ = 0.1; f = 20 kHz

Fig. 12. Average forward current as a function of solder point temperature; typical values

11. Test information

tcy

006aac658

duty cycle δ =

tcy

Fig. 13. Duty cycle definition

The current ratings for the typical waveforms are calculated according to the equations:

IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMS

defined as RMS current.

Quality information

This product has been qualified in accordance with the Automotive Electronics Council (AEC)

standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in

automotive applications.

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 9 / 13

12. Package outline

07-09-12Dimensions in mm

1.1

0.9

0.22

0.10

0.6

0.3

5.0

4.4 4.0

3.6

1.9

1.6

2.7

2.3

Fig. 14. Package outline CFP5 (SOD128)

13. Soldering

solder lands

solder resist

occupied area

solder paste

2.53.4 2.1

(2×)

1.9

(2×)

4.4

4.2

6.2

1.2

(2×)

1.4

(2×) sod128_fr

Dimensions in mm

Fig. 15. Reflow soldering footprint for CFP5 (SOD128)

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 10 / 13

SOD128Wave soldering footprint information

sod128_fw

occupied area

dummy track (solder resist and Cu free)

solder resist

solder lands

Issue date

Dimensions in mm

17-06-06

17-06-07

4.2

(2×)

5.7 4.35

(2×)

3.5 (2×) 3.65 (2×)

2.3

10.2

5.8

Fig. 16. Wave soldering footprint for CFP5 (SOD128)

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 11 / 13

14. Revision history

Table 8. Revision history

Data sheet ID Release date Data sheet status Change notice Supersedes

PMEG4030EP v.2 20171122 Product data sheet - PMEG4030EP_1

Modifications: •Features and benefits: Capable for reflow and wave soldering added

•Soldering: Wave soldering footprint added

PMEG4030EP_1 20090807 Product data sheet - -

Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 12 / 13

15. Legal information

Data sheet status

Document

status [1][2]

Product

status [3]

Definition

Objective

[short] data

sheet

Development This document contains data from

the objective specification for product

development.

Preliminary

[short] data

sheet

Qualification This document contains data from the

preliminary specification.

Product

[short] data

sheet

Production This document contains the product

specification.

[1] Please consult the most recently issued document before initiating or

completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the Internet at URL http://www.nexperia.com.

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Nexperia PMEG4030EP

3 A low VF MEGA Schottky barrier rectifier

Product data sheet 22 November 2017 13 / 13

16. Contents

1. General description......................................................1

2. Features and benefits.................................................. 1

3. Applications.................................................................. 1

4. Quick reference data....................................................1

5. Pinning information......................................................2

6. Ordering information....................................................2

7. Marking.......................................................................... 2

8. Limiting values............................................................. 3

9. Thermal characteristics............................................... 3

10. Characteristics............................................................ 5

11. Test information......................................................... 8

12. Package outline.......................................................... 9

13. Soldering..................................................................... 9

14. Revision history........................................................11

15. Legal information..................................................... 12

For more information, please visit: http://www.nexperia.com

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Date of release: 22 November 2017