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Middle Power Class-D Speaker Amplifiers
Analog Input / BTL Output
Class-D Speaker Amplifier
BD5424EFS
●Description
BD5424EFS is a 20W + 20W stereo class-D power amplifier IC, developed for space-saving and low heat-generation
applications such as low-profile TV sets. The IC employs state-of-the-art Bipolar, CMOS, and DMOS (BCD) process technology
that eliminates turn-on resistance in the out put power stage and internal loss due to line r esistances up to an ultimate level.
With this technology, the IC has achieved high efficiency of 91% (10W + 10W output with 8Ω load), which is the top cla ss in
the industry. The IC, in addition, employs a compact back-surface heat radiation type power package to achieve lo w power
consumption and l ow heat ge neration and elim inates nec essit y of installing an e xternal ra diator, up t o a total output of 40W.
This product satisfies both needs for drastic downsizing, low-profile structures and powerful, high-quality playback of the
sound system.
●Features
1) A high ef ficiency of 91% (10W + 10W output with 8Ω load), which is the highest grade in the industry and low heat-generation.
2) An output of 20W + 20W (17V, with 8Ω load) is allowed without an external heat radiator.
3) Driving a lowest rating load of 3.6Ω is allowed.
4) Pop noise upon turning power on/off and power interruption has been reduced.
5) High-quality audio muti ng is implemented by soft-switching technology.
6) An output power limiter function limits excessive output to speakers.
7) High-reliability design provided with built-in protection circuits against high temperatures, against VCC shorting and
GND shorting, against reduced-voltage, and against applying DC voltage to speaker.
8) A master/slave function allo wing synchronization of multiple devices reduces beat noises.
9) Adjustment of internal PWM sampling clock f r equencies (350kHz to 500kHz) allows easy protective measures
against unwanted radio emission to AM radio band.
10) A compact back-surface heat radiation type power package is employed.
HTSSOP-A44 (5mm × 7.5mm × 1.0mm, pitch 0.8mm)
●Absolute Maximum Ratings
A circuit must be designed and evaluated not to exceed absolute maximum ra ting in any cases and even mo mentarily, to prevent
reduction in functional performances and thermal destruction of a semicondu ctor product and secure useful life and reliability.
The following values assume Ta =25℃. For latest values, refer to delivery specifications.
Parameter Symbol Ratings Unit Conditions
Supply voltage VCC +20 V Pin 7, 8, 15, 16, 29, 30, 37, 38, 40
(Note 1, 2)
Power dissipation Pd 2.0 W(Note 3)
4.5 W(Note 4)
Input voltage for signal pin VIN -0.2 ~ +7.2 V Pin 1, 44 (Note 1)
Input voltage for control pin VCONT -0.2 ~ Vcc+0.2 V Pin 20, 24 (Note 1)
Input voltage for clock pin VOSC -0.2 ~ +7.2 V Pin 23 (Note 1)
Operating temperature range Topr -40 ~ +85 ℃
Storage temper ature range Tstg -55 ~ +150 ℃
Maximum junction temperature Tjmax +150 ℃
(Note 1) A voltage that can be applied with reference to GND (pins 11, 12, 33, 34, and 43)
(Note 2) Pd and Tjmax=150℃ must not be exceeded.
(Note 3) 70mm × 70mm × 1.6mm FR4 One-sided glass epoxy board (Back copper foil 0%) installed.
If used under Ta=25℃ or higher, reduce 16mW for increase of every 1℃. The board is provided with thermal via.
(Note 4) 70mm × 70mm × 1.6mm FR4 Both-sided glass epoxy board (Back copper foil 100%) installed.
If used under Ta=25℃ or higher, reduce 36mW for increase of every 1℃. The board is provided with thermal via.
No.10075EBT04
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BD5424EFS
●Operating Conditions
The following values assume Ta =25℃. Check for latest values in delivery specifications.
Parameter Symbol Ratings Unit Conditions
Supply voltage VCC +10 ~ +18 V Pin 7, 8, 15, 16, 29, 30, 37, 38, 40
Minimum load resistance RL 3.6 Ω (Note 5)
(Note 5) Pd should not be exceeded.
●Electrical Characteristics
Except otherwise specified Ta = 25℃, VCC = 12V, fIN = 1kHz, Rg = 0Ω, RL = 8Ω, MUTEX="H", MS="L", SDX="H".
For latest values, refer to delivery specifications.
Parameter Symbol Limits Unit Conditions
Whole circuit
Circuit current 1 (Sampling mode) ICC1 30 mA With no signal
Circuit current 2 (Muting mode) ICC2 12 mA MUTEX = “L”
Control circuit
“H” level input voltage VIH 2.3 ~ 12 V SDX, MUTEX, MS
“L” level input voltage VIL 0 ~ 0.8 V SDX, MU TEX, MS
Audio circuit
Voltage gain GV 28 dB PO = 1W
Maximum output power 1 (Note 6) PO1 10 W THD+N = 10%
Maximum output power 2 (Note 6) PO2 20 W Vcc=17V, THD+N = 10%
Total harmonic distortion (Note 6) THD 0.1 % PO = 1W, BW=20Hz ~ 20kHz
Crosstalk CT 85 dB PO = 1W, Rg = 0Ω, BW = IHF-A
Output noise voltage (Sampling mode) VNO 80 µVrms Rg = 0Ω, BW = IHF-A
Residual noise voltage (Muting mode) VNOM 35 µVrms Rg = 0Ω, BW = IHF-A, MUTEX = “L”
Mute Attenuation Gvm 98 dB Po =1W, BW =IHF-A, MUTEX = “L”
Internal sampling clock frequency FOSC 350 kHz MS = “L” (In master operation)
(Note 6) The rated values of items above indicate average performances of the device, which largely depend on circuit layouts, components,
and power supplies. The reference values are those applicable to the dev ice and components directly installed on a board specified by us.
Technical Note
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BD5424EFS
0.01
0.1
1
10
100
0.001 0.01 0.1 1 10 100
OUTPUT POWER (W)
THD+N (%)
100Hz
1kHz
6kHz
Vcc=12V
RL=8Ω
BW=20～20kHz
0.01
0.1
1
10
100
10 100 1000 10000 100000
FREQUENCY (Hz)
THD+N (%)
Vcc=12V
RL
=8Ω
Po=1W
BW=20～20kHz
0
5
10
15
20
25
30
35
40
10 100 1000 10000 100000
FREQUENCY (Hz)
VOLTAGE GAIN (dB)
Vcc=12V
RL=8Ω
Po=1W
L=33µH
C=0.47µF
Cｇ=0.1µF
-100
-80
-60
-40
-20
0
10 100 1000 10000 100000
FREQUENCY (Hz)
CROSSTALK (dB)
Vcc=12V
RL=8Ω
Po=1W
BW=20～20kHz
-100
-80
-60
-40
-20
0
0.001 0.01 0.1 1 10 100
OUTPUT POWER (W)
CROSSTALK (dB)
Vcc=12V
RL=8Ω
fin=1kHz
BW=20～20kHz
0
5
10
15
20
25
8 101214161820
VCC (V)
OUTPUT POWER (W)
THD=10%
THD=1%
RL=8Ω
fin=1kHz
●Electrical characteristic curves (Reference data)
(1) Under Stereo Operation (RL=8Ω)
Fig. 1 THD+N － Output powe
r
Fig. 2 THD+N － Frequency
Fig. 3 Voltage gain - Frequenc y Fig. 4 Crosstalk - Frequency
Fig. 5 Crosstalk - Output powe
r
Fig. 6 Output power - Power supply voltage
Technical Note
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BD5424EFS
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=12V
RL=8Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=10V
RL=8Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=18V
RL=8Ω
fin=1kHz
0
1
2
3
0 5 10 15 20 25 30 35 40 45 50
TOTAL OUTPUT POWER (W)
ICC (A)
Vcc=10V
Vcc=12V
Vcc=18V
RL=8Ω
fin=1kHz
-140
-120
-100
-80
-60
-40
-20
0
10 100 1000 10000 100000
FREQUENCY (Hz)
NOISE FFT (dBV)
Vcc=12V
RL=8Ω
無信号時
BW=20～20kHz
0
10
20
30
40
50
60
70
80
90
100
81012141618
VCC (V)
ICC (mA)
Sampling
Mute
RL=8Ω
無信号時
●Electrical characteristic curves (Refer ence data) – Continued
Fig. 7 Efficiency - Output powe
r
Fig. 8 Efficiency - Output powe
r
Fig. 9 Efficiency - Output powe
r
Fig. 10 Current consumption - Output powe
r
Fig. 11 Current consumption - Power supply voltage Fig. 12 FFT of Output Noise Voltage
Without signal
Without signal
Technical Note
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BD5424EFS
●Electrical characteristic curves (Refer ence data) – Continued
MUTEX
Pin 20
TM
Pin 26
10msec/div
2V/div
5V/div
10V/div Vcc=12V
RL=8Ω
Po=500mW
fin=500Hz
MUTEX
Pin 20
TM
Pin 26
10msec/div
2V/div
5V/div
10V/div Vcc=12V
RL=8Ω
Po=500mW
fin=500Hz
Speaker
output Speaker
output
Fig. 13 Wave form when Releasing Soft-mute Fig. 14 Wave form when Activating Soft-mute
VCCA
VHOLD
Pin 27 Vcc=12V
RL=8Ω
Po=500mW
fin=3kHz
20msec/div
2V/div
5V/div
5V/div
TM
Pin 26
VCCA
VHOLD
Pin 27 Vcc=12V
RL=8Ω
Po=500mW
fin=3kHz
2msec/div
2V/div
5V/div
5V/div
TM
Pin 26
Speaker
output Speaker
output
Fig. 15 Wave form on Instantaneous Power Interruption
(20msec / div) Fig. 16 Wave form on Instantaneous Power Interruption
(2msec / div)
Vcc=12V
RL=8Ω
Po=5W
THD+n=10%
fin=1kHz
R2=91kΩ
R3=22kΩ
200μsec/div
5V/div
Soft Clip
Soft Clip
Speaker
output
Fig. 17 Wave form on Output Power Limiter function
(Po = 5W)
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BD5424EFS
0
5
10
15
20
25
30
8 101214161820
VCC (V)
OUTPUT POWER (W)
THD=10%
RL=6Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=10V
RL=6Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=12V
RL=6Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25 30
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=18V
RL=6Ω
fin=1kHz
0
1
2
3
4
0 5 10 15 20 25 30 35 40 45 50 55 60
TOTAL OUTPUT POWER (W)
ICC (A)
Vcc=10V
Vcc=12V
Vcc=18V
RL=6Ω
fin=1kHz
●Electrical characteristic curves (Refer ence data) – Continued
(2)Under Stereo Operatio n (RL=6Ω)
Fig. 18 Output power - Power supply voltage
Fig. 19 Efficiency - Output powe
r
Fig. 20 Efficiency - Output powe
r
Fig. 21 Efficiency - Output powe
r
Fig. 22 Current consumption - Output powe
r
Dotted lines of the graphs indicate continuous output power to be obtained on musical signal source or by installing
additional heat sinks.
Technical Note
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BD5424EFS
0
5
10
15
20
25
30
8 1012141618
VCC (V)
OUTPUT POWER (W)
THD=10%
RL=4Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=10V
RL=4Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=12V
RL=4Ω
fin=1kHz
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25 30 35 40
OUTPUT POWER (W/ch)
EFFICIENCY (%)
Vcc=18V
RL=4Ω
fin=1kHz 0
1
2
3
4
5
6
0 1020304050607080
TOTAL OUTPUT POWER (W)
ICC (A)
Vcc=10V Vcc=12V
Vcc=18V
RL=4Ω
fin=1kHz
●Electrical characteristic curves (Refer ence data) – Continued
(3)Under Stereo Operatio n (RL=4Ω)
Fig. 23 Output power - Power supply voltage
Fig. 24 Efficiency - Output powe
r
Fig. 25 Efficiency - Output powe
r
Fig. 26 Efficiency - Output powe
r
Fig. 27 Current consumption - Output powe
r
Dotted lines of the graphs indicate continuous output power to be obtained on musical signal source or by installing
additional heat sinks.
Technical Note
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8/17
BD5424EFS
BD5424EFS
(MAX 18.85 include BURR)
18.
5
±
0.1
Lot No.
TYPE
1PIN MARK
(6.0)
(5.0)
0.85
44 23
122
1.0 MAX
(Unit: mm)
●Pin Assignment Top View
IN1
PLM T1
PLM T2
BSP1P
VCCP1P
VCCP1P
OUT1P
OUT1P
GNDP1
GNDP1
OUT1N
OUT1N
VCCP1N
BSP1N
WARNING
ERROR
MUTEX
N.C.
IN2
GNDA
FILA
FILP
VCCA
BSP2P
VCCP2P
VCCP2P
OUT2P
OUT2P
GNDP2
GNDP2
OUT2N
OUT2N
VCCP2N
VCCP2N
BSP2N
VHOLD
TM
ROSC
MS
OSC
VCCP1N
Output DC Voltage Protection
Output Short Protection
7
8
9
10
6
2
3
4
5
1
11
12
13
14
15
16
17
18
19
20
21
22
25
24
23
28
27
26
30
29
31
32
33
34
35
36
37
38
39
40
41
42
43
44
DRIVER
1P DRIVER
1N
Power
Limit
Soft M ute
FILP
PW M 1 PW M 2
DRIVER
2P DRIVER
2N
FILA
ERROR
Mute
Control
Under Voltage Protection
High Temperature Protection Ramp
Generator
Clock
Control
N.C.
Protections & Logic Power- off
Detector
VCCA
GNDA
WARNING
PLM T3
PLM T4
Control
SD
SDX
Fig. 28 Pin Assignment Diagram
●Outer Dimensions and Inscriptions
Fig. 29 Outer Dimensions and Inscriptions of HT SSOP-A44 Package
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BD5424EFS
●Explanation of Pin Functions (Provided pin voltages are typical values.)
No. Symbol Pin voltage Pin descri ptio n Internal equalizing circuit
1
44 IN1
IN2 3.5V ch1 Analog sig nal input pin
ch2 Analog signal input pin
Input audio signal via a capacitor.
2 PLMT1 3.5V Voltage-to-current conversion pin for
output power limiter function
Connect a register.
3 PLMT2 - Current-to-voltage conversion pin for
output power limiter function
Connect a register.
4 PLMT3 - Current-to-voltage conversion pin for
output power limiter function
Connect a register.
5 PLMT4 3.5V Bias pin for output power limiter function
Connect a register and a capacitor.
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BD5424EFS
●Explanation of Pin Functions - Continued
No. Symbol Pin voltage Pin description Internal equalizing circuit
6 BSP1P - ch1 positive bootstrap pin
Connect a capacitor.
7, 8 VCCP1P Vcc ch1 positive power system power supply
pin
9, 10 OUT1P Vcc ~ 0V ch1 positive PWM signal output pin
Connect with output LPF.
11, 12 GNDP1 0V ch1 power system GND pin
13, 14 OUT1N Vcc ~ 0V ch1 negative PWM signal output pin
Connect with output LPF.
15, 16 VCCP1N Vcc ch1 negative power system power supply
pin
17 BSP1N - ch1 ne gative bootstrap pin
Connect a capacitor.
18 WARNING H: 5V
L: 0V
Warnin g output pin
Pin to notify operation warning.
H: Under warning
L: Normal operation
19 ERROR H: 5V
L: 0V
Error output pin
A pin for notifying operation errors.
H: Error
L: Normal operation
20 MUTEX - Audio mute co ntrol pin
H: Mute off
L: Mute on
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BD5424EFS
●Explanation of Pin Functions - Continued
No. Symbol Pin voltage Pin descri ptio n Internal equalizing circuit
21 SDX - Shutdown control pin
H: Shutdown off
L: Shutdown on
22 N.C. - N.C. pin
Nothing is connected with IC internal
circuit.
23 OSC - Sampling clock signal i nput/output pin
When using two or more samplin g clocks,
connect via a capacitor.
24 MS -
Master/Slave switching pin
Switching of master/slave functions on a
sampling clock signal.
H: Slave operation
L: Master operation
25 ROSC 5.6V
Internal PWM sampling clock frequency
setting pin
Usually the pin is used open.
To adjust an internal sampling clock
frequency, connect a resister.
26 TM 0 ~ 5V Audio muting constant setting pin
Connect a capacitor.
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BD5424EFS
●Explanation of Pin Functions - Continued
No. Symbol Pin voltage Pin description Internal equalizing circuit
27 HOLD 0.68×Vcc
Instantaneous power interruption
detecting voltage setting pin
Connect a capacitor.
To adjust a detecting voltage, connect a
resister.
28 BSP2N - ch2 ne gative bootstrap pin
Connect a capacitor.
29, 30 VCCP2N Vcc ch2 negative power system power supply
pin
31, 32 OUT2N Vcc ~ 0V ch2 negative PWM signal output pin
Connect an output LPF.
33, 34 GNDP2 0V ch2 power system GND pin
35, 36 OUT2P Vcc ~ 0V ch2 positive PWM signal output pin
Connect an output LPF.
37, 38 VCCP2P Vcc ch2 positive power system power supply
pin
39 BSP2P - ch2 positive bootstrap pin
Connect a capacitor.
40 VCCA Vcc Analog system power pin
41 FILP Vcc+35
12 PWM system bias pin
Connect a capacitor.
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BD5424EFS
●Explanation of Pin Functions - Continued
No. Symbol Pin voltage Pin descri ptio n Internal equalizing circuit
42 FILA 3.5V Analog signal system bi as pin
Connect a capacitor.
43 GNDA 0Ｖ Analog system power supply pin
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BD5424EFS
●Application Circuit Diagram
・Vcc=10V ~ 18V
GNDA
VCCA
INPUT 2ch
1µF
10µF
10µF
MUTE
WARNING
OUTPUT
SLAVE
MASTER
CLK I/O
R25
ERROR
OUTPUT
INPUT 1ch
0.1µF
GNDP
0.1µF
22kΩ
22kΩ
22kΩ
GNDA
GNDA
0.1µF
SD
1
2
3
4
5
6
7
8
9
14
15
16
17
18
19
20
21
22
36
35
34
33
32
31
30
29
28
27
26
25
44
43
42
41
40
39
10
11
12
13
38
37
24
23
PWM1
DRIVER
1P
SOFT MUTE
DRIVER
1N
PWM2
DRIVER
2P
FILP
DRIVER
2N
Clock
Control
Mute
Control
ERROR
Ramp
Generator
GNDA
VCCA
WARNING
FILA
Protections & Logic
Under Voltage Protection
High Temperature Protection
Output Short Protection
Output DC Voltage Protection
N.C.
Power
Limit
SD
Control
Power-off
Detector
C43
1µF
R2
C40
C41
C42
C26
22kΩ
0.1µF
C23
3.3µF
C27
R4
R3 C5
+
0.1µF
VCCP
GNDP
1µF
+
10µF
C38
C29 C28
0.1µF
C37
1µF
C39
SP 2ch
(4Ω）
0.15µF 0.15µF
10µH
10µH
C35
C320.68µF
C31
L31
L35
0.1µF
VCCP
GNDP
1µF
+
10µF
C8
C15
C17
0.1µF
C7
1µF
C6
SP 1ch
(4Ω）
0.15µF 0.15µF
10µH
10µH
C9
C10
0.68µF
C13
L13
L9
1µF
C44
C1
Fig. 30 Circuit Diagram of Stereo Operation with 4Ω Load
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BD5424EFS
Table 1 BOM List of Stereo Operation with 4Ω Load
No. Item Part Number Vendor Configuration Value Rated
voltage Tolerance Temperature
characteristics Quantity Reference
mm inch
1 IC BD5424EFS ROHM HTSSOP-A44 - - - - 1 IC1
2 C GRM21BB31H105KA12 MURATA 2012 0805 1µF 50V ±10% ±10% 4 C6, C17, C28, C39
3 C GRM188R11H104KA93 MURATA 1608 0603 0.1µF 50V ±10% ±10% 5 C7, C15, C29, C37, C40
4 C GRM21BB31H154KA88 MURATA 2012 0805 0.15µF 50V ±10% ±10% 4 C9, C13, C31, C35
5 C GRM188B31C105KA92 MURATA 1608 0603 1µF 16V ±10% ±10% 2 C1, C44
6 C GRM31MR71H684KA88 MURATA 3216 1206 0.68µF 50V ±10% ±15% 2 C10, C32
7 C GRM21BB31E335KA75 MURATA 2012 0805 3.3µF 25V ±10% ±10% 1 C27
8 C GRM188B11E104KA01 MURATA 1608 0603 0.1µF 25V ±10% ±10% 3 C5, C23, C26
9 C GRM21BB11C105KA MURATA 2012 0805 1µF 16V ±10% ±10% 1 C41
10 C GRM21BB31C106KE15 MURATA 2012 0805 10µF 16V ±10% ±10% 1 C42
11 C 25SVPD10M SANYO 6666 2626 10µF 25V ±20% ±25% 3 C8, C38, C43
12 R MCR01MZPF2202 ROHM 1005 0402 22kΩ 50V ±1%
±200ppm/℃ 3 R2, R3, R4,R25
No. Item Part Number Vendor Configuration Value Tolerance DC
Resistance Rated
DC Current Quantity Reference
mm
13 L A7502BY-100M TOKO φ13×16.0 10µH ±20% 30mΩmax. 5.09A max. 4 L9, L13, L31, L35
Technical Note
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BD5424EFS
●Notes for use Notes for use
1. About absolute maximum r atings
If an applied voltage or an operating temperature exceeds an absolute maximum rating, it may cause destruction of a
device. A result of destruction, whether it is short mode or open mode, is not predictable. Therefore, provide a physical
safety measure such as fuse, against a special mode that may violate conditions of absolute maximum ratings.
2. About power supply line
As return of current regenerated by back EMF of output coil happens, take steps such as putting capacitor between
power supply and GND as a electric pathway for the regenerated current. Be sure that there is no problem with each
property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the
connected power supply do es not have sufficient current absorption capacity, regenerati ve current will cause the voltage
on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute
maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp
diode between the po wer suppl y and GND pins.
3. Potential of GND (11, 12, 33, 34, and 43 pins)
Potential of the GND terminal must be the lowest under any operating conditions.
4. About thermal design
Perform thermal design with sufficient margins, in consideration of ma ximum po wer dissipation Pd under actual operati ng
conditions. This product has an exposed frame on the bac k of the package, and it is assumed that the frame is used with
measures to improve efficiency of heat dissi pation. In addition to front surf ace of board, p rovide a h eat dissipation pattern
as widely as possible on the back also.
A class-D power amplifier has heat diss ipation efficiency far higher than that of conventional analog power ampl ifier and
generates less heat. However, extra attention must be paid in thermal design so that a power dissipation Pdiss should not
exceed the maximum power dissipation Pd.
Maximum power dissipation
W
θ
Ta-T
Pd aj
jmax
Tjmax: Maximum temperature junction = 150[℃]
Ta: Operating ambient temperature [℃]
θja: Package thermal resistance [℃/W]
Po: Output power [W]
η: Efficiency
Power dissipation
W 1-
η
1
PP Odiss
5. About operations in strong electric field
Note that the device may malfunction in a strong electric field.
6. Thermal shutdown (TSD) circuit
This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the outpu t
transistors are placed under open status. The thermal shutdown circuit is primarily intend ed to shut down the IC avoiding
thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = 150℃.
7. About shorting bet ween pin s and installation failure
Be careful about direction and displacement of an LSI when installing it onto the board. Faulty installation may destroy
the LSI when the device is energized. In addition, a fore ign matter getting in between LSI pins, pins a nd power supply,
and pins and GND may cause shorting and destruction of th e LSI.
8. About power supply startup and sh utdo wn
When starting up a power supply, be sure to place the MUTEX pin (pin 20) and SDX pin (pin 21), at “L” level. When
shutting down a po wer su pply also, be sure to place the pin at “L” level. Those processes reduce pop noises generated
upon turning on and off the power supply. In addition, all power supply pins must be started up and shut down at the
same time.
9. About WARNING output pin (pin 18) and ERROR output pin (pin 19)
A WARNING flag is output from the WARNING output pin upon operation of the high-temperatur e protection function and
under-voltage protection function. And an E RROR flag is output from the ERRO R outp ut pin upon o per ation of VCC/G ND
shorting protection function and spe aker DC voltage applying protection function. These flags are the function which the
condition of this product is shown in. The use which aimed at the protection except for this product is prohibition.
10. About N.C. pins (pin 22)
The N.C. (Non connection) pins are not connected with an internal circuit. Leave the pins open or connect them to GND.
Technical Note
www.rohm.com 2010.05 - Rev.B
© 2010 ROHM Co., Ltd. All rights reserved.
17/17
BD5424EFS
●Ordering part number
B D 5 4 2 4 E F S -E 2
Part No.
Part No.
Package
EFS:HTSSOP-44 Packaging and forming specific ation
E2: Embossed tape and reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tape (with dry pack)Tape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
1500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
HTSSOP-A44
(5.0)
(6.0)
0.85
9.5±0.2
7.5±0.1
44 23
22
1
(MAX 18.85 include BURR)
18.5±0.1
1PIN MARK
0.8
1.0MAX
0.85±0.05
0.08±0.05
0.08
M
0.37+0.05
-
0.04
S
0.08
0.5±0.15
1.0±0.2
0.17+0.05
-
0.03
S
4°
+
6°
−
4°
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
