1
2
3
4
8
7
6
5
OUTPUT
INPUT†
INPUT†
NC
NC
INPUT†
INPUT†
COMMON
D PACKAGE
(TOP VIEW)
NC − No internal connection
LP PACKAGE
(TOP VIEW)
†Internally connected
OUTPUT
INPUT
COMMON
 
 
SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D3-Terminal Regulators
DOutput Current Up To 100 mA
DNo External Components Required
DInternal Thermal-Overload Protection
DInternal Short-Circuit Current Limiting
DDirect Replacement for Industry-Standard
MC79L00 Series
DAvailable in 5% or 10% Selections
description/ordering information
This series of fixed negative-voltage
integrated-circuit voltage regulators is designed
for a wide range of applications. These include
on-card regulation for elimination of noise and
distribution problems associated with single-point
regulation. I n addition, they can be used to control series pass elements to make high-current voltage-regulator
circuits. One of these regulators can deliver up to 100 mA of output current. The internal current-limiting and
thermal-shutdown features essentially make the regulators immune to overload. When used as a replacement
for a Zener-diode and resistor combination, these devices can provide an effective improvement in output
impedance of two orders of magnitude, with lower bias current.
ORDERING INFORMATION
TJOUTPUT
VOLTAGE
TOLERANCE
NOMINAL
OUTPUT
VOLTAGE
(V)
PACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
SOIC (D)
Tube of 75 MC79L05ACD
79L05A
−5
SOIC (D)
Reel of 2500 MC79L05ACDR
79L05A
−5
T O-226 / TO-92 (LP)
Bulk of 1000 MC79L05ACLP
79L05AC
T O-226 / TO-92 (LP)
Reel of 2000 MC79L05ACLPR
79L05AC
SOIC (D)
Tube of 75 MC79L12ACD
79L12A
5%
−12
SOIC (D)
Reel of 2500 MC79L12ACDR
79L12A
0°C to 125°C
5%
−12
T O-226 / TO-92 (LP)
Bulk of 1000 MC79L12ACLP
79L12AC
0C to 125 C
T O-226 / TO-92 (LP)
Reel of 2000 MC79L12ACLPR
79L12AC
Bulk of 1000 MC79L15ACLP
−15 T O-226 / TO-92 (LP) Ammo of 2000 MC79L15ACLPM 79L15AC
−15
T O-226 / TO-92 (LP)
Reel of 2000 MC79L15ACLPR
79L15AC
10%
−12 T O-226 / TO-92 (LP) Bulk of 1000 MC79L12CLP 79L12C
10%
−15 SOIC (D) Tube of 75 MC79L15CD 79L15C
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Copyright 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
    !   "#$ %!&
%   "! "! '! !  !( !
%% )*& % "!+ %!  !!$* $%!
!+  $$ "!!&
 
 
SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
equivalent schematic
OUTPUT
INPUT
COMMON
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Input voltage: MC79L05 −30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MC79L12, MC79L15 −35 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 1 and 2): D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
LP package 140°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air, case, or virtual junction temperature 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN MAX UNIT
MC79L05 −7 −20
V
I
Input voltage MC79L12 −14.5 −27 V
VI
Input voltage
MC79L15 −17.5 −30
V
IOOutput current 100 mA
TJOperating virtual junction temperature 0 125 °C
 
 
SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified virtual junction temperature, VI = −10 V, IO = 40 mA (unless
otherwise noted)
TEST CONDITIONS†
TJ
MC79L05C MC79L05AC
UNIT
TEST CONDITIONS†
T
JMIN TYP MAX MIN TYP MAX
UNIT
25°C −4.6 −5 −5.4 −4.8 −5 −5.2
Output voltage
VI = −7 V to −20 V,
IO = 1 mA to 40 mA 0°C to 125°C −4.5 −5.5 −4.75 −5.25 V
VI = −10 V, IO = 1 mA to 70 mA 0°C to 125°C −4.5 −5.5 −4.75 −5.25
VI = −7 V to −20 V
25°C
200 150
mV
VI = −8 V to −20 V
25
°
C
150 100
mV
Ripple rejection VI = − 8 V t o −1 8 V, f = 120 Hz 25°C 40 49 41 49 dB
IO = 1 mA to 100 mA
25°C
60 60
mV
IO = 1 mA to 40 mA
25
°
C
30 30
mV
Output noise voltage f = 10 Hz to 100 kHz 25°C 40 40 µV
Dropout voltage IO = 40 mA 25°C 1.7 1.7 V
25°C 6 6
mA
125°C 5.5 5.5
mA
VI = −8 V to −20 V
0°C to 125°C
1.5 1.5
mA
IO = 1 mA to 40 mA
0
°
C to 125
°
C
0.2 0.1
mA
†All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across the output. Pulse-testing techniques are
used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into a ccount separately.
‡This specification applies only for dc power dissipation permitted by absolute maximum ratings.
electrical characteristics at specified virtual junction temperature, VI = −19 V, IO = 40 mA (unless
otherwise noted)
TEST CONDITIONS†
TJ
MC79L12C MC79L12AC
UNIT
TEST CONDITIONS†
T
JMIN TYP MAX MIN TYP MAX
UNIT
25°C −11.1 −12 −12.9 −11.5 −12 −12.5
Output voltage
VI = −14.5 V to −27 V,
IO = 1 mA to 40 mA 0°C to 125°C −10.8 −13.2 −11.4 −12.6 V
VI = −19 V, IO = 1 mA to 70 mA 0°C to 125°C −10.8 −13.2 −11.4 −12.6
VI = −14.5 V to −27 V
25°C
250 250
mV
VI = −16 V to −27 V
25
°
C
200 200
mV
Ripple rejection VI = −15 V to −25 V, f = 120 Hz 25°C 36 42 37 42 dB
IO = 1 mA to 100 mA
25°C
100 100
mV
IO = 1 mA to 40 mA
25
°
C
50 50
mV
Output noise voltage f = 10 Hz to 100 kHz 25°C 80 80 µV
Dropout voltage IO = 40 mA 25°C 1.7 1.7 V
25°C 6.5 6.5
mA
125°C 6 6
mA
VI = −16 V to −27 V
0°C to 125°C
1.5 1.5
mA
IO = 1 mA to 40 mA
0
°
C to 125
°
C
0.2 0.1
mA
†All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across the output. Pulse-testing techniques are
used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into a ccount separately.
‡This specification applies only for dc power dissipation permitted by absolute maximum ratings.
 
 
SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified virtual junction temperature, VI = −23 V, IO = 40 mA (unless
otherwise noted)
TEST CONDITIONS†
TJ
MC79L15C MC79L15AC
UNIT
TEST CONDITIONS†
T
JMIN TYP MAX MIN TYP MAX
UNIT
25°C −13.8 −15 −16.2 −14.4 −15 −15.6
VI = −17.5 V to −30 V,
0°C to 125°C
−13.5
−16.5
−14.25
−15.75
V
VI = −17.5 V to −30 V,
IO = 1 mA to 40 mA
0
°
C to 125
°
C
−13.5
−16.5
−14.25
−15.75
V
VI = −23 V, IO = 1 mA to 70 mA
0°C to 125°C
−13.5
−16.5
−14.25
−15.75
VI = −23 V, IO = 1 mA to 70 mA
0
°
C to 125
°
C
−13.5
−16.5
−14.25
−15.75
VI = −17.5 V to −30 V
25°C
300 300
mV
VI = −17.5 V to −30 V
25
°
C
250 250
mV
VI = −18.5 V to −28.5 V, f = 120 Hz
25°C
33
39
34
39
dB
VI = −18.5 V to −28.5 V, f = 120 Hz
25
°
C
33
39
34
39
dB
IO = 1 mA to 100 mA
25°C
150 150
mV
IO = 1 mA to 40 mA
25
°
C
75 75
mV
Output noise voltage f = 10 Hz to 100 kHz 25°C 90 90 µV
Dropout voltage IO = 40 mA 25°C 1.7 1.7 V
25°C 6.5 6.5
mA
125°C 6 6
mA
VI = −20 V to −30 V
0°C to 125°C
1.5 1.5
mA
IO = 1 mA to 40 mA
0
°
C to 125
°
C
0.2 0.1
mA
†All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across the output. Pulse-testing techniques are
used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into a ccount separately.
‡This specification applies only for dc power dissipation permitted by absolute maximum ratings.
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
MC79L05ACD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
MC79L05ACDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
MC79L05ACDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
MC79L05ACDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
MC79L05ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
MC79L05ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
MC79L05ACLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor
or Sales Office
MC79L05ACLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor
or Sales Office
MC79L05ACLPM ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Purchase Samples
MC79L05ACLPME3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Purchase Samples
MC79L05ACLPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Purchase Samples
MC79L05ACLPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Purchase Samples
MC79L05AILP OBSOLETE TO-92 LP 3 TBD Call TI Call TI Samples Not Available
MC79L05CD OBSOLETE SOIC D 8 TBD Call TI Call TI Samples Not Available
MC79L05CDR OBSOLETE SOIC D 8 TBD Call TI Call TI Samples Not Available
MC79L05CLP OBSOLETE TO-92 LP 3 TBD Call TI Call TI Samples Not Available
MC79L12ACD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
MC79L12ACDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
MC79L12ACDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
MC79L12ACDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2010
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
MC79L12ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
MC79L12ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
MC79L12ACLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Purchase Samples
MC79L12ACLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Purchase Samples
MC79L12ACLPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor
or Sales Office
MC79L12ACLPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor
or Sales Office
MC79L12CD OBSOLETE SOIC D 8 TBD Call TI Call TI Samples Not Available
MC79L12CLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor
or Sales Office
MC79L12CLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor
or Sales Office
MC79L15ACD OBSOLETE SOIC D 8 TBD Call TI Call TI Samples Not Available
MC79L15ACLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor
or Sales Office
MC79L15ACLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor
or Sales Office
MC79L15ACLPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Purchase Samples
MC79L15ACLPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Purchase Samples
MC79L15CLP OBSOLETE TO-92 LP 3 TBD Call TI Call TI Samples Not Available
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2010
Addendum-Page 3
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
MC79L05ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
MC79L12ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MC79L05ACDR SOIC D 8 2500 340.5 338.1 20.6
MC79L12ACDR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LP (O-PBCY-W3) PLASTIC CYLINDRICAL PACKAGE
4040001-2/C 10/01
STRAIGHT LEAD OPTION
0.016 (0,41)
0.014 (0,35)
0.157 (4,00) MAX
FORMED LEAD OPTION
0.104 (2,65)
0.210 (5,34)
0.170 (4,32)
0.050 (1,27)
0.016 (0,41)
0.022 (0,56)
0.500 (12,70) MIN
Seating
Plane
0.175 (4,44)
0.205 (5,21) 0.165 (4,19)
0.125 (3,17)
DIA
D
C
0.105 (2,67)
0.095 (2,41)
0.135 (3,43) MIN
0.080 (2,03)
0.055 (1,40)
0.045 (1,14)
1
0.105 (2,67)
23
0.080 (2,03)
0.105 (2,67)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area
D. FAlls within JEDEC TO -226 Variation AA (TO-226 replaces TO-92)
E. Shipping Method:
Straight lead option available in bulk pack only.
Formed lead option available in tape & reel or ammo pack.
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LP (O-PBCY-W3) PLASTIC CYLINDRICAL PACKAGE
4040001-3/C 10/01
0.094 (2,40)
0.114 (2,90)
0.460 (11,70)
0.539 (13,70)
TAPE & REEL
0.335 (8,50)
0.384 (9,75)
0.020 (0,50) MIN
0.217 (5,50)
0.748 (19,00) 0.748 (19,00)
0.689 (17,50)
0.098 (2,50)
0.433 (11,00)
0.335 (8,50)
0.610 (15,50)
0.650 (16,50)
1.260 (32,00)
0.905 (23,00)
0.234 (5,95)
0.266 (6,75)
0.512 (13,00)
0.488 (12,40)
0.114 (2,90)
0.094 (2,40) 0.146 (3,70)
0.169 (4,30) DIA
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Tape and Reel information for the Format Lead Option package.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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