General Description
The MAX9995 dual, high-linearity, downconversion
mixer provides 6.1dB gain, +25.6dBm IIP3, and 9.8dB
NF for UMTS/WCDMA, DCS, and PCS base-station
applications. The MAX9995 is ideal for low-side LO
injection. (For a mixer variant optimized for high-side
LO injection, contact the factory.)
This device integrates baluns in the RF and LO ports, a
dual-input LO selectable switch, an LO buffer, two double-
balanced mixers, and a pair of differential IF output ampli-
fiers. The MAX9995 requires a typical LO drive of 0dBm
and supply current is guaranteed to be below 380mA.
These devices are available in a compact 36-pin thin
QFN package (6mm ×6mm) with an exposed paddle.
Electrical performance is guaranteed over the extended
temperature range, from TC= -40°C to +85°C.
Applications
Features
♦1700MHz to 2200MHz RF Frequency Range
♦1400MHz to 2000MHz LO Frequency Range
(MAX9995)
♦1900MHz to 2400MHz LO Frequency Range
(Contact Factory)
♦40MHz to 350MHz IF Frequency Range
♦6.1dB Conversion Gain
♦+25.6dBm Input IP3
♦9.8dB Noise Figure
♦66dBc 2RF–2LO Spurious Rejection at
PRF = -10dBm
♦Dual Channels Ideal for Diversity Receiver
Applications
♦Integrated LO Buffer
♦Integrated RF and LO Baluns for Single-Ended
Inputs
♦Low -3dBm to +3dBm LO Drive
♦Built-In SPDT LO Switch with 50dB LO1–LO2
Isolation and 50ns Switching Time
♦44dB Channel-to-Channel Isolation
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
________________________________________________________________ Maxim Integrated Products 1
19-3383; Rev 0; 8/04
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
cdma2000 is a registered trademark of Telecommunications
Industry Association.
Ordering Information
PART TEMP RANGE PIN-PACKAGE
MAX9995ETX TC** = -40°C to +85°C 36 Thin QFN-EP*
MAX9995ETX-T TC = -40°C to +85°C 36 Thin QFN-EP*
MAX9995ETX+D TC = -40°C to +85°C 36 Thin QFN-EP*
lead free, bulk
MAX9995ETX+TD TC = -40°C to +85°C 36 Thin QFN-EP*
lead free, T/R
*EP = Exposed pad.
**TC= Case temperature.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18 28
29
30
31
32
33
34
35
36
19
20
21
22
23
24
25
26
27 LO2
VCC
GND
VCC
GND
GND
TAPDIV
TAPMAIN
RFMAIN
RFDIV
EXPOSED
PADDLE
IFD_SET
GND
IND_EXTD
LO_ADJ_D
N.C.
V
CC
V
CC
N.C.
LO_ADJ_M
V
CC
IND_EXTM
GND
IFM_SET
IFD+
IFD-
V
CC
IFM+
IFM-
LO1
LOSEL
GND
GND
GND
GND
GND
VCC
MAX9995
EXPOSED PADDLE ON THE BOTTOM OF THE PACKAGE
6mm x 6mm THIN QFN (EXPOSED PADDLE)
TOP VIEW
Pin Configuration/
Functional Diagram
UMTS/WCDMA and
cdma2000®3G Base
Stations
DCS1800 and EDGE
Base Stations
PCS1900 and EDGE
Base Stations
PHS/PAS Base Stations
Fixed Broadband
Wireless Access
Wireless Local Loop
Private Mobile Radio
Military Systems
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC ........................................................................-0.3V to +5.5V
LO1, LO2 to GND ...............................................................±0.3V
IFM_, IFD_, IFM_SET, IFD_SET, LOSEL,
LO_ADJ_M, LO_ADJ_D to GND.............-0.3V to (VCC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ..........................+20dBm
RFMAIN, RFDIV Current (RF is DC shorted to GND through
balun) ..................................................................................50mA
Continuous Power Dissipation (TA= +70°C)
36-Lead Thin QFN (derate 26mW/°C
above +70°C).............................................................2100mW
θJA .................................................................................+38°C/W
θJC ................................................................................+7.4°C/W
Operating Temperature Range (Note A) ....TC= -40°C to +85°C
Maximum Junction Temperature Range..........................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, no input RF or LO signals applied, VCC = 4.75V to 5.25V, TC= -40°C to +85°C. Typical values are at VCC
= 5.0V, TC= +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 4.75 5 5.25 V
Total supply current 332 380
VCC (pin 16) 82 90
VCC (pin 30) 97 110
IFM+/IFM- (total of both) 70 90
Supply Current ICC
IFD+/IFD- (total of both) 70 90
mA
LOSEL Input High Voltage VIH 2V
LOSEL Input Low Voltage VIL 0.8 V
LOSEL Input Current IIL and IIH -10 +10 µA
AC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50Ωsources, PLO = -3dBm to +3dBm, fRF =
1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, with fRF > fLO, TC= -40°C to +85°C. Typical values are at VCC =
5.0V, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, and TC= +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency fRF (Note 7) 1700 2200 MHz
(Note 7) 1400 2000 MHz
LO Frequency fLO (Contact factory) (Note 7) 1900 2400 MHz
IF Frequency fIF
Meeting RF and LO frequency ranges;
IF matching components affect the IF
frequency range (Note 7)
40 350 MHz
fRF = 1710MHz to 1875MHz 6
fRF = 1850MHz to 1910MHz 6.2Conversion Gain GC
fRF = 2110MHz to 2170MHz 6.1
dB
Note A: TCis the temperature on the exposed paddle of the package.
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 3
AC ELECTRICAL CHARACTERISTICS (continued)
(Typical Application Circuit, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50Ωsources, PLO = -3dBm to +3dBm, fRF =
1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, with fRF > fLO, TC= -40°C to +85°C. Typical values are at VCC =
5.0V, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, and TC= +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
fRF = 1710MHz to 1875MHz ±0.5 ±1
fRF = 1850MHz to 1910MHz ±0.5 ±1Gain Variation from Nominal
VCC = 5.0V,
TC = +25°C,
PLO = 0dBm,
PRF = -10dBm
(Note 3) fRF = 2110MHz to 2170MHz ±0.5 ±1
dB
Gain Variation with Temperature ±0.75 dB
fRF = 1710MHz to 1875MHz 9.7
fRF = 1850MHz to 1910MHz 9.8
Noise Figure NF No blockers
present fRF = 2110MHz to 2170MHz 9.9
dB
Noise Figure (with Blocker)
8dBm blocker tone applied to RF port at
2000MHz, fRF = 1900MHz, fLO = 1710MHz,
PLO = -3dBm
22 dB
Input 1dB Compression Point P1dB (Note 3) 9.5 12.6 dBm
Input Third-Order Intercept Point IIP3 (Notes 3, 4) 23 25.6 dBm
PRF = -10dBm 66
2RF-2LO Spur Rejection 2 x 2
fRF = 1900MHz,
fLO = 1700MHz,
fSPUR = 1800MHz (Note 3) PRF = -5dBm 61
dBc
PRF = -10dBm 70 88
3RF-3LO Spur Rejection 3 x 3
fRF = 1900MHz,
fLO = 1700MHz,
fSPUR = 1766.7MHz (Note 3) PRF = -5dBm 60 78
dBc
Maximum LO Leakage at RF Port fLO = 1400MHz to 2000MHz -29 dBm
M axi m um 2LO Leakag e at RF P or tf
LO = 1400MHz to 2000MHz -17 dBm
Maximum LO Leakage at IF Port fLO = 1400MHz to 2000MHz -25 dBm
Minimum RF to IF Isolation fRF = 1700MHz to 2200MHz, fIF = 200MHz 37 dB
LO1-LO2 Isolation PLO1 = 0dBm, PLO2 = 0dBm (Note 5) 40 50.5 dB
Minimum Channel-to-Channel
Isolation
PRF = -10dBm, RFMAIN (RFDIV)
power measured at IFDIV (IFMAIN),
relative to IFMAIN (IFDIV),
all unused parts terminated at 50Ω
40 44 dB
LO Switching Time 50% of LOSEL to IF settled to within 2° 50 ns
RF Return Loss 14 dB
LO port selected 18
LO Return Loss LO port unselected 21 dB
IF Return Loss LO driven at 0dBm, RF terminated into 50Ω21 dB
Note 1: Guaranteed by design and characterization.
Note 2: All limits reflect losses of external components. Output measurements taken at IF outputs of Typical Application Circuit.
Note 3: Production tested.
Note 4: Two tones 3MHz spacing, -5dBm per tone at RF port.
Note 5: Measured at IF port at IF frequency. fLO1 and fLO2 are offset by 1MHz.
Note 6: IF return loss can be optimized by external matching components.
Note 7: Operation outside this frequency band is possible but has not been characterized. See the Typical Operating Characteristics.
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
4 _______________________________________________________________________________________
CONVERSION GAIN vs. RF FREQUENCY
MAX9995 toc01
FREQUENCY (MHz)
CONVERSION GAIN (dB)
2100200019001800
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
3.0
1700 2200
TC = -20°C
TC = +85°C
TC = +25°C
CONVERSION GAIN vs. RF FREQUENCY
MAX9995 toc02
FREQUENCY (MHz)
CONVERSION GAIN (dB)
2100200019001800
5.6
5.7
5.8
5.9
6.0
6.1
6.2
6.3
6.4
6.5
5.5
1700 2200
PLO = -3dBm to +3dBm
CONVERSION GAIN vs. RF FREQUENCY
MAX9995 toc03
FREQUENCY (MHz)
CONVERSION GAIN (dB)
2100200019001800
5.6
5.7
5.8
5.9
6.0
6.1
6.2
6.3
6.4
6.5
5.5
1700 2200
VCC = 4.75V
VCC = 5.0V
VCC = 5.25V
INPUT IP3 vs. RF FREQUENCY
IIP3 (dBm)
24.8
25.2
25.6
26.0
26.4
26.8
24.4
MAX9995 toc04
FREQUENCY (MHz)
21002000190018001700 2200
TC = +85°C
TC = -20°C
TC = +25°C
2RF - 2LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc07
2RF - 2LO (dBc)
35
40
45
50
55
60
65
70
75
30
FREQUENCY (MHz)
21002000190018001700 2200
TC = +85°C
TC = +25°C
TC = -20°C
PRF = -5dBm
25.4
25.6
25.8
26.0
26.2
26.4
26.6
25.2
INPUT IP3 vs. RF FREQUENCY
IIP3 (dBm)
MAX9995 toc05
FREQUENCY (MHz)
21002000190018001700 2200
PLO = 0dBm
PLO = +3dBm
PLO = -3dBm
INPUT IP3 vs. RF FREQUENCY
IIP3 (dBm)
25.0
25.4
25.8
26.2
26.6
27.0
24.6
MAX9995 toc06
FREQUENCY (MHz)
21002000190018001700 2200
VCC = 5.25V
VCC = 4.75V VCC = 5.0V
52
54
56
58
62
60
64
66
50
2RF - 2LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc08
2RF - 2LO (dBc)
FREQUENCY (MHz)
21002000190018001700 2200
PLO = -3dBm
PLO = +3dBm
PLO = 0dBm
PRF = -5dBm
52
54
56
58
62
60
64
66
50
2RF - 2LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc09
2RF - 2LO (dBc)
FREQUENCY (MHz)
21002000190018001700 2200
VCC = 4.75V
VCC = 5.0V
VCC = 5.25V
PRF = -5dBm
Typical Operating Characteristics
(Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC= +25°C.)
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 5
72
74
76
78
80
82
84
86
88
90
70
3RF - 3LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc10
3RF - 3LO (dBc)
FREQUENCY (MHz)
21002000190018001700 2200
TC = -20°C
TC = +25°C
TC = +85°C
PRF = -5dBm
74
76
78
80
84
82
86
88
72
3RF - 3LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc11
3RF - 3LO (dBc)
FREQUENCY (MHz)
21002000190018001700 2200
PLO = -3dBm PLO = 0dBm
PLO = +3dBm
PRF = -5dBm
74
76
78
80
84
82
86
88
72
3RF - 3LO vs. FUNDAMENTAL FREQUENCY
MAX9995 toc12
3RF - 3LO (dBc)
FREQUENCY (MHz)
21002000190018001700 2200
VCC = 5.0V
VCC = 5.25V
VCC = 4.75V
PRF = -5dBm
INPUT P1dB vs. RF FREQUENCY
P1dB (dBm)
12.8
13.2
13.6
14.0
14.4
12.4
MAX9995 toc13
FREQUENCY (MHz)
21002000190018001700 2200
TC = +25°CTC = +85°C
TC = -20°C
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9995 toc16
FREQUENCY (MHz)
ISOLATION (dB)
19001800170016001500
46
47
48
49
50
51
52
53
54
55
45
1400 2000
TC = -20°C
TC = +25°C
TC = +85°C
13.0
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
12.9
INPUT P1dB vs. RF FREQUENCY
P1dB (dBm)
MAX9995 toc14
FREQUENCY (MHz)
21002000190018001700 2200
PLO = 0dBm
PLO = -3dBm
PLO = +3dBm
12.6
12.8
13.0
13.2
13.4
13.6
13.8
14.0
14.2
14.4
12.4
INPUT P1dB vs. RF FREQUENCY
P1dB (dBm)
MAX9995 toc15
FREQUENCY (MHz)
21002000190018001700 2200
VCC = 5.25V
VCC = 4.75V
VCC = 5.0V
48
49
50
51
52
53
54
47
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9995 toc17
FREQUENCY (MHz)
ISOLATION (dB)
190018001700160015001400 2000
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
48
49
50
51
52
53
54
47
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX9995 toc18
FREQUENCY (MHz)
ISOLATION (dB)
190018001700160015001400 2000
VCC = 4.75V TO 5.25V
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC= +25°C.)
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
6 _______________________________________________________________________________________
CHANNEL ISOLATION vs. RF FREQUENCY
ISOLATION (dB)
30
40
50
60
70
80
20
MAX9995 toc19
FREQUENCY (MHz)
21002000190018001700 2200
TC = +85°CTC = +25°C
TC = -20°C
CHANNEL ISOLATION vs. RF FREQUENCY
ISOLATION (dB)
40
50
60
70
80
90
30
MAX9995 toc20
FREQUENCY (MHz)
21002000190018001700 2200
PLO = 0dBm
PLO = +3dBm
PLO = -3dBm
CHANNEL ISOLATION vs. RF FREQUENCY
ISOLATION (dB)
40
50
60
70
80
90
30
MAX9995 toc21
FREQUENCY (MHz)
21002000190018001700 2200
VCC = 4.75V VCC = 5.0V
VCC = 5.25V
-55
-50
-45
-40
-30
-35
-25
-20
-60
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9995 toc22
LEAKAGE (dBm)
FREQUENCY (MHz)
1800 19001700160015001400 2000
TC = -20°C
TC = +85°CTC = +25°C
-50
-45
-40
-30
-35
-25
-20
-55
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9995 toc25
LEAKAGE (dBm)
FREQUENCY (MHz)
1800 1900
1700160015001400 2000
TC = -20°C
TC = +85°C
TC = +25°C
-50
-45
-40
-35
-30
-25
-55
LO LEAKAGE AT IF PORT vs. LO FREQUENC
Y
MAX9995 toc23
LEAKAGE (dBm)
FREQUENCY (MHz)
1800 19001700160015001400 2000
PLO = -3dBm
PLO = +3dBm PLO = 0dBm
-45
-40
-35
-30
-25
-50
LO LEAKAGE AT IF PORT vs. LO FREQUENCY
MAX9995 toc24
LEAKAGE (dBm)
FREQUENCY (MHz)
1800 19001700160015001400 2000
VCC = 5.25V
VCC = 4.75V
VCC = 5.0V
-45
-40
-35
-30
-25
-20
-50
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
MAX9995 toc26
LEAKAGE (dBm)
FREQUENCY (MHz)
1800 19001700160015001400 2000
PLO = +3dBm
PLO = -3dBm PLO = 0dBm -55
-50
-45
-40
-30
-35
-25
-20
-60
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
LEAKAGE (dBm)
FREQUENCY (MHz)
1800 19001700160015001400 2000
VCC = 4.75V TO 5.25V
MAX9995 toc27
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC= +25°C.)
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 7
39
40
41
42
43
44
45
38
RF TO IF ISOLATION vs. RF FREQUENCY
ISOLATION (dB)
MAX9995 toc28
FREQUENCY (MHz)
21002000190018001700 2200
TC = +85°C
TC = -20°C
TC = +25°C
37
39
38
40
41
43
42
45
44
46
36
RF TO IF ISOLATION vs. RF FREQUENCY
ISOLATION (dB)
MAX9995 toc29
FREQUENCY (MHz)
21002000190018001700 2200
PLO = -3dBm TO +3dBm
40.0
40.5
41.0
41.5
42.0
42.5
43.0
39.5
RF TO IF ISOLATION vs. RF FREQUENCY
ISOLATION (dB)
MAX9995 toc30
FREQUENCY (MHz)
21002000190018001700 2200
VCC = 5.25V
VCC = 4.75V
VCC = 5.0V
NOISE FIGURE vs. RF FREQUENCY
MAX9995 toc31
FREQUENCY (MHz)
NOISE FIGURE (dB)
210020001800 1900
7
8
9
10
12
11
13
14
6
1700 2200
TC = +85°CTC = +25°C
TC = -20°C
RETURN LOSS (dB)
25
20
15
10
5
0
30
RF RETURN LOSS vs. RF FREQUENCY
MAX9995 toc34
FREQUENCY (MHz)
210020001800 19001700 2200
PLO = -3dBm TO +3dBm
9.7
9.8
9.9
10.0
10.1
10.2
9.6
NOISE FIGURE vs. RF FREQUENCY
MAX9995 toc32
FREQUENCY (MHz)
NOISE FIGURE (dB)
210020001800 19001700 2200
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
9.6
9.7
9.8
9.9
10.0
10.1
10.2
10.3
10.4
10.5
9.5
NOISE FIGURE vs. RF FREQUENCY
MAX9995 toc33
FREQUENCY (MHz)
NOISE FIGURE (dB)
210020001800 19001700 2200
VCC = 5.25V
VCC = 5.0V
VCC = 4.75V
IF RETURN LOSS vs. IF FREQUENCY
MAX9995 toc35
FREQUENCY (MHz)
RETURN LOSS (dB)
320280200 240120 16080
40
35
30
25
20
15
10
5
0
45
40 360
LO RETURN LOSS vs. LO FREQUENCY
(LO INPUT SELECTED)
MAX9995 toc36
FREQUENCY (MHz)
RETURN LOSS (dB)
19001800170016001500
20
15
10
5
0
25
1400 2000
PLO = +3dBm
PLO = 0dBm
PLO = -3dBm
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC= +25°C.)
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
8 _______________________________________________________________________________________
PIN NAME FUNCTION
1 RFMAIN Main Channel RF Input. Internally matched to 50Ω. Requires an input DC-blocking capacitor.
2 TAPMAIN Main Channel Balun Center Tap. Connect a 0.033µF capacitor from this pin to the board ground.
3, 5, 7, 12, 20, 22,
24, 25, 26, 34 GND Ground
4, 6, 10, 16, 21, 30,
36 VCC Power Supply. Connect bypass capacitors as close to the pin as possible (see the Typical
Application Circuit).
8 TAPDIV Diversity Channel Balun Center Tap. Connect a 0.033µF capacitor from this pin to the ground.
9 RFDIV Diversity Channel RF Input. Internally matched to 50Ω. Requires an input DC-blocking capacitor.
11 IFD_SET IF Diversity Amplifier Bias Control. Connect a 1.2kΩ resistor from this pin to ground to set the
bias current for the diversity IF amplifier.
13, 14 IFD+, IFD- Diversity Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC
(see the Typical Application Circuit).
15 IND_EXTD Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation.
17 LO_ADJ_D LO Diversity Amplifier Bias Control. Connect a 392Ω resistor from this pin to ground to set the
bias current for the diversity LO amplifier.
18, 28 N.C. No Connection. Not internally connected.
19 LO1 Local Oscillator 1 Input. This input is internally matched to 50Ω. Requires an input DC-blocking
capacitor.
23 LOSEL Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2.
Pin Description
LO RETURN LOSS vs. LO FREQUENCY
(LO INPUT UN SELECTED)
MAX9995 toc37
FREQUENCY (MHz)
RETURN LOSS (dB)
19001800170016001500
30
25
20
15
10
5
0
35
1400 2000
PLO = -3dBm TO +3dBm
310
330
325
320
315
340
335
360
355
350
345
365
-20 -5 10 25 40 55 70 85
SUPPLY CURRENT vs. TEMPERATURE (TC)
MAX9995 toc38
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
VCC = 5.25V
VCC = 4.75V
VCC = 5.0V
Typical Operating Characteristics (continued)
(Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC= +25°C.)
Detailed Description
The MAX9995 dual, high-linearity, downconversion
mixer provides 6.1dB gain and +25.6dBm IIP3, with a
9.8dB noise figure. Integrated baluns and matching cir-
cuitry allow 50Ωsingle-ended interfaces to the RF and
LO ports. A single-pole, double-throw (SPDT) LO
switch provides 50ns switching time between LO
inputs, with 50dB LO-to-LO isolation. Furthermore, the
integrated LO buffer provides a high drive level to the
mixer core, reducing the LO drive required at the
MAX9995’s inputs to -3dBm. The IF port incorporates a
differential output, which is ideal for providing
enhanced 2RF-2LO performance.
Specifications are guaranteed over broad frequency
ranges to allow for use in UMTS/WCDMA and
2G/2.5G/3G DCS1800, PCS1900, and cdma2000 base
stations. The MAX9995 is specified to operate over an
RF input range of 1700MHz to 2200MHz, an LO range
of 1400MHz to 2000MHz, and an IF range of 40MHz to
350MHz. Operation beyond this is possible; however,
performance is not characterized. This device can
operate in high-side LO injection applications with an
extended LO range, but performance degrades as fLO
continues to increase. For a device with better high-
side performance, contact the factory. This device is
available in a compact 6mm x 6mm, 36-pin thin QFN
package with an exposed paddle.
RF Input and Balun
The MAX9995’s two RF inputs (RFMAIN and RFDIV) are
internally matched to 50Ω, requiring no external match-
ing components. DC-blocking capacitors are required
as the inputs are internally DC shorted to ground
through the on-chip baluns. Input return loss is typically
14dB over the entire RF frequency range of 1700MHz
to 2200MHz.
LO Input, Switch, Buffer, and Balun
The mixers can be used for either high-side or low-side
injection applications with an LO frequency range of
1400MHz to 2000MHz. For a device with an LO fre-
quency range of 1900MHz to 2400MHz, contact the
factory. As an added feature, the MAX9995 includes an
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 9
PIN NAME DESCRIPTION
27 LO2 Local Oscillator 2 Input. This input is internally matched to 50Ω. Requires an input DC-blocking
capacitor.
29 LO_ADJ_M LO Main Amplifier Bias Control. Connect a 392Ω resistor from this pin to ground to set the bias
current for the main LO amplifier.
31 IND_EXTM Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation.
32, 33 IFM-, IFM+ Main Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC
(see the Typical Application Circuit).
35 IFM_SET IF Main Amplifier Bias Control. Connect a 1.2kΩ resistor from this pin to ground to set the bias
current for the main IF amplifier.
Exposed Paddle GND Exposed Ground Plane. This paddle affects RF performance and provides heat dissipation. The
paddle must be connected to ground.
Pin Description (continued)
Table 1. Component Values
COMPONENT VALUE DESCRIPTION
C1, C8 4pF Microwave capacitors (0402)
C2, C7 10pF Microwave capacitors (0402)
C3, C6 0.033µF Microwave capacitors (0603)
C4, C5, C14, C16 22pF Microwave capacitors (0402)
C9, C13, C15,
C17, C18 0.01µF Microwave capacitors (0402)
C10, C11, C12,
C19, C20, C21 150pF Microwave capacitors (0603)
L1, L2, L4, L5 330nH Wire-wound high-Q inductors
(0805)
L3, L6 10nH Wire-wound high-Q inductors
(0603)
R1, R4 1.21kΩ±1% resistors (0402)
R2, R5 392Ω±1% resistors (0402)
R3, R6 10Ω±1% resistors (1206)
T1, T2 4:1
(200:50) IF baluns
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
10 ______________________________________________________________________________________
RF MAIN INPUT
RF DIV INPUT
C2C3
C1
C8
C9
C13
C17
C18
R1
VCC
L2
L1
R3
C20
C19
IF MAIN OUTPUT
T1
C16
R2
L3
LO2
C14
LO1
4:1
4:1
VCC
VCC
VCC
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18 28
29
30
31
32
33
34
35
36
19
20
21
22
23
24
25
26
27 LO2
VCC
GND
VCC
GND
GND
TAPDIV
TAPMAIN
RFMAIN
RFDIV
EXPOSED
PADDLE
IFD_SET
GND
IND_EXTD
LO_ADJ_D
N.C.
V
CC
V
CC
N.C.
LO_ADJ_M
V
CC
IND_EXTM
GND
IFM_SET
IFD+
IFD-
V
CC
IFM+
IFM-
LO1
LOSEL
GND
GND
GND
GND
GND
VCC
MAX9995
C4
C7C6
C5
VCC
VCC
C21
LO SELECT
C15
VCC
R5
R4
VCC
L4
L5
R6
L6
C10
C11
T2
IF DIV OUTPUT
C12
Typical Application Circuit
internal LO SPDT switch that can be used for frequen-
cy-hopping applications. The switch selects one of the
two single-ended LO ports, allowing the external oscil-
lator to settle on a particular frequency before it is
switched in. LO switching time is typically less than
50ns, which is more than adequate for virtually all GSM
applications. If frequency hopping is not employed, set
the switch to either of the LO inputs. The switch is con-
trolled by a digital input (LOSEL): logic high selects
LO1, and logic low selects LO2. LO1 and LO2 inputs
are internally matched to 50Ω, requiring only a 22pF
DC-blocking capacitor.
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifica-
tions are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF out-
puts are integrated on-chip.
High Linearity Mixers
The core of the MAX9995 is a pair of double-balanced,
high-performance passive mixers. Exceptional linearity
is provided by the large LO swing from the on-chip LO
buffer. When combined with the integrated IF ampli-
fiers, the cascaded IIP3, 2RF-2LO rejection, and NF
performance is typically +25.6dBm, 66dBc, and 9.8dB,
respectively.
Differential IF Output Amplifiers
The MAX9995 mixers have an IF frequency range of
40MHz to 350MHz. The differential, open-collector IF
output ports require external pullup inductors to VCC.
Note that these differential outputs are ideal for provid-
ing enhanced 2RF-2LO rejection performance. Single-
ended IF applications require a 4:1 balun to transform
the 200Ωdifferential output impedance to a 50Ωsingle-
ended output. After the balun, VSWR is typically 1.5:1.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω.
No matching components are required. Return loss at
each RF port is typically 14dB over the entire input
range (1700MHz to 2200MHz), and return loss at the
LO ports is typically 18dB (1400MHz to 2000MHz). RF
and LO inputs require only DC-blocking capacitors for
interfacing.
The IF output impedance is 200Ω(differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50Ωsingle-
ended output (see the Typical Application Circuit).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are
optimized by fine tuning the resistors R1, R2, R4, and R5.
If reduced current is required at the expense of perfor-
mance, contact factory. If the ±1% bias resistor values
are not readily available, substitute standard ±5% values.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that mul-
tiple vias be used to connect this pad to the lower-level
ground planes. This method provides a good RF/ther-
mal-conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX9995 Evaluation Kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each VCC pin with a
capacitor as close to the pin as possible (Typical
Application Circuit).
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9995’s 36-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
which the MAX9995 is mounted be designed to con-
duct heat from the EP. In addition, provide the EP with
a low-inductance path to electrical ground. The EP
MUST be soldered to a ground plane on the PC board,
either directly or through an array of plated via holes.
Chip Information
TRANSISTOR COUNT: 1414
PROCESS: SiGe BiCMOS
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 11
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
12 ______________________________________________________________________________________
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
QFN THIN 6x6x0.8.EPS
e e
LL
A1 A2 A
E/2
E
D/2
D
E2/2
E2
(NE-1) X e
(ND-1) X e
e
D2/2
D2
b
k
k
L
C
L
C
L
C
L
C
L
E
12
21-0141
PACKAGE OUTLINE
36, 40, 48L THIN QFN, 6x6x0.8mm
L1
L
e
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13
© 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm
FROM TERMINAL TIP.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1
SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE
ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT FOR 0.4mm LEAD PITCH PACKAGE T4866-1.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
3. N IS THE TOTAL NUMBER OF TERMINALS.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
NOTES:
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
E
22
21-0141
PACKAGE OUTLINE
36, 40, 48L THIN QFN, 6x6x0.8mm
