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SMT power inductors
Size 12.95 u 9.4 u 5.08 (mm)
Series/Type: B82476A1
Date: June 2012
EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
206/12
Please read Cautions and warnings and
Important notes at the end of this document.
Rated inductance 1 ... 1000 μH
Rated current 0.3 ... 6.8 A
Construction
■Ferrite core
■Winding: enamel copper wire
■Winding soldered to terminals
■Plastic terminal carrier
Features
■Temperature range up to +150 °C
■High rated current
■Low DC resistance
■Suitable for lead-free reflow soldering
as referenced in JEDEC J-STD 020D
■RoHS-compatible
Applications
■Filtering of supply voltages
■Coupling, decoupling
■DC/DC converters
■Automotive electronics
■Industrial electronics
■Consumer electronics
Terminals
■Base material CuSn6P
■Schichtaufbau Ni, Sn (lead-free)
■Electro-plated
Marking
■Marking on component:
Manufacturer, L value (PH, coded),
manufacturing date (YWWD)
■Minimum marking on reel:
Manufacturer, ordering code, L value,
quantity, date of packing
Delivery mode and packing unit
■24-mm blister tape, wound on 330-mm reel
■Packing unit: 750 pcs./reel
B82476A1SMT power inductors
Size 12.95 x 9.4 x 5.08 (mm)
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Please read Cautions and warnings and
Important notes at the end of this document.
Dimensional drawing and layout recommendation
Taping and packing
Blister tape Reel
Dimensions in mm
IND0105-H
2.92
2.79
7.37
Dimensions in mm
Component tolerances r0.2 mm unless
otherwise noted.
IND0348-6
75±1
30.4 max.
2.5±0.5
330±1
13±0.2
1.0
21±0.5
B82476A1SMT power inductors
Size 12.95 x 9.4 x 5.08 (mm)
406/12
Please read Cautions and warnings and
Important notes at the end of this document.
Technical data and measuring conditions
Characteristics and ordering codes
Rated inductance LR
Measured with LCR meter Agilent 4284A at frequency f
L
, 0.1 V, +20 °C
Rated temperature TR+85 °C
Rated current IRMax. permissible DC with temperature increase of d 40 K at rated
temperature
Saturation current Isat Max. permissible DC with inductance decrease'L/L0 of approx. 10%
DC resistance Rmax Measured at +20 °C
Solderability (lead-free) Dip and look method Sn95.5Ag3.8Cu0.7: +(245 r5) °C, (5 r0.3) s
Wetting of soldering area t90%
(based on IEC 60068-2-58)
Resistance to soldering heat +260 °C, 40 s (as referenced in JEDEC J-STD 020D)
Climatic category 55/150/56 (to IEC 60068-1)
Storage conditions Mounted: –55 °C … +150 °C
Packaged: –25 °C … +40 °C, d75% RH
Weight Approx. 1.3 g
LR
PH
Tolerance fL
MHz
IR
A
Isat
A
Rmax
:
Ordering code
1.0 r20% M 0.1 6.8 9.0 0.0080 B82476A1102M000
1.5 0.1 6.4 8.0 0.0090 B82476A1152M000
2.2 0.1 6.1 7.0 0.0105 B82476A1222M000
3.3 0.1 5.4 6.4 0.0135 B82476A1332M000
4.7 0.1 4.8 5.4 0.0165 B82476A1472M000
6.8 0.1 4.4 4.6 0.0210 B82476A1682M000
10 0.1 3.9 3.8 0.0270 B82476A1103M000
15 0.1 3.1 3.0 0.0400 B82476A1153M000
22 0.1 2.7 2.6 0.0500 B82476A1223M000
33 0.1 2.1 2.0 0.0880 B82476A1333M000
47 0.1 1.8 1.6 0.120 B82476A1473M000
68 0.1 1.5 1.4 0.160 B82476A1683M000
100 0.1 1.3 1.2 0.230 B82476A1104M000
150 0.1 1.0 1.0 0.330 B82476A1154M000
220 0.1 0.8 0.8 0.530 B82476A1224M000
330 0.1 0.6 0.6 0.810 B82476A1334M000
470 0.1 0.5 0.5 1.10 B82476A1474M000
680 0.1 0.4 0.4 1.60 B82476A1684M000
1000 0.1 0.3 0.3 2.15 B82476A1105M000
^
B82476A1SMT power inductors
Size 12.95 x 9.4 x 5.08 (mm)
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Impedance |Z| versus frequency f
measured with impedance analyzer
Agilent 4294A, typical values at +20 °C
Current derating Iop/IR
versus ambient temperature TA
(rated temperature TR = +85 °C)
Inductance L versus DC load current IDC
measured with LCR meter Agilent 4275A,
typical values at +20 °C
0
0
0.2
0.4
I
0.6
R
0.8
1.0
op
I
1.2
A
T
IND0602-K
C
˚
20 40 60 80 100 120 150
B82476A1SMT power inductors
Size 12.95 x 9.4 x 5.08 (mm)
606/12
Cautions and warnings
■Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.
706/12
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for certain areas
of application. These statements are based on our knowledge of typical requirements that are often placed
on our products in the areas of application concerned. We nevertheless expressly point out that such
statements cannot be regarded as binding statements about the suitability of our products for a
particular customer application. As a rule we are either unfamiliar with individual customer applications or
less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent
on the customer to check and decide whether a product with the properties described in the product
specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure before
the end of their usual service life cannot be completely ruled out in the current state of the art, even
if they are operated as specified. In customer applications requiring a very high level of operational safety
and especially in customer applications in which the malfunction or failure of an electronic component could
endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be
ensured by means of suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the
event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet
(www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our
sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this publication
may change from time to time. The same is true of the corresponding product specifications. Please
check therefore to what extent product descriptions and specifications contained in this publication are still
applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The aforementioned
does not apply in the case of individual agreements deviating from the foregoing for customer-specific
products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and
Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF
certifications confirm our compliance with requirements regarding the quality management system in the
automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK
always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949
may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only
requirements mutually agreed upon can and will be implemented in our Quality Management
System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become
legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered
or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-
electronics.tdk.com/trademarks.
Release 2018-10
