
IN74AC32
2
MAXIMUM RATINGS*
Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) -0.5 to +7.0 V
VIN DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V
VOUT DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V
IIN DC Input Current, per Pin ±20 mA
IOUT DC Output Sink/Source Current, per Pin ±50 mA
ICC DC Supply Current, VCC and GND Pins ±50 mA
PD Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
mW
Tstg Storage Temperature -65 to +150 °C
TL Lead Temperature, 1 mm from Case for 10
Seconds
(Plastic DIP or SOIC Package)
260 °C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC DC Supply Voltage (Referenced to GND) 2.0 6.0 V
VIN, VOUT DC Input Voltage, Output Voltage (Referenced to
GND)
0 VCC V
TJ Junction Temperature (PDIP) 140 °C
TA Operating Temperature, All Package Types -40 +85 °C
IOH Output Current - High -24 mA
IOL Output Current - Low 24 mA
tr, tf Input Rise and Fall Time *
(except Schmitt Inputs)
VCC =3.0 V
VCC =4.5 V
VCC =5.5 V
0
0
0
150
40
25
ns/V
* VIN from 30% to 70% VCC
This device contains protection circuitry to guard against damage due to high static
voltages or electric fields. However, precautions must be taken to avoid applications of any voltage
higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and
VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or
VCC). Unused outputs must be left open.