General Description
The MAX9390/MAX9391 dual 2 x 2 crosspoint switches
perform high-speed, low-power, and low-noise signal
distribution. The MAX9390/MAX9391 multiplex one of two
differential input pairs to either or both low-voltage differ-
ential signaling (LVDS) outputs for each channel.
Independent enable inputs turn on or turn off each differ-
ential output pair.
Four LVCMOS/LVTTL logic inputs (two per channel) con-
trol the internal connections between inputs and outputs.
This flexibility allows for the following configurations: 2 x 2
crosspoint switch, 2:1 mux, 1:2 splitter, or dual repeater.
This makes the MAX9390/MAX9391 ideal for protection
switching in fault-tolerant systems, loopback switching for
diagnostics, fanout buffering for clock/data distribution,
and signal regeneration.
Fail-safe circuitry forces the outputs to a differential low
condition for undriven inputs or when the common-
mode voltage exceeds the specified range. The
MAX9390 provides high-level input fail-safe detection
for LVDS, HSTL, and other GND-referenced differential
inputs. The MAX9391 provides low-level input fail-safe
detection for LVPECL, CML, and other VCC-referenced
differential inputs.
Ultra-low 82ps(P-P) (max) pseudorandom bit sequence
(PRBS) jitter ensures reliable communications in high-
speed links that are highly sensitive to timing error,
especially those incorporating clock-and-data recovery,
or serializers and deserializers. The high-speed switch-
ing performance guarantees 1.5GHz operation and less
than 65ps (max) skew between channels.
LVDS inputs and outputs are compatible with the
TIA/EIA-644 LVDS standard. The LVDS outputs drive
100Ωloads. The MAX9390/MAX9391 are offered in a
32-pin TQFP package and operate over the extended
temperature range (-40°C to +85°C).
Also refer to the MAX9392/MAX9393 with flow-through
pinout.
Applications
High-Speed Telecom/Datacom Equipment
Central-Office Backplane Clock Distribution
DSLAM
Protection Switching
Fault-Tolerant Systems
Features
1.5GHz Operation with 250mV Differential Output
Swing
2ps(RMS) (max) Random Jitter
AC Specifications Guaranteed for 150mV
Differential Input
Signal Inputs Accept Any Differential Signaling
Standard
LVDS Outputs for Clock or High-Speed Data
High-Level Input Fail-Safe Detection (MAX9390)
Low-Level Input Fail-Safe Detection (MAX9391)
3.0V to 3.6V Supply Voltage Range
LVCMOS/LVTTL Logic Inputs Control Signal
Routing
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
________________________________________________________________ Maxim Integrated Products 1
TOP VIEW
MAX9390
MAX9391
TQFP
32 28
293031 25
26
27
INA1
INA1
VCC
ASEL0
ASEL1
INA0
INA0
GND
10 13 15
14 1611 12
9
GND
INB0
INB0
BSEL0
VCC
INB1
INB1
BSEL1
17
18
19
20
21
22
23 OUTA0
24 VCC
OUTA0
ENA0
GND
OUTA1
OUTA1
ENA1
2
3
4
5
6
7
8VCC
OUTB0
OUTB0
GND
OUTB1
OUTB1
1ENB1
ENB0
+
PART TEMP RANGE PIN-
PACKAGE
PKG
CODE
MAX9390EHJ -40°C to +85°C 32 TQFP H32-1
MAX9390EHJ+ -40°C to +85°C 32 TQFP H32-1
MAX9391EHJ -40°C to +85°C 32 TQFP H32-1
MAX9391EHJ+ -40°C to +85°C 32 TQFP H32-1
Pin Configurations
Ordering Information
19-2829; Rev 2; 5/07
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
+Denotes a lead-free package.
Functional Diagram and Typical Operating Circuit appear at
end of data sheet.
EVALUATION KIT
AVAILABLE
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC = 3.0V to 3.6V, RL= 100Ω±1%, EN_ _ = VCC, VCM = 0.05V to (VCC - 0.6V) (MAX9390), VCM = 0.6V to (VCC - 0.05V) (MAX9391) TA=
-40°C to +85°C, unless otherwise noted. Typical values are at VCC = 3.3V, |VID| = 0.2V, VCM = 1.2V, TA= +25°C.) (Notes 1, 2, and 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC to GND...........................................................-0.3V to +4.1V
IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _,
_SEL_ to GND.........................................-0.3V to (VCC + 0.3V)
IN_ _ to IN_ _ ..........................................................................±3V
Short-Circuit Duration (OUT_ _, OUT_ _) ...................Continuous
Continuous Power Dissipation (TA= +70°C)
32-Pin QFP (derate 13.1mW/°C
above +70°C).............................................................1047mW
Junction-to-Ambient Thermal Resistance in Still Air
32-Pin TQFP............................................................+76.4°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ESD Protection (Human Body Model)
(IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _, SEL_ _) ................±2kV
Soldering Temperature (10s) ...........................................+300°C
PARAMETER
SYM B O L
CONDITIONS
MIN TYP MAX
UNITS
LVCMOS/LVTTL INPUTS (EN_ _, _SEL_)
Input High Voltage VIH 2.0 VCC V
Input Low Voltage VIL 0 0.8 V
Input High Current IIH VIN = 2.0V to VCC 020µA
Input Low Current IIL VIN = 0 to 0.8V 0 10 µA
DIFFERENTIAL INPUTS (IN_ _, IN_ _)
Differential Input Voltage VID VILD
>
0 and VIHD
<
VCC, Figure 1 0.1 3.0 V
MAX9390
0.05 VCC - 0.6
Input Common-Mode Range VCM MAX9391 0.6
VCC - 0.05
V
MAX9390 |VID|
<
3.0V -75 +10
Input Current IIN_ _,
IIN_ _ MAX9391 |VID|
<
3.0V -10
+100
µA
LVDS OUTPUTS (OUT_ _, OUT_ _)
Differential Output Voltage VOD RL = 100Ω, Figure 2
250 350
450 mV
Change in Magnitude of VOD
Between Complementary Output
States
ΔVOD Figure 2
1.0
50 mV
Offset Common-Mode Voltage VOS Figure 2
1.125 1.25 1.375
V
Change in Magnitude of VOS
Between Complementary Output
States
ΔVOS Figure 2
1.0
50 mV
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________ 3
AC ELECTRICAL CHARACTERISTICS
(VCC = 3.0V to 3.6V, fIN <1.34GHz, tR_IN = tF_IN = 125ps, RL= 100Ω±1%, |VID| > 150mV, VCM = 0.075V to (VCC - 0.6V) (MAX9390
only), VCM = 0.6V to (VCC - 0.075V) (MAX9391 only), EN_ _ = VCC, TA= -40°C to +85°C, unless otherwise noted. Typical values are
at VCC = 3.3V, |VID| = 0.2V, VCM = 1.2V, fIN = 1.34GHz, TA= +25°C.) (Note 5)
Note 1: Measurements obtained with the device in thermal equilibrium. All voltages referenced to GND except VID, VOD, and ΔVOD.
Note 2: Current into the device defined as positive. Current out of the device defined as negative.
Note 3: DC parameters tested at TA= +25°C and guaranteed by design and characterization for TA= -40°C to +85°C.
Note 4: Current through either output.
Note 5: Guaranteed by design and characterization. Limits set at ±6 sigma.
Note 6: tSKEW is the magnitude difference of differential propagation delays for the same output over same conditions. tSKEW =
|tPHL - tPLH|.
Note 7: Measured between outputs of the same device at the signal crossing points for a same-edge transition, under the same
conditions.
Note 8: Device jitter added to the differential input signal.
DC ELECTRICAL CHARACTERISTICS (continued)
(VCC = 3.0V to 3.6V, RL= 100Ω±1%, EN_ _ = VCC, VCM = 0.05V to (VCC - 0.6V) (MAX9390), VCM = 0.6V to (VCC - 0.05V) (MAX9391) TA=
-40°C to +85°C, unless otherwise noted. Typical values are at VCC = 3.3V, |VID| = 0.2V, VCM = 1.2V, TA= +25°C.) (Notes 1, 2, and 3)
PARAMETER
SYM B O L
CONDITIONS
MIN
TYP
UNITS
VOUT_ _ or V OUT_ _ = 0
30 40
Output Short-Circuit Current
(Either Output Shorted to GND) |IOS|V
ID
= ±100m V
( N ote 4)
VOUT_ _ = V OUT_ _ = 0
18 24 mA
Output Short-Circuit Current
(Outputs Shorted Together) |IOSB|VID = ±100mV, VOUT_ _ = V OUT_ _
(Note 4)
5.0
12 mA
SUPPLY CURRENT
RL = 100Ω, EN_ _ = VCC 68 98
Supply Current ICC RL = 100Ω, EN_ _ = VCC, switching at
670MHz (1.34Gbps) 68 98 mA
PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS
_SEL_ to Switched Output tSWITCH Figure 3 1.1 ns
Disable, Time to Differential
Output Low tPHD Figure 4 1.7 ns
Enable, Time to Differential
Output High tPDH Figure 4 1.7 ns
Switching Frequency fMAX VOD > 250mV 1.50 2.20 GHz
Low-to-High Propagation Delay tPLH Figures 1, 5 294 409 565 ps
High-to-Low Propagation Delay tPHL Figures 1, 5 286 402 530 ps
Pulse Skew |tPLH - tPHL|t
SKEW Figures 1, 5 (Note 6) 7 97 ps
Output-to-Output Skew tCCS Figures 5, 6 (Note 7) 10 65 ps
Output Low-to-High Transition
Time (20% to 80%) tRFigures 1, 5; fIN = 100MHz 112 153 185 ps
Output High-to-Low Transition
Time (80% to 20%) tFFigures 1, 5; fIN = 100MHz 112 153 185 ps
Added Random Jitter tRJ fIN_ _ = 1.34GHz, clock pattern (Note 8) 2 ps
(
RMS
)
Added Deterministic Jitter tDJ 1.34Gbps, 223 - 1 PRBS (Note 8) 55 82 ps
(
P-P
)
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
4 _______________________________________________________________________________________
Typical Operating Characteristics
(VCC = 3.3V, |VID| = 0.2V, VCM = 1.2V, fIN = 1.34GHz, TA= +25°C.)
SUPPLY CURRENT
vs. TEMPERATURE
MAX9390 toc01
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
603510-15
58
62
66
70
74
78
82
54
-40 85
VCC = 3.6V
VCC = 3.3V
VCC = 3V
OUTPUT AMPLITUDE
vs. FREQUENCY
MAX9390 toc02
FREQUENCY (GHz)
OUTPUT AMPLITUDE (mV)
2.22.00.2 0.4 0.6 1.0 1.2 1.4 1.60.8 1.8
50
100
150
200
250
300
350
400
0
0 2.4
OUTPUT RISE AND FALL TIMES
vs. TEMPERATURE
MAX9390 toc03
TEMPERATURE (°C)
RISE/FALL TIME (ps)
603510-15
130
140
150
160
170
180
120
-40 85
tF
fIN = 100MHz
tR
PROPAGATION DELAY
vs. TEMPERATURE
MAX9390 toc04
TEMPERATURE (°C)
PROPAGATION DELAY (ps)
603510-15
360
370
380
390
400
410
420
430
440
450
350
-40 85
MAX9390
DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAx9390 toc05
TEMPERATURE (°C)
INPUT CURRENT (μA)
603510-15
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
-50
-40 85
VIN = 0.1V
VIN = 3V
MAX9391
DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAX9390 toc06
TEMPERATURE (°C)
INPUT CURRENT (μA)
603510-15
0
10
20
30
40
50
60
70
80
-10
-40 85
VIN = 3.2V
VIN = 0.3V
MAX9390 INPUT CURRENT vs. VIHD
MAX9390 toc07
VIHD (V)
INPUT CURRENT (μA)
3.33.02.4 2.70.6 0.9 1.2 1.5 1.8 2.10.3
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
-50
0 3.6
IN_ _ OR
IN_ _ = GND
VCC = 3V
VCC = 3.6V
MAX9391
DIFFERENTIAL INPUT CURRENT vs. VILD
MAX9390 toc08
VILD (V)
INPUT CURRENT (μA)
3.33.02.4 2.70.6 0.9 1.2 1.5 1.8 2.10.30 3.6
-10
10
0
40
30
20
50
60
70
80
VCC = 3.6V
VCC = 3V
IN_ _ OR
IN_ _ = VCC
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________ 5
PIN
NAME
FUNCTION
1 ENB1 B1 Output Enable. Drive ENB1 high to enable the B1 LVDS outputs. An internal 435kΩ resistor pulls ENB1
low when unconnected.
2
OUTB1
B1 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTB1 and OUTB1 at the
receiver inputs to ensure proper operation.
3
OUTB1
B1 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTB1 and OUTB1 at the
receiver inputs to ensure proper operation.
4, 9,
20, 25 GND Ground
5 ENB0 B0 Output Enable. Drive ENB0 high to enable the B0 LVDS outputs. An internal 435kΩ resistor pulls ENB0
low when unconnected.
6
OUTB0
B0 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTB0 and OUTB0 at the
receiver inputs to ensure proper operation.
7
OUTB0
B0 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTB0 and OUTB0 at the
receiver inputs to ensure proper operation.
8, 13,
24, 29 VCC Power-Supply Input. Bypass each VCC to GND with 0. 1µF and 0.01µF ceramic capacitors. Install both
bypass capacitors as close to the device as possible, with the 0.01µF capacitor closest to the device.
10 INB0
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Inverting Input. An internal 128kΩ resistor to VCC pulls
the input high when unconnected (MAX9390). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9391).
11 INB0
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Noninverting Input. An internal 128kΩ resistor to VCC
pulls the input high when unconnected (MAX9390). An internal 68kΩ resistor to GND pulls the input low
when unconnected (MAX9391).
12
BSEL0
Input Select for B0 Output. Selects the differential input to reproduce at the B0 differential outputs. Connect
BSEL0 to GND or leave open to select the INB0 (INB0) set of inputs. Connect BSEL0 to VCC to select the
INB1 (INB1) set of inputs. An internal 435kΩ resistor pulls BSEL0 low when unconnected.
14 INB1
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Inverting Input. An internal 128kΩ resistor to VCC pulls
the input high when unconnected (MAX9390). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9391).
15 INB1
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Noninverting Input. An internal 128kΩ resistor to VCC
pulls the input high when unconnected (MAX9390). An internal 68kΩ resistor to GND pulls the input low
when unconnected (MAX9391).
16
BSEL1
Input Select for B1 Output. Selects the differential input to reproduce at the B1 differential outputs. Connect
BSEL1 to GND or leave open to select the INB0 (INB0) set of inputs. Connect BSEL1 to VCC to select the
INB1 (INB1) set of inputs. An internal 435kΩ resistor pulls BSEL1 low when unconnected.
Pin Description
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
6 _______________________________________________________________________________________
PIN
NAME
FUNCTION
17 ENA1 A1 Output Enable. Drive ENA1 high to enable the A1 LVDS outputs. An internal 435kΩ resistor pulls ENA1
low when unconnected.
18
OUTA1
A1 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTA1 and OUTA1 at the
receiver inputs to ensure proper operation.
19
OUTA1
A1 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTA1 and OUTA1 at the
receiver inputs to ensure proper operation.
21 ENA0 A0 Output Enable. Drive ENA0 high to enable the A0 LVDS outputs. An internal 435kΩ resistor pulls ENA0
low when unconnected.
22
OUTA0
A0 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTA0 and OUTA0 at the
receiver inputs to ensure proper operation.
23
OUTA0
A0 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTA0 and OUTA0 at the
receiver inputs to ensure proper operation.
26 INA0
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Noninverting Input. An internal 128kΩ resistor to VCC
pulls the input high when unconnected (MAX9390). An internal 68kΩ resistor to GND pulls the input low
when unconnected (MAX9391).
27 INA0
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Inverting Input. An internal 128kΩ resistor to VCC pulls
the input high when unconnected (MAX9390). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9391).
28
ASEL0
Input Select for A0 Output. Selects the differential input to reproduce at the A0 differential outputs. Connect
ASEL0 to GND or leave open to select the INA0 (INA0) set of inputs. Connect ASEL0 to VCC to select the
INA1 (INA1) set of inputs. An internal 435kΩ resistor pulls ASEL0 low when unconnected.
30 INA1
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Noninverting Input. An internal 128kΩ resistor to VCC
pulls the input high when unconnected (MAX9390). An internal 68kΩ resistor to GND pulls the input low
when unconnected (MAX9391).
31 INA1
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Inverting Input. An internal 128kΩ resistor to VCC pulls
the input high when unconnected (MAX9390). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9391).
32
ASEL1
Input Select for A1 Output. Selects the differential input to reproduce at the A1 differential outputs. Connect
ASEL1 to GND or leave open to select the INA0 (INA0) set of inputs. Connect ASEL1 to VCC to select the
INA1 (INA1) set of inputs. An internal 435kΩ resistor pulls ASEL1 low when unconnected.
Pin Description (continued)
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________ 7
tPHL
tPLH
80%
20% 20%
80%
50% VOD = 0
VOD = 0
VID = 0
VOD = 0
VOD = 0
VID = 0
50%
VID = VIN_ _ - VIN_ _
VOD = VOUT_ _ - VOUT_ _
tPLH AND tPHL MEASURED FOR ANY COMBINATION OF _SEL0 AND _SEL1.
VIN_ _ VIHD
VILD
VIN_ _
VOUT_ _
VOUT_ _
tF
tR
VIHD
VILD
VIHD
VILD
VIH
VIL
VOD = 0
tSWITCH tSWITCH
IN_0
IN_0
IN_1
IN_1
VID = 0
VID = 0
_SEL_
1.5V
IN_1
OUT_ _
OUT_ _
EN_0 = EN_1 = HIGH
VID = VIN_ _ - VIN_ _
IN_0 IN_0
1.5V
VOD = 0
VID = VIN_ _ - VIN_ _
ΔVOD = VOD - VOD*
ΔVOS = VOS - VOS*
VOD AND VOS ARE MEASURED WITH VID = +100mV
VOD* AND VOS* ARE MEASURED WITH VID = -100mV
IN_ _
IN_ _
RL/2
RL/2
VOD
OUT_ _
OUT_ _
1/4 MAX9390/MAX9391
EN_ _ = HIGH
VOS
Figure 1. Output Transition Time and Propagation Delay Timing
Diagram
Figure 3. Input to Rising/Falling Edge Select and Mux Switch Timing Diagram
Figure 2. Test Circuit for VOD and VOS
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
8 _______________________________________________________________________________________
VID = VIN_ _ - VIN_ _
0
3V
1.5V
1.5V
VEN_ _
tPHD
tPHD
tPDH
tPDH
50%
50%
50%
50%
VOUT_ _ WHEN VID = +100mV
VOUT_ _ WHEN VID = -100mV
CL
PULSE
GENERATOR
IN_ _
IN_ _
RL/2
RL/2
50Ω
OUT_ _
OUT_ _
1.25V
CL
1/4 MAX9390/MAX9391
VOUT_ _ WHEN VID = -100mV
VOUT_ _ WHEN VID = +100mV
RL = 100Ω ±1%
CL = 1.0pF
_SEL0
_SEL1
0
1
0
1
IN_1
IN_1
PULSE
GENERATOR
OUT_0
OUT_0
OUT_1
OUT_1
CL
RL
RL
IN_0
IN_0
50Ω
CL
50Ω
CL
CL
MAX9390
MAX9391
EN_0 = EN_1 = HIGH
1 CHANNEL SHOWN
RL = 100Ω ±1%
CL = 1.0pF
Figure 4. Output Active-to-Disable and Disable-to-Active Test Circuit and Timing Diagram
Figure 5. Output Transition Time, Propagation Delay, and Output Channel-to-Channel Skew Test Circuit
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________ 9
Detailed Description
The LVDS interface standard provides a signaling
method for point-to-point communication over a con-
trolled-impedance medium as defined by the ANSI
TIA/EIA-644 standard. LVDS utilizes a lower voltage
swing than other communication standards, achieving
higher data rates with reduced power consumption,
while reducing EMI emissions and system susceptibility
to noise.
The MAX9390/MAX9391 1.5GHz dual 2 x 2 crosspoint
switches optimize high-speed, low-power, point-to-
point interfaces. The MAX9390 accepts LVDS and
HSTL signals, while the MAX9391 accepts LVPECL and
CML signals. Both devices route the input signals to
either or both LVDS outputs.
When configured as a 1:2 splitter, the outputs repeat
the selected inputs. This configuration creates copies
of signals for protection switching. When configured as
a repeater, the device operates as a two-channel
buffer. Repeating restores signal amplitude, allowing
isolation of media segments or longer media drive.
When configured as a 2:1 mux, select primary or back-
up signals to provide a protection-switched, fault-toler-
ant application.
Input Fail-Safe
The differential inputs of the MAX9390/MAX9391 pos-
sess internal fail-safe protection. Fail-safe circuitry
forces the outputs to a differential low condition for
undriven inputs or when the common-mode voltage
exceeds the specified range. The MAX9390 provides
high-level input fail-safe detection for LVDS, HSTL, and
other GND-referenced differential inputs. The MAX9391
provides low-level input fail-safe detection for LVPECL,
CML, and other VCC-referenced differential inputs.
Select Function
The _SEL_ logic inputs control the input and output sig-
nal connections. Two logic inputs control the signal rout-
ing for each channel. _SEL0 and _SEL1 allow the
devices to be configured as a differential crosspoint
switch, 2:1 mux, dual repeater, or 1:2 splitter (Figure 7).
See Table 1 for mode-selection settings (insert A or B for
the _). Channels A and B possess separate select
inputs, allowing different configurations for each channel.
Enable Function
The EN_ _ logic inputs enable and disable each set of
differential outputs. Connect EN_0 to VCC to enable the
OUT_0/OUT_0 differential output pair. Connect EN_0 to
GND to disable the OUT_0/OUT_0 differential output
pair. The differential output pairs assert to a differential
low condition when disabled.
VOD = VOUT_ _ - VOUT_ _
VOD = 0
tCCS
VOD = 0
VOD = 0 VOD = 0
tCCS
VOUT_0
VOUT_0
VOUT_1
VOUT_1
tCCS MEASURED WITH _SEL0 = _SEL1 = HIGH OR LOW
(1:2 SPLITTER CONFIGURATION).
Figure 6. Output Channel-to-Channel Skew
OUT_0
OUT_0 OR OUT_1
OUT_1
2 x 2 CROSSPOINT
2:1 MUX
1:2 SPLITTER
DUAL REPEATER
OUT_0
OUT_1
OUT_0
OUT_1
IN_0
IN_1
IN_0
IN_1
IN_0
IN_1
IN_0 OR IN_1
Figure 7. Programmable Configurations
MAX9390/MAX9391
Applications Information
Differential Inputs
The MAX9390/MAX9391 inputs accept any differential
signaling standard within the specified common-mode
voltage range. The fail-safe feature detects common-
mode input signal levels and generates a differential
output low condition for undriven inputs or when the
common-mode voltage exceeds the specified range.
Leave unused inputs unconnected or connect to VCC
for the MAX9390 or to GND for the MAX9391.
Differential Outputs
The output common-mode voltage is not properly
established if the LVDS output is higher than 0.6V when
the supply voltage is ramping up at power-on. This
condition can occur when an LVDS output drives an
LVDS input on the same chip. To avoid this situation for
the MAX9390/MAX9391, connect a 10kΩresistor from
the noninverting output (OUT_) to ground, and connect
a 10kΩresistor from the inverting output (OUT_) to
ground. These pulldown resistors keep the output
below 0.6V when the supply is ramping up (Figure 8).
Expanding the Number of LVDS Output
Ports
Cascade devices to make larger switches. Consider
the total propagation delay and total jitter when deter-
mining the maximum allowable switch size.
Power-Supply Bypassing
Bypass each VCC to GND with high-frequency surface-
mount ceramic 0.1µF and 0.01µF capacitors in parallel
as close to the device as possible. Install the 0.01µF
capacitor closest to the device.
Differential Traces
Input and output trace characteristics affect the perfor-
mance of the MAX9390/MAX9391. Connect each input
and output to a 50Ωcharacteristic impedance trace.
Maintain the distance between differential traces and
eliminate sharp corners to avoid discontinuities in dif-
ferential impedance and maximize common-mode
noise immunity. Minimize the number of vias on the dif-
ferential input and output traces to prevent impedance
discontinuities. Reduce reflections by maintaining the
50Ωcharacteristic impedance through connectors and
across cables. Minimize skew by matching the electri-
cal length of the traces.
Output Termination
Terminate LVDS outputs with a 100Ωresistor between
the differential outputs at the receiver inputs. LVDS out-
puts require 100Ωtermination for proper operation.
Ensure that the output currents do not exceed the cur-
rent limits specified in the Absolute Maximum Ratings.
Observe the total thermal limits of the MAX9390/
MAX9391 under all operating conditions.
Cables and Connectors
Use matched differential impedance for transmission
media. Use cables and connectors with matched differ-
ential impedance to minimize impedance discontinu-
ities. Avoid the use of unbalanced cables. Balanced
cables such as twisted pair offer superior signal quality
and tend to generate less EMI due to canceling effects.
Board Layout
Use a four-layer printed circuit (PC) board providing
separate signal, power, and ground planes for high-
speed signaling applications. Bypass VCC to GND as
close to the device as possible. Install termination
resistors as close to receiver inputs as possible. Match
the electrical length of the differential traces to minimize
signal skew.
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
10 ______________________________________________________________________________________
Table 1. Input/Output Function Table
_SEL0 _SEL1 OUT_0 / OUT_0 OUT_1 / OUT_1 MODE
0 0 IN_0 / IN_0 IN_0 / IN_0 1:2 splitter
0 1 IN_0 / IN_0 IN_1 / IN_1 Repeater
1 0 IN_1 / IN_1 IN_0 / IN_0 Switch
1 1 IN_1 / IN_1 IN_1 / IN_1 1:2 splitter
100Ω DIFFERENTIAL
TRANSMISSION LINE
100Ω
TERMINATION
RESISTOR
10kΩ
GND
10kΩ
OUT_
OUT_
MAX9390
MAX9391
Figure 8. Pulldown Resistor Configuration for LVDS Outputs
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
______________________________________________________________________________________ 11
Typical Operating Circuit
0.1μF 0.01μF
3.0V TO
3.6V
OUTA0
OUTA0
LVDS
RECEIVER
INA0
INA0
ENA0
ENA1
ENB0
ENB1
GNDGND GNDGND
OUTA1
OUTA1
OUTB0
OUTB0
OUTB1
OUTB1
ASEL0
LVCMOS/LVTTL
LOGIC INPUTS
ASEL1
BSEL0
BSEL1
INA1
INB0
INB0
100Ω
Z0 = 50Ω
Z0 = 50Ω
MAX9390
MAX9391
VCC
INB1
INA1
INB1
Z0 = 50Ω
Z0 = 50Ω
100Ω
Z0 = 50Ω
Z0 = 50Ω
Z0 = 50Ω
Z0 = 50Ω
Z0 = 50Ω
Z0 = 50Ω
MAX9173
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
12 ______________________________________________________________________________________
Chip Information
TRANSISTOR COUNT: 1565
PROCESS: BIPOLAR
Functional Diagram
0
1
0
1
INA1
INA1
OUTA0
ENA0
ASEL0
ENA1
ASEL1
OUTA0
OUTA1
OUTA1
INA0
INA0
MAX9390
MAX9391
INB1
INB1
INB0
INB0
OUTB0
ENB0
BSEL0
ENB1
BSEL1
OUTB0
OUTB1
OUTB1
0
1
0
1
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
______________________________________________________________________________________ 13
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
32L TQFP, 5x5x01.0.EPS
B
12
21-0110
PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2007 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
B22
21-0110
PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm
Revision History
Pages changed at Rev 2: 1–4, 6, 8, 10–14