Z0103MNT1G - LITTELFUSE

Speciﬁcations are subject to change without notice.

Revised: 06/26/19

Thyristors

Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN

• Sensitive Gate Trigger

Current in Four Trigger

Modes

• Blocking Voltage to 600 V

• Glass Passivated Surface

for Reliability and

Uniformity

• Surface Mount Package

• These are Pb−Free

Devices

Features

Designed for use in solid state relays, MPU interface, TTL

logic and other light industrial or consumer applications.

Supplied in surface mount package for use in automated

manufacturing.

Description

Z0103MN, Z0107MN, Z0109MN

Functional Diagram

Additional Information

Samples

Resources

Datasheet

MT 1

MT 2

1 2 3

Pin Out

Speciﬁcations are subject to change without notice.

Revised: 06/26/19

Thyristors

Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN

Maximum Ratings (TJ = 25°C unless otherwise noted)

Rating Symbol Value Unit

Peak Repetitive Off−State Voltage (Note 1)

(RGK = IK, TJ− 40 to +125°C, Sine Wave, 50 to 60 Hz) VDRM,

VRRM 600 V

On-State RMS Current (Full Sine Wave 50 to 60 Hz; TC = 80°C) IT (RMS) 1.0 A

Peak Non−repetitive Surge Current

(One Full Cycle Sine Wave, 60 Hz, TC = 25ºC) IT (RMS) 8.0 A

Circuit Fusing Considerations (t = 8.3 ms) I2t 0.4 A2s

Average Gate Power (TC = 80°C, t ≤ 8.3 ms) PG(AV) 1.0 W

Peak Gate Current (t ≤ 20 s, TJ = +125°C) IGM 1.0 A

Operating Junction Temperature Range @ Rated VRRM and VDRM TJ-40 to +110 °C

Storage Temperature Range Tstg -40 to +150 °C

Thermal Characteristics

Rating Symbol Value Unit

Thermal Resistance, Junction−to−Ambient PCB Mounted per Figure 1 R8JA 156 °C/W

Thermal Resistance, Junction−to−Tab Measured on MT2 Tab Adjacent

to Epoxy R8JT 25 °C/W

Maximum Device Temperature for Soldering Purposes for

10 Secs Maximum TL260 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied.

Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

1. V DRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative

potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.

Electrical Characteristics - OFF (TJ = 25°C unless otherwise noted)

Characteristic Symbol Min Ty p Max Unit

Peak Repetitive Forward or Reverse Blocking Current (Note 3)

(VAK = Rated VDRM or VRRM, RGK = 1000 kQ

TJ = 25°C IDRM,- - 5.0 μA

TJ = 125°C - - 500

Speciﬁcations are subject to change without notice.

Revised: 06/26/19

Thyristors

Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN

Gate Trigger Voltage (Continuous dc)

(VD = 12 Vdc, RL = 30 Ohms) VGT − − 1.3 V

Gate−Controlled Turn−On Time,

(VD = Rated VDRM, ITM = 16 A Peak, IG = 30 mA) tgt 0.2 − 10 μs

Electrical Characteristics - ON (TJ = 25°C unless otherwise noted; Electricals apply in both directions) Continued

Electrical Characteristics - ON (TJ = 25°C unless otherwise noted; Electricals apply in both directions)

Characteristic Symbol Min Ty p Max Unit

Peak On−State Voltage (ITM = ±11 A Peak, Pulse Width ≤2 ms,

Duty Cycle ≤2%) VTM − − 1.8 V

Z0103MN

Gate Trigger Current

(Continuous dc)

(VD = 12 V, RL = 30 Ohms)

MT2(+), G(+)

IGT

0.15 − 3.0

MT2(+), G(−) 0.15 − 3.0

MT2(−), G(−) 0.15 − 3.0

MT2(−), G(+) 0.25 − 5.0

Z0107MN

Gate Trigger Current

(Continuous dc)

(VD = 12 V, RL = 30 Ohms)

MT2(+), G(+)

IGT

0.15 − 5.0

MT2(+), G(−) 0.15 − 5.0

MT2(−), G(−) 0.15 − 5.0

MT2(−), G(+) 0.25 − 7. 0

Z0109MN

Gate Trigger Current

(Continuous dc)

(VD = 12 V, RL = 30 Ohms)

MT2(+), G(+)

IGT

0.15 − 10

MT2(+), G(−) 0.15 − 10

MT2(−), G(−) 0.15 − 10

MT2(−), G(+) 0.25 − 10

Z0103MN

Latching Current

(VD = 12 V, IG = 1.2 x IGT)

ALL TYPES

MT2(+), G(+)

− − 7. 0

MT2(+), G(−) − − 15

MT2(−), G(−) − − 7. 0

MT2(−), G(+) − − 7. 0

Z0107MN

Latching Current

(VD = 12 V, IG = 1.2 x IGT)

ALL TYPES

MT2(+), G(+)

− − 10

MT2(+), G(−) − − 20

MT2(−), G(−) − − 10

MT2(−), G(+) − − 10

Z0109MN

Latching Current

(VD = 12 V, IG = 1.2 x IGT)

ALL TYPES

MT2(+), G(+)

− − 15

MT2(+), G(−) − − 25

MT2(−), G(−) − − 15

MT2(−), G(+) − − 15

Speciﬁcations are subject to change without notice.

Revised: 06/26/19

Thyristors

Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN

Dynamic Characteristics

Characteristic Symbol Min Ty p Max Unit

Rate of Change of Commutating Current

(VD = 400 V, ITM = 0.84 A, Commutating dv/dt = 1.5 V/µs,

Gate Open, TJ = 110ºC, f = 250 Hz, with Snubber) dv/dt 1.6 − − A/ms

Critical Rate of Rise of On−State Current

(TC = 110°C, IG = 2 x IGT, RGK = 1 kΩ)

Z0103MN

di/dt

10 30 _

V/µsZ0107MN 20 60 _

Z0109MN 50 75 _

Repetitive Critical Rate of Rise of On−State Current,

TJ = 125ºC Pulse Width = 20 µs, IPKmax = 15 A,

diG/dt = 1 A/µs, f = 60 Hz − − 20 A/µs

Figure 1. PCB for Thermal Impedance and Power Testing

of SOT-223

0.079

2.0

0.079

2.0

0.059

1.5

0.091

2.3

0.091

2.3

inches

0.472

12.0

0.096

2.44

0.984

25.0

0.244

6.2

0.059

1.5

0.059

1.5

0.096

2.44

0.096

2.44

0.059

1.5

0.059

1.5

0.15

3.8

BOARD MOUNTED VERTICALLY IN CINCH 8840 EDGE CONNECTOR

BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL.

MATERIAL: G10 FIBERGLASS BASE EPOXY

Voltage Current Characteristic of SCR

Quadrant Deﬁnitions for a Triac

Symbol Parameter

VDRM Peak Repetitive Forward Off State Voltage

IDRM Peak Forward Blocking Current

VRRM Peak Repetitive Reverse Off State Voltage

IRRM Peak Reverse Blocking Current

VTM Maximum On State Voltage

IHHolding Current

+C urrent

+V oltage

VTM

IDR M at VDR M

on stat e

off stat e

IRR M at VRR M

Quadrant 1

Main Terminal 2 +

Quadrant 3

Main Terminal 2 VTM

All polarities are referenced to MT1.

With in phase signals (using standard AC lines) quadrants I and III are used

MT 1

(+) IGT

GA TE

(+) MT 2

RE F

MT 1

() IGT

GA TE

(+) MT 2

RE F

MT 1

(+) IGT

GA TE

() MT 2

RE F

MT 1

() IGT

GA TE

() MT 2

RE F

MT2 NEGA TIVE

(Negative Half Cycle)

MT2 POSITIVE

(Positive Half Cycle)

VItnardauQIIItnardauQ

ItnardauQIItnardauQ

IGT +I GT

Speciﬁcations are subject to change without notice.

Revised: 06/26/19

Thyristors

Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN

1.0

0.01 5.04.03.02.01.00

TYPICAL AT TJ = 110°C

MAX AT T

J = 110°C

MAX AT T

J = 25°C

TA, MAXIMUM ALLOWABLEA MBIENT TEMPERATURE ( C

)

T(RMS)

110

0.5

0.30.20.

100

20 0.4

70 dc

30° 60°

90°

α = 180°

MINIMUM FOOTPRINT

50 OR 60 Hz

120°

α = CONDUCTION

ANGLE

Figure 2. On-State Characteristics Figure 3. Junction to Ambient Thermal Resistance vs

Copper Tab Area

Figure 4. Current Derating, Minimum Pad Size Reference:

Ambient Temperature

Figure 6. Current Derating, 2.0 cm Square Pad Reference:

Ambient Temperature

Figure 5. Current Derating, 1.0 cm Square Pad Reference:

Ambient Temperature

Figure 7. Current Derating Reference: MT2 Tab

Speciﬁcations are subject to change without notice.

Revised: 06/26/19

Thyristors

Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN

LL1N4007

200 V

MEASURE

CHARGE

CONTROL

CHARGE TRIGGER

MT2

1N914

TRIGGER CONTROL

200 VRMS

ADJUST FOR

TM, 60 Hz VAC

c. See AN1048 for additional information.

ADJUST FOR

dv/dt

)

Figure 10. Simpliﬁed Test Circuit to Measure the Critical Rate of Rise of Commutating Voltage (dv/dt)c

Figure 8. Power Dissipation Figure 9. Thermal Response, Device Mounted on Figure 1

Printed Circuit Board

Figure 11. Typical Commutating dv/dt vs Current Crossing Rate

and Junction Temperature Figure 12. Typical Commutating dv/dt vs Junction Temperature at

0.8 Amps RMS

Speciﬁcations are subject to change without notice.

Revised: 06/26/19

Thyristors

Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN

Figure 13. Exponential Static dv/dt versus Gate −

Main Terminal 1 Resistance Figure 14. Typical Gate Trigger Current Variation

Figure 15. Typical Holding Current Variation Figure 16. Gate Trigger Voltage Variation

Speciﬁcations are subject to change without notice.

Revised: 06/26/19

Thyristors

Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN

Dimensions Soldering Footprint

Part Marking System

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

Dim Inches Millimeters

Min Nom Max Min Nom Max

A --- --- 0.071 --- --- 1.80

A1 0.001 0.003 0.005 0.02 0.07 0.13

b 0.026 0.030 0.033 0.66 0.75 0.84

b1 0.114 0.118 0.122 2.90 3.00 3.10

c 0.009 0.011 0.014 0.23 0.29 0.35

D 0.260 0.260 0.264 6.60 6.60 6.71

E0.130 0.138 0.146 3.30 3.50 3.70

e--- 0.091 --- --- 2.30 ---

e1 0.030 0.037 0.045 0.75 0.95 1. 15

L1 0.059 0.069 0.079 1.50 1.75 2.00

HE 0.268 0.276 0.283 6.80 7. 0 0 7.20

ø 0° --- 10° 0° --- 10°

Pin Assignment

1Main Terminal 1

2Main Terminal 2

3 Gate

4Main Terminal 2

Ordering Information

Device Package Shipping

Z0103MNT1G SOT-223

(Pb-Free)

1000 /

Tape & Reel

Z0107MNT1G SOT-223

(Pb-Free)

Z0109MNT1G SOT-223

(Pb-Free)

12 3

0.08 (0003

)

1.5

0.059

inches

SCALE 6:

3.8

0.15

2.0

0.079

6.3

0.248

2.3

0.091

2.3

0.091

2.0

0.079

SOT 223

CASE 318 E

STYLE 11

(Note: Microdot may be in either location

)

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of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.

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10XMN

YMAXX

10XMN =Device Code

x =3, 7, and 9

Y =Year

M =Month

A =Assembly Site

XX =Lot Serial Code

G =Pb-Free Package