BAT754S,215 - NEXPERIA

Important notice

Dear Customer,

On 7 February 2017 the former NXP Standard Product business became a new company with the

tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS

semiconductors with its focus on the automotive, industrial, computing, consumer and wearable

application markets

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use

the references to Nexperia, as shown below.

Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,

use http://www.nexperia.com

Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use

salesaddresses@nexperia.com (email)

Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on

the version, as shown below:

reserved

Should be replaced with:

If you have any questions related to the data sheet, please contact our nearest sales office via e-mail

or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and

understanding,

Kind regards,

Team Nexperia

1. Product profile

1.1 General description

Planar Schottky barrier diodes with an integrated guard ring for stress protection,

encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic

package.

1.2 Features and benefits

Low forward voltage

Low capacitance

AEC-Q101 qualified

1.3 Applications

1.4 Quick reference data

[1] Pulse test: tp300 s; 0.02.

2. Pinning information

BAT754 series

Schottky barrier diodes

Rev. 3 — 9 October 2012 Product data sheet

SOT23

Ultra high-speed switching Voltage clamping

Line termination Reverse polarity protection

Table 1. Quick reference data

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Per diode

VRreverse voltage - - 30 V

VFforward voltage IF=100mA [1] - 600 - mV

IRreverse current VR=25V [1] --2A

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

BAT754

1 anode

2 not connected

3 cathode

006aaa436

n.c.

Product data sheet Rev. 3 — 9 October 2012 2 of 10

NXP Semiconductors BAT754 series

Schottky barrier di od e s

3. Ordering information

4. Marking

[1] * = placeholder for manufacturing site code.

BAT754A

1 cathode (diode 1)

2 cathode (diode 2)

3 common anode

BAT754C

1 anode (diode 1)

2 anode (diode 2)

3 common cathod e

BAT754S

1 anode (diode 1)

2 cathode (diode 2)

3 cathode (diode 1),

anode (diode 2)

Table 2. Pinning …continued

Pin Description Simplified outline Graphic symbol

006aaa439

006aac984

006aaa437

Tabl e 3. Ordering i nfo rmation

Type number Package

Name Description Version

BAT754 series - plastic surface-mounted package; 3 leads SOT23

Table 4. Marking codes

Type number Marking code[1]

BAT754 2K*

BAT754A 2L*

BAT754C 2M*

BAT754S 2N*

Product data sheet Rev. 3 — 9 October 2012 3 of 10

NXP Semiconductors BAT754 series

Schottky barrier di od e s

5. Limiting values

[1] Tj=25C before surge.

6. Thermal characteristics

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

7. Characteristics

[1] Pulse test: tp300 s; 0.02.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

VRreverse voltage - 30 V

IFforward current - 200 mA

IFRM repetitive peak forward

current tp1s; 0.5 300 mA

IFSM non-repetitive peak

forward current sine wave;

tp<8.3ms [1] -600mA

Per device; one diode loaded

Tjjunction temperature - 125 C

Tamb ambient temperature 55 +125 C

Tstg storage temperature 65 +150 C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Per device; one diode loaded

Rth(j-a) thermal resistance from

junction to ambient in free air [1] - - 500 K/W

Table 7. Characteristics

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage [1]

IF= 0.1 mA - - 200 mV

IF= 1 mA - - 260 mV

IF= 10 mA - - 340 mV

IF= 30 mA - - 420 mV

IF= 100 mA - 600 - mV

IRreverse current VR=25V [1] --2A

Cddiode capacitance f = 1 MHz; VR=1V --10pF

Product data sheet Rev. 3 — 9 October 2012 4 of 10

NXP Semiconductors BAT754 series

Schottky barrier di od e s

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

(1) Tamb = 125 C

(2) Tamb =85C

(3) Tamb =25C

(1) Tamb = 125 C

(2) Tamb =85C

(3) Tamb =25C

Fig 1. Forward current as a function of forward

voltage; typical values Fig 2. Reverse current as a function of reverse

voltage; typical values

f=1MHz; T

amb =25C

Fig 3. Diod e capacitance as a function of reverse voltage; typical values

006aac830

VF (V)

0.0 1.20.80.4

102

103

(mA)

10-1

(1)

(1) (2)

(2) (3)

(3)

DDD

9











$









0102030

VR (V)

(pF)

msa891

Product data sheet Rev. 3 — 9 October 2012 5 of 10

NXP Semiconductors BAT754 series

Schottky barrier di od e s

9. Package outline

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

Fig 4. Package outline SOT23 (TO-236AB)

04-11-04Dimensions in mm

0.45

0.15

1.9

1.1

0.9

3.0

2.8

2.5

2.1 1.4

1.2

0.48

0.38 0.15

0.09

Table 8. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

3000 10000

BAT754 series SOT23 4 mm pitch, 8 mm tape and reel -215 -235

Product data sheet Rev. 3 — 9 October 2012 6 of 10

NXP Semiconductors BAT754 series

Schottky barrier di od e s

11. Soldering

Fig 5. Reflow soldering footprint SOT 23 (TO-236AB)

Fig 6. Wave soldering footprint SOT23 (TO-236AB)

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3×)

0.6

(3×)

0.6

(3×)

0.7

(3×)

3.3

2.9

1.7

1.9

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2×)

1.2

(2×)

2.2

2.6

Dimensions in mm

Product data sheet Rev. 3 — 9 October 2012 7 of 10

NXP Semiconductors BAT754 series

Schottky barrier di od e s

12. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAT754_SER v.3 20121009 Product data sheet - BAT754_SERIES v.2

Modifications: •The format of this document has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Section 1: updated

•Section 4: updated

•Table 5: IFSM conditions updated; changed Tamb mini mum value to comply wi th AEC-Q101

•Figure 1 and 2: updated

•Section 8 “Test in f ormation”: added

•Figure 4: replaced by mi nimized package outline drawing

•Section 10 “Packing information”: added

•Section 11 “Soldering”: added

•Section 13 “Legal information”: updated

BAT754_SERIES v.2 20030325 Product data sheet - BAT754_SERIES v.1

BAT754 _SERIES v.1 19990805 Product specification - -

Product data sheet Rev. 3 — 9 October 2012 8 of 10

NXP Semiconductors BAT754 series

Schottky barrier di od e s

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. Unless ot herwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, lif e-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe propert y or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 3 — 9 October 2012 9 of 10

NXP Semiconductors BAT754 series

Schottky barrier di od e s

No offer to sell or license — Nothing in this document may be interpret ed or

construed as an of fer to sell product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BAT754 series

Schottky barrier di od e s

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 9 October 2012

Document identifier: BAT754_SER

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 4

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 4

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

10 Packing information . . . . . . . . . . . . . . . . . . . . . 5

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10