
Approval sheet
Page 4 of 7
ASC_VZ0603 Green Series- V10
Jul. 2010
SPECIFICATION
1. Electrical Reliability
Test item Test condition / Test method Specification
High temperature storage +125±3℃ for 1000 hours
Measurement to be made after keeping at room temp. for 24 ±2hr △V at 1mA < 10%
Low temperature storage -40±3℃ for 1000 hours
Measurement to be made after keeping at room temp. for 24 ±2h △V at 1mA < 10%
Humidity storage 40±2℃ , 90 ~95%RH for 500 hours
Measurement to be made after keeping at room temp. for 24 ±2h △V at 1mA < 10%
Temperature cycles Times:5 cycles
Step Temp.(℃) Time(min.)
1 -55±3 30±3
2 room temp. 2~3
3 +125±3℃ 30±2
4 room temp. 2~3
Measurement to be made after keeping axt room temp. for 24 ±2h
△V at 1mA < 10%
2. Mechanical Reliability
Test item Test condition / Test method Specification
Solderability Solder temp.:230±5°C
Immersion time:2±0.5 sec
Immersion and emersion rates:25mm/s
Min 90% electrode shall
be covered with solder.
Resistance to Soldering Heat Pre-heating:120~ 150℃ , 60 sec
Solder temp.:260±5°C
Immersion time:10±1 sec
Measurement to be made after keeping at room temp. for 24 ±2h
△V at 1mA < 10%
Disappearance of
electrode due to
immersion into solder
shall not exceed 25% of
edges of each
electrode.
Adhesive Strength of
Termination Solder chip on PCB and applied
0805/1206 Series: 10N(1Kgf) for 10 sec No visible damage
0402/0603 Series: 5N(0.5Kgf) for 10 sec
Vibration Solder chip on PCB.
Frequency:10 Hz~55 Hz~10 Hz (1min)
Oscillation amplitude:1.5 mm
Times:2 hrs in each of three perpendicular direction
No visible damage
Bending Test
The middle part of substrate shall be pressurized by means of the
pressurizing rod at a rate of 1mm per second until the deflection becomes 1
mm and then the pressure shall be maintained for 5 sec..
No visible damage
△V at 1mA < 10%