AUIRFZ44VZS
VDSS 60V
RDS(on) typ. 9.6m
ID 57A
max. 12m
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and
power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless
otherwise specified.
Features
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
Description
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to achieve
extremely low on-resistance per silicon area. Additional features of
this design are a 175°C junction operating temperature, fast
switching speed and improved repetitive avalanche rating . These
features combine to make this design an extremely efficient and
reliable device for use in Automotive applications and a wide variety
of other applications
1 2015-10-27
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
AUTOMOTIVE GRADE
Symbol Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 57
A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 40
IDM Pulsed Drain Current 230
PD @TC = 25°C Maximum Power Dissipation 92 W
Linear Derating Factor 0.61 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS (Thermally Limited) Single Pulse Avalanche Energy (Thermally Limited) 73
mJ
EAS (Tested) Single Pulse Avalanche Energy (Tested Limited) 110
IAR Avalanche Current See Fig. 12a, 12b, 15, 16 A
EAR Repetitive Avalanche Energy mJ
TJ Operating Junction and -55 to + 175
TSTG Storage Temperature Range °C
Soldering Temperature, for 10 seconds (1.6mm from case) 300
Thermal Resistance
Symbol Parameter Typ. Max. Units
RJC Junction-to-Case ––– 1.64 °C/W
RJA Junction-to-Ambient (PCB Mount), D2 Pak ––– 40
D2Pak
AUIRFZ44VZS
S
D
G
Base part number Package Type Standard Pack Orderable Part Number
Form Quantity
AUIRFZ44VZS D2-Pak Tube 50 AUIRFZ44VZS
Tape and Reel Left 800 AUIRFZ44VZSTRL
G D S
Gate Drain Source
HEXFET® Power MOSFET