1
2006.10
microSDTM/TransFlashTM Card Connectors
DM3 Series
NEW
■Features
1. Extremely small size
The width of 13.85 mm, length of 15.95 mm and height of 1.68
mm makes this connector smallest on the market.
2. Card fall-out prevention
Built-in card tray and unique push-push ejection
mechanism (patent pending) prevents accidental card
ejection or fall-out.
3. Reverse card insertion protection
Unique card slot metal tabs (patent pending) protect
connector from damage when the card is attempted to be
inserted in reverse.
The card may be easily removed and re-inserted correctly.
4. Long card ejection distance
Despite it's small size the push-push ejection will eject card for
the large distance of 4.0 mm allowing easy hold and removal
of the card.
5. Multiple ground and shield connections
4 connection points of the metal cover (at each corner of
the connector) to the printed circuit board surface assure
reliable ground connections.
6. Rigid and strong construction
All plastic components held by the metal top created a
strong and rigid connector while retaining it’s extremely
small size.
7. Card detection switch
The card detection switch is normally open.
8. Exposed termination leads
Easy inspection and rework of solder joints.
9. RoHS compliant
All components and materials comply with the requirements
of the EU Directive 2002/95/EC.
■Applications
Mobile phones, digital cameras, PDA’s and any other
portable device requiring use of small size, high durability
microSDTM memory card connectors.
*microSD is a trademark of the SD Association.
Extremely small size
Card fall-out prevention
Reverse card insertion prevention
Long card ejection distance (4 mm)
Latch
Side spring Tray
Metal tabs
17.55 mm
(Card fully inserted)
4.0 mm
(Card ejection distance)
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
2
Series name: DM3
Connector typeA...Standard receptacle
Number of contacts: 8
Termination type
SF : Right-angle SMT (standard mounting)
Card ejection code: Push insert/push eject
Positioning boss type
Blank : Without positioning boss
2 : With positioning boss
DM3 A- SF - PEJ - **
■Product Specifications
■Materials and Finish
Ratings
Current rating: 0.5A
Voltage rating: 125V AC
Operating temperature range: -20ç to +85ç (Note)
Storage temperature range: -40ç to +85ç
Operating humidity range: Relative humidity 95% max.
(No condensation)
500V DC
500V AC / one minute
1mA
Frequency: 10 to 55 Hz, single amplitude of 0.75mm, 2 hours / 3 axis
96 hours at 40ç ± 2ç and humidity of 90% to 95%.
Temperature: -55ç ➝ +5ç to +35ç ➝+85ç ➝+5ç to +35ç
Duration: 30
➝
5
➝
30
➝
5 (Minutes)
5 cycles
10,000 cycles at 400 to 600 cycles per hour
Reflow: At the recommended temperature profile
Manual soldering: 350ç for 3 seconds
1000 M ohms min. (Initial value)
No flashover or insulation breakdown.
100m ohms max. (Initial value)
No electrical discontinuity of 100 ns or more.
Contact resistance: 40m ohms max. from initial value
Insulation resistance: 100M ohms min.
Contact resistance: 40m ohms max. from initial value
Insulation resistance: 100M ohms min.
Contact resistance: 40m ohms max. from initial value.
No deformation of components affecting performance.
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Vibration
5. Humidity
6. Temperature cycle
7. Durability
(mating/un-mating)
8. Resistance to soldering
heat
Item Specification Conditions
■Ordering information
1 42 3 5
1
52
3
4
Note 1: Includes temperature rise caused by current flow.
Note 2: The term “storage” refers to products stored for long period of time prior to mounting and use. Operating temperature range and
humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation.
Remarks
UL94V-0
-------------------
-------------------
-------------------
Part Material Finish
Insulator
Contacts
Guide cover
Other components
Highly heat-resistant resin
Copper alloy
Copper alloy
Stainless steel
Piano wire
Color: Black
Contact area: Gold plated
Lead area: Gold plated
-------------------
-------------------
Nickel plated
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
■Standard (Top board mounting - Without positioning boss)
Part number CL No. RoHS
DM3A-SF-PEJ 609-0014-1 YES
(3.2)
(7.35)
(0.8)
(16.75): Card pushed-in for ejection
(17:55): Card fully inserted
(21.55): Card ejected
15.95
#1(DAT2)
#2(CD/DAT3)
#3(CMD)
#4(VDD)
#5(CLK)
#6(VSS)
#7(DAT0)
#8(DAT1)
13.85
(11)
(5.5)
Outline of the
microSD card
1.68
15.95
1
Outline of the connector
8.65
1.3
15.1
C0.15
2.7
0.55
2.55
0.8
2.8
1
1.9
(3.2 )
8.35
3.259.1
0.25
6.1 0.55
9.25
10
7.7
1.55
P=1.1
0.7
1
1.2
4.4
6
6.8
8.75
12.8
14.5
0.15
1.2
3.7
9.9
14.05
7.9
0.7
3
3
3
1
15.75
DM3A-SF-PEJ2
Connector on the PCB
microSD card
Card detection switch
No conductive traces
Without the card Card inserted
Closed
(
A
)(
B
)(
A
)(
B
)
indicates the center line of the microSD card slot.
1
2
3
C
L
Open
Note
■Recommended PC board mounting pattern
3
● Card insertion direction
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
4
■Standard (Top board mounting - With positioning boss)
Part number CL No. RoHS
DM3A-SF-PEJ2 609-0015-4 YES
12.8
15.95
#1(DAT2)
#2(CD/DAT3)
#3(CMD)
#4(VDD)
#5(CLK)
#6(VSS)
#7(DAT0)
#8(DAT1)
(3.2)
(7.35)
13.85
(0.8)
1.68
(16.75): Card pushed-in for ejection
(17:55): Card fully inserted
(21.55): Card ejected
15.950.5
(11)
2.9
9.1
2-Ø0.8
1.2
(5.5)
Outline of the
microSD card
1
8.65
1.3
15.1
C0.15
2.7
1.2
9.1
0.55
2.55
2-Ø1
0.8
2.8
1
1.9
(3.2 )
8.35
3.259.1
0.25
6.1 0.55
9.25
10
7.7
1.55
P=1.1
0.7
1
1.2
4.4
6
6.8
8.75
12.1
12.8
14.5
0.15
1.2
3.7
9.9
14.05
7.9
0.7
3
3
3
1
15.75
Outline of the connector
DM3A-SF-PEJ2
Connector on the PCB
microSD card
Card detection switch
No conductive traces
Without the card Card inserted
Closed
(
A
)(
B
)(
A
)(
B
)
indicates the center line of the microSD card slot.
1
2
3
C
L
Open
Note
■Recommended PC boar d mounting pattern
● Card insertion direction
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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■Packaging Specifications
Preheating
Time (Seconds)
90 sec. to 120 sec.
150ç
200ç
230ç min
250ç max
Soldering
50 sec.
250
(ç)
200
150
100
50
Temperature
■Recommended Temperature Profile
(3.2)
32
28.4
2
1.75
Ø1.5
20±0.1
14.2
(16.35)
P=4±0.1 Unreeling direction
● Embossed carrier tape dimensions 1,500pieces per reel
Top cover tape
Embossed carrier tape
End section Mounting section Lead section (400mm min.)
Blank section (100mm min.)
Blank section
(160mm min.)
32.4
Ø380
Ø80
● Reel dimensions
<Recommended conditions >
Reflow system : IR/Hot air reflow
Environment : Room air
Solder composition : Paste, 96.5%Sn / 3.0%Ag / 0.5%Cu
(M705-GRN360-K2-V manufactured by Senju Metal Industry Co., Ltd.)
Test board : Glass epoxy 60mm x 100mm x 1mm thick
Metal mask thickness : 0.12 mm
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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■Precautions and use recommendations
1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the
ejection mechanism and electrical performance of the connector.
Clean ONLY the soldered termination areas.
2. Do not apply excessive force to connector when handling or after installation on the PC board.
3. The connector will reliably connect and function with the correctly inserted microSDTM or TransFlashTM cards. The
connector will not allow reverse insertion of the card.
Do NOT force reverse oriented card in to the connector as this may cause permanent damage to the card or
connector.
4. Do not use force when removing the inserted card from the connector.
5. Protective cover recommendations.
To avoid accidental damage to the connector or electrical discontinuity when the device may be accidentally dropped
it is recommended to have a removable, sliding or hinged protective cover, as shown on the illustration below.
6. Recommended application area for surface mounting adhesive
Surface mounting adhesive must be applied on the PCB only in the area indicated on the illustration below.
Excessive amount of the adhesive may affect the soldered termination leads.
Use only the minimum required amount of adhesive.
7. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert card in the
un-mounted connector.
(17.55)
(17.95)
Protective cover
7.7max 0.5max
Apply the adhesive only in this area.
9.6max
11.4max
Recommended adhesive: SOMAKOTE IR-010H-3
(Manufactured by Somar Corporation)
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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8. Mounting on the Flexible Printed Circuit (FPC)
To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under
the FPC.
9. To assure card guidance during insertion and the protection of the exposed edge when fully inserted it is
recommended that the users housing be designed as illustrated below.
10. The edge of the moveable tray may be visually slanted as shown on the illustration below. This has no affect on
connector performance.
11. Small visible residual manufacturing oils or tooling marks do not affect connector performance.
12. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on
the connector prformance.
13. The card detection contacts are exposed.
Exercise extra caution during handling and installation on the PC board as to avoid damage or contamination to
them.
0.7 MAX.
0.45
Board
microSD card
Card detection contact
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.