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Power Management Switch ICs for PCs and Digital Consumer Products
2ch High Side Switch ICs
for USB Devices and Memory Cards
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
●Description
High side switch for USB is a high side switch having over current protection used in power supply line of universal serial bus
(USB). Its switch unit has two channels of N-channel power MOSFET, and current of 500mA as USB standard can be flown
to the respective channels. And, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start
circuit are built in.
●Features
1) Dual N-MOS high side switch
2) Continuous current load 0.5A
3) Control input logic
Active-Low
Active-High
4) Soft start circuit
5) Over current detection
6) Thermal shutdown
7) Under voltage lockout
8) Open drain error flag output
9) Reverse-current protection when switch off
10) Flag output delay filter built in
●Applications
USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth
●Lineup
Parameter BD6512F BD6513F BD6516F BD6517F BD2052AFJ BD2042AFJ Unit
Over current detection 1.65 1.65 - - - - A
Output current at short - - 1.65 1.65 1.0 1.0 A
On resistance 100 100 110 110 100 100 mΩ
Control input logic High Low High Low High Low -
Reverse current flow
blockingat switch off - - ○ ○ ○ ○ -
Flag output delay filter - - ○ ○ ○ ○ -
No.11029EBT11
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
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●Absolute Maximum Ratings
◎BD6512F/BD6513F/BD6516F/BD6517F
Parameter Symbol Ratings Unit
Supply voltage VDD -0.3 to 6.0 V
CTRL voltage VCTRL -0.3 to VDD+0.3 V
Flag voltage VFLAG -0.3 to 6.0 V
Output voltage VOUT
-0.3 to VDD+0.3
(BD6512F/ BD6513F) V
-0.3 to 6.0
(BD6516F/ BD6517F) V
Storage temperature TSTG -55 to 150 ºC
Power dissipation *1 Pd 560 *1 mW
◎BD2042AFJ/ BD2052AFJ
Parameter Symbol Ratings Unit
Supply voltage VIN -0.3 to 6.0 V
EN,/EN voltage VEN, V/EN -0.3 to 6.0 V
/OC voltage V/OC -0.3 to 6.0 V
/OC current IS/OC 10 mA
OUT voltage VOUT -0.3 to 6.0 V
Storage temperature TSTG -55 to 150 ºC
Power dissipation *1 Pd 560*1 mW
*1 This value decreases 4.48mW/℃ above Ta=25℃.
* Resistance radiation design is not doing.
●Operating conditions
◎BD6512F/BD6513F/BD6516F/BD6517F
Parameter Symbol Ratings Unit
Supply voltage VDD 3.0 to 5.5 V
Operation temperature TOPR -25 to 85 °C
Continuous output current ILO 0 to 500 mA
◎BD2042AFJ/ BD2052AFJ
Parameter Symbol Ratings Unit
Supply voltage VIN 2.7 to 5.5 V
Operation temperature TOPR -40 to 85 ºC
Continuous output current ILO 0 to 500 mA
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
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●Electrical characteristics
◎BD6512F/BD6513F(VDD =5V, Ta=25℃, unless otherwise specified.)
Parameter Symbol Limits Unit Condition
Min. Typ. Max.
Operating current IDD
- 85 120 μA VCTRL=5V(BD6512F), 0V(BD6513F)
OUT=OPEN
- 0.01 2 μA VCTRL=0V(BD6512F), 5V(BD6513F)
OUT=OPEN
Control input voltage VCTRL - - 0.7 V
CTRL Low Level Input
2.5 - - V
CTRL High Level Input
Control input current ICTRL -1 0.01 1 μA VCTRL=0V or 5V
On resistance RON - 100 130 mΩ VDD=5V,IOUT=500mA
- 120 160 mΩ VDD=3.3V,IOUT=500mA
Turn on delay TRD 100 600 2000 μs RL=10Ω
Turn on rise time TR 200 1500 6000 μs RL=10Ω
Turn off delay TFD - 3 20 μs RL=10Ω
Turn off fall time TF - １ 20 μs RL=10Ω
UVLO threshold voltage VUVLOH 2.3 2.5 2.7 V
VDD increasing
VUVLOL 2.1 2.3 2.5 V
VDD decreasing
Thermal shutdown threshold TTS - 135 - ºC
Flag output resistance RFLAG - 16 40 Ω IFLAG=5mA
Flag off current IFLAG - 0.01 1 μA
Current limit threshold ITHLIM 1.25 1.65 2.20 A
Over current limit level ILIM 0.6 1.1 1.6 A
◎BD6516F/BD6517F (VDD =5V, Ta=25℃, unless otherwise specified.)
Parameter Symbol Limits Unit Condition
Min. Typ. Max.
Current consumption IDD
- 100 140 μA VCTRL=5V(BD6516F), 0V(BD6517F)
OUT=OPEN
- 0.01 2 μA VCTRL=0V(BD6516F), 5V(BD6517F)
OUT=OPEN
CTRL input voltage VCTRL - - 0.7 V
Low level input voltage
2.5 - - V
High level input voltage
CTRL input current ICTRL -1 0.01 1 μA VCTRL=0V or 5V
FLAG output resistance RFLAG - 250 450 Ω IFLAG=1mA
FLAG output leak current IFLAG - 0.01 1 μA VFLAG=5V
FLAG output delay TDFL - 1 4 ms
ON resistance RON - 110 150 mΩ VDD=5V,IOUT=500mA
- 140 180 mΩ VDD=3.3V,IOUT=500mA
Short circuit output current ISC 1.2 1.65 2.2 A
VOUT=0V
Output leak current ILEAK - - 10 μA VCTRL=0V(BD6516F), 5V(BD6517F)
Thermal shutdown threshold TTS - 135 - ºC
At Tj increase
Output rise time TON1 100 1300 4000 μs RL=10Ω
Output turn on delay time TON2 200 1500 6000 μs RL=10Ω
Output fall time TOFF1 - 1 20 μs RL=10Ω
Output turn off delay time TOFF2 - 3 20 μs RL=10Ω
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
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◎BD2042AFJ/BD2052AFJ (VDD =5V, Ta=25℃, unless otherwise specified.)
Parameter Symbol Limits Unit Condition
Min. Typ. Max.
Operating Current IDD - 110 140 μA V/EN = 0V, OUT = OPEN (BD2042AFJ)
VEN = 5V, OUT = OPEN (BD2052AFJ)
Standby Current ISTB - 0.01 1 μA V/EN = 5V, OUT = OPEN (BD2042AFJ)
VEN = 0V, OUT = OPEN (BD2052AFJ)
/EN input voltage V/EN,EN
2.0 - - V
High input
- - 0.8 V
Low input
- - 0.4 V
Low input2.7V≤ VIN ≤4.5V
/EN input current I/EN,EN -1.0 0.01 1.0 μA V/EN,EN = 0V or V/EN,EN = 5V
/OC output LOW voltage V/OC - - 0.5 V
I/OC = 5mA
/OC output leak current IL/OC - 0.01 1 μA V/OC = 5V
ON resistance RON - 100 130 mΩ IOUT = 500mA
Output current at short ISC 0.7 1.0 1.3 A
VIN = 5V, VOUT = 0V,
CL = 100μF (RMS)
Output rise time TON1 - 1.8 10 ms
RL = 10Ω , CL = OPEN
Output turn on time TON2 - 2.1 20 ms
Output fall time TOFF1 - 1 20 μs
Output turn off time TOFF2 - 3 40 μs
UVLO threshold VTUVH 2.1 2.3 2.5 V
Increasing VIN
VTUVL 2.0 2.2 2.4 V
Decreasing VIN
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
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●Measurement circuit
◎BD6512F/ BD6513F/ BD6516F/ BD6517F
CTRLA
FLAGA
FLAGB
CTRLB
OUTA
VDD
GND
OUTB
VDD
1µF
VCTRL
VCTRL
A
CTRLA
FLAGA
FLAGB
CTRLB
OUT
A
VDD
GND
OUTB
VDD
1µF
VCTRL
VCTRL
RLCL
RLCL
Operating current CTRL input voltage, Output rise, fall time
CTRLA
FLAGA
FLAGB
CTRLB
OUTA
VDD
GND
OUTB
VDD
1µF
VCTRL
CL
CL
VDD
VCTRL
10k 10
k
IOUT
IOUT
CTRLA
FLAGA
FLAGB
CTRLB
OUT
A
VDD
GND
OUTB
VDD
1µF
VCTRL
VCTRL
IFLAG IFLAG
ON resistance, Over current detection FLAG output resistance
◎BD2042AFJ/ BD2052AFJ
GND
IN
EN1
EN2
/OC1
OUT1
OUT2
/OC2
VDD
VEN
A
1µF
VEN
GND
IN
EN1
EN2
/OC1
OUT1
OUT2
/OC2
VDD
VEN
1µF
VEN
RL CL
RLCL
Operating current EN, /EN input voltage, Output rise, fall time
GND
IN
EN1
EN2
/OC1
OUT1
OUT2
/OC2
VDD
VEN
1µF
VEN IOUT
10k 10
k
VDD
IOUT
GND
IN
EN1
EN2
/OC1
OUT1
OUT2
/OC2
VDD
VEN
1µF
VEN
IOUT
IOUT
ON resistance, Over current detection /OC output LOW voltage
Fig.1 Measurement circuit
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
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●Timing diagram
◎BD6513F ◎BD6512F
TRD
50%
TR
10%
50%
90%
50%
TFD
90%
50%
10%
TF
VOUT
VCTRL
TRD
50%
TR
10%
50%
90%
50%
TFD
90%
50%
10%
TF
VOUT
VCTRL
◎BD6515F/BD2042AFJ ◎BD6516F/BD2052AFJ
TON2
50%
TON1
10%
90%
50%
90%
10%
TOFF1
VOUT
VCTRL
V/EN
TOFF2
TON2
50%
TON1
10%
90%
50%
90%
10%
TOFF1
VOUT
VCTRL
VEN
TOFF2
Fig.2 Timing diagram
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
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●Reference data
◎BD6512F/ BD6513F
Fig.3 Operating current Fig.4 Operating current
0
20
40
60
80
100
120
23456
SUPPLY VOLTAGE : VDD[V]
OPERATING CURRENT : I
DD [uA]
Ta=25 ºC
0
20
40
60
80
100
120
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
OPERATING CURRENT : I
DD [uA]
VDD=5.0V
Fig.5 CTRL input voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
23456
SUPPLY VOLTAGE : VDD[V]
CONTROL INPUT VOLTAGE : V
CTRL [V]
Low to High
High to Low
Ta=25 ºC
Fig.6 CTRL input voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
CONTROL INPUT VOLTAGE : V
CTRL [V]
VDD=5.0V
High to Low
Low to High
Fig.7 ON resistance Fig.8 ON resistance
0
50
100
150
200
23456
SUPPLY VOLTAGE : VDD[V]
ON RESISTANCE : R
ON[mΩ]
Ta=25 ºC
0
50
100
150
200
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
ON RESISTANCE : R
ON[mΩ]
VDD=3.3V
VDD=5.0V
Fig.9 Output rise time
0
1000
2000
3000
4000
23 456
SUPPLY VOLTAGE : VDD[V]
TURN ON RISE TIME : T
R[us]
Ta=25 ºC
Fig.10 Output rise time Fig.11 Output rise delay time
0
1000
2000
3000
4000
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN ON RISE TIME : T
R[us]
VDD=5.0V
0
1000
2000
3000
4000
23456
SUPPLY VOLTAGE : VDD[V]
TURN ON DELAY : T
RD [us]
Ta=25 ºC
Fig.12 Output rise delay time
0
1000
2000
3000
4000
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN ON DELAY : T
RD [us]
VDD=5.0V
Fig.13 Output fall time Fig.14 Output fall time
0.0
1.0
2.0
3.0
4.0
5.0
23 456
SUPPLY VOLTAGE : VDD[V]
TURN OFF FALL TIME : T F[us]
Ta=25 ºC
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN OFF FALL TIME : T F[us]
VDD=5.0V
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
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Fig.15 Output fall delay time Fig.16 Output fall delay time
0.0
1.0
2.0
3.0
4.0
5.0
23456
SUPPLY VOLTAGE : VDD[V]
TURN OFF DELAY : T
FD[us]
Ta=25 ºC
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN OFF DELAY : T
FD[us]
VDD=5.0V
Fig.17 UVLO threshold voltage
Fig.18 UVLO hysteresis voltage
2.0
2.2
2.4
2.6
2.8
3.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
UVLO THRESHOLD VOLTAGE
VUVLOH , VUVLOL [V]
VUVLOH
VUVLOL
0.0
0.2
0.4
0.6
0.8
1.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
UVLO HYSTERESIS VOLTAGE : VHYS[V]
Fig.19 Over current threshold Fig.20 Over current threshold
0.0
1.0
2.0
3.0
23456
SUPPLY VOLTAGE : VDD[V]
CURRENT LIMIT THRESHOLD : ITHLIM[A]
Ta=25 ºC
Fig.21 Flag output resistance Fig.22 Flag output resistance
0
5
10
15
20
25
30
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
FLAG OUTPUT RESISTANCE : R
FLAG[Ω]
VDD=5.0V
Fig.23 Operating current
CTRL Disable
0.0
0.2
0.4
0.6
0.8
1.0
23456
SUPPLY VOLTAGE : VDD[V]
OPERATING CURRENT : I
DD [uA]
Ta=25 ºC
Fig.24 Operating current
CTRL Disable
0.0
0.2
0.4
0.6
0.8
1.0
23456
SUPPLY VOLTAGE : VDD[V]
OPERATING CURRENT : I
DD [uA]
VDD=5.0V
0
5
10
15
20
25
30
23 456
Supply Voltag e : VDD[V]
FLAG OUTPUT RESISTANCE : R
FLAG[Ω]
Ta=25 ºC
0.0
1.0
2.0
3.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
CURRENT LIMIT THRESHOLD : ITH
LIM[A]
VDD=5.0V
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
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0
20
40
60
80
100
120
23456
SUPPLY VOLTAGE : VDD[V]
OPERATING CURRENT : I
DD [uA]
Ta=25 ºC
●Reference data
◎BD6516F/ BD6517F
Fig.25 Operating current Fig.26 Operating current Fig.27 CTRL input voltage
(BD6516F)
Fig.28 CTRL input voltage
(BD6516F)
Fig.29 CTRL input voltage
(BD6517F) Fig.30 CTRL input voltage
(BD6517F)
0
20
40
60
80
100
120
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
OPERATING CURRENT : I
DD [uA]
VDD=5.0V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
23456
SUPPLY VOLTAGE : VDD[V]
CONTROL INPUT VOLTAGE : V
CTRL [V]
Ta=25 ºC
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
CONTROL INPUT VOLTAGE : V
CTRL [V]
VDD=5.0V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
23456
SUPPLY VOLTAGE : VDD[V]
CONTROL INPUT VOLTAGE : V
CTRL [V]
Ta=25 ºC
Low to High
High to Low
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
CONTROL INPUT VOLTAGE : V
CTRL [V]
VDD=5.0V
Low to High
High to Low
0
50
100
150
200
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
ON RESISTANCE : RON[mΩ]
Fig.31 ON resistance Fig.32 ON resistance
0
50
100
150
200
23456
SUPPLY VOLTAGE : VDD[V]
ON RESISTANCE : R
ON[mΩ]
Ta=25 ºC
VDD=3.3V
VDD=5.0V
Fig.33 Output rise time
0
1000
2000
3000
4000
23456
SUPPLY VOLTAGE : VDD[V]
TURN ON RISE TIME : T
ON1 [us]
Ta=25 ºC
0
1000
2000
3000
4000
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN ON DELAY : TON2[us]
0
1000
2000
3000
4000
23456
SUPPLY VOLTAGE : VDD[V]
TURN ON DELAY : TON2[us]
0
1000
2000
3000
4000
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN ON RISE TIME : T
ON1[us]
Fig.34 Output rise time Fig.35 Output rise delay time Fig.36 Output rise delay time
VDD=3.3V
VDD=5.0V
Ta=25 ºC
VDD=3.3V
VDD=5.0V
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
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0.0
1.0
2.0
3.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
SHORT CIRCUIT CURRENT : ISC[A]
0.0
1.0
2.0
3.0
23456
SUPPLY VOLTAGE : VDD[V]
SHORT CIRCUIT CURRENT : ISC[A]
0.0
0.2
0.4
0.6
0.8
1.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
OPERATING CURRENT : IDD[uA]
0.0
0.2
0.4
0.6
0.8
1.0
23456
SUPPLY VOLTAGE : VDD[V]
OPERATING CURRENT : IDD[uA]
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN OFF DELAY : TOFF2[us]
0.0
1.0
2.0
3.0
4.0
5.0
23456
SUPPLY VOLTAGE : VDD[V]
TURN OFF DELAY : TOFF2[us]
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN OFF FALL TIME : TOFF1[us]
Fig.38 Output fall time Fig.39 Output fall time
Fig.40 Output fall delay time
Fig.41 Output fall delay time Fig.42 Shortcircuit output
current
Fig.43 Shortcircuit output
current
Fig.47 Operating current
CTRL Disable
Fig.48 Operating current
CTRL Disable
0.0
1.0
2.0
3.0
4.0
5.0
23456
SUPPLY VOLTAGE : VDD[V]
TURN OFF FALL TIME : T
OFF1[us]
Ta=25 ºC
VDD=3.3V
VDD=5.0V
Ta=25 ºC
VDD=3.3V
VDD=5.0V
Ta=25 ºC
VDD=5.0V
VDD=3.3V
Ta=25 ºC VDD=5.0V
0
100
200
300
400
500
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
FLAG OUTPUT RESISTANCE : RFLAG[Ω]
Fig.37 Flag output resistance
VDD=5.0V
VDD=3.3V
0
1
2
3
4
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
FLAG OUTPUT DELAY : TDFL[ms]
0
1
2
3
4
23456
SUPPLY VOLTAGE : VDD[V]
FLAG OUTPUT DELAY : TDFL[ms]
0
100
200
300
400
500
23456
SUPPLY VOLTAGE : VDD[V]
FLAG OUTPUT RESISTANCE : RFLAG[Ω]
Fig.44 Flag output resistance
Fig.45 Flag output delay
Fig.46 Flag output delay
Ta=25 ºC Ta=25 ºC
VDD=5.0V
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
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●Reference data
◎BD2042AFJ/ BD2052AFJ
Fig.51 Operating current
EN,/EN Disable
Fig.52 Operating current
EN,/EN Disable
Fig.49 Operating current
EN,/EN Enable
0
20
40
60
80
100
120
140
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
OPERATING CURRENT :
IDD[uA]
VIN=5.0V
0.0
0.2
0.4
0.6
0.8
1.0
23456
SUPPLY VOLTAGE : VIN[V]
OPERATING CURRENT :
ISTB[uA]
Ta=25 ºC
Fig.50 Operating current
EN,/EN Enable
0.0
0.5
1.0
1.5
2.0
23456
SUPPLY VOLTAGE : VIN[V]
ENABLE INPUT VOLTAGE :
VEN, V/EN[V] 0
Low to Hi
g
h
High to Low
Ta=25 ºC
Fig.53 EN,/EN input voltage
0.0
0.5
1.0
1.5
2.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
ENABLE INPUT VOLTAGE :
VEN, V/EN[V]
VIN=5.0V
High to Lo
w
Low to High
Fig.54 EN,/EN input voltage
0.0
0.1
0.2
0.3
0.4
0.5
23456
SUPPLY VOLTAGE : VDD[V]
/OC OUTPUT LOW VOLTAGE :
V/OC[V]
Ta=25 ºC
Fig.55 /OC output LOW voltage
0.0
0.1
0.2
0.3
0.4
0.5
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
/OC OUTPUT LOW VOLTAGE :
V/OC[V]
VIN=5.0V
Fig.56 /OC output LOW voltage Fig.57 ON resistance
0
50
100
150
200
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
ON RESISTANCE :
RON[mΩ]
VIN=5.0V
Fig.58 ON resistance
0
20
40
60
80
100
120
140
23456
SUPPLY VOLTAGE : VIN[V]
OPERATING CURRENT :
IDD[uA]
Ta=25 ºC
0.0
0.2
0.4
0.6
0.8
1.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
OPERATING CURRENT :
ISTB[uA]
VIN=5.0V
0
50
100
150
200
23456
SUPPLY VOLTAGE : VDD[V]
ON RESISTANCE :
RON[mΩ]
Ta=25 ºC
0.0
0.5
1.0
1.5
2.0
23456
SUPPLY VOLTAGE : VIN[V]
SHORT CIRCUIT CURRENT :
ISC[A]
Ta=25 ºC
Fig.59 Output current at shortcircuit
0.0
0.5
1.0
1.5
2.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
SHORT CIRCUIT CURRENT :
ISC[A]
VIN=5.0V
Fig.60 Output current at shortcircuit
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
12/20
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Fig.63 Output turn on time
Fig.64 Output turn on time
Fig.67 Output turn off time
0.0
1.0
2.0
3.0
4.0
5.0
23456
SUPPLY VOLTAGE : VIN[V]
TURN ON TIME :
TON2[ms]
Ta=25 ºC
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN ON TIME :
TON2[ms]
VIN=5.0V
0.0
1.0
2.0
3.0
4.0
5.0
23456
SUPPLY VOLTAGE : VIN[V]
FALL TIME :
TOFF1[us]
Ta=25 ºC
Fig.65 Output fall time
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
FALL TIME :
TOFF1[us]
VIN=5.0V
Fig.66 Output fall time
0.0
1.0
2.0
3.0
4.0
5.0
6.0
23456
SUPPLY VOLTAGE : VIN[V]
TURN OFF TIME :
TOFF2[us]
Ta=25 °C
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN OFF TIME :
TOFF2[us]
VIN=5.0V
Fig.68 Output turn off time
2.0
2.1
2.2
2.3
2.4
2.5
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
UVLO THRESHOLD VOLTAGE :
VUVLOH, VUVLOL[V]
VUVLOH
VUVLOL
Fig.69 UVLO threshold voltage
0.0
0.2
0.4
0.6
0.8
1.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
UVLO HYSTERESIS VOLTAGE : VHYS[V]
Fig.70 UVLO hysteresis voltage
Fig.61 Output rise time
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
RISE TIME :
TON1[ms]
VIN=5.0V
Fig.62 Output rise time
0.0
1.0
2.0
3.0
4.0
5.0
23456
SUPPLY VOLTAGE : VIN[V]
RISE TIME :
TON1[ms]
Ta=25 ºC
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
13/20
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●Waveform data
Regarding the output rise/fall and over current detection characteristics of BD6513F, BD6517F, BD2042AFJ refer to the characteristic of BD6512F, BD6516F, BD2052AFJ.
VCTRL
(5V/div.)
VCTRL
(5V/div.)
VDD=5V
RL=47Ω
CL=47uF
VDD=5V
RL=47Ω
CL=47uF
VFLAG
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
VFLAG
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
TIME(200ms/div.)
Fig.71 Output rise, fall characteristic
(BD6512F)
TIME(200ms/div.)
Fig.72 Output rise, fall characteristic
(BD6516F)
TIME(200ms/div.)
Fig.73 Output rise, fall characteristic
(BD2052AFJ)
VDD=5V
CL=47uF
TIME (2ms/div.)
Fig.74 Over current response
Ramped load
(BD6512F)
TIME (2ms/div.)
Fig.75 Over current response
Ramped load
(BD6516F)
VCTRL
(5V/div.)
VFLAG
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
TIME (2ms/div.)
Fig.77 Over current response
Enable to shortcircuit (BD6512F)
TIME (2ms/div.)
Fig.78 Over current response
Enable to shortcircuit (BD6516F)
VFLAG
(5V/div.)
VOUT
(5V/div.)
IOUT
(2A/div.)
VFLAG
(5V/div.)
VOUT
(5V/div.)
IOUT
(2A/div.)
TIME (100ms/div.)
Fig.80 Over current response
Output shortcircuit at Enable (BD6512F)
TIME (100ms/div.)
Fig.81 Over current response
Output shortcircuit at Enable (BD6516F)
VFLAG
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
VDD=5V
CL=47uF
VFLAG
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
VDD=5V
CL=47uF
VCTRL
(5V/div.)
VFLAG
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
VDD=5V
CL=47uF
1ms Delay
Thermal Shutdown
VDD=5V
CL=47uF
Thermal Shutdown
VDD=5V
CL=47uF
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
VDD=5V
RL=10Ω
CL=100uF
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
VDD=5V
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
VDD=5V
CL=100uF
1.3ms Delay
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(2A/div.)
VDD=5V
CL=100uF
Thermal Shutdown
TIME (200ms/div.)
Fig.82 Over current response
Output shortcircuit at Enable (BD2052AFJ)
TIME (2ms/div.)
Fig.79 Over current response
Enable to shortcircuit (BD2052AFJ)
TIME (2ms/div.)
Fig.76 Over current response
Ramped load
(BD2052AFJ)
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
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●Block diagram
◎BD6512F/ BD6513F/ BD6516F/ BD6517F
Gate
Logic1
OCD1 Charge
Pump1
UVLO
Charge
Pump2
OCD2
Gate
Logic2
TSD
CTRLA
VDD
CTRLB
GND
FLAGA
OUTA
OUTB
FLAGB
Delay
Delay
(BD6516F/17F)
(BD6516F/17F)
1
2
8
7
CTRL
A
FLAG
A
OUTA
VDD
3FLAGB
4CTRLB
6
5
GND
OUTB
To p Vie w
Fig.83 Block diagram Fig.84 Pin Configuration
●Pin description
◎BD6512F/ BD6513F/ BD6516F/ BD6517F
Pin No. Symbol I / O Pin function
1, 4 CTRLA
CTRLB I
Enable input.
Switch on at Low level. (BD6513F/BD6517F)
Switch on at High level. (BD6512F/BD6516F)
High level input > 2.5V, Low level input < 0.7V.
2, 3 FLAGA
FLAGB O
Error flag output.
Low at over current, thermal shutdown.
Open drain output.
5, 8 OUTB
OUTA O Switch output.
6 GND I Ground.
7 VDD I
Power supply input.
Input terminal to the switch and power supply input terminal of the internal circuit.
●I/O circuit
◎BD6512F/ BD6513F/ BD6516F/ BD6517F
Symbol Pin No. Equivalent circuit
(BD6512F/ BD6513F)
Equivalent circuit
(BD6516F/ BD6517F)
CTRLA
CTRLB 1, 4
CTRL
A
CTRLB
CTRL
A
CTRLB
FLAGA
FLAGB 2, 3
FLAG
FLAGB
FLAG
FLAGB
OUTA
OUTB 5, 8
OUT
A
OUTB
OUT
A
OUTB
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
15/20
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●Block diagram
◎BD2042AFJ/BD2052AFJ
Gate
Logic1
OCD1 Charge
Pump1
TSD1
UVLO
Charge
Pump2
OCD2
Gate
Logic2
TSD2
/EN1
EN1
IN
/EN2
EN2
GND
/OC1
OUT1
OUT2
/OC2
Delay
Delay
1
2
8
7
GND
IN
/OC1
OUT1
3
/
EN1
(EN1)
4
6
5
OUT2
/OC2
To p Vie w
/EN2
(EN2)
Fig.85 Block diagram Fig.86 Pin Configuration
●Pin description
◎BD2042AFJ/BD2052AFJ
Pin No. Symbol I / O Pin function
1 GND I Ground.
2 IN I
Power supply input.
Input terminal to the switch and power supply input terminal of the
internal circuit.
3, 4 /EN, EN I
Enable input.
Switch on at Low level. (BD2042AFJ)
Switch on at High level. (BD2052AFJ)
High level input > 2.0V, Low level input < 0.8V.
5, 8 /OC O
Error flag output.
Low at over current, thermal shutdown.
Open drain output.
6, 7 OUT O Switch output.
●I/O circuit
◎BD2042AFJ/BD2052AFJ
Symbol Pin No Equivalent circuit
/EN1(EN1)
/EN2(EN2) 3, 4
/
EN1(EN1)
/
EN2(EN2)
/OC1
/OC2 5, 8
/
OC1
/
OC2
OUT1
OUT2 6, 7
OUT1
OUT2
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
16/20
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●Functional description
1. Switch operation
VDD(IN) pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. And the VDD(IN) pin
is used also as power source input to internal control circuit.
When the switch is turned on from CTRL(EN) control input, VDD(IN) and OUT is connected. In a normal condition, current
flows from VDD to OUT. If voltage of OUT is higher than VDD, current flows from OUT to VDD, since the switch is
bidirectional.
◎BD6512F/ BD6513F
There is a parasitic diode between the drain and the source of switch MOSFET. Therefore, even when the switch is off, if
the voltage of OUT is higher than that of VDD, current flows from OUT to VDD.
◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ
There is not parasitic diode, it is possible to prevent current from flowing reversely from OUT to VDD.
2. Thermal shutdown (TSD)
Thermal shut down circuit turns off the switch and outputs an error flag when the junction temperature in chip exceeds a
threshold temperature. The thermal shut down circuit works when either of two control signals is active.
In BD6512F/BD6513F/BD6516F/BD6517F, the switches of both OUTA and OUTB become off and error flags are output to the both.
BD2042AFJ/ BD2052AFJ have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction
temperature when an overcurrent occurs, only the switch of an overcurrent state become off and error flag is output.
◎BD6512F/BD6513F
The switch off status of the thermal shut down is latched. Therefore, even when the junction temperature goes down,
switch off and error flag output status are maintained. To release the latch, it is necessary to input a signal to switch off to
CTRL pin or make UVLO status. When the switch on signal is input or UVLO is released, the switch on and error flag
output are recovered.
◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ
Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag
output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is
removed or the switch is turned off, thermal shut down detection and recovery are repeated.
3. Over current detection, limit circuit
The over current detection circuit limits current and outputs error flag when current flowing in each switch MOSFET
exceeds a specified value. There are three types of response against over current. The over current detection, limit circuit
works when the switch is on (CTRL・EN signal is active).
3-1 When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status, the switch become current limit mode soon.
3-2 When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over current limit circuit responds. When the current detection, limit circuit works, current limitation is carried out.
3-3 When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the over
current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under voltage lockout(UVLO)
When the supply voltage is below UVLO threshold level, UVLO circuit turns off switch to prevent malfunction. The UVLO
circuit works when either of two control signals is active.
◎BD6512F/BD6513F
UVLO circuit prevents the switch from turning on until the VDD exceeds 2.5V(Typ.). If the VDD drops below 2.3V(Typ.)
while the switch turns on, then UVLO shuts off the switch.
◎BD2042AFJ/BD2052AFJ
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.)
while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ).
5. Error flag output
Error flag output is N-MOS open drain output.
◎BD6512F/BD6513F
At detection of over current detection, thermal shutdown, UVLO, Low level is output.
◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ
At detection of over current detection, thermal shutdown, Low level is output. Error flag output at over current detection
has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug
from being informed to outside.
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
17/20
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Output shortcircuit
Thermal shut down
Latch release
VCTRL
VOUT
IOUT
VFLAG
Latch
Fig.87 BD6512F/ BD6513F over current detection, thermal shutdown timing
(VCTRL of BD6513F active Low)
Output shortcircuit
Thermal shut down
VCTRL
VEN
VOUT
IOUT
VFLAG
V/OC
delay
Fig.88 BD6516F/ BD6517F/BD2042AFJ/ BD2052AFJ over current detection, thermal shutdown timing
(VCTRL, V/EN of BD6517F/BD2042AFJ active Low)
●Typical application circuit
ON/OFF
OC
OC
ON/OFF
CTRLA
(EN)
FLAGA
(/OC) OUT
A
VDD
GND
OUTB
100k
100k
5V(Typ)
OUTIN
VBUS
D+
D-
GND
Data
Regulator
USB Controller
CIN CL
Ferrite
Beads
Data
CL
Data
CTRLB
(EN)
FLAGA
(/OC)
Fig.89 Typical application circuit
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
18/20
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© 2011 ROHM Co., Ltd. All rights reserved.
0
100
200
300
400
500
600
0 25 50 75 100 125 150
AMBIENT TEMPERATURE: Ta [℃]
POWER DISSIPATION: Pd[mW]
●Application information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and
may cause bad influences upon IC operations. In order to avoid this case, connect a bypass capacitor by VDD pin and GND
pin of IC. 1uF or higher is recommended.
Pull up flag output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
In BD6512F/BD6513F, there are cases where over current detection error flag is output to inrush current at switch on or at
insertion of active line of peripheral devices. In the case of erroneous detection inBD6512F/BD6513F, use RC filter shown in
Fig. 90 for FLAG output.
OC
CTRLA
FLAGA
FLAGB
CTRLB
OUT
A
VDD
GND
OUTB
USB Controller
BD6512F/13F
VDD
Fig.90 FLAG output RC filter
●Thermal derating characteristic
(SOP8, SOP-J8)
Fig.92 Power dissipation curve
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
19/20
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●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 135°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed
at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the
LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.
BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ
Technical Note
20/20
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© 2011 ROHM Co., Ltd. All rights reserved.
●Ordering part number
B D 6 5 1 2 F - E 2
Part No. Part No.
6512
6513
6516
6517
2042A
2052A
Package
F: SOP8
FJ:SOP-J8
Packaging and forming specification
E2: Embossed tape and reel
(SOP8,SOP-J8)
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
SOP8
0.9±0.15
0.3MIN
4
°
+
6
°
−
4
°
0.17 +0.1
-
0.05
0.595
6
43
8
2
5
1
7
5.0±0.2
6.2±0.3
4.4±0.2
(MAX 5.35 include BURR)
1.27
0.11
0.42±0.1
1.5±0.1
S
0.1 S
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
SOP-J8
4°+6°
−4°
0.2±0.1
0.45MIN
234
5678
1
4.9±0.2
0.545
3.9±0.2
6.0±0.3
(MAX 5.25 include BURR)
0.42±0.1
1.27
0.175
1.375±0.1
0.1 S
S
R1120
A
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Notice
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http://www.rohm.com/contact/
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-
controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.