LL4151 HIGH-SPEED SWITCHING DIODE FEATURES High reliability DL - 35 Small surface mounting type APPLICATIONS High speed switch and general purpose use in .063(1.6) .055(1.4) computer and industrial applications .020(0.5) .012(0.3) CONSTRUCTION .020(0.5) .012(0.3) .146(3.7) .130(3.3) Silicon epitaxial planar Dimensions in inches and (millimeters) ABSOLUTE MAXIMUM RATINGS Parameter (TJ=25) Symbol Value Unit VRRM 100 V VR 75 V tp=1uS IFSM IFRM 75 A IF 75 mA VR=0 IFAV 53 mA PV 300 mW TsTg -65 ~ +175 Test Conditions Symbol Value Unit On PC board 50mm*50mm*1.6mm RthJA 500 K/W Test Conditions Type Repetitive peak reverse voltage Reverse Vltage Peak forward surge current Repetitive peak forward current Forward current Average forward current Power dissipation Junction temperature TJ Storge temperature range MAXIMUM THERMAL RESISTANCE Parameter Junction ambient ELECTRICAL CHARACTERISTICS Parameter Forward voltage Reverse current Diode capacitance Reverse recovery time (TJ=25) TJ=25 Test Conditions Symbol Min Max Unit IF=1mA VF 0.54 0.62 V IF=10mA VF 0.66 0.74 V IF=50mA VF 0.76 0.86 V IF=100mA VF 0.82 0.92 V IF=200mA VF 0.87 1.0 V VR=50V IR 100 nA VR=50V, Tj=150 IR 100 uA VR=0, f=1MHZ, VHF=50mA CD 2.5 pF IF= IR=10...100mA,RL=100 trr 4 ns ~ 429 ~ Typ RATING AND CHARACTERISTIC CURVES LL4151 FIG. 2 -FORWARD CURRENT VS.FORWARD VOLTAGE FIG. 1 - MAXIMUM PERMISSIBLE CONTINUOUS FORWARD CURRENT VS. AMBIENT TEMPERATURE 600 TJ=175C TYPICAL VALUES 400 300 400 IF (m A) IF (m A) TJ=25C TYPICAL VALUES 200 200 100 0 0 0 100 200 Tamb(C) 2 1 0 VF (V) FIG. 4 -DIODE CAPACITANCE VS. REVERSE VOLTAGE (TYPICAL VALUES) FIG.3-REVERSE CURRENT VS. JUNCTION TEMPERATURE 1000 1.2 100 IR (uA) 1.0 VR=75V TYPICAL VALUES 10 Cd (pF) 0.8 1 0.6 VR=20V TYPICAL VALUES f=1MHZ,TJ=25C 0.1 0.4 0 0.01 10 VR(V) 0 100 TJ((C) 200 ~ 430 ~ 20