Document Number: MPX2202
Rev 7, 01/2012
Freescale Semiconductor
© 2005-2008, 2012 Freescale Semiconductor, Inc. All rights reserved.
Pressure
200 kPa On-Chip Temperature
Compensated Silicon
Pressure Sensors
The MPX2202 devices series are silicon piezoresistive pressure sensor
providing a highly accurate and linear voltage output directly proportion al to
the applied pressure. The sensor is a single monolithic silicon diaphragm with
the strain gauge and a thin-film resistor network integrated on chip. The chip
is laser trimmed for precise span and offset calibration and temperature
compensation. They are designed for use in applications such as pump/
motor controllers, robotics, level indicators, medical diagnostics, pressure
switching, barometers, altimeters, etc.
Features
• Temperature Compensated Over 0°C to +85°C
• Easy-to-Use Chip Carrier Package Options
• Available in Absolute, Differential and Gauge Configurations
• Ratiometric to Supply Voltage
• Available in Easy-to-Use Tape and Reel
ORDERING INFORMATION
Device Name Case
No. # of Ports Pressure Type Device Marking
None Single Dual Gauge Differential Absolute
Unibody Package (MPX2202 Series)
MPX2202A 344 • • MPX2202A
MPX2202DP 344C • • MPX2202DP
MPX2202AP 344B • • MPX2202AP
MPX2202GP 344B • • MPX2202GP
MPX2202ASX 344F • • MPX2202A
Small Outline Package (MPXV2202 Series)
MPXV2202GP 1369 • • MPXV2202GP
MPXV2202DP 1351 • • MPXV2202DP
MPXV2202GC6TI 482A • • MPXV2202G
MPXV2202GC6U 482A • • MPXV2202G
MPAK Package (MPXM2202 Series)
MPXM2202D 1320 • • MPXM2202D
MPXM2202DT1 1320 • • MPXM2202D
MPXM2202A 1320 • • MPXM2202A
MPXM2202GS 1320A • • MPXM2202GS
MPXM2202GST1 1320A • • MPXM2202GS
MPXM2202AS 1320A • • MPXM2202AS
MPX2202
Series
0 to 200 kPa (0 to 29 psi)
40 mV Full Scale
(Typical)
Application Examples
• Pump/Motor Controllers
• Robotics
• Level Indicators
• Medical Diagnostics
• Pressure Switching
• Barometers
• Altimeters
MPX2202
Sensors
2Freescale Semiconductor, Inc.
Pressure
MPX2202AP/GP
CASE 344B-01 MPX2202DP
CASE 344C-01
UNIBODY PACKAGES
MPX2202A
CASE 344-15
SMALL OUTLINE PACKAGES
MPXV2202GP
CASE 1369-01
MPX2202ASX
CASE 344F-01
MPXM2202A
CASE 1320-02 MPXM2202GS/AS
CASE 1320A-02
MPAK
MPXV2202GP
CASE 1351-01 MPXV2202GP
CASE 482A-01
MPX2202
Sensors
Freescale Semiconductor, Inc. 3
Pressure
Operating Characteristics
Table 1. Operating Characteristics
(VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristics Symbol Min Typ Max Unit
Pressure Range(1)
Absolute Pressure Range MPX2202A
Differential Pressure Range MPX2202D
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
POP
POP
20
0—
—200
200 kPa
kPa
Supply Voltage(2)
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
VS—1016Vdc
Supply Current Io—6.0—mAdc
Full Scale Span(3)
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
VFSS 38.5 40 41.5 mV
Offset(4)
MPX2202D, MPXM2202D/G Series
MPX2202A, MPXM2202A Series
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
Voff -1.0
-2.0 —
—1.0
2.0 mV
Sensitivity ΔV/ΔP— 0.2 —mV/kPa
Linearity(5)
MPXM2202D/G, MPX2202D Series
MPXM2202A, MPX2202A Series
5. Accuracy (error budget) consists of the following:
Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25°C.
TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
—-0.6
-1.0 —
—0.4
1.0 %VFSS
Pressure Hysteresis(5) (0 to 200 kPa) ——±0.1 — %VFSS
Temperature Hysteresis(5) (-40°C to +125°C) ——±0.5 — %VFSS
Temperature Effect on Full Scale Span(5) TCVFSS -2.0 — 2.0 %VFSS
Temperature Effect on Offset(5) TCVoff -1.0 — 1.0 mV
Input Impedance Zin 1000 — 2500 Ω
Output Impedance Zout 1400 — 3000 Ω
Response Time(6) (10% to 90%)
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
tR—1.0—ms
Warm-Up — — 20 — ms
Offset Stability(7)
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
——±0.5 — %VFSS
MPX2202
Sensors
4Freescale Semiconductor, Inc.
Pressure
Maximum Ratings
Voltage Output versus Applied Differential
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
(P1) side relative to the vacuum (P2) side. Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a block diagram of the internal circuitry
on the stand-alone pressure sensor chip.
Figure 1. Te mpe r ature Compensated and Calibrated
Pressure Sensor Schematic
Table 2. Maximum Ratings(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Max Value Unit
Maximum Pressure (P1 > P2) 400 kPa
Storage Temperature -40 to 125 °C
Operating Temperature -40 to 125 °C
+VOUT
–VOUT
4
2
VS3
Sensing
Element
GND
1
Thin Film
Temperature
Compensation
and Calibration
Circuitry
MPX2202
Sensors
Freescale Semiconductor, Inc. 5
Pressure
On-Chip Temperature Compensation and Calibration
Figure 2. Output vs. Pressure Diffe rential
Figure 2 shows the output characteristics of the MPX2202
series at 25°C. The output is directly proportional to the
differential pressure and is essentially a straight line.
The effects of temperature on full scale span and offset are
very small and are shown under Operating Characteristics.
Figure 3. Cross Sectional Diagram (not to scale)
Figure 3 illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2202 series pressure sensor operating
characteristics an d internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have ad ve rse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: V out = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end poi nt straight line fit (see Figure 4) or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linea ri ty error (lower numer ic al val u e), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pr essu re .
Figure 4. Linearity Specification Compariso n
Output (mVDC)
VS = 10 VDC
TA = 25°C
P1 > P2
40
35
30
25
20
15
10
5
0
-5
TYP
MAX
MIN
Span
Range
(TYP)
Offset
(TYP)
0 50 100 150 200kPa
PSI 7.25 14.5 21.75 29
1751257525
Pressure
Lead Frame
Wire Bond
Differential/Gauge
Die
Silicone Gel
Die Coat
Differential/Gauge
P2 Die
Bond
Epoxy
Case
Stainless Steel
Metal Cover
P1 Silicone Gel
Die Coat Absolute
Die P1 Metal Cover Epoxy
Case
Absolute Element
P2
Lead Frame
Wire Bond
Die
Bond
Stainless Steel
Element
Least
Square
Deviation
Relative Voltage Output
Pressure (% Full Scale)
050 100
End Point Straight
Line Fit
Exaggerated
Performance
Curve
Least Squares Fit
Straight Line
Deviation
Offset
MPX2202
Sensors
6Freescale Semiconductor, Inc.
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Table 3. Pressure (P1) Side Delineation
Part Number Case Type Pressure (P1) Side Identifier
MPX2202A 344 Stainless Steel Cap
MPX2202DP 344C Side with Part Marking
MPX2202GP/AP 344B Side with Port Attached
MPX2202ASX 344F Side with Port Attached
MPX2202GP 1369 Side with Port Attached
MPX2202DP 1351 Side with Part Marking
MPXV2202GP 1369 Side with Port Attached
MPXV2202DP 1351 Side with Part Marking
MPXV2202GC6TI/U 482A Side with Port Attached
MPXM2202A/ATI/DT/DTI 1320 Side with Part Marking
MPXM2202GS/GSTI/AS/ASTI 1320A Side with Port Attached
MPX2202
Sensors
Freescale Semiconductor, Inc. 7
Pressure
PACKAGE DIMENSIONS
CASE 482A–01
ISSUE A
DATE 05/13/98
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A10.540.4250.415 10.79
B10.540.4250.415 10.79
C12.700.5200.500 13.21
D0.960.0420.038 1.07
G0.100 BSC 2.54 BSC
H0.002 0.010 0.05 0.25
J0.009 0.011 0.23 0.28
K0.061 0.071 1.55 1.80
M0 7 0 7
N0.444 0.448 11.28 11.38
S0.709 0.725 18.01 18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
S
D
G
8 PL
4
5
81
S
B
M
0.25 (0.010) A S
T
–A–
–B–
C
M
J
KPIN 1 IDENTIFIER
H
SEATING
PLANE
–T–
N
V
W
V0.245 0.255 6.22 6.48
W0.115 0.125 2.92 3.17
MPX2202
Sensors
8Freescale Semiconductor, Inc.
Pressure
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
A
M
0.136 (0.005)
T
1234
PIN 1
R
NL
G
F
D
4 PL
SEATING
PLANE
-T-
C
M
J
B-A-
DAMB AR TRIM ZONE:
F
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
1234
Y
Z
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
STYLE 2:
PIN 1. V
CC
2. - SUPPLY
3. + SUPPLY
4. GROUND
STYLE 3:
PIN 1. GND
2. -VOUT
3. VS
4. +VOUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.595 0.630 15.11 16.00
B0.514 0.534 13.06 13.56
C0.200 0.220 5.08 5.59
D0.016 0.020 0.41 0.51
F0.048 0.064 1.22 1.63
G0.100 BSC 2.54 BSC
J0.014 0.016 0.36 0.40
L0.695 0.725 17.65 18.42
M30˚ NOM 30˚ NOM
N0.475 0.495 12.07 12.57
R0.430 0.450 10.92 11.43
Y0.048 0.052 1.22 1.32
Z0.106 0.118 2.68 3.00
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
D
4 PL
F
U
HL
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
-A-
-Q-
S
K
G
-P-
S
Q
M
0.25 (0.010)
T
S
S
M
0.13 (0.005)
QS
T
12 34
SEATING
PLANE
B
N
R
C
J
-T-
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.145 1.175 29.08 29.85
B0.685 0.715 17.40 18.16
C0.305 0.325 7.75 8.26
D0.016 0.020 0.41 0.51
F0.048 0.064 1.22 1.63
G0.100 BSC 2.54 BSC
H0.182 0.194 4.62 4.93
J0.014 0.016 0.36 0.41
K0.695 0.725 17.65 18.42
L0.290 0.300 7.37 7.62
N0.420 0.440 10.67 11.18
P0.153 0.159 3.89 4.04
Q0.153 0.159 3.89 4.04
R0.230 0.250 5.84 6.35
S
U0.910 BSC 23.11 BSC
0.220 0.240 5.59 6.10
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
PACKAGE DIMENSIONS
PACKAGE DIMENSIONS
MPX2202
Sensors
Freescale Semiconductor, Inc. 9
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.
D
4 PL
F
U
LH
PORT #2
VACUUM
(P2) POSITIVE
PRESSURE
(P1)
PIN 1
-A-
-Q-
S
K
G
-P-
S
Q
M
0.25 (0.010) T
S
S
M
0.13 (0.005) Q
S
T
12 34
SEATING
PLANE
B
N
R
C
J
-T-
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.145 1.175 29.08 29.85
B0.685 0.715 17.40 18.16
C0.305 0.325 7.75 8.26
D0.016 0.020 0.41 0.51
F0.048 0.064 1.22 1.63
G0.100 BSC 2.54 BSC
H0.182 0.194 4.62 4.93
J0.014 0.016 0.36 0.41
K0.695 0.725 17.65 18.42
L0.290 0.300 7.37 7.62
N0.420 0.440 10.67 11.18
P0.153 0.159 3.89 4.04
Q0.153 0.158 3.89 4.04
R0.230 0.250 5.84 6.35
S
U0.910 BSC 23.11 BSC
0.220 0.240 5.59 6.10
CASE 344D-01
ISSUE B
UNIBODY PACKAGE
Pressure
MPX2202
Sensors
10 Freescale Semiconductor, Inc.
Pressure
PAGE 1 OF 2
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2202
Sensors
Freescale Semiconductor, Inc. 11
Pressure
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 2 OF 2
MPX2202
Sensors
12 Freescale Semiconductor, Inc.
Pressure
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2202
Sensors
Freescale Semiconductor, Inc. 13
Pressure
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
PACKAGE DIMENSIONS
MPX2202
Sensors
14 Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
CASE 1320-02
ISSUE B
MPAK
MPX2202
Sensors
Freescale Semiconductor, Inc. 15
Pressure
PACKAGE DIMENSIONS
CASE 1320-02
ISSUE B
MPAK
MPX2202
Sensors
16 Freescale Semiconductor, Inc.
Pressure PACKAGE DIMENSIONS
PIN 4
PIN 1
CASE 1320A-02
ISSUE A
MPAK
MPX2202
Sensors
Freescale Semiconductor, Inc. 17
Pressure
PACKAGE DIMENSIONS
CASE 1320A-02
ISSUE A
MPAK
MPX2202
Sensors
Freescale Semiconductor, Inc. 18
Pressure
REVISION HISTORY
Revision
number Revision
date Description of changes
7 01/2012 • In Table 1. Operating Characteristics, in the Characteristic column under Pressure Range, added
rows for Absolute Pressure Range MPX2202A and Differential Pressure Range MPX2202D
devices
MPX2202
Rev. 7
01/2012
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