1/2
DATA BRIEFING
September 2001
This is Brief D ata fro m STMicr oelectronics. Details are subject to change without notice. For complete d ata, please contact
your nearest Sales Office or SmartCard Products Divison, Rousse t, Fra n ce. Fax: (+33) 4 42 68 87 29.
SMARTCARD MCU
Ordering Information
For Package And Delivery
INTRODUCTION
The manufacturing process of Smartcards in-
volves various components and technologies in
order to issue a finished product:
– micromodules,
– flat packages,
– wafers.
■MICROMODULES
Dedicated package for Smartcard products, the
micromodule type depends on the size of the
product and on the application.
Table 1 lists all available micromodules.
■FLA T PACKAG ES
For applications which require surface mount tech-
nology, suitable for PC cards, or other security
modules, STMicroel ectronics offers flat packages
listed In Table 2 .
■WAFERS
For issuer production need, ST offers sawn and
unsawn wafers deliveries, listed in Tab le 3.
Figure 1. Delivery form
Table 1. Micromo du les in super 35 standa rd
tape
Table 2. Flat Packages
Table 3. Wafers
4
4
4
4
SO20
261a.ai
8” Wafer
Micromodule
Notch
Type Description
D1, D2 8 contacts for memory cards
D15 6 contacts for memory cards
D3, D4 8 contacts with ring MCU cards
D5 8 contacts for dual contact contactless
MCU cards
D68 8 contacts for MCU cards
D7 6 contacts for dual contact contactless
MCU cards
C7 Full contactless for MCU cards
D8 8 contacts for MCU cards
Type Description
O20 SO20 for MCU products
QF4 TQFP4 4 for MCU products
R20 SO20 on tape and reel for MCU products
Type Description
W00 Unsawn wafers, 750 µm thickness
W20 Unsawn wafers, 275 µm thickness
W40 Unsawn wafers, 180 µm thickness
S2x 280 µm sawn wafers on UV tape
R4x 180 µm sawn wafers on insolated UV tape
S4x 180 µm sawn wafers on UV tape
T4x 180 µm sawn wafers on blue tape
SMARTCARD MCU
2/2
Table 4. Ordering Information Scheme
Note: * where “y” i ndi cates the s a wi ng ori entati on as show n i n Figure 2
Figure 2. Sawing orientation
Sawn wa fers are sc ribed an d m ount ed in a frame
on adhesive tape. The orientation is defined by the
position of the GND pad on the die, viewed with
active area of pr oduct visible, r elati ve to the not ch-
es of the frame (as shown in Figure 2). The orien-
tation of the die with respect to the plastic frame
notches is specified by the Customer.
One further concern, when specifying devices to
be delivered in this form, is that wafers mounted
on adhesive tape mus t be used within a limit ed pe-
riod from the mounting date:
– two months, if wafers are stored a t 25°C, 55%
relative hu m id it y
– six months, i f wafers are stored at 4°C, 55% rel-
ative humidity
Example: ST19SF08C D45 XXX Z
Product name Pre-personalization name
“+” if no pre-personalization
Delivery Form Customer ROM code name
Dxx: Module contact or dual
Cxx: Contactless modules
Oxx: SO package
Wxx: Unsawn wafer
Sxy*: Sawn wafer (std UV tape)
Rxy*: Sawn wafer (insolated UV tape) or SO on tape and reel
AI02171
1ORIENTATION
GND
GND GND
GND
234
VIEW: WAFER FRONT SIDE
