Quad-Channel Digital Isolators
Data Sheet
ADuM1410/ADuM1411/ADuM1412
FEATURES
Low power operation
5 V operation
1.3 mA per channel maximum at 0 Mbps to 2 Mbps
4.0 mA per channel maximum at 10 Mbps
3 V operation
0.8 mA per channel maximum at 0 Mbps to 2 Mbps
1.8 mA per channel maximum at 10 Mbps
Bidirectional communication
3 V/5 V level translation
High temperature operation: 105°C
Up to 10 Mbps data rate (NRZ)
Programmable default output state
High common-mode transient immunity: >25 kV/µs
16-lead, RoHS compliant, SOIC wide body package
Safety and regulatory approvals
UL recognition: 3750 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice 5A
VDE certificate of conformity
DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12
VIORM = 560 V peak
TÜV approval: IEC/EN 60950-1
APPLICATIONS
General-purpose multichannel isolation
SPI interface/data converter isolation
RS-232/RS-422/RS-485 transceivers
Industrial field bus isolation
FUNCTIONAL BLOCK DIAGRAMS
ENCODE DECODE
ENCODE DECODE
ENCODE DECODE
ENCODE DECODE
V
DD1
GND
1
V
IA
V
IB
V
IC
V
ID
DISABLE
GND
1
V
DD2
GND
2
V
OA
V
OB
V
OC
V
OD
CTRL
2
GND
2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
ADuM1410
06580-001
Figure 1. ADuM1410
DECODE ENCODE
ENCODE DECODE
ENCODE DECODE
ENCODE DECODE
V
DD1
GND
1
V
IA
V
IB
V
IC
V
OD
CTRL
1
GND
1
V
DD2
GND
2
V
OA
V
OB
V
OC
V
ID
CTRL
2
GND
2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
ADuM1411
06580-002
Figure 2. ADuM1411
DECODE ENCODE
DECODE ENCODE
ENCODE DECODE
ENCODE DECODE
VDD1
GND1
VIA
VIB
VOC
VOD
CTRL1
GND1
VDD2
GND2
VOA
VOB
VIC
VID
CTRL2
GND2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
ADuM1412
06580-003
Figure 3. ADuM1412
GENERAL DESCRIPTION
The ADuM1410/ADuM1411/ADuM14121 are four-channel
digital isolators based on Analog Devices, Inc., iCoupler®
technology. Combining high speed CMOS and monolithic air
core transformer technologies, these isolation components provide
outstanding performance characteristics superior to alternatives
such as optocoupler devices.
By avoiding the use of LEDs and photodiodes, iCoupler devices
remove the design difficulties commonly associated with opto-
couplers. The usual concerns that arise with optocouplers, such
as uncertain current transfer ratios, nonlinear transfer functions,
and temperature and lifetime effects, are eliminated with the simple
iCoupler digital interfaces and stable performance characteristics.
The need for external drivers and other discrete components is
eliminated with these iCoupler products. Furthermore, iCoupler
devices consume one-tenth to one-sixth the power of optocou-
plers at comparable signal data rates.
The ADuM1410/ADuM1411/ADuM1412 isolators provide four
independent isolation channels in a variety of channel configu-
rations and data rates (see the Ordering Guide) up to 10 Mbps.
All models operate with the supply voltage on either side ranging
from 2.7 V to 5.5 V, providing compatibility with lower voltage
systems as well as enabling voltage translation functionality across
the isolation barrier. All products also have a default output
control pin. This allows the user to define the logic state the
outputs are to adopt in the absence of the input power. Unlike
other optocoupler alternatives, the ADuM1410/ADuM1411/
ADuM1412 isolators have a patented refresh feature that ensures
dc correctness in the absence of input logic transitions and
during power-up/power-down conditions.
1 Protected by U.S. Patents 5,952,849; 6,873,065; 6,903,578; and 7,075,329.
Rev. M Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©20052015 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
ADuM1410/ADuM1411/ADuM1412 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagrams ............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Electrical Characteristics5 V Operation................................ 3
Electrical Characteristics3 V Operation................................ 5
Electrical CharacteristicsMixed 5 V/3 V or 3 V/5 V
Operation ....................................................................................... 7
Package Characteristics ............................................................. 10
Regulatory Information ............................................................. 10
Insulation and Safety-Related Specifications .......................... 10
DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12
Insulation Characteristics .......................................................... 11
Recommended Operating Conditions .................................... 11
Absolute Maximum Ratings ......................................................... 12
ESD Caution................................................................................ 12
Pin Configurations and Function Descriptions ......................... 13
Typical Performance Characteristics ........................................... 17
Applications Information .............................................................. 19
PC Board Layout ........................................................................ 19
Propagation Delay-Related Parameters ................................... 19
DC Correctness and Magnetic Field Immunity ........................... 19
Power Consumption .................................................................. 20
Insulation Lifetime ..................................................................... 20
Outline Dimensions ....................................................................... 22
Ordering Guide .......................................................................... 22
REVISION HISTORY
8/15—Re v. L to Rev. M
Changes to Table 5 and Table 6 ..................................................... 10
7/15—Rev. K to Rev. L
Changes to Table 5 and Table 6 ..................................................... 10
4/15—Re v. J to Rev. K
Changed ADuM141x to ADuM1410/ADuM1411/
ADuM1412 ..................................................................... Throughout
Change to Features Section ............................................................. 1
Changes to Table 5 and Table 6 ..................................................... 10
4/14—Re v. I to Rev. J
Change to Table 5 ........................................................................... 10
3/12—Rev. H to Rev. I
Created Hyperlink for Safety and Regulatory Approvals
Entry in Features Section ................................................................. 1
Change to PC Board Layout Section ............................................ 19
11/10—Re v. G to Rev. H
Added TÜV Approval to Features Section .................................... 1
Added TÜV Column, Table 5 ....................................................... 10
6/07—Re v. F to Rev. G
Updated VDE Certification Throughout ...................................... 1
Changes to Features and Applications ............................................ 1
Changes to DC Specifications in Table 1 ........................................ 3
Changes to DC Specifications in Table 2 ........................................ 5
Changes to DC Specifications in Table 3 ........................................ 7
Changes to Regulatory Information Section .............................. 10
Added Table 10 ............................................................................... 12
Added Insulation Lifetime Section .............................................. 21
2/07—Rev. E to Rev. F
Added ADuM1410ARWZ ................................................ Universal
Updated Pin Name CTRL to CTRL2 Throughout ........................ 1
Changes to Ordering Guide .......................................................... 21
10/06—Re v. D to Rev. E
Added ADuM1411 and ADuM1412 ............................... Universal
Deleted ADuM1310 ........................................................... Universal
Changes to Features .......................................................................... 1
Changes to Specifications Section ................................................... 3
Updated Outline Dimensions ....................................................... 20
Changes to Ordering Guide .......................................................... 20
3/06—Re v. C to Rev. D
Added Note 1 and Changes to Figure 2 .......................................... 1
Changes to Absolute Maximum Ratings ..................................... 11
11/05—Revision C: Initial Version
Rev. M | Page 2 of 22
Data Sheet ADuM1410/ADuM1411/ADuM1412
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS5 V OPERATION
4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD25.5 V; all minimum/maximum specifications apply over the entire recommended operation range,
unless otherwise noted; all typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V. All voltages are relative to their respective ground.
Table 1.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DC SPECIFICATIONS
Input Supply Current per Channel,
Quiescent
IDDI (Q) 0.50 0.73 mA
Output Supply Current per Channel,
Quiescent
IDDO (Q) 0.38 0.53 mA
ADuM1410, Total Supply Current,
Four Channels1
DC to 2 Mbps
VDD1 Supply Current IDD1 (Q) 2.4 3.2 mA DC to 1 MHz logic signal frequency
VDD2 Supply Current IDD2 (Q) 1.2 1.6 mA DC to 1 MHz logic signal frequency
10 Mbps (BRWZ Version Only)
VDD1 Supply Current IDD1 (10) 8.8 12 mA 5 MHz logic signal frequency
VDD2 Supply Current IDD2 (10) 2.8 4.0 mA 5 MHz logic signal frequency
ADuM1411, Total Supply Current,
Four Channels1
DC to 2 Mbps
VDD1 Supply Current IDD1 (Q) 2.2 2.8 mA DC to 1 MHz logic signal frequency
VDD2 Supply Current IDD2 (Q) 1.8 2.4 mA DC to 1 MHz logic signal frequency
10 Mbps (BRWZ Version Only)
V
DD1
Supply Current
I
DD1 (10)
7.6
mA
5 MHz logic signal frequency
VDD2 Supply Current IDD2 (10) 3.8 5.3 mA 5 MHz logic signal frequency
ADuM1412, Total Supply Current,
Four Channels1
DC to 2 Mbps
V
DD1
or V
DD2
Supply Current
I
DD1 (Q)
, I
DD2
(Q)
2.6
mA
DC to 1 MHz logic signal frequency
10 Mbps (BRWZ Version Only)
VDD1 or VDD2 Supply Current IDD1 (10), IDD2 (10) 4.6 6.5 mA 5 MHz logic signal frequency
All Models
Input Currents IIA, IIB, IIC,
IID, ICTRL1,
ICTRL2, IDISABLE
−10 +0.01 +10 µA 0 V VIA, VIB, VIC, VID VDD1 or VDD2,
0 V ≤ VCTRL1, VCTRL2 ≤ VDD1 or VDD2,
0 V VDISABLE ≤ VDD1
Logic High Input Threshold VIH 2.0 V
Logic Low Input Threshold VIL 0.8 V
Logic High Output Voltages VOAH, VOBH,
VOCH, VODH
(VDD1 or VDD2) − 0.1 5.0 V IOx = −20 µA, VIx = VIxH
(VDD1 or VDD2) − 0.4 4.8 V IOx = −4 mA, VIx = VIxH
Logic Low Output Voltages
VOAL, VOBL,
VOCL, VODL
0.1
V
I
Ox
= 20 µA, V
Ix
= V
IxL
0.04 0.1 V IOx = 400 µA, VIx = VIxL
0.2 0.4 V IOx = 4 mA, VIx = VIxL
Rev. M | Page 3 of 22
ADuM1410/ADuM1411/ADuM1412 Data Sheet
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
SWITCHING SPECIFICATIONS
ADuM1410ARWZ/ADuM1411ARWZ/
ADuM1412ARWZ
Minimum Pulse Width2 PW 1000 ns CL = 15 pF, CMOS signal levels
Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels
Propagation Delay4 tPHL, tPLH 20 65 100 ns CL = 15 pF, CMOS signal levels
Pulse Width Distortion, |tPLH − tPHL|4 PWD 40 ns CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 tPSK 50 ns CL = 15 pF, CMOS signal levels
Channel-to-Channel Matching6 tPSKCD/OD 50 ns CL = 15 pF, CMOS signal levels
ADuM1410BRWZ/ADuM1411BRWZ/
ADuM1412BRWZ
Minimum Pulse Width2 PW 100 ns CL = 15 pF, CMOS signal levels
Maximum Data Rate3 10 Mbps CL = 15 pF, CMOS signal levels
Propagation Delay4 tPHL, tPLH 20 30 50 ns CL = 15 pF, CMOS signal levels
Pulse Width Distortion, |tPLH − tPHL|4 PWD 5 ns CL = 15 pF, CMOS signal levels
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 tPSK 30 ns CL = 15 pF, CMOS signal levels
Channel-to-Channel Matching,
Codirectional Channels6
tPSKCD 5 ns CL = 15 pF, CMOS signal levels
Channel-to-Channel Matching,
Opposing-Directional Channels6
tPSKOD 6 ns CL = 15 pF, CMOS signal levels
All Models
Output Rise/Fall Time (10% to 90%) tR/tF 2.5 ns CL = 15 pF, CMOS signal levels
Common-Mode Transient Immunity
at Logic High Output7
|CMH| 25 35 kV/µs VIx = VDD1 or VDD2, VCM = 1000 V,
transient magnitude = 800 V
Common-Mode Transient Immunity
at Logic Low Output7
|CML| 25 35 kV/µs VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate
f
r
Mbps
Input Enable Time8 tENABLE 2.0 µs VIA, VIB, VIC, VID = 0 V or VDD1
Input Disable Time8 tDISABLE 5.0 µs VIA, VIB, VIC, VID = 0 V or VDD1
Input Dynamic Supply Current
per Channel9
IDDI (D) 0.12 mA/
Mbps
Output Dynamic Supply Current
per Channel9
I
DDO (D)
mA/
Mbps
1 The supply current values for all four channels are combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate can be calculated as described in the Power Consumption section.
See Figure 8 through Figure 10 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 11 through
Figure 15 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM1410/ADuM1411/ADuM1412 channel configurations.
2 The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3 The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4 tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5 tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load
within the recommended operating conditions.
6 Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with
inputs on opposing sides of the isolation barrier.
7 |CMH| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. |CML| is the maximum common-mode voltage slew rate
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient
magnitude is the range over which the common mode is slewed.
8 Input enable time is the duration from when VDISABLE is set low until the output states are guaranteed to match the input states in the absence of any input data logic
transitions. If an input data logic transition within a given channel does occur within this time interval, the output of that channel reaches the correct state within the
much shorter duration as determined by the propagation delay specifications within this data sheet. Input disable time is the duration from when VDISABLE is set high
until the output states are guaranteed to reach their programmed output levels, as determined by the CTRL2 logic state (see Table 14).
9 Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 8 through Figure 10 for information
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current
for a given data rate.
Rev. M | Page 4 of 22
Data Sheet ADuM1410/ADuM1411/ADuM1412
ELECTRICAL CHARACTERISTICS3 V OPERATION
2.7 V ≤ VDD1 ≤ 3.6 V, 2.7 V ≤ VDD2 ≤ 3.6 V; all minimum/maximum specifications apply over the entire recommended operation range,
unless otherwise noted; all typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.0 V. All voltages are relative to their respective ground.
Table 2.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DC SPECIFICATIONS
Input Supply Current per Channel,
Quiescent
IDDI (Q) 0.25 0.38 mA
Output Supply Current per Channel,
Quiescent
IDDO (Q) 0.19 0.33 mA
ADuM1410, Total Supply Current,
Four Channels1
DC to 2 Mbps
VDD1 Supply Current IDD1 (Q) 1.2 1.6 mA DC to 1 MHz logic signal
frequency
V
DD2
Supply Current
I
DD2 (Q)
0.8
1.0
mA
DC to 1 MHz logic signal
frequency
10 Mbps (BRWZ Version Only)
VDD1 Supply Current IDD1 (10) 4.5 6.5 mA 5 MHz logic signal frequency
VDD2 Supply Current IDD2 (10) 1.4 1.8 mA 5 MHz logic signal frequency
ADuM1411, Total Supply Current,
Four Channels1
DC to 2 Mbps
VDD1 Supply Current IDD1 (Q) 1.0 1.9 mA DC to 1 MHz logic signal frequency
VDD2 Supply Current IDD2 (Q) 0.9 1.7 mA DC to 1 MHz logic signal frequency
10 Mbps (BRWZ Version Only)
V
DD1
Supply Current
I
DD1 (10)
3.1
4.5
mA
5 MHz logic signal frequency
VDD2 Supply Current IDD2 (10) 2.1 3.0 mA 5 MHz logic signal frequency
ADuM1412, Total Supply Current,
Four Channels1
DC to 2 Mbps
VDD1 or VDD2 Supply Current IDD1 (Q), IDD2 (Q) 1.0 1.8 mA DC to 1 MHz logic signal frequency
10 Mbps (BRWZ Version Only)
VDD1 or VDD2 Supply Current IDD1 (10), IDD2 (10) 2.6 3.8 mA 5 MHz logic signal frequency
All Models
Input Currents IIA, IIB, IIC, IID,
ICTRL1,ICTRL2, IDISABLE
−10 +0.01 +10 µA 0 V VIA, VIB, VIC, VID VDD1 or VDD2,
0 V ≤ VCTRL1, VCTRL2 ≤ VDD1 or VDD2,
0 V VDISABLE ≤ VDD1
Logic High Input Threshold VIH 1.6 V
Logic Low Input Threshold VIL 0.4 V
Logic High Output Voltages VOAH, VOBH,
VOCH, VODH
(VDD1 or VDD2) 0.1 3.0 V IOx = −20 µA, VIx = VIxH
(VDD1 or VDD2) − 0.4 2.8 V IOx = −4 mA, VIx = VIxH
Logic Low Output Voltages VOAL, VOBL,
VOCL, VODL
0.0 0.1 V IOx = 20 µA, VIx = VIxL
0.04
0.1
V
I
Ox
= 400 µA, V
Ix
= V
IxL
0.2 0.4 V IOx = 4 mA, VIx = VIxL
Rev. M | Page 5 of 22
ADuM1410/ADuM1411/ADuM1412 Data Sheet
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
SWITCHING SPECIFICATIONS
ADuM1410ARWZ/ADuM1411ARWZ/
ADuM1412ARWZ
Minimum Pulse Width2 PW 1000
ns CL = 15 pF, CMOS signal levels
Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels
Propagation Delay4 tPHL, tPLH 20 75 100 ns CL = 15 pF, CMOS signal levels
Pulse Width Distortion, |tPLH − tPHL|4 PWD 40 ns CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 tPSK 50 ns CL = 15 pF, CMOS signal levels
Channel-to-Channel Matching6 tPSKCD/OD 50 ns CL = 15 pF, CMOS signal levels
ADuM1410BRWZ/ADuM1411BRWZ/
ADuM1412BRWZ
Minimum Pulse Width2 PW 100 ns CL = 15 pF, CMOS signal levels
Maximum Data Rate3 10 Mbps CL = 15 pF, CMOS signal levels
Propagation Delay4 tPHL, tPLH 20 40 60 ns CL = 15 pF, CMOS signal levels
Pulse Width Distortion, |tPLH − tPHL|4 PWD 5 ns CL = 15 pF, CMOS signal levels
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 tPSK 30 ns CL = 15 pF, CMOS signal levels
Channel-to-Channel Matching,
Codirectional Channels6
tPSKCD 5 ns CL = 15 pF, CMOS signal levels
Channel-to-Channel Matching,
Opposing-Directional Channels6
tPSKOD 6 ns CL = 15 pF, CMOS signal levels
All Models
Output Rise/Fall Time (10% to 90%) tR/tF 2.5 ns CL = 15 pF, CMOS signal levels
Common-Mode Transient Immunity
at Logic High Output7
|CMH| 25 35 kV/µs VIx = VDD1 or VDD2, VCM = 1000 V,
transient magnitude = 800 V
Common-Mode Transient Immunity
at Logic Low Output7
|CML| 25 35 kV/µs VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate
f
r
1.1
Mbps
Input Enable Time8 tENABLE 2.0 µs VIA, VIB, VIC, VID = 0 V or VDD1
Input Disable Time8 tDISABLE 5.0 µs VIA, VIB, VIC, VID = 0 V or VDD1
Input Dynamic Supply Current
per Channel9
IDDI (D) 0.07 mA/
Mbps
Output Dynamic Supply Current
per Channel9
I
DDO (D)
0.02
mA/
Mbps
1 The supply current values for all four channels are combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate can be calculated as described in the Power Consumption section.
See Figure 8 through Figure 10 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 11 through
Figure 15 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM1410/ADuM1411/ADuM1412 channel configurations.
2 The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3 The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4 tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5 tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load
within the recommended operating conditions.
6 Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with
inputs on opposing sides of the isolation barrier.
7 |CMH| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. |CML| is the maximum common-mode voltage slew rate
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient
magnitude is the range over which the common mode is slewed.
8 Input enable time is the duration from when VDISABLE is set low until the output states are guaranteed to match the input states in the absence of any input data logic
transitions. If an input data logic transition within a given channel does occur within this time interval, the output of that channel reaches the correct state within the
much shorter duration as determined by the propagation delay specifications within this data sheet. Input disable time is the duration from when VDISABLE is set high
until the output states are guaranteed to reach their programmed output levels, as determined by the CTRL2 logic state (see Table 14).
9 Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 8 through Figure 10 for information
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current
for a given data rate.
Rev. M | Page 6 of 22
Data Sheet ADuM1410/ADuM1411/ADuM1412
ELECTRICAL CHARACTERISTICSMIXED 5 V/3 V OR 3 V/5 V OPERATION
5 V/3 V operation: 4.5 V ≤ VDD1 ≤ 5.5 V, 2.7 V ≤ VDD2 ≤ 3.6 V; 3 V/5 V operation: 2.7 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V; all
minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted; all typical specifications
are at TA = 25°C; VDD1 = 3.0 V, VDD2 = 5 V; or VDD1 = 5 V, V DD2 = 3.0 V. All voltages are relative to their respective ground.
Table 3.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent IDDI (Q)
5 V/3 V Operation 0.50 0.73 mA
3 V/5 V Operation 0.25 0.38 mA
Output Supply Current per Channel, Quiescent IDDO (Q)
5 V/3 V Operation 0.19 0.33 mA
3 V/5 V Operation 0.38 0.53 mA
ADuM1410, Total Supply Current,
Four Channels1
DC to 2 Mbps
VDD1 Supply Current IDD1 (Q)
5 V/3 V Operation
2.4 3.2 mA
DC to 1 MHz logic signal
frequency
3 V/5 V Operation
1.2 1.6 mA
DC to 1 MHz logic signal
frequency
VDD2 Supply Current IDD2 (Q)
5 V/3 V Operation
0.8 1.0 mA
DC to 1 MHz logic signal
frequency
3 V/5 V Operation
1.2 1.6 mA
DC to 1 MHz logic signal
frequency
10 Mbps (BRWZ Version Only)
VDD1 Supply Current IDD1 (10)
5 V/3 V Operation 8.6 11 mA 5 MHz logic signal frequency
3 V/5 V Operation 3.4 6.5 mA 5 MHz logic signal frequency
VDD2 Supply Current IDD2 (10)
5 V/3 V Operation 1.4 1.8 mA 5 MHz logic signal frequency
3 V/5 V Operation
2.6
3.0
mA
5 MHz logic signal frequency
ADuM1411, Total Supply Current, Four Channels1
DC to 2 Mbps
VDD1 Supply Current IDD1 (Q)
5 V/3 V Operation
2.2 2.8 mA
DC to 1 MHz logic signal
frequency
3 V/5 V Operation
1.0 1.9 mA
DC to 1 MHz logic signal
frequency
VDD2 Supply Current IDD2 (Q)
5 V/3 V Operation
0.9 1.7 mA
DC to 1 MHz logic signal
frequency
3 V/5 V Operation
1.7 2.4 mA
DC to 1 MHz logic signal
frequency
10 Mbps (BRWZ Version Only)
VDD1 Supply Current IDD1 (10)
5 V/3 V Operation 5.4 7.6 mA 5 MHz logic signal frequency
3 V/5 V Operation 3.1 4.5 mA 5 MHz logic signal frequency
V
DD2
Supply Current
I
DD2 (10)
5 V/3 V Operation 2.1 3.0 mA 5 MHz logic signal frequency
3 V/5 V Operation 3.8 5.3 mA 5 MHz logic signal frequency
Rev. M | Page 7 of 22
ADuM1410/ADuM1411/ADuM1412 Data Sheet
Rev. M | Page 8 of 22
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
ADuM1412, Total Supply Current, Four Channels1
DC to 2 Mbps
VDD1 Supply Current IDD1 (Q)
5 V/3 V Operation
2.0 2.6 mA
DC to 1 MHz logic signal
frequency
3 V/5 V Operation
1.0 1.8 mA
DC to 1 MHz logic signal
frequency
VDD2 Supply Current IDD2 (Q)
5 V/3 V Operation
1.0 1.8 mA
DC to 1 MHz logic signal
frequency
3 V/5 V Operation
2.0 2.6 mA
DC to 1 MHz logic signal
frequency
10 Mbps (BRWZ Version Only)
VDD1 Supply Current IDD1 (10)
5 V/3 V Operation 4.6 6.5 mA 5 MHz logic signal frequency
3 V/5 V Operation 2.6 3.8 mA 5 MHz logic signal frequency
VDD2 Supply Current IDD2 (10)
5 V/3 V Operation 2.6 3.8 mA 5 MHz logic signal frequency
3 V/5 V Operation 4.6 6.5 mA 5 MHz logic signal frequency
All Models
Input Currents IIA, IIB, IIC,
IID,ICTRL1, ICTRL2,
IDISABLE −10 +0.01 +10 μA
0 V ≤ VIA, VIB, VIC, VID ≤ VDD1 or VDD2,
0 V ≤ VCTRL1, VCTRL2 ≤ VDD1 or VDD2,
0 V ≤ VDISABLEVDD1
Logic High Input Threshold VIH
5 V/3 V Operation 2.0 V
3 V/5 V Operation 1.6 V
Logic Low Input Threshold VIL
5 V/3 V Operation 0.8 V
3 V/5 V Operation 0.4 V
Logic High Output Voltages
VOAH, VOBH,
VOCH, VODH
(VDD1 or
VDD2) − 0.1
(VDD1 or
VDD2) V IOx = −20 μA, VIx = VIxH
(VDD1 or
VDD2) − 0.4
(VDD1 or
VDD2) − 0.2 V IOx = −4 mA, VIx = VIxH
Logic Low Output Voltages
VOAL, VOBL,
VOCL, VODL
0.0 0.1 V IOx = 20 μA, VIx = VIxL
0.04 0.1 V IOx = 400 μA, VIx = VIxL
0.2 0.4 V IOx = 4 mA, VIx = VIxL
SWITCHING SPECIFICATIONS
ADuM1410ARWZ/ADuM1411ARWZ/
ADuM1412ARWZ
Minimum Pulse Width2 PW 1000 ns CL = 15 pF, CMOS signal levels
Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels
Propagation Delay4 t
PHL, tPLH 25 70 100 ns CL = 15 pF, CMOS signal levels
Pulse Width Distortion, |tPLH − tPHL|4 PWD 40 ns CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 t
PSK 50 ns CL = 15 pF, CMOS signal levels
Channel-to-Channel Matching6 t
PSKCD/OD 50 ns CL = 15 pF, CMOS signal levels
Data Sheet ADuM1410/ADuM1411/ADuM1412
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
ADuM1410BRWZ/ADuM1411BRWZ/
ADuM1412BRWZ
Minimum Pulse Width2 PW 100 ns CL = 15 pF, CMOS signal levels
Maximum Data Rate3 10 Mbps
CL = 15 pF, CMOS signal levels
Propagation Delay4 tPHL, tPLH 25 35 60 ns CL = 15 pF, CMOS signal levels
Pulse Width Distortion, |tPLH − tPHL|4 PWD 5 ns CL = 15 pF, CMOS signal levels
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 tPSK 30 ns CL = 15 pF, CMOS signal levels
Channel-to-Channel Matching,
Codirectional Channels6 tPSKCD 5 ns CL = 15 pF, CMOS signal levels
Channel-to-Channel Matching,
Opposing-Directional Channels6 tPSKOD 6 ns CL = 15 pF, CMOS signal levels
All Models
Output Rise/Fall Time (10% to 90%) tR/tF CL = 15 pF, CMOS signal levels
5 V/3 V Operation 2.5 ns
3 V/5 V Operation 2.5 ns
Common-Mode Transient Immunity at
Logic High Output7 |CMH| 25 35 kV/µs
VIx = VDD1 or VDD2, VCM = 1000 V,
transient magnitude = 800 V
Common-Mode Transient Immunity at
Logic Low Output7 |CML| 25 35 kV/µs
VIx = 0 V, VCM = 1000 V, transient
magnitude = 800 V
Refresh Rate fr
5 V/3 V Operation
1.2
Mbps
3 V/5 V Operation 1.1 Mbps
Input Enable Time8 tENABLE 2.0 µs VIA, VIB, VIC, VID = 0 V or VDD1
Input Disable Time8 tDISABLE 5.0 µs VIA, VIB, VIC, VID = 0 V or VDD1
Input Dynamic Supply Current
per Channel9 IDDI (D)
5 V Operation
0.12
mA/
Mbps
3 V Operation
0.07
mA/
Mbps
Output Dynamic Supply Current per
Channel9 IDDO (D)
5 V Operation
0.04
mA/
Mbps
3 V Operation
0.02
mA/
Mbps
1 The supply current values for all four channels are combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate can be calculated as described in the Power Consumption section.
See Figure 8 through Figure 10 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 11 through
Figure 15 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM1410/ADuM1411/ADuM1412 channel configurations.
2 The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3 The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4 tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5 tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load
within the recommended operating conditions.
6 Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with
inputs on opposing sides of the isolation barrier.
7 |CMH| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. |CML| is the maximum common-mode voltage slew rate
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient
magnitude is the range over which the common mode is slewed.
8 Input enable time is the duration from when VDISABLE is set low until the output states are guaranteed to match the input states in the absence of any input data logic
transitions. If an input data logic transition within a given channel does occur within this time interval, the output of that channel reaches the correct state within the
much shorter duration as determined by the propagation delay specifications within this data sheet. Input disable time is the duration from when VDISABLE is set high
until the output states are guaranteed to reach their programmed output levels, as determined by the CTRL2 logic state (see Table 14).
9 Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 8 through Figure 10 for information
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current
for a given data rate.
Rev. M | Page 9 of 22
ADuM1410/ADuM1411/ADuM1412 Data Sheet
Rev. M | Page 10 of 22
PACKAGE CHARACTERISTICS
Table 4.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
Resistance (Input to Output)1 R
I-O 1012 Ω
Capacitance (Input to Output)1 CI-O 2.2 pF f = 1 MHz
Input Capacitance2 C
I 4.0 pF
IC Junction to Case Thermal Resistance
Side 1 θJCI 33 °C/W Thermocouple located at center of package underside
Side 2 θJCO 28 °C/W
1 The device is considered a 2-terminal device; Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together.
2 Input capacitance is from any input data pin to ground.
REGULATORY INFORMATION
The ADuM1410/ADuM1411/ADuM1412 have been approved by the organizations listed in Table 5. See Table 10 and the Insulation Lifetime
section for recommended maximum working voltages for specific cross-isolation waveforms and insulation levels.
Table 5.
UL CSA CQC VDE TÜV
Recognized Under
1577 Component
Recognition
Program1
Approved under CSA
Component Acceptance
Notice 5A
Approved under
CQC11-471543-2012
Certified according to
DIN V VDE V 0884-10
(VDE V 0884-10): 2006-122
Approved according to
IEC 60950-1:2005 and
EN 60950-1:2006
Single Protection,
3750 V rms
Isolation
Voltage
Basic insulation per
CSA 60950-1-03 and
IEC 60950-1, 800 V rms
(1131 V peak) maximum
working voltage
Basic insulation per
GB4943.1-2011, 600 V rms
(848 V peak) maximum
working voltage, tropical
climate, altitude ≤ 5000 m
Reinforced insulation,
560 V peak
3000 V rms reinforced isolation
at a 400 V rms working voltage,
3000 V rms basic isolation at a
600 V rms working voltage
Reinforced insulation
per CSA 60950-1-03 and
IEC 60950-1, 400 V rms
(566 V peak) maximum
working voltage
Reinforced insulation per
GB4943.1-2011, 380 V rms
(537 V peak) maximum
working voltage, tropical
climate, altitude ≤ 5000 m
File E214100 File 205078 File CQC14001108689 File 2471900-4880-0001 Certificate B 10 03 56232 006
1 In accordance with UL 1577, each ADuM1410/ADuM1411/ADuM1412 is proof tested by applying an insulation test voltage ≥3000 V rms for 1 sec (current leakage
detection limit = 5 μA).
2 In accordance with DIN V VDE V 0884-10, each ADuM1410/ADuM1411/ADuM1412 is proof tested by applying an insulation test voltage ≥1050 V peak for 1 second
(partial discharge detection limit = 5 pC). The asterisk (*) marked on the component designates DIN V VDE V 0884-10 approval.
INSULATION AND SAFETY RELATED SPECIFICATIONS
Table 6.
Parameter Symbol Value Unit Conditions
Rated Dielectric Insulation Voltage 3750 V rms 1-minute duration
Minimum External Tracking (Creepage) L(I02) 7.71 mm min
Measured from input terminals to output terminals, shortest
distance path along package body
Minimum External Air Gap (Clearance) L(I01) 7.7 mm min Measured from input terminals to output terminals, shortest
distance through air
Minimum Clearance in the Plane of the
Printed Circuit Board (PCB Clearance)
L(PCB) 8.12 mm min
Measured from input terminals to output terminals, shortest
distance through air, line of sight, in the PCB mounting plane
Minimum Internal Gap (Internal Clearance) 0.017 mm min Insulation distance through insulation
Tracking Resistance (Comparative Tracking
Index)
CTI >400 V DIN IEC 112/VDE 0303 Part 1
Isolation Group II Material Group (DIN VDE 0110, 1/89, Table 1)
1 Clearance and creepage measured by VDE is >8 mm for SOIC wide packages.
2 This value is for information only, to aid in PCB design. Package clearance is identical to creepage as specified in L(I02).
Data Sheet ADuM1410/ADuM1411/ADuM1412
Rev. M | Page 11 of 22
DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 INSULATION CHARACTERISTICS
These isolators are suitable for reinforced electrical isolation within the safety limit data only. Maintenance of the safety data is ensured by
protective circuits. The asterisk (*) marked on packages denotes DIN V VDE V 0884-10 approval.
Table 7.
Description Conditions Symbol Characteristic Unit
Installation Classification per DIN VDE 0110
For Rated Mains Voltage ≤ 150 V rms I to IV
For Rated Mains Voltage ≤ 300 V rms I to III
For Rated Mains Voltage ≤ 400 V rms I to II
Climatic Classification 40/105/21
Pollution Degree per DIN VDE 0110, Table 1 2
Maximum Working Insulation Voltage VIORM 560 V peak
Input-to-Output Test Voltage, Method B1 VIORM × 1.875 = VPR, 100% production test, tm = 1 sec,
partial discharge < 5 pC
VPR 1050 V peak
Input-to-Output Test Voltage, Method A VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC VPR
After Environmental Tests Subgroup 1 896 V peak
After Input and/or Safety Test Subgroup 2
and Subgroup 3
VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC 672 V peak
Highest Allowable Overvoltage Transient overvoltage, tTR = 10 seconds VTR 4000 V peak
Safety Limiting Values Maximum value allowed in the event of a failure;
see Figure 4
Case Temperature TS 150 °C
Side 1 Current IS1 265 mA
Side 2 Current IS2 335 mA
Insulation Resistance at TS VIO = 500 V RS >109 Ω
CASE TE M P ERATURE (°C)
SAF E TY-LIMIT ING CURRENT (mA)
0
0
350
300
250
200
150
100
50
50 100 150 200
SIDE #1
SIDE #2
06580-007
Figure 4. Thermal Derating Curve, Dependence of Safety Limiting Values
with Case Temperature per DIN V VDE V 0884-10
RECOMMENDED OPERATING CONDITIONS
Table 8.
Parameter Symbol Min Max Unit
Operating Temperature TA −40 +105 °C
Supply Voltages1 V
DD1, VDD2 2.7 5.5 V
Input Signal Rise and Fall Times 1.0 ms
1 All voltages are relative to their respective ground. See the DC Correctness
and Magnetic Field Immunity section for information on immunity to external
magnetic fields.
ADuM1410/ADuM1411/ADuM1412 Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 9.
Parameter Rating
Storage Temperature (TST) Range −65°C to +150°C
Ambient Operating Temperature
(TA) Range
−40°C to +105°C
Supply Voltages (VDD1, VDD2)1 −0.5 V to +7.0 V
Input Voltages (VIA, VIB, VIC, VID, VCTRL1,
VCTRL2, VDISABLE)1, 2
−0.5 V to VDDI + 0.5 V
Output Voltages (V
OA
, V
OB
, V
OC
, V
OD
)1, 2
−0.5 V to V
DDO
+ 0.5 V
Average Output Current per Pin3
Side 1 (IO1) −18 mA to +18 mA
Side 2 (IO2) −22 mA to +22 mA
Common-Mode Transients4 −100 kV/μs to +100 kV/μs
1 All voltages are relative to their respective ground.
2 VDDI and VDDO refer to the supply voltages on the input and output sides of a
given channel, respectively. See the PC Board Layout section.
3 See Figure 4 for maximum rated current values for various temperatures.
4 Refers to common-mode transients across the insulation barrier. Common-
mode transients exceeding the absolute maximum ratings may cause
latch-up or permanent damage.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Table 10. Maximum Continuous Working Voltage1
Parameter Max Unit Constraint
AC Voltage, Bipolar Waveform 565 V peak 50-year minimum lifetime
AC Voltage, Unipolar Waveform
Basic Insulation 1131 V peak Maximum approved working voltage per IEC 60950-1
Reinforced Insulation 560 V peak Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
DC Voltage
Basic Insulation 1131 V peak Maximum approved working voltage per IEC 60950-1
Reinforced Insulation 560 V peak Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
1 Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details.
Rev. M | Page 12 of 22
Data Sheet ADuM1410/ADuM1411/ADuM1412
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VDD1 1
GND1*2
VIA 3
VIB 4
VDD2
16
GND2*
15
VOA
14
VOB
13
VIC 5VOC
12
VID 6VOD
11
DISABLE 7CTRL2
10
GND1*8GND2*
9
ADuM1410
TOP VIEW
(No t t o Scale)
*PIN 2 AND P IN 8 ARE INT E RNALL Y CONNECTED. CO NNE CTI NG BO TH
TO GND1 I S RE COMM E NDE D. PIN 9 AND PIN 15 ARE INT E RNALL Y
CONNECTED. CO NNE CTI NG BO TH T O G ND2 IS RECOMMENDED.
06580-004
Figure 5. ADuM1410 Pin Configuration
Table 11. ADuM1410 Pin Function Descriptions
Pin No. Mnemonic Description
1 VDD1 Supply Voltage for Isolator Side 1 (2.7 V to 5.5 V).
2 GND1 Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
3 VIA Logic Input A.
4 VIB Logic Input B.
5 VIC Logic Input C.
6 VID Logic Input D.
7
DISABLE
Input Disable. Disables the isolator inputs and halts the dc refresh circuits. Outputs take on the logic state
determined by CTRL2.
8 GND1 Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
9 GND2 Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
10
CTRL
2
Default Output Control. Controls the logic state the outputs assume when the input power is off. VOA, VOB, VOC, and
VOD outputs are high when CTRL2 is high or disconnected and VDD1 is off. VOA, VOB, VOC, and VOD outputs are low when
CTRL2 is low and VDD1 is off. When VDD1 power is on, this pin has no effect.
11 VOD Logic Output D.
12 VOC Logic Output C.
13 VOB Logic Output B.
14 VOA Logic Output A.
15 GND2 Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
16 VDD2 Supply Voltage for Isolator Side 2 (2.7 V to 5.5 V).
Rev. M | Page 13 of 22
ADuM1410/ADuM1411/ADuM1412 Data Sheet
V
DD1 1
GND
1
*
2
V
IA 3
V
IB 4
V
DD2
16
GND
2
*
15
V
OA
14
V
OB
13
V
IC 5
V
OC
12
V
OD 6
V
ID
11
CTRL
17
CTRL
2
10
GND
1
*
8
GND
2
*
9
ADuM1411
TOP VIEW
(No t t o Scale)
*PIN 2 AND P IN 8 ARE INT E RNALL Y CONNECTED. CO NNE CTI NG BO TH
TO GND
1
IS RE COMM E NDE D. PIN 9 AND PIN 15 ARE INT E RNALL Y
CONNECTED. CO NNE CTI NG BO TH T O G ND
2
IS RECOMMENDED.
06580-005
Figure 6. ADuM1411 Pin Configuration
Table 12. ADuM1411 Pin Function Descriptions
Pin No. Mnemonic Description
1 VDD1 Supply Voltage for Isolator Side 1 (2.7 V to 5.5 V).
2 GND1 Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
3 VIA Logic Input A.
4
V
IB
Logic Input B.
5 VIC Logic Input C.
6 VOD Logic Output D.
7 CTRL1 Default Output Control. Controls the logic state the outputs assume when the input power is off. VOD output is high
when CTRL1 is high or disconnected and VDD2 is off. VOD output is low when CTRL1 is low and VDD2 is off. When VDD2
power is on, this pin has no effect.
8
GND
1
Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
9 GND2 Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
10 CTRL2 Default Output Control. Controls the logic state the outputs assume when the input power is off. VOA, VOB, and VOC
outputs are high when CTRL2 is high or disconnected and VDD1 is off. VOA, VOB, and VOC outputs are low when CTRL2 is
low and VDD1 is off. When VDD1 power is on, this pin has no effect.
11 VID Logic Input D.
12 VOC Logic Output C.
13 VOB Logic Output B.
14 VOA Logic Output A.
15 GND2 Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
16 VDD2 Supply Voltage for Isolator Side 2 (2.7 V to 5.5 V).
Rev. M | Page 14 of 22
Data Sheet ADuM1410/ADuM1411/ADuM1412
VDD1 1
GND1*2
VIA 3
VIB 4
VDD2
16
GND2*
15
VOA
14
VOB
13
VOC 5VIC
12
VOD 6VID
11
CTRL17CTRL2
10
GND1*8GND2*
9
ADuM1412
TOP VIEW
(No t t o Scal e)
*PIN 2 AND P IN 8 ARE INT E RNALL Y CONNECTED. CO NNE CTI NG BO TH
TO GND1 I S RE COMM E NDE D. PIN 9 AND PIN 15 ARE INT E RNALL Y
CONNECTED. CO NNE CTI NG BO TH T O G ND2 IS RECOMMENDED.
06580-006
Figure 7. ADuM1412 Pin Configuration
Table 13. ADuM1412 Pin Function Descriptions
Pin No. Mnemonic Description
1 VDD1 Supply Voltage for Isolator Side 1 (2.7 V to 5.5 V).
2 GND1 Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
3 VIA Logic Input A.
4 VIB Logic Input B.
5 VOC Logic Output C.
6 VOD Logic Output D.
7 CTRL1 Default Output Control. Controls the logic state the outputs assume when the input power is off. VOC and VOD
outputs are high when CTRL1 is high or disconnected and VDD2 is off. VOC and VOD outputs are low when CTRL1 is low
and VDD2 is off. When VDD2 power is on, this pin has no effect.
8
GND
1
Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND
1
is
recommended.
9 GND2 Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
10 CTRL2 Default Output Control. Controls the logic state the outputs assume when the input power is off. VOA and VOB
outputs are high when CTRL2 is high or disconnected and VDD1 is off. VOA and VOB outputs are low when CTRL2 is low
and VDD1 is off. When VDD1 power is on, this pin has no effect.
11 VID Logic Input D.
12 VIC Logic Input C.
13 VOB Logic Output B.
14 VOA Logic Output A.
15 GND2 Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
16 VDD2 Supply Voltage for Isolator Side 2 (2.7 V to 5.5 V).
Rev. M | Page 15 of 22
ADuM1410/ADuM1411/ADuM1412 Data Sheet
Table 14. Truth Table (Positive Logic)
VIx
Input1
CTRLX
Input2
VDISABLE
State3
VDDI
State4
VDDO
State5
VOx
Output1 Description
H X L or
NC
Powered Powered H Normal operation, data is high.
L
X
L or
NC
Powered
Powered
L
Normal operation, data is low.
X H or
NC
H X Powered H Inputs disabled. Outputs are in the default state as determined
by CTRLX.
X L H X Powered L Inputs disabled. Outputs are in the default state as determined by
CTRLX.
X H or
NC
X Unpowered Powered H Input unpowered. Outputs are in the default state as determined
by CTRLX.
Outputs return to input state within 1 µs of VDDI power restoration.
See the pin function descriptions (Table 11, Table 12, and Table 13) for
more details.
X
L
X
Unpowered
Powered
L
Input unpowered. Outputs are in the default state as determined
by CTRLX.
Outputs return to input state within 1 µs of VDDI power restoration.
See the pin function descriptions (Table 11, Table 12, and Table 13) for
more details.
X X X Powered Unpowered Z Output unpowered. Output pins are in high impedance state.
Outputs return to input state within 1 µs of VDDO power restoration.
See the pin function descriptions (Table 11, Table 12, and Table 13) for
more details.
1 VIx and VOx refer to the input and output signals of a given channel (A, B, C, or D).
2 CTRLX refers to the default output control signal on the input side of a given channel (A, B, C, or D).
3 Available only on the ADuM1410.
4 VDDI refers to the power supply on the input side of a given channel (A, B, C, or D).
5 VDDO refers to the power supply on the output side of a given channel (A, B, C, or D).
Rev. M | Page 16 of 22
Data Sheet ADuM1410/ADuM1411/ADuM1412
TYPICAL PERFORMANCE CHARACTERISTICS
DATA RATE ( M bp s)
CURRENT/CHANNEL (mA)
0
0
1.0
0.5
1.5
2.0
2 6 84 10
5V
3V
06580-008
Figure 8. Typical Supply Current per Input Channel vs. Data Rate
for 5 V and 3 V Operation
DATA RATE ( M bp s)
CURRENT/CHANNEL (mA)
0
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
2 6 84 10
5V
3V
06580-009
Figure 9. Typical Supply Current per Output Channel vs. Data Rate
for 5 V and 3 V Operation (No Output Load)
DATA RATE ( M bp s)
CURRENT/CHANNEL (mA)
0
0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
2 6 84 10
5V
3V
06580-010
Figure 10. Typical Supply Current per Output Channel vs. Data Rate
for 5 V and 3 V Operation (15 pF Output Load)
DATA RATE ( M bp s)
CURRENT (mA)
0
0
10
8
6
4
2
26 84 10
5V
3V
06580-011
Figure 11. Typical ADuM1410 VDD1 Supply Current vs. Data Rate
for 5 V and 3 V Operation
DATA RATE ( M bp s)
CURRENT (mA)
0
0
10
8
6
4
2
2 6 8
410
5V
3V
06580-012
Figure 12. Typical ADuM1410 VDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
DATA RATE ( M bp s)
CURRENT ( mA)
0
0
10
8
6
4
2
2 6 84 10
5V
3V
06580-013
Figure 13. Typical ADuM1411 VDD1 Supply Current vs. Data Rate
for 5 V and 3 V Operation
Rev. M | Page 17 of 22
ADuM1410/ADuM1411/ADuM1412 Data Sheet
DATA RATE ( M bp s)
CURRENT ( mA)
0
0
10
8
6
4
2
2 6 8
410
5V
3V
06580-014
Figure 14. Typical ADuM1411 VDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
DATA RATE ( M bp s)
CURRENT ( mA)
0
0
10
8
6
4
2
2 6 8
410
5V
3V
06580-015
Figure 15. Typical ADuM1412 VDD1 or VDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
Rev. M | Page 18 of 22
Data Sheet ADuM1410/ADuM1411/ADuM1412
APPLICATIONS INFORMATION
PC BOARD LAYOUT
The ADuM1410/ADuM1411/ADuM1412 digital isolators
require no external interface circuitry for the logic interfaces.
Power supply bypassing is strongly recommended at the input
and output supply pins (see Figure 16). Bypass capacitors are
most conveniently connected between Pin 1 and Pin 2 for VDD1,
and between Pin 15 and Pin 16 for VDD2. The capacitor value
should be between 0.01 µF and 0.1 µF. The total lead length
between both ends of the capacitor and the input power supply
pin should not exceed 20 mm. Bypassing between Pin 1 and Pin 8
and between Pin 9 and Pin 16 should also be considered unless
both ground pins on each package are connected together close to
the package.
V
DD1
GND
1
V
IA
V
IB
V
IC
V
ID
DISABLE
GND
1
V
DD2
GND
2
V
OA
V
OB
V
OC
V
OD
CTRL
2
GND
2
06580-016
ADuM1410
Figure 16. Recommended Printed Circuit Board Layout
In applications involving high common-mode transients, it is
important to minimize board coupling across the isolation barrier.
Furthermore, users should design the board layout so that any
coupling that does occur equally affects all pins on a given
component side. Failure to ensure this can cause voltage
differentials between pins exceeding the absolute maximum
ratings of the device, thereby leading to latch-up or permanent
damage. See the AN-1109 Application Note for board layout
guidelines.
PROPAGATION DELAY-RELATED PARAMETERS
Propagation delay is a parameter that describes the time it takes
a logic signal to propagate through a component. The input-to-
output propagation delay time for a high-to-low transition may
differ from the propagation delay time of a low-to-high transition.
INPUT (V
Ix
)
OUTPUT (V
Ox
)
tPLH tPHL
50%
50%
06580-017
Figure 17. Propagation Delay Parameters
Pulse width distortion is the maximum difference between these
two propagation delay values and an indication of how accurately
the timing of the input signal is preserved.
Channel-to-channel matching refers to the maximum amount
the propagation delay differs between channels within a single
ADuM1410/ADuM1411/ADuM1412 component.
Propagation delay skew refers to the maximum amount the
propagation delay differs between multiple ADuM1410/
ADuM1411/ADuM1412 components operating under the same
conditions.
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
Positive and negative logic transitions at the isolator input
cause narrow (~1 ns) pulses to be sent to the decoder using the
transformer. The decoder is bistable and is, therefore, either set
or reset by the pulses, indicating input logic transitions. In the
absence of logic transitions at the input for more than ~1 µs, a
periodic set of refresh pulses indicative of the correct input state
is sent to ensure dc correctness at the output. If the decoder
receives no internal pulses of more than approximately 5 µs, the
input side is assumed to be unpowered or nonfunctional, in
which case the isolator output is forced to a default state (see
Table 14) by the watchdog timer circuit.
The magnetic field immunity of the ADuM1410/ADuM1411/
ADuM1412 is determined by the changing magnetic field, which
induces a voltage in the transformer’s receiving coil large enough
to either falsely set or reset the decoder. The following analysis
defines the conditions under which this can occur. The 3 V
operating condition of the ADuM1410/ADuM1411/ADuM1412
is examined because it represents the most susceptible mode of
operation.
The pulses at the transformer output have an amplitude greater
than 1.0 V. The decoder has a sensing threshold at about 0.5 V, thus
establishing a 0.5 V margin in which induced voltages can be
tolerated. The voltage induced across the receiving coil is given by
V = (−dβ/dt) ∑ π rn2; n = 1, 2, … , N
where:
β is magnetic flux density (gauss).
rn is the radius of the nth turn in the receiving coil (cm).
N is the number of turns in the receiving coil.
Given the geometry of the receiving coil in the ADuM1410/
ADuM1411/ADuM1412 and an imposed requirement that the
induced voltage be, at most, 50% of the 0.5 V margin at the
decoder, a maximum allowable magnetic field at a given frequency
can be calculated. The result is shown in Figure 18.
MAG NETI C FI E LD F RE QUENCY ( Hz )
100
MAXIMUM ALLOWABLE MAGNETIC FLUX
DENSI TY ( kgau ss)
0.001 1M
10
0.01
1k 10k 10M
0.1
1
100M100k
06580-018
Figure 18. Maximum Allowable External Magnetic Flux Density
Rev. M | Page 19 of 22
ADuM1410/ADuM1411/ADuM1412 Data Sheet
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event occurred during a transmitted pulse
(and had the worst-case polarity), it would reduce the received
pulse from >1.0 V to 0.75 V, still well above the 0.5 V sensing
threshold of the decoder.
The preceding magnetic flux density values correspond to
specific current magnitudes at given distances from the
ADuM1410/ADuM1411/ADuM1412 transformers. Figure 19
shows these allowable current magnitudes as a function of
frequency for selected distances. As shown, the ADuM1410/
ADuM1411/ADuM1412 is extremely immune and can be affected
only by extremely large currents operated at high frequency very
close to the component. For the 1 MHz example noted previously, a
0.5 kA current would have to be placed 5 mm away from the
ADuM1410/ADuM1411/ADuM1412 to affect the operation of
the component.
MAG NETI C FI E LD F RE QUENCY ( Hz )
MAXI MUM ALL O WABLE CURRENT (kA)
1000
100
10
1
0.1
0.011k 10k 100M100k 1M 10M
DISTANCE = 5mm
DISTANCE = 1m
DISTANCE = 100mm
06580-019
Figure 19. Maximum Allowable Current for Various
Current-to-ADuM1410/ADuM1411/ADuM1412 Spacings
Note that at combinations of strong magnetic field and high
frequency, any loops formed by printed circuit board traces can
induce error voltages sufficiently large enough to trigger the
thresholds of succeeding circuitry. Care should be taken in the
layout of such traces to avoid this possibility.
POWER CONSUMPTION
The supply current at a given channel of the ADuM1410/
ADuM1411/ADuM1412 isolators is a function of the supply
voltage, the data rate of the channel, and the output load of the
channel.
For each input channel, the supply current is given by
IDDI = IDDI (Q) f ≤ 0.5 fr
IDDI = IDDI (D) × (2f fr) + IDDI (Q) f > 0.5 fr
For each output channel, the supply current is given by
IDDO = IDDO (Q) f ≤ 0.5 fr
IDDO = (IDDO (D) + (0.5 × 10−3) × CL × VDDO) × (2f − fr) + IDDO (Q)
f > 0.5 fr
where:
IDDI (D), IDDO (D) are the input and output dynamic supply currents
per channel (mA/Mbps).
CL is the output load capacitance (pF).
VDDO is the output supply voltage (V).
f is the input logic signal frequency (MHz); it is half the input
data rate, expressed in units of Mbps.
fr is the input stage refresh rate (Mbps).
IDDI (Q), IDDO (Q) are the specified input and output quiescent
supply currents (mA).
To calculate the total VDD1 and VDD2 supply current, the supply
currents for each input and output channel corresponding to
VDD1 and VDD2 are calculated and totaled. Figure 8 and Figure 9
show per-channel supply currents as a function of data rate for
an unloaded output condition. Figure 10 shows the per-channel
supply current as a function of data rate for a 15 pF output
condition. Figure 11 through Figure 15 show the total VDD1 and
VDD2 supply current as a function of data rate for ADuM1410/
ADuM1411/ADuM1412 channel configurations.
INSULATION LIFETIME
All insulation structures eventually break down when subjected
to voltage stress over a sufficiently long period. The rate of
insulation degradation is dependent on the characteristics of the
voltage waveform applied across the insulation. In addition to
the testing performed by the regulatory agencies, Analog
Devices carries out an extensive set of evaluations to determine
the lifetime of the insulation structure within the ADuM1410/
ADuM1411/ADuM1412.
Rev. M | Page 20 of 22
Data Sheet ADuM1410/ADuM1411/ADuM1412
Analog Devices performs accelerated life testing using voltage
levels higher than the rated continuous working voltage.
Acceleration factors for several operating conditions are
determined. These factors allow calculation of the time to
failure at the actual working voltage. The values shown in
Table 10 summarize the peak voltage for 50 years of service life
for a bipolar ac operating condition and the maximum
CSA/VDE approved working voltages. In many cases, the
approved working voltage is higher than 50-year service life
voltage. Operation at these high working voltages can lead to
shortened insulation life in some cases.
The insulation lifetime of the ADuM1410/ADuM1411/
ADuM1412 depends on the voltage waveform type imposed
across the isolation barrier. The iCoupler insulation structure
degrades at different rates depending on whether the waveform
is bipolar ac, unipolar ac, or dc. Figure 20, Figure 21, and Figure 22
illustrate these different isolation voltage waveforms.
Bipolar ac voltage is the most stringent environment. The goal
of a 50-year operating lifetime under the ac bipolar condition
determines the Analog Devices recommended maximum
working voltage.
In the case of unipolar ac or dc voltage, the stress on the insulation
is significantly lower. This allows operation at higher working
voltages while still achieving a 50-year service life. The working
voltages listed in Table 10 can be applied while maintaining the
50-year minimum lifetime provided the voltage conforms to
either the unipolar ac or dc voltage case. Any cross-insulation
voltage waveform that does not conform to Figure 21 or Figure 22
should be treated as a bipolar ac waveform, and its peak voltage
should be limited to the 50-year lifetime voltage value listed in
Table 10.
Note that the voltage presented in Figure 21 is shown as sinusoidal
for illustration purposes only. It is meant to represent any voltage
waveform varying between 0 V and some limiting value. The
limiting value can be positive or negative, but the voltage cannot
cross 0 V.
0V
RATED P E AK V OL TAG E
06580-020
Figure 20. Bipolar AC Waveform
0V
RATED P E AK V OL TAG E
06580-021
Figure 21. Unipolar AC Waveform
0V
RATED P E AK V OL TAG E
06580-022
Figure 22. DC Waveform
Rev. M | Page 21 of 22
ADuM1410/ADuM1411/ADuM1412 Data Sheet
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013-AA
10.50 (0.4134)
10.10 (0.3976)
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0.75(0.0295)
0.25(0.0098)
45°
1.27 (0.0500)
0.40 (0.0157)
COPLANARITY
0.100.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
0°
169
8
1
1.27 (0.0500)
BSC
03-27-2007-B
Figure 23. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body (RW-16)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model1
Number
of Inputs,
VDD1 Side
Number
of Inputs,
VDD2 Side
Maximum
Data Rate
Maximum
Propagation
Delay, 5 V
Maximum
Pulse Width
Distortion
Temperature
Range Package Description
Package
Option
ADuM1410ARWZ
4
0
1 Mbps
100 ns
40 ns
−40°C to +105°C
16-Lead SOIC_W
RW-16
ADuM1410ARWZ-RL 4 0 1 Mbps 100 ns 40 ns −40°C to +105°C
16-Lead SOIC_W, 13” Tape and Reel RW-16
ADuM1410BRWZ 4 0 10 Mbps 50 ns 5 ns −40°C to +105°C
16-Lead SOIC_W RW-16
ADuM1410BRWZ-RL 4 0 10 Mbps 50 ns 5 ns −40°C to +105°C
16-Lead SOIC_W, 13” Tape and Reel RW-16
ADuM1411ARWZ 3 1 1 Mbps 100 ns 40 ns −40°C to +105°C
16-Lead SOIC_W RW-16
ADuM1411ARWZ-RL 3 1 1 Mbps 100 ns 40 ns −40°C to +105°C
16-Lead SOIC_W, 13” Tape and Reel RW-16
ADuM1411BRWZ 3 1 10 Mbps 50 ns 5 ns −40°C to +105°C
16-Lead SOIC_W RW-16
ADuM1411BRWZ-RL 3 1 10 Mbps 50 ns 5 ns −40°C to +105°C
16-Lead SOIC_W, 13” Tape and Reel RW-16
ADuM1412ARWZ 2 2 1 Mbps 100 ns 40 ns −40°C to +105°C
16-Lead SOIC_W RW-16
ADuM1412ARWZ-RL 2 2 1 Mbps 100 ns 40 ns −40°C to +105°C
16-Lead SOIC_W, 13” Tape and Reel RW-16
ADuM1412BRWZ 2 2 10 Mbps 50 ns 5 ns −40°C to +105°C
16-Lead SOIC_W RW-16
ADuM1412BRWZ-RL 2 2 10 Mbps 50 ns 5 ns −40°C to +105°C
16-Lead SOIC_W, 13” Tape and Reel RW-16
1 Z = RoHS Compliant Part.
©20052015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06580-0-8/15(M)
Rev. M | Page 22 of 22