2007-04-20
1
BC846...-BC850...
NPN Silicon AF Transistors
• For AF input stages and driver applications
• High current gain
• Low collector-emitter saturation voltage
• Low noise between 30 Hz and 15 kHz
• Complementary types:
BC856...-BC860...(PNP)
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
1Pb-containing package may be available upon special request
2007-04-20
2
BC846...-BC850...
Type Marking Pin Configuration Package
BC846A
BC846B
BC846BW
BC847A
BC847B
BC847BF
BC847BL3
BC847BT
BC847BW
BC847C
BC847CW
BC848A
BC848AW
BC848B
BC848BF
BC848BL3
BC848BW
BC848C
BC848CW
BC849B
BC849BF
BC849C
BC849CW
BC850B
BF850BF
BC850BW
BC850C
BC850CW
1As
1Bs
1Bs
1Es
1Fs
1Fs
1F
1F
1Fs
1Gs
1Gs
1Js
1Js
1Ks
1Ks
1K
1Ks
1Ls
1Ls
2Bs
2Bs
2Cs
2Cs
2Fs
2Fs
2Fs
2Gs
2Gs
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SOT23
SOT23
SOT323
SOT23
SOT23
TSFP-3
TSLP-3-1
SC75
SOT323
SOT23
SOT323
SOT23
SOT323
SOT23
TSFP-3
TSLP-3-1
SOT323
SOT23
SOT323
SOT23
TSFP-3
SOT23
SOT323
SOT23
TSFP-3
SOT323
SOT23
SOT323
2007-04-20
3
BC846...-BC850...
Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage
BC846...
BC847..., BC850...
BC848..., BC849...
VCEO
65
45
30
V
Collector-emitter voltage
BC846...
BC847..., BC850...
BC848..., BC849...
VCES
80
50
30
Collector-base voltage
BC846...
BC847..., BC850...
BC848..., BC849...
VCBO
80
50
30
Emitter-base voltage
BC846...
BC847..., BC850...
BC848..., BC849...
VEBO
6
6
6
Collector current IC100 mA
Peak collector current ICM 200
Total power dissipation-
TS ≤ 71 °C, BC846-BC850
TS ≤ 128 °C, BC847F-BC850F
TS ≤ 135 °C, BC847L3-BC848L3
TS ≤ 109 °C, BC847T
TS ≤ 124 °C, BC846W-BC850W
Ptot
330
250
250
250
250
mW
Junction temperature Tj150 °C
Storage temperature Tstg -65 ... 150
2007-04-20
4
BC846...-BC850...
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1)
BC846-BC850
BC847F-BC850F
BC847L3-BC848L3
BC847T
BC846W-BC850W
RthJS
≤ 240
≤ 90
≤ 60
≤ 165
≤ 105
K/W
1For calculation of RthJA please refer to Application Note Thermal Resistance
2007-04-20
5
BC846...-BC850...
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 10 mA, IB = 0 , BC846...
IC = 10 mA, IB = 0 , BC847..., BC850...
IC = 10 mA, IB = 0 , BC848..., BC849...
V(BR)CEO
65
45
30
-
-
-
-
-
-
V
Collector-base breakdown voltage
IC = 10 µA, IE = 0 , BC846...
IC = 10 µA, IE = 0 , BC847..., BC850...
IC = 10 µA, IE = 0 , BC848..., BC849...
V(BR)CBO
80
50
30
-
-
-
-
-
-
Emitter-base breakdown voltage
IE = 0 , IC = 10 µA V(BR)EBO - 6 -
Collector-base cutoff current
VCB = 45 V, IE = 0
VCB = 30 V, IE = 0 , TA = 150 °C
ICBO
-
-
0.015
5
-
-
µA
DC current gain1)
IC = 10 µA, VCE = 5 V, hFE-grp.A
IC = 10 µA, VCE = 5 V, hFE-grp.B
IC = 10 µA, VCE = 5 V, hFE-grp.C
IC = 2 mA, VCE = 5 V, hFE-grp.A
IC = 2 mA, VCE = 5 V, hFE-grp.B
IC = 2 mA, VCE = 5 V, hFE-grp.C
hFE
-
-
-
110
200
420
140
250
480
180
290
520
-
-
-
220
450
800
-
Collector-emitter saturation voltage1)
IC = 10 mA, IB = 0.5 mA
IC = 100 mA, IB = 5 mA
VCEsat
-
-
90
200
250
600
mV
Base emitter saturation voltage1)
IC = 10 mA, IB = 0.5 mA
IC = 100 mA, IB = 5 mA
VBEsat
-
-
700
900
-
-
Base-emitter voltage1)
IC = 2 mA, VCE = 5 V
IC = 10 mA, VCE = 5 V
VBE(ON)
580
-
660
-
700
770
1Pulse test: t < 300µs; D < 2%
2007-04-20
6
BC846...-BC850...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
AC Characteristics
Transition frequency
IC = 10 mA, VCE = 5 V, f = 100 MHz fT- 250 - MHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz Ccb - 0.95 - pF
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz Ceb - 9 -
Short-circuit input impedance
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
h11e
-
-
-
2.7
4.5
8.7
-
-
-
kΩ
Open-circuit reverse voltage transf. ratio
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
h12e
-
-
-
1.5
2
3
-
-
-
10-4
Short-circuit forward current transf. ratio
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
h21e
-
-
-
200
330
600
-
-
-
Open-circuit output admittance
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
h22e
-
-
-
18
30
60
-
-
-
µS
Noise figure
IC = 200 µA, VCE = 5 V, f = 1 kHz,
∆ f = 200 Hz, RS = 2 kΩ, BC849..., BC850...
F- 1.2 4 dB
Equivalent noise voltage
IC = 200 µA, VCE = 5 V, RS = 2 kΩ,
f = 10 ... 50 Hz , BC850...
Vn- - 0.135 µV
2007-04-20
7
BC846...-BC850...
DC current gain hFE = ƒ(IC)
VCE = 5 V
10 10 10 10
EHP00365
h
mA
-2 -1 12
FE
3
10
10
2
0
10
5
5
10
1
0
10
5
555
100
25
-50
Ι
C
C
C
C
Collector-emitter saturation voltage
IC = ƒ(VCEsat), hFE = 20
10 0
EHP00367
VCEsat
10
mA
10
Ι
C
10
2
1
0
-1
5
5
V
0.3 0.5
100
25
-50
0.1 0.2 0.4
C
C
C
Base-emitter saturation voltage
IC = ƒ(VBEsat), hFE = 20
0
10
EHP00364
BEsat
V
0.6 V 1.2
-1
10
0
10
1
2
10
5
5
Ι
C
mA
0.2 0.4 0.8
C
25
C
100
C
-50
C
Collector cutoff current ICBO = ƒ(TA)
VCB = 30 V
10 0 50 100 150
EHP00415
T
A
10
nA
10
Ι
CB0
10
10
4
3
2
1
0
max
typ
5
5
5
˚C
2007-04-20
8
BC846...-BC850...
Transition frequency fT = ƒ(IC)
VCE = 5 V
10 10 10 10
EHP00363
f
mA
MHz
-1 0 1 2
5
T
3
10
102
1
10
5
5
5
Ι
C
Collector-base capacitance Ccb = ƒ(VCB)
Emitter-base capacitance Ceb = ƒ(VEB)
0 4 8 12 16 V22
VCB/VEB
0
1
2
3
4
5
6
7
8
9
10
11
pF
13
CCB/CEB
CCB
CEB
Total power dissipation Ptot = ƒ(TS)
BC846-BC850
0 15 30 45 60 75 90 105 120 °C 150
TS
0
30
60
90
120
150
180
210
240
270
300
mW
360
Ptot
Total power dissipation Ptot = ƒ(TS)
BC847BF-BC850BF
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
2007-04-20
9
BC846...-BC850...
Total power dissipation Ptot = ƒ(TS)
BC847BL3/BC848BL3
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Total power dissipation Ptot = ƒ(TS)
BC847BT
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Total power dissipation Ptot = ƒ(TS)
BC846W-BC850W
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BC846/W-BC850/W
10
EHP00362
-6
0
10
5
D
=
5
101
102
3
10
10-5 10-4 10-3 10-2 100
s
0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
t
p
=
DT
t
p
T
totmax
tot
PDC
P
p
t
2007-04-20
10
BC846...-BC850...
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BC847BF-BC850BF
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stp
0
10
1
10
2
10
3
10
Ptotmax/PtotDC
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Permissible Puls Load RthJS = ƒ (tp)
BC847BF-BC850BF
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stp
-1
10
0
10
1
10
2
10
K/W
RthJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
Permissible Puls Load RthJS = ƒ (tp)
BC847BL3, BC848BL3
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BC847BL3, BC848BL3
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
Ptotmax/ PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2007-04-20
11
BC846...-BC850...
Permissible Puls Load RthJS = ƒ (tp)
BC847BT
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stp
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BC847BT
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
stp
0
10
1
10
2
10
3
10
Ptotmax / PtotDC
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Noise figure F = ƒ(VCE)
IC = 0.2mA, RS = 2kΩ , f = 1kHz
0
10 10 10 10
BC 846...850 EHP00370
V
CE
F
V
10
5
15
dB
20
-1 0 1 2
5
Noise figure F = ƒ(f)
IC = 0.2 mA, VCE = 5V, RS = 2 kΩ
10 10 10 10
BC 846...850 EHP00371
F
kHz
dB
-2 -1 1 2
20
10
0
5
15
f
0
10
2007-04-20
12
BC846...-BC850...
Noise figure F = ƒ(IC)
VCE = 5V, f = 120Hz
10 10 10 10
BC 846...850 EHP00372
F
mA
-3 -2 0 1
20
10
0
5
15
-1
10
= 1 M 100 k 10 k
dB
500
1 k
ΩΩΩ
S
R
Ω
Ω
C
Ι
Noise figure F = ƒ(IC)
VCE = 5V, f = 1kHz
10 10 10 10
BC 846...850 EHP00373
F
mA
-3 -2 0 1
20
10
0
5
15
-1
10
= 1 M
100 k
10 k
dB
500
1 k
ΩΩΩ
S
R
Ω
Ω
C
Ι
Noise figure F = ƒ(IC)
VCE = 5V, f = 10kHz
10 10 10 10
BC 846...850 EHP00374
F
mA
-3 -2 0 1
20
10
0
5
15
-1
10
= 1 M
100 k
10 k
dB
500
1 k
Ω
Ω
Ω
S
R
Ω
Ω
C
Ι
2007-04-20
13
BC846...-BC850...
Package SC75
Package Outline
Foot Print
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.6
±0.2
0.5
0.10 M0.5
A
0.2
0.2
+0.1
-0.05 1 2
-0.05
3
+0.1
1.6±0.2
0.2 MA
0.7
0.15
10˚
MAX.
0.1 MAX.
±0.05
±0.1
±0.1
0.8
MAX.
10˚
1.15
0.65
0.4
0.4
0.65
0.50.5
BCR108T
Type code
Pin 1
4
8
1.8
0.2 MAX.
0.9
1.4
1.75
0.45
Pin 1
2005, December
Date code
Marking Layout (Example)
2007-04-20
14
BC846...-BC850...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04dsDSdsDSdsDS
05et ETet ETet ET
06fuFUfuFUfuFU
07gvGVgvGVgvGV
08hxHXhxHXhxHX
09jyJYjyJYjyJY
10kzKZkzKZkzKZ
11l 2L4l 2L4l 2L4
12n3N5n3N5n3N5
2007-04-20
15
BC846...-BC850...
Package SOT23
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
EH
s
BCW66
Type code
Pin 1
0.8
0.9 0.91.3
0.8 1.2
0.25 MBC
1.9
-0.05
+0.1
0.4
±0.1
2.9
0.95
C
B
0...8˚
0.2 A
0.1 MAX.
10˚ MAX.
0.08...0.15
1.3
±0.1
10˚ MAX.
M
2.4
±0.15
±0.1
1
A
0.15 MIN.
1)
1) Lead width can be 0.6 max. in dambar area
12
3
3.15
4
2.65
2.13
0.9
8
0.2
1.15
Pin 1
Manufacturer
2005, June
Date code (YM)
2007-04-20
16
BC846...-BC850...
Package SOT323
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.25
±0.1
0.1 MAX.
2.1
±0.1
0.15
+0.1
-0.05
0.3
+0.1
±0.1
0.9
12
3A
±0.2
2
-0.05
0.650.65
M
3x 0.1
0.1 MIN.
0.1
M
0.2 A
0.2
4
2.15 1.1
8
2.3
Pin 1
Pin 1
2005, June
Date code (YM)
BCR108W
Type code
0.6
0.8
1.6
0.65 0.65
Manufacturer
2007-04-20
17
BC846...-BC850...
Package TSFP-3
4
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
±0.05
0.2
3
±0.05
1.2
12
10˚ MAX.
±0.05
0.8
1.2±0.05
±0.04
0.55
±0.05
0.2
±0.05
0.15
±0.05
0.2
0.4
±0.05
0.4
±0.05
0.4
0.45
1.05
0.4 0.4
BCR847BF
Type code
Pin 1
0.2
1.35
0.3
0.7
1.2
1.5
8
Pin 1
Manufacturer
2007-04-20
18
BC846...-BC850...
Package TSLP-3-1
2
3
1
0.4
+0.1
BFR193L3
Type code
Pin 1 marking
Laser marking
0.76
4
1.16
0.5
Pin 1
marking
8
Reel ø180 mm = 15.000 Pieces/Reel
For board assembly information please refer to Infineon website "Packages"
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Stencil aperturesCopper Solder mask
0.275
0.2
0.315
0.945
0.45
0.17
0.355
0.2
0.35
0.225
1
0.6
0.225
0.15
0.35 0.3
R0.1
1
2
±0.05
0.35
±0.035
2x0.15
1)
Top view Bottom view
1) Dimension applies to plated terminal
±0.035
0.5
1) ±0.05
0.6
3
±0.05
0.65
±0.035
2x
0.25
1)
±0.035
0.25
1)
1
±0.05
Pin 1
marking
0.05 MAX.
2007-04-20
19
BC846...-BC850...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
