1997 Nov 04 152
Philips Components
Miniature ceramic plate capacitors General data
CURRENT AND MAINTENANCE TYPES
Current ceramic plate capacitors have leads provided with
a flange. They are available in a wide variety of executions.
The flange ensures excellent solderability and component
height definition on the printed-circuit boards. These
capacitors are suitable for both hand mounting and
automatic insertion.
Ceramic plate capacitors without flanged leads are not
for design-in. They are for maintenance purposes only.
They are not available on tape.
The electrical properties of capacitors with flanged leads
are the same as the electrical properties of capacitors with
straight leads.
TC DEFINITION AND RELEVANT CODES
The variation of capacitance with temperature is
determined by:
1. Temperature coefficient of capacitance.
2. Temperature characteristic of capacitance.
The temperature coefficient of capacitance is applicable to
class 1 capacitors. They show a predictable and almost
linear change of capacitance with temperature.
This makes them suitable for temperature compensation
in resonant and tuning circuits (N150 to N1500), and in all
critical applications which require a very small capacitance
change with temperature (NP0).
The dielectric number indicates the nominal value of the
temperature coefficient of capacitance with the letters ‘P’
or ‘N’ indicating a positive or negative capacitance change
with the temperature. For example, P100 indicates a
positive temperature coefficient of 100 ×10−6/°C and
N750 indicates a negative temperature coefficient of
750 ×10−6/°C. In accordance with
“RS198”
, the P100 is
identified with the code M7G and the N750 with the
code U2J.
The temperature characteristic of capacitance is specified
by means of letters and numbers denoting the maximum
permissible capacitance change from 20 °C over a
specified temperature range. The
“EIA publication RS198”
has a similar coding system but the reference temperature
is 25 °C.
Tables 1 and 2 show the temperature characteristic of
capacitance in accordance with
“IEC 384-9”
and
“RS198”
respectively.
Table 3 shows the temperature coefficient codes in
accordance with
“RS198”
.
As an example, a capacitor with a capacitance change of
−56 to +20% in the temperature range from −55 to +85 °C
will be defined as a class 2E2 capacitor in accordance with
“IEC 384-9”
and X5U in accordance with
“RS198”
.
Also, a capacitor with a temperature change of 0 ±30 ppm
will be defined as C0G in accordance with
“RS198”
(see Table 3) and NP0 in accordance with
“IEC 384-8”
.
1997 Nov 04 153
Philips Components
Miniature ceramic plate capacitors General data
Table 1 Temperature characteristic of capacitance in accordance with
“IEC 384-9”
Table 2 Temperature characteristics in accordance with
“RS198”
Table 3 Temperature coefficient in accordance with
“RS198”
SUB-CLASS
LETTER CODE
∆C/C at 20 °C
(%) PREFERRED CATEGORY TEMPERATURE RANGE (P)
AND CORRESPONDING NUMBER CODE
WITHOUT DC
VOLTAGE
APPLIED
WITH RATED
DC VOLTAGE
APPLIED
−55/+125 °C−55/+85 °C−40/+85 °C−25/+85 °C−10/+85 °C
12346
2B ±10 +10/−15 −PPP−
2C ±20 +20/−30 P P P −−
2D +20/−30 +20/−40 −−−P−
2E +22/−56 +22/−70 −PPPP
2F +30/−80 +30/−90 −PPPP
2R ±15 +15/−40 P −−−−
2X ±15 +15/−25 P −−−−
FIRST DIGIT IS MINIMUM
TEMPERATURE CODE SECOND DIGIT IS MAXIMUM
TEMPERATURE CODE
LAST DIGIT IS RELATED TO
∆C/C at 25 °C
(%)
X=−55 °C 5 = +85 °CF=±7.5
Y=−30 °C 6 = +105 °CP=±10
Z = +10 °C 7 = +125 °CR=±15
−8 = +150 °CS=±22
−9 = +200 °CT=−33 to +22
−−U=−56 to +22
−−V=−82 to +22
SIGNIFICANT FIGURES MULTIPLIER TOLERANCE
ppm
(°C)
C=0.0 0=−1G=±30
M=1 1=−10 H = ±60
P=1.5 2=−100 J = ±120
R=2.2 3=−1000 K = ±250
S=3.3 5=+1 L=±500
T = 4.7 6 = +10 M = ±1000
U = 7.5 7 = +100 N = ±2500
−8 = +1000 −
1997 Nov 04 154
Philips Components
Miniature ceramic plate capacitors General data
Fig.1 Capacitance change as a function of temperature.
handbook, full pagewidth
4.8
−4.8
−60 −40 −20 0
CCA038
20 40 60 80 100 120 140
0
1.6
3.2
−3.2
−1.6 N220
N330
N150
N075
NP0
P100
T (oC)
∆C
C
(%)
NP0
P100
N075
N150
N220
N330
Fig.2 Capacitance change as a function of temperature.
handbook, full pagewidth
140120100806040200−20−40−60
16
−16
12
−12
8
−8
4
−4
0
CCA039
N1500
N750
N470
T (oC)
∆C
C
(%) N1500
N750
N470
1997 Nov 04 155
Philips Components
Miniature ceramic plate capacitors General data
COMPOSITION, COLOUR CODING AND MARKING
Tables 4 and 5 show the composition of the materials used in ceramic plate capacitors. Colour coding indicating the
temperature coefficient or temperature dependency is given.
The capacitance is marked on the body of the plate capacitors in a 3-digit code: two numbers corresponding with the
numerical capacitance value and one letter indicating the multiplier and the decimal point. For example: 1p0 = 1.0 pF,
22n = 22 nF.
Table 4 Class 1: εr= 6 up to 250; TC types
Table 5 Class 2: εr>250; high-K types
TC TYPES MATERIAL COLOUR CODES
CODE VALUE TC BODY
P100 +100 ×10−6/K MgTiO3, Mg2SiO4red-violet
grey
NP0 0 ×10−6/K MgTiO3black
N075 −75 ×10−6/K BaNd2(Bi2)Ti5O×+TiO
2red
N150 −150 ×10−6/K BaNd2(Bi2)Ti5O×+TiO
2orange
N220 −220 ×10−6/K BaNd2(Bi2)Ti5O×+TiO
2yellow
N330 −330 ×10−6/K BaNd2(Bi2)Ti5O×+TiO
2green
N470 −470 ×10−6/K BaNd2(Bi2)Ti5O×+TiO
2blue
N750 −750 ×10−6/K TiO2+ additions violet
N1500 −1500 ×10−6/K CaTiO3+ additions orange/orange
εrVALUE MATERIAL COLOUR CODES
TC BODY
εr= 2000 Ba(Bi)TiO3yellow tanεr= 5000 (Ba, Ca) (Ti, Zr) O3+ additions blue
εr= 14000 (Ba, Ca) (Ti, Zr) O3+ additions green
1997 Nov 04 156
Philips Components
Miniature ceramic plate capacitors General data
PACKAGING
The miniature ceramic plate capacitors are supplied in bulk packaging (cardboard boxes), in tape on reel or in ammopack
(see Table 6).
Table 6 Packaging quantities
CAPACITORS ON TAPE, LEAD PITCH 5.08 mm (0.2 inch)
SIZE CODE PACKAGING QUANTITIES
BOX REEL AMMOPACK
I, IIA, IIB (excluding 1000 V) 1000 4000 4000
III, IV, V (with lead length ≤6 mm) (excluding 1000 V) 1000 −−
III, IV, V (with lead length >6 mm) (excluding 1000 V) 500 4000 4000
III (500 V with lead length >6 mm) (excluding 1000 V) 500 4000 4000
IV, V (500 V with lead length >6 mm) (excluding 1000 V) 500 4000 2000
I, IIA, IIB, III, IV, V (1000 V with lead length >6 mm) 500 2000 2000
I, IIA, IIB, III, IV (1000 V with lead length ≤6 mm) 1000 −−
V (1000 V with lead length ≤6 mm) 500 −−
Fig.3 Capacitors, lead pitch 5.08 mm, on tape.
For dimensions see Table 7.
P2P
P1Ø d
LF
F0
W1W0
W2
W
H0
H1
D0
P0
direction of unreeling
A
t
detail A
∆ h ∆ h
∆ s
CCA032
t1
1997 Nov 04 157
Philips Components
Miniature ceramic plate capacitors General data
Table 7 Dimensions of tape; see Fig.3
Notes
1. Cumulative pitch error: ±≤1 mm/20 pitches.
2. Obliquity maximum 3°.
3. H0= 16 mm also available.
4. Values between parentheses are referred to component height when H0= 16 mm.
SYMBOL PARAMETER DIMENSIONS
(mm)
NOMINAL TOLERANCE
d lead diameter 0.6 +0.6
−0.05
P pitch between capacitors 12.7 ±1.0
P0feed-hole pitch 12.7 ±0.2; note 1
P1feed-hole centre to lead centre 3.85 ±0.5; note 2
P2feed-hole centre to component centre 6.35 ±0.7; note 2
F lead-to-lead 5.0 +0.6
−0.1
F0lead-to-lead 5.08 +0.5
−0.1
∆h component alignment 0 ±1.0
∆s deviation along tape, left or right 0 ±0.6
W tape width 18.0 ±0.5
W0hold-down tape width 6.0 ±0.5
W1hole position 9.0 ±0.5
W2hold-down tape position 0 ±2
H0flange to tape centre 18.25 (16.0); note 3 ±0.5
H1maximum component height 31 (28.75); note 4 −
minimum component height 22 (18.75); note 4 −
L maximum length of snipped lead 11 −
D0feed-hole diameter 4.0 ±0.2
t total tape thickness 0.65 ±0.2
t1maximum thickness of tape and wires 1.5 −
1997 Nov 04 158
Philips Components
Miniature ceramic plate capacitors General data
Table 8 Properties of the tape
PARAMETER MIN. MAX. UNIT
Extraction force for component in the tape plane, vertically to direction of unreeling 5 −N
Break force of tape 15 −N
Pull-off force adhesive tape from main tape −2.5 N
Fig.4 Connection of tapes, lead pitch 5.08 mm.
Dimensions in mm.
Maximum 0.5% of the total number of capacitors per reel may be missing. A maximum of 3 consecutive vacant positions
is followed by at least 6 consecutive components. The tape begins and ends with 5 empty positions.
MBB605
0.5 A
A
12.7 0.2
19 0
1main tape
adhesive tape
connection tape1 max
1997 Nov 04 159
Philips Components
Miniature ceramic plate capacitors General data
Fig.5 Reel with capacitors on tape.
Dimensions in mm.
Ø 30 0.5
0
arbor hole
MBB601
45 1
54 1.5
355
1
Fig.6 Ammopack with capacitors on tape.
Dimensions in mm.
MBB602
253
2
332 2
45 2
1997 Nov 04 160
Philips Components
Miniature ceramic plate capacitors General data
CAPACITORS ON TAPE, LEAD PITCH 2.54 mm (0.1 inch)
Fig.7 Capacitors, lead pitch 2.54 mm, on tape.
For dimensions see Table 9.
CCA031
P2P
P1 Ød
LF
F0
W1W0
W2
W
H0
H1
D0
P0
direction of unreeling
∆h
∆s
A
t
t1
detail A
∆h
1997 Nov 04 161
Philips Components
Miniature ceramic plate capacitors General data
Table 9 Dimensions of tape; see Fig.7
Notes
1. Cumulative pitch error: ±≤1 mm/20 pitches.
2. Obliquity maximum 3°.
3. H0= 16 mm also available.
4. Values between parentheses are referred to component height when H0= 16 mm.
SYMBOL PARAMETER DIMENSIONS
(mm)
NOMINAL TOLERANCE
d lead diameter 0.6 +0.6
−0.05
P pitch between capacitors 12.7 ±1.0
P0feed-hole pitch 12.7 ±0.2; note 1
P1feed-hole centre to lead centre 5.1 ±0.5; note 2
P2feed-hole centre to component centre 6.35 ±0.7; note 2
F lead-to-lead 2.54 ±0.3
F0lead-to-lead 2.54 ±0.3
∆h component alignment 0 ±1.0
∆s deviation along tape, left or right 0 ±0.6
W tape width 18.0 ±0.5
W0hold-down tape width 6.0 ±0.5
W1hole position 9.0 ±0.5
W2hold-down tape position 0 ±2
H0flange to tape centre 18.25 (16.0); note 3 ±0.5
H1maximum component height 30 (27.75); note 4 −
minimum component height 21 (18.75); note 4 −
L maximum length of snipped lead 11 −
D0feed-hole diameter 4.0 ±0.2
t total tape thickness 0.65 ±0.2
t1maximum thickness of tape and wires 1.5 −
1997 Nov 04 162
Philips Components
Miniature ceramic plate capacitors General data
Table 10 Properties of the tape
PARAMETER MIN. MAX. UNIT
Extraction force for component in the tape plane, vertically to direction of unreeling 5 −N
Break force of tape 15 −N
Pull-off force adhesive tape from main tape −2.5 N
Fig.8 Connection of tapes, lead pitch 2.54 mm.
MBB606
0.5 A
A
12.7 0.2
19 0
1main tape
adhesive tape
connection tape1 max
Dimensions in mm.
Maximum 0.5% of the total number of capacitors per reel may be missing. A maximum of 3 consecutive vacant positions
is followed by at least 6 consecutive components. The tape begins and ends with 5 empty positions.
1997 Nov 04 163
Philips Components
Miniature ceramic plate capacitors General data
Fig.9 Reel with capacitors on tape.
Dimensions in mm.
Ø 30 0.5
0
arbor hole
MBB601
45 1
54 1.5
355
1
Fig.10 Ammopack with capacitors on tape.
MBB602
253
2
332 2
45 2
Dimensions in mm.
1997 Nov 04 164
Philips Components
Miniature ceramic plate capacitors General data
LABELLING
The label on the package containing the capacitors is as shown.
1.
2.
3.
4.
5.
Fig.11 Packaging label (example).
6.
CCA095
Notes
1. Temperature coefficient for
Class 1 capacitors;
temperature characteristics for
Class 2 capacitors.
2. Lead length is not shown on taped versions.
LINE MARKING EXPLANATION
1. Country of origin
2. Capacitance value, tolerance,
dielectric class (note 1), rated voltage,
lead spacing and lead length (note 2)
3. Country of origin and responsible
production centre codes; A520 is Italy
4. Quantity and date code
5. Commercial type number
6. Catalogue number (12NC)
1997 Nov 04 165
Philips Components
Miniature ceramic plate capacitors General data
TESTS AND REQUIREMENTS
Class 1 capacitors
After manufacture, each capacitor is checked on capacitance, tan δ and test voltage. Apart from this the following quality
checks are carried out by frequent inspections.
Essentially all tests mentioned in the schedule of
“IEC publication 384-8”
, category as specified for each product family
are carried out in accordance with
“IEC publication 68”
.
Table 11 Test procedures and requirements
IEC 384-8
CLAUSE
IEC 68-2
TEST
METHOD TEST PROCEDURE REQUIREMENTS
4.4 robustness of
terminations:
pull-off pull velocity 15 cm/minute; load 5 N no lead breakage
Ua1tensile strength axial force 10 N no lead breakage
Ub bending load 5 N; 4 ×90°no lead breakage
4.6 Ta
method 1 solderability
(solder bath) 235 °C; 2 s good tinning
4.5 Tb
method
1A
resistance to
soldering heat 260 °C; 10 s no visible damage
∆C/C: ±≤0.5% or ±0.5 pF after
1 to 2 hours
4.7 Na rapid change of
temperature 30 minutes at −55 °C and
30 minutes at +85 °C; 5 cycles
(+125 °C for P100, NP0 and N1500
with UR(DC) = 100 V;
+150 °C for 2222 694, P100, NP0
and N1500 with UR(DC) = 500 V)
no damage, after 24 hours
∆C/C: ±≤0.5% or ±0.5 pF
4.8 Fc vibration 10 to 55 to 10 Hz;
0.75 mm displacement; 3 directions;
6 hours
no visible damage
4.9 Eb bump 4000 bumps in 2 directions; 40 g;
pulse time 6 ms no visible damage
inflammability 15 s; 35 mm above bunsen burner
with flame height 40 to 60 mm self-extinguishing within
15 seconds after removal of
bunsen burner
4.3 temperature
coefficient between +20 and −55 °C and
between +20 and +85 °Cwithin tolerance as specified for
each particular material
1997 Nov 04 166
Philips Components
Miniature ceramic plate capacitors General data
4.11 climatic
sequence:
4.11.2 B dry heat 16 hours; +85 °C
(+125 °C for P100, NP0 and N1500
with UR(DC) = 100 V;
+150 °C for 2222 694, P100, NP0
and N1500 with UR(DC) = 500 V)
no visible damage
4.11.3 Db damp heat
(accelerated)
1st cycle
12 hours; +55 °C; 90 to 96% RH
12 hours; +25 °C; 95 to 100% RH no visible damage;
after recovery of 1 to 2 hours
immediately followed by cold test
4.11.4 A cold 2 hours; −55 °C no visible damage
4.11.5 M low air pressure 1 hour; 8.5 kPa,
last 2 minutes rated voltage no breakdown or flashover
4.11.6 Db damp heat
(accelerated)
remaining cycle
12 hours; +55 °C; 90 to 96% RH
12 hours; +25 °C; 95 to 100% RH ∆C/C: ±≤1% or ±1pF
tan δ:≤2×specified tan δ
Rins after 1 to 2 hours:
>5000 MΩ for 2222 650 to
654/691/692/694
>100 MΩ for other types
4.12 Ca damp heat,
steady state
(half number of
the lot at rated
voltage, other half
at zero voltage)
21 days; +40 °C; 90 to 95% RH ∆C/C: ±≤1% or ±1pF
tan δ:≤2×specified tan δ
Rins after 1 to 2 hours:
>5000 MΩ for 2222 650 to
654/691/692/694
>100 MΩ for other types
4.13 endurance 1000 hours at +85 °C
(+125 °C for P100, NP0 and N1500
with UR(DC) = 100 V;
+150 °C for 2222 694, P100, NP0
and N1500 with UR(DC) = 500 V);
2222 694: 1500 V (DC)
2222 650 to 654/691/692:
750 V (DC)
other types: 150 V (DC)
∆C/C: ±≤1% or ±1pF
tan δ:≤1.5 ×specified tan δ
Rins after 1 to 2 hours:
>3000 MΩ for 2222 650 to
654/691/692/694
>300 MΩ for other types
resistance to
solvents 3 minutes ultrasonic washing in
trichloroethylene; 1 minute drying;
30 °C; 10 brush strokes
marking and colour code must
remain legible and not be
discoloured; no mechanical or
electrical damage or
deterioration of the material
IEC 384-8
CLAUSE
IEC 68-2
TEST
METHOD TEST PROCEDURE REQUIREMENTS
1997 Nov 04 167
Philips Components
Miniature ceramic plate capacitors General data
Class 1 precision capacitors NP0
After manufacture, each capacitor is checked on capacitance, tan δ and test voltage. Apart from this the following quality
checks are carried out by frequent inspections.
Essentially all tests mentioned in the schedule of
“IEC publication 384-8”
, category 55/125/56 (temperature range
−55/+125 °C; damp heat, long term, 56 days) are carried out in accordance with
“IEC publication 68”
.
Table 12 Test procedures and requirements
IEC 384-8
CLAUSE
IEC 68-2
TEST
METHOD TEST PROCEDURE REQUIREMENTS
4.4 robustness of
terminations:
pull-off pull velocity 15 cm/minute; load 5 N no lead breakage
Ua1tensile strength axial force 10 N no lead breakage
Ub bending load 5 N; 4 ×90°no lead breakage
4.6 Ta
method 1 solderability
(solder bath) 235 °C; 2 s good tinning
4.5 Tb
method
1A
resistance to
soldering heat 260 °C; 10 s no visible damage
∆C/C after 1 to 2 hours:
±≤0.5% or ±0.5 pF
4.7 Na rapid change of
temperature 30 minutes at −55 °C and
30 minutes at +150 °C; 5 cycles no damage
∆C/C after 24 hours:
±≤0.5% or ±0.5 pF
4.8 Fc vibration 10 to 55 to 10 Hz;
0.75 mm displacement; 3 directions;
6 hours
no visible damage
4.9 Eb bump 4000 bumps in 2 directions; 40 g;
pulse time 6 ms no visible damage
inflammability 15 s; 35 mm above bunsen burner
with flame height 40 to 60 mm self-extinguishing within
15 seconds after removal of
bunsen burner
4.3 temperature
coefficient between +20 and −55 °C and
between +20 and +125 °Cwithin tolerance as specified
1997 Nov 04 168
Philips Components
Miniature ceramic plate capacitors General data
4.11 climatic
sequence:
4.11.2 B dry heat 16 hours; +150 °C no visible damage
4.11.3 Db damp heat
(accelerated)
1st cycle
12 hours; +55 °C; 90 to 96% RH
12 hours; +25 °C; 95 to 100% RH no visible damage;
after recovery of 1 to 2 hours
immediately followed by cold test
4.11.4 A cold 2 hours; −55 °C no visible damage
4.11.5 M low air pressure 1 hour; 8.5 kPa,
last 2 minutes rated voltage no breakdown or flashover
4.11.6 Db damp heat
(accelerated)
remaining cycle
12 hours; +55 °C; 90 to 96% RH
12 hours; +25 °C; 95 to 100% RH ∆C/C: ±≤1% or ±1 pF whichever
is greater
tan δ:≤2×specified tan δ
Rins after 1 to 2 hours:
>1000 MΩ
4.12 Ca damp heat,
steady state
(half number of
the lot at rated
voltage, other half
at zero voltage)
56 days; +40 °C; 90 to 95% RH ∆C/C: ±≤1% or ±1 pF whichever
is greater
tan δ:≤2×specified tan δ
Rins after 1 to 2 hours:
>1000 MΩ
4.13 endurance 1000 hours at +150 °C, 1.5 ×rated
voltage; (+125 °C for P100, NP0 and
N1500 with UR(DC) = 100 V;
+150 °C for 2222 694, P100, NP0
and N1500 with UR(DC) = 500 V)
∆C/C: ±≤1% or ±1 pF whichever
is greater
tan δ:≤1.5 ×specified tan δ
Rins:>3000 MΩ
resistance to
solvents 3 minutes ultrasonic washing in
trichloroethylene;
1 minute drying; 30 °C;
10 brush strokes
marking and colour code must
remain legible and not be
discoloured; no mechanical or
electrical damage or
deterioration of the material
IEC 384-8
CLAUSE
IEC 68-2
TEST
METHOD TEST PROCEDURE REQUIREMENTS
1997 Nov 04 169
Philips Components
Miniature ceramic plate capacitors General data
Class 2 capacitors
After manufacture, each capacitor is checked on capacitance, tan δ and test voltage. Apart from this the following quality
checks are carried out by frequent inspections.
Essentially all tests mentioned in the schedule of
“IEC publication 384-9”
, category as specified for each product family,
are carried out in accordance with
“IEC publication 68”
.
Table 13 Test procedures and requirements
IEC 384-9
CLAUSE
IEC 68-2
TEST
METHOD TEST PROCEDURE REQUIREMENTS
4.1 pre-conditioning 1 hour; +150 °C; reference
measurement after 24 hours
4.5 robustness of
terminations:
pull-off pull velocity 15 cm/minute; load 5 N no lead breakage
Ua1tensile strength axial force 10 N no lead breakage
Ub bending load 5 N; 4 ×90°no lead breakage
4.7 Ta
method 1 solderability
(solder bath) 235 °C; 2 s good tinning
4.6 Tb
method
1A
resistance to
soldering heat pre-conditioning: 260 °C; 10 s no visible damage
∆C/C after 24 hours:
2222 630: ±≤10%
2222 629/640/695: ±≤20%
2222 655/693: ±10%
4.8 Na rapid change of
temperature pre-conditioning:
2222 630/655/693/695:
30 minutes at −55 °C and
30 minutes at +85 °C
(+125 °C for 630;
+105 °C for 640/695;
+150 °C for 655/693);
2222 629:
30 minutes at −10 °C and
30 minutes at +85 °C; 5 cycles
no damage
∆C/C after 24 hours:
2222 630/655/693: ±≤10%
2222 629/640/695: ±≤20%
4.9 Fb vibration 10 to 55 to 10 Hz;
0.75 mm displacement;
3 directions; 6 hours
no visible damage
4.10 Eb bump 4000 bumps in 2 directions; 40 g;
pulse time 6 ms no visible damage
inflammability 15 s; 35 mm above bunsen burner
with flame height 40 to 60 mm self-extinguishing within 15 s after
removal of bunsen burner
resistance to
solvents 3 minutes ultrasonic washing in
trichloroethylene; 1 minute drying,
30 °C; 10 brush strokes
marking and colour code must
remain legible and not be
discoloured; no mechanical or
electrical damage or
deterioration of the material
1997 Nov 04 170
Philips Components
Miniature ceramic plate capacitors General data
4.12 climatic
sequence:
4.12.1 pre-conditioning 1 hour; +150 °C
4.12.2 Ba dry heat 16 hours at:
+85 °C for 2222 629;
+105 °C for 2222 640/695;
+125 °C for 2222 630;
+150 °C for 2222 655/693
no visible damage
4.12.3 Db damp heat
(accelerated)
1st cycle
12 hours; +55 °C; 90 to 96% RH
12 hours; +25 °C; 95 to 100% RH no visible damage;
after recovery of 1 to 2 hours
immediately followed by cold test
4.12.4 Aa cold 2222 630/640/655/693/695:
2 hours; −55 °C;
2222 629: 2 hours; −10 °C
no visible damage
4.12.5 M low air pressure 1 hour at 8.5 kPa,
last 2 minutes rated voltage no breakdown or flashover
4.12.6 Db damp heat
(accelerated)
remaining cycle
12 hours; +55 °C; 90 to 96% RH
12 hours; +25 °C; 95 to 100% RH ∆C/C after 24 hours:
2222 630/655/693: ±≤10%
2222 629/640/695: ±≤20%
tan δ:≤7% (2222 695: <2%)
Rins:
2222 629/630/640: >100 MΩ
2222 655/693/695: >1000 MΩ
4.13 Ca damp heat,
steady state
(half number of
samples at rated
voltage, other half
of samples no
voltage applied)
pre-conditioning:
2222 629/640: 21 days;
+40 °C; 90 to 95% RH;
2222 630/655/693/695: 56 days;
+40 °C; 90 to 95% RH
no visible damage
∆C/C after 24 hours:
2222 630/655/693: ±≤10%
2222 629/640/695: ±≤20%
tan δ:≤7% (2222 695: <2%)
Rins:
2222 629/630/640: >100 MΩ
2222 655/693/695: >1000 MΩ
4.14 endurance pre-conditioning: 1000 hours (IEC)
pre-conditioning:
2222 630: +125 °C; 150 V (DC)
2222 640: +105 °C; 150 V (DC
2222 629: +85 °C; 100 V (DC)
2222 655: +150 °C; 750 V (DC)
2222 693: +150 °C; 1500 V (DC)
2222 695: +105 °C; 1500 V (DC)
∆C/C after 24 hours:
2222 630/655/693: ±≤10%
2222 629/640/695: ±≤20%
tan δ: ≤5% (2222 629: ≤6.5%)
(2222 695: <2%)
Rins:
2222 629/630/640: >300 MΩ
2222 655/693/695: >1000 MΩ
4.4 temperature
characteristic pre-conditioning
minimum and maximum temperature in accordance with specification
IEC 384-9
CLAUSE
IEC 68-2
TEST
METHOD TEST PROCEDURE REQUIREMENTS
1997 Nov 04 171
Philips Components
Miniature ceramic plate capacitors Clear text code
CLEAR TEXT ORDERING CODE
handbook, full pagewidth
CCA945
Class code
R 101 G 33 C0G H WG AP
The first two digits are the significant
figures of capacitance and
the last digit is a multiplier as follows:
Product type
R plate capacitor AP
SP class 1
class 2
F
H
L
N
50 V
100 V
500 V
1000 V
Capacitance (pF)
0
1
2
3
9
8
× 1
× 10
× 100
× 1000
× 0.1
× 0.01
Size Wmax
19
29
33
43
53
3.9 mm (0.152")
4.5 mm (0.177")
5.3 mm (0.208")
6.2 mm (0.244")
6.2 mm (0.244")
Hmax
6.7 mm (0.254")
7.3 mm (0.288")
8.1 mm (0.319")
9.0 mm (0.354")
11.2 mm (0.441")
Code Space
WC
WD
WE
WF
WG
WH
WJ
WK
0.100"
0.200"
0.100"
0.200"
0.200"
0.100"
0.200"
0.100"
Form
flange
flange
flange
flange
flange
flange
flange
flange
Packaging
bulk
bulk
bulk
bulk
tape on reel
tape on reel
ammopack
ammopack
Length
0.500" min.
0.167 ±0.020"
0.167 ±0.020"
0.500" min.
H0 = 18 mm
H0 = 18 mm
H0 = 18 mm
H0 = 18 mm
Code TC
M7J
C0G
U1G
P2G
R2G
R2H
T2H
U2J
P8K
U2M
Y5P
X5U
Z5V
P100 ±30 ppm
NP0 ±30 ppm
N075 ±30 ppm
N150 ±30 ppm
N220 ±30 ppm
N330 ±60 ppm
N470 ±60 ppm
N750 ±120 ppm
N1500 +600/−0 ppm
+150 to −1500 ppm
±10%; −30 to +85 °C
+22/−58%; −55 to +85 °C
+22/−82%; −10 to +85 °C
class 1
class 1
class 1
class 1
class 1
class 1
class 1
class 1
class 1
class 1
class 2
class 2
class 2
Marking
red/violet
black
red
orange
yellow
green
blue
violet
orange/orange
nil
yellow
blue
green
Capacitance tolerance
Size code
Packaging
Rated voltage (DC)
EIA TC codes
B
C
G
F
J
K
M
Z
±0.1 pF (NP0 precision cap. < 10 pF)
±0.25 pF (cap. < 10 pF)
±2% (class 1 for cap. ≥ 10 pF)
±1% (NP0 precision cap. ≥ 10 pF)
±5% (class 1 for cap. ≥ 10 pF)
±10% (class 2, Y5P)
±20% (class 2, X5U)
+80%/−20% (class 2, Z5V)
